Yamaichi IC264-22501-1-PN-MF Ball grid array (bga, 1.50mm pitch) Datasheet

IC264 Series (Open Top)
Ball Grid Array (BGA, 1.50mm Pitch)
Specifications
Part Number (Details)
1,000MW min. at 100V DC
Insulation Resistance:
Dielectric Withstanding Voltage: 100V AC for 1 minute
Contact Resistance:
1 W max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
10,000 insertions min.
Mating Cycles:
225 contact pins
Pin Count:
25g to 35g per individual
Contact Force:
contact pin
IC264
- 225 01 - 1 - ** - MF
Series No.
No. of Contact Pins
Design Number
NN: Without Positioning Pin #1, #2
NP: Without Positioning Pin #1,
With Positioning Pin #2
PN: With Positioning Pin #1,
Without Positioning Pin #2
Blank: With Positioning Pin #1, #2
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
MF = Flanged
Unmarked = Not Flanged
Outline Socket Dimensions
13.0±0.1
(1.5±0.1)x14=21.0±0.15
57.0
37.6±0.1
4-R 3.0
25.0
56.0±0.1
50.0
4- Æ2.8
Recommended PC Board Layout
Matching IC Dimensions
Top View from Socket
IC264-22501-1-**-**
56.0±0.05
27.00 ±0.2
+0.1
0
28.0±0.05
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
2- Æ1.5
+0.1
0
28.0±0.05
25.4±0.05
1.5±0.05
225- Æ0.6
Test & Burn-In
+0.1
0
32.5±0.05
13.0±0.05
1.50x14=21.00
4- Æ2.0
+0.1
0
2- 1.5x14=21.0±0.1
1.50±0.1
37.6±0.05
Æ0.75±0.1
1.30~1.80
0.60±0.1
4- Æ2.8
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