ON NLU3G16MUTAG Triple non-inverting buffer Datasheet

NLU3G16
Triple Non-Inverting Buffer
The NLU3G16 MiniGatet is an advanced high-speed CMOS
triple non-inverting buffer in ultra-small footprint.
The NLU3G16 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
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Features
•High Speed: tPD = 3.5 ns (Typ) @ VCC = 5.0 V
•Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
•Power Down Protection Provided on inputs
•Balanced Propagation Delays
•Overvoltage Tolerant (OVT) Input and Output Pins
•Ultra-Small Packages
•These are Pb-Free Devices
IN A1
1
8
VCC
OUT Y3
2
7
OUT Y1
IN A2
3
6
IN A3
MARKING
DIAGRAMS
1
UDFN8
1.8 x 1.2
CASE 517AJ
UYM
G
RM
1
ULLGA8
1.45 x 1.0
CASE 613AA
1
ULLGA8
1.6 x 1.0
CASE 613AB
LRM
G
ULLGA8
1.95 x 1.0
CASE 613AC
LRM
G
8
1
4
GND
5
UY, R or LR = Specific Device Code
M = Date Code
G
= Pb-Free Package
OUT Y2
Figure 1. Pinout (Top View)
PIN ASSIGNMENT
IN A1
IN A2
IN A3
1
1
1
OUT Y2
OUT Y2
OUT Y3
Figure 2. Logic Symbol
1
IN A1
2
OUT Y3
3
IN A2
4
GND
5
OUT Y2
6
IN A3
7
OUT Y1
8
VCC
FUNCTION TABLE
A
Y
L
H
L
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 2
1
Publication Order Number:
NLU3G16/D
NLU3G16
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
-0.5 to +7.0
V
VIN
DC Input Voltage
-0.5 to +7.0
V
DC Output Voltage
-0.5 to +7.0
V
VIN < GND
-20
mA
VOUT < GND
±20
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±12.5
mA
ICC
DC Supply Current Per Supply Pin
±25
mA
IGND
DC Ground Current per Ground Pin
±25
mA
TSTG
Storage Temperature Range
-65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
Latchup Performance Above VCC and Below GND at 125°C (Note 2)
UL 94 V-0 @ 0.125 in
±500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
VOUT
Output Voltage
TA
Operating Free-Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
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2
Min
Max
Unit
1.65
5.5
V
0
5.5
V
0
5.5
V
-55
+125
°C
0
0
100
20
ns/V
NLU3G16
DC ELECTRICAL CHARACTERISTICS
Symbol
VIH
VIL
VOH
VOL
Parameter
VCC
(V)
Conditions
Low-Level
Input Voltage
Low-Level
Input Voltage
High-Level
Output Voltage
Low-Level
Output Voltage
TA = 25 5C
Min
Typ
TA = +855C
Max
Min
1.65
0.75 x
VCC
0.75 x
VCC
2.3 to
5.5
0.70 x
VCC
0.70 x
VCC
Max
TA = -555C to
+1255C
Min
Max
V
1.65
0.25 x
VCC
0.25 x
VCC
0.25 x
VCC
2.3 to
5.5
0.30 x
VCC
0.30 x
VCC
0.30 x
VCC
VIN = VIH or VIL
IOH = -50 mA
2.0
3.0
4.5
1.9
2.9
4.4
VIN = VIH or VIL
IOH = -4 mA
IOH = -8 mA
3.0
4.5
2.58
3.94
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
2.0
3.0
4.5
Unit
1.9
2.9
4.4
1.9
2.9
4.4
2.48
3.80
2.34
3.66
V
V
V
0
0
0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN
Input Leakage
Current
0 v VIN v 5.5 V
0 to
5.5
±0.1
±1.0
±1.0
mA
ICC
Quiescent
Supply Current
0 v VIN v VCC
5.5
1.0
10
40
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol
Parameter
VCC
(V)
Test
Condition
tPLH,
tPHL
Propagation Delay,
Input A to Output Y
3.0 to
3.6
4.5 to
5.5
CIN
Input Capacitance
CPD
Power Dissipation
Capacitance
(Note 3)
TA = 25 5C
Min
TA = +855C
Typ
Max
CL = 15 pF
4.5
7.1
CL = 50 pF
6.4
CL = 15 pF
CL = 50 pF
5.0
Max
Unit
8.5
10
ns
10.6
12
14.5
3.5
5.5
6.5
8.0
4.5
7.5
8.5
10
4.0
10
10
10
8.0
Min
Max
TA = -555C to
+1255C
Min
pF
pF
3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
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3
NLU3G16
SWITCHING WAVEFORMS
TEST POINT
VCC
50%
OUTPUT
A
GND
DEVICE
UNDER
TEST
tPHL
tPLH
50% VCC
CL *
Y
*Includes all probe and jig capacitance
Figure 3. Switching Waveforms
Figure 4. Test Circuit
ORDERING INFORMATION
Package
Shipping†
UDFN8
(Pb-Free)
3000 / Tape & Reel
NLU3G16AMX1TCG
ULLGA8, 1.95 x 1.0, 0.5P
(Pb-Free)
3000 / Tape & Reel
NLU3G16BMX1TCG
ULLGA8, 1.6 x 1.0, 0.4P
(Pb-Free)
3000 / Tape & Reel
NLU3G16CMX1TCG
ULLGA8, 1.45 x 1.0, 0.35P
(Pb-Free)
3000 / Tape & Reel
Device
NLU3G16MUTAG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU3G16
PACKAGE DIMENSIONS
UDFN8 1.8x1.2, 0.4P
CASE 517AJ-01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
D
0.10 C
PIN ONE
REFERENCE
ÉÉÉ
L1
E
DETAIL A
NOTE 5
0.10 C
TOP VIEW
(A3)
0.05 C
DIM
A
A1
A3
b
b2
D
E
e
L
L1
L2
A
0.05 C
SIDE VIEW
A1
e/2
e
(b2)
C
DETAIL A
8X
1
4
8
5
SEATING
PLANE
L
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
(L2)
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
0.30 REF
1.80 BSC
1.20 BSC
0.40 BSC
0.45
0.55
0.00
0.03
0.40 REF
8X b
8X
0.10
M
C A B
0.05
M
C
0.66
7X
0.22
NOTE 3
1.50
1
0.32
0.40 PITCH
DIMENSIONS: MILLIMETERS
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5
NLU3G16
PACKAGE DIMENSIONS
ULLGA8 1.45x1.0, 0.35P
CASE 613AA-01
ISSUE A
ÉÉÉ
ÉÉÉ
ÉÉÉ
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
A1
C
e
L
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
7X
e/2
1
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
7X
0.48
NOTE 4
8X
0.22
4
L1
1.18
8
5
8X
b
0.53
0.10 C A B
BOTTOM VIEW
0.05 C
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
NLU3G16
PACKAGE DIMENSIONS
ULLGA8 1.6x1.0, 0.4P
CASE 613AB-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
8X
0.05 C
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
SEATING
PLANE
SIDE VIEW
C
A1
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
7X
e/2
0.49
e
1
7X
L
NOTE 4
8X
0.26
4
L1
1.24
8
5
8X
b
0.53
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
1
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
NLU3G16
PACKAGE DIMENSIONS
ULLGA8 1.95x1.0, 0.5P
CASE 613AC-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.95 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
7X
e/2
e
7X
L
0.49
NOTE 4
8X
0.30
4
1
L1
1.24
8
5
8X
BOTTOM VIEW
b
0.10 C A B
0.05 C
0.53
1
PKG
OUTLINE
NOTE 3
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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For additional information, please contact your local
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NLU3G16/D
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