IXYS DHG30I600PA Sonic fast recovery diode Datasheet

DHG 30 IM 600 PC
advanced
V RRM =
I FAV =
t rr =
Sonic Fast Recovery Diode
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Single Diode
600 V
30 A
35 ns
Part number
DHG 30 IM 600 PC
1
2
3
Backside: cathode
Features / Advantages:
Applications:
Package:
● Planar passivated chips
● Very low leakage current
● Very short recovery time
● Improved thermal behaviour
● Very low Irm-values
● Very soft recovery behaviour
● Avalanche voltage rated for reliable
operation
● Soft reverse recovery for low EMI/RFI
● Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
● Antiparallel diode for high frequency
switching devices
● Antisaturation diode
● Snubber diode
● Free wheeling diode
● Rectifiers in switch mode power
supplies (SMPS)
● Uninterruptible power supplies (UPS)
● Housing: TO-263 (D2Pak)
Conditions
●rIndustry standard outline
●rEpoxy meets UL 94V-0
●rRoHS compliant
Ratings
Symbol
Definition
VRRM
max. repetitive reverse voltage
IR
reverse current
VF
forward voltage
I FAV
average forward current
VF0
threshold voltage
rF
slope resistance
thermal resistance junction to case
T VJ
virtual junction temperature
Ptot
total power dissipation
I FSM
max. forward surge current
I RM
max. reverse recovery current
CJ
reverse recovery time
junction capacitance
IXYS reserves the right to change limits, conditions and dimensions.
© 2008 IXYS all rights reserved
typ.
max.
Unit
600
V
VR = 600 V
50
µA
VR = 600 V
TVJ = 125 °C
5
mA
TVJ = 25 °C
2.37
V
3.18
V
2.22
V
3.11
V
TC = 95°C
30
A
TVJ = 150°C
1.31
V
IF =
30 A
IF =
60 A
IF =
30 A
IF =
60 A
rectangular
TVJ = 150 °C
d = 0.5
for power loss calculation only
RthJC
t rr
min.
TVJ = 25 °C
TVJ = 25 °C
-55
29.2
mΩ
0.60
K/W
150
°C
TC = 25 °C
210
W
t = 10 ms (50 Hz), sine
TVJ = 45°C
200
A
TVJ = 25 °C
12
A
IF =
TVJ =
tbd
A
35 A; VR = 400 V
-di F /dt = 600 A/µs
VR = 400 V; f = 1 MHz
°C
TVJ = 25 °C
35
ns
TVJ =
°C
tbd
ns
TVJ = 25 °C
16
pF
Data according to IEC 60747and per diode unless otherwise specified
20081031
DHG 30 IM 600 PC
advanced
Ratings
Symbol
Definition
min.
Conditions
I RMS
RMS current
RthCH
thermal resistance case to heatsink
Tstg
storage temperature
per pin
1)
max.
Unit
35
0.25
-55
Weight
FC
typ.
1)
A
K/W
150
°C
2
20
mounting force with clip
g
60
N
IRMS is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.
In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting
the backside.
Product Marking
Part number
Part No.
Logo
XXXXXXXXX
D
H
G
30
IM
600
PC
IXYS yww
Date Code
Order Code
abcd
Ordering
Standard
Part Name
DHG 30 IM 600 PC
Similar Part
DHG30I600PA
DHG30I600HA
IXYS reserves the right to change limits, conditions and dimensions.
© 2008 IXYS all rights reserved
Marking on Product
DHG30IM600PC
Package
TO-220
TO-247
Delivering Mode
Tape & Reel
=
=
=
=
=
=
=
Diode
Sonic Fast Recovery Diode
extreme fast
Current Rating [A]
Single Diode
Reverse Voltage [V]
TO-263AB (D2Pak) (2)
Base Qty Code Key
800
503501
Voltage Class
600
600
Data according to IEC 60747and per diode unless otherwise specified
20081031
DHG 30 IM 600 PC
advanced
Outlines TO-263 (D2Pak)
Dim.
A
A1
Millimeter
Inches
min
max
min
max
4.06
4.83
0.160
0.190
typ. 0.10
typ. 0.004
b
0.51
0.99
0.020
0.039
b2
1.14
1.40
0.045
0.055
c
0.40
0.74
0.016
0.029
c2
1.14
1.40
0.045
0.029
D
8.38
9.40
0.330
0.370
D1
8.00
8.89
0.315
0.350
E
9.65
10.41
0.380
0.410
E1
e
6.22
8.13
2,54 BSC
0.245
0.320
0,100 BSC
H
14.61
15.88
0.575
L
1.78
2.79
0.070
0.110
L1
1.02
1.68
0.040
0.066
0.625
L2
1.02
1.52
0.040
0.060
typ.
typ.
0.040
0.0016
0.02
0.0008
All dimensions conform with and/or are within
JEDEC standard.
W
IXYS reserves the right to change limits, conditions and dimensions.
© 2008 IXYS all rights reserved
Data according to IEC 60747and per diode unless otherwise specified
20081031
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