ON MC74LCX32 Low-voltage cmos quad 2-input or gate Datasheet

MC74LCX32
Low-Voltage CMOS Quad
2-Input OR Gate
With 5 V−Tolerant Inputs
The MC74LCX32 is a high performance, quad 2−input OR gate
operating from a 2.3 to 3.6 V supply. High impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance. A VI
specification of 5.5 V allows MC74LCX32 inputs to be safely driven
from 5.0 V devices.
Current drive capability is 24 mA at the outputs.
Features







MARKING
DIAGRAMS
14
SOIC−14
D SUFFIX
CASE 751A
14
1
Designed for 2.3 V to 3.6 V VCC Operation
5.0 V Tolerant Inputs − Interface Capability With 5.0 V TTL Logic
14
LVCMOS Compatible
14
24 mA Balanced Output Sink and Source Capability
1
Near Zero Static Supply Current (10 mA) Substantially Reduces
System Power Requirements
Latchup Performance Exceeds 500 mA
Human Body Model >2000 V
Machine Model >200 V
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
 Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 8
LCX32G
AWLYWW
1
LVTTL Compatible

 ESD Performance:

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1
TSSOP−14
DT SUFFIX
CASE 948G
1
A
L, WL
Y, YY
W, WW
G or G
LCX
32
ALYWG
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Publication Order Number:
MC74LCX32/D
MC74LCX32
VCC
A2
B2
O2
A3
B3
O3
14
13
12
11
10
9
8
1
A0
3
2
B0
4
A1
6
5
B1
11
12
B2
2
3
4
5
6
7
A0
B0
O0
A1
B1
O1
GND
O1
13
A2
1
O0
O2
10
A3
8
9
B3
Figure 1. Pinout: 14−Lead (Top View)
O3
Figure 2. Logic Diagram
PIN NAMES
TRUTH TABLE
Pins
Function
An, Bn
Data Inputs
On
Outputs
Inputs
Outputs
An
Bn
On
L
L
L
L
H
H
H
L
H
H
H
H
H = High Voltage Level
L = Low Voltage Level
For ICC reasons, DO NOT FLOAT Inputs
MAXIMUM RATINGS
Symbol
VCC
Parameter
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
Value
Condition
Units
−0.5 to +7.0
V
−0.5  VI  +7.0
V
−0.5  VO  VCC + 0.5
Output in HIGH or LOW State.(Note 1)
V
−50
VI < GND
mA
−50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
50
mA
ICC
DC Supply Current Per Supply Pin
100
mA
IGND
DC Ground Current Per Ground Pin
100
mA
TSTG
Storage Temperature Range
MSL
Moisture Sensitivity
−65 to +150
C
Level 1
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
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2
MC74LCX32
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Type
Max
2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
Units
V
VI
Input Voltage
0
5.5
V
VO
Output Voltage (HIGH or LOW State) (3−State)
0
VCC
V
IOH
HIGH Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
−24
−12
−8
IOL
LOW Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
+24
+12
+8
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
mA
mA
−40
+85
C
0
10
ns/V
DC ELECTRICAL CHARACTERISTICS
TA = −40C to +85C
Symbol
VIH
VIL
VOH
VOL
IOFF
Characteristic
HIGH Level Input Voltage (Note 1.)
LOW Level Input Voltage (Note 1.)
HIGH Level Output Voltage
LOW Level Output Voltage
Power Off Leakage Current
IIN
Input Leakage Current
ICC
Quiescent Supply Current
DICC
Increase in ICC per Input
Condition
Min
2.3 V  VCC  2.7 V
1.7
2.7 V  VCC  3.6 V
2.0
Max
V
2.3 V  VCC  2.7 V
0.7
2.7 V  VCC  3.6 V
0.8
2.3 V  VCC  3.6 V; IOH = −100 mA
VCC − 0.2
VCC = 2.3 V; IOH = −8 mA
1.8
VCC = 2.7 V; IOH = −12 mA
2.2
VCC = 3.0 V; IOH = −18 mA
2.4
VCC = 3.0 V; IOH = −24 mA
2.2
Units
V
V
2.3 V  VCC  3.6 V; IOL = 100 mA
0.2
V
VCC = 2.3 V; IOL = 8 mA
0.6
VCC = 2.7 V; IOL = 12 mA
0.4
VCC = 3.0 V; IOL = 16 mA
0.4
VCC = 3.0 V; IOL = 24 mA
0.55
VCC = 0, VIN = 5.5 V or VOUT = 5.5 V
10
mA
VCC = 3.6 V, VIN = 5.5 V or GND
5
mA
VCC = 3.6 V, VIN = 5.5 V or GND
10
mA
2.3  VCC  3.6 V; VIH = VCC − 0.6 V
500
mA
1. These values of VI are used to test DC electrical characteristics only.
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MC74LCX32
AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W)
Limits
TA = −40C to +85C
Symbol
Parameter
tPLH
tPHL
Propagation Delay Time
Input to Output
tOSHL
tOSLH
Output−to−Output Skew
(Note 2)
VCC = 3.3 V  0.3 V
VCC = 2.7 V
VCC = 2.5 V  0.2 V
CL = 50 pF
CL = 50 pF
CL = 30 pF
Waveform
Min
Max
Min
Max
Min
Max
Units
1
1.5
1.5
5.5
5.5
1.5
1.5
6.2
6.2
1.5
1.5
6.6
6.6
ns
1.0
1.0
ns
2. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25C
Symbol
Characteristic
Condition
Min
Typ
Max
Units
VOLP
Dynamic LOW Peak Voltage
(Note 3)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
0.8
0.6
V
VOLV
Dynamic LOW Valley Voltage
(Note 3)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
−0.8
−0.6
V
3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
Condition
Typical
Units
Input Capacitance
VCC = 3.3 V, VI = 0 V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3 V, VI = 0 V or VCC
8
pF
CPD
Power Dissipation Capacitance
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
CIN
Parameter
ORDERING INFORMATION
Package
Shipping†
MC74LCX32DR2G
SOIC−14
(Pb−Free)
2500 Tape & Reel
MC74LCX32DTG
TSSOP−14
(Pb−Free)
96 Units / Rail
MC74LCX32DTR2G
TSSOP−14
(Pb−Free)
2500 Tape & Reel
NLV74LCX32DTR2G*
TSSOP−14
(Pb−Free)
2500 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
MC74LCX32
VCC
An, Bn
Vmi
Vmi
0V
tPHL
tPLH
VOH
Vmo
On
Vmo
VOL
WAVEFORM 1 − PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Vcc
Symbol
3.3 V + 0.3 V
2.7 V
2.5 V + 0.2 V
Vmi
1.5 V
1.5 V
Vcc/2
Vmo
1.5 V
1.5 V
Vcc/2
Figure 3. AC Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL =
CL =
RL =
RT =
CL
RL
50 pF at VCC = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance)
30 pF at VCC = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance)
R1 = 500 W or equivalent
ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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MC74LCX32
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.020 0.024
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74LCX32
PACKAGE DIMENSIONS
D
SOIC−14 NB
CASE 751A−03
ISSUE K
A
B
14
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
A3
E
H
L
1
0.25
M
DETAIL A
7
B
13X
M
b
0.25
M
C A
S
B
S
e
DETAIL A
h
A
X 45 _
M
A1
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74LCX32/D
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