SPANSION MBM29LV160TM90PBT Flash memory cmos 16 m (2m x 8/1m x 16) bit mirrorflashtm Datasheet

FUJITSU SEMICONDUCTOR
DATA SHEET
DS05-20906-3E
FLASH MEMORY
CMOS
16 M (2M × 8/1M × 16) BIT
MirrorFlashTM*
MBM29LV160TM/BM 90
■ DESCRIPTION
The MBM29LV160TM/BM is a 32M-bit, 3.0 V-only Flash memory organized as 4M bytes by 8 bits or 2M words
by 16 bits. The MBM29LV160TM/BM is offered in 48-pin TSOP(1) and 48-ball FBGA. The device is designed to
be programmed in-system with the standard 3.0 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required for
program or erase operations. The devices can also be reprogrammed in standard EPROM programmers.
The standard MBM29LV160TM/BM offers access times of 90 ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention the devices have separate chip enable (CE), write enable
(WE), and output enable (OE) controls.
(Continued)
■ PRODUCT LINE UP
Part No.
VCC
MBM29LV160TM/BM
90
3.0 V to 3.6 V
Max Address Access Time
90 ns
Max CE Access Time
90 ns
Max OE Access Time
25 ns
■ PACKAGES
48-pin plastic TSOP (1)
48-ball plastic FBGA
Marking Side
(FPT-48P-M19)
(BGA-48P-M20)
* : MirrorFlashTM is a trademark of Fujitsu Limited.
Notes : • Programming in byte mode ( × 8) is prohibited.
• Programming to the address that already contains data is prohibited (It is mandatory to erase data prior to
overprogram on the same address) .
MBM29LV160TM/BM90
(Continued)
The MBM29LV160TM/BM supports command set compatible with JEDEC single-power-supply EEPROMS standard. Commands are written into the command register. The register contents serve as input to an internal statemachine which controls the erase and programming circuitry. Write cycles also internally latch addresses and
data needed for the programming and erase operations. Reading data out of the devices is similar to reading
from 5.0 V and 12.0 V Flash or EPROM devices.
The MBM29LV160TM/BM is programmed by executing the program command sequence. This will invoke the
Embedded Program AlgorithmTM which is an internal algorithm that automatically times the program pulse widths
and verifies proper cell margin. Erase is accomplished by executing the erase command sequence. This will
invoke the Embedded Erase AlgorithmTM which is an internal algorithm that automatically preprograms the array
if it is not already programmed before executing the erase operation. During erase, the device automatically
times the erase pulse widths and verifies proper cell margin.
The device also features a sector erase architecture. The sector mode allows each sector to be erased and
reprogrammed without affecting other sectors. All sectors are erased when shipped from the factory.
The device features single 3.0 V power supply operation for both read and write functions. Internally generated
and regulated voltages are provided for the program and erase operations. A low VCC detector automatically
inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7,
by the Toggle Bit feature on DQ6. Once the end of a program or erase cycle has been completed, the devices
internally return to the read mode.
Fujitsu Flash technology combines years of Flash memory manufacturing experience to produce the highest
levels of quality, reliability, and cost effectiveness. The devices electrically erase all bits within a sector simultaneously via hot-hole assisted erase. The bytes/words are programmed one bytes/words at a time using the
EPROM programming mechanism of hot electron injection.
2
MBM29LV160TM/BM90
■ FEATURES
• 0.23 µm Process Technology
• Single 3.0 V read, program and erase
Minimizes system level power requirements
• Industry-standard pinouts
48-pin TSOP (1) (Package suffix: TN - Normal Bend Type)
48-ball FBGA (Package suffix: PBT)
• Minimum 100,000 program/erase cycles
• High performance
90 ns maximum access time
• Sector erase architecture
One 16K bytes, two 8K bytes, one 32K bytes, and thirty-one 64K bytes sectors in byte mode
One 8K words, two 4K words, one 16K words, and thirty-one 32K words sectors in word mode
Any combination of sectors can be concurrently erased. Also supports full chip erase
• Boot Code Sector Architecture
T = Top sector
B = Bottom sector
• Embedded EraseTM* Algorithms
Automatically pre-programs and erases the chip or any sector
• Embedded ProgramTM* Algorithms
Automatically program and verifies data at specified address
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion
• Ready/Busy output (RY/BY)
Hardware method for detection of program or erase cycle completion
• Automatic sleep mode
When addresses remain stable, automatically switches themselves to low power mode
• Program Suspend/Resume
Suspends the program operation to allow a read in another address
• Low VCC write inhibit ≤ 2.5 V
• Erase Suspend/Resume
Suspends the erase operation to allow a read data and/or program in another sector within the same device
• Sector Protection
Hardware method disables any combination of sectors from program or erase operations
• Sector Protection Set function by Extended sector protect command
• Fast Programming Function by Extended Command
• Temporary sector unprotection
Temporary sector unprotection via the RESET pin
This feature allows code changes in previously locked sectors
• In accordance with CFI (Common Flash Memory Interface)
* : Embedded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc.
3
MBM29LV160TM/BM90
■ PIN ASSIGNMENTS
48-pin TSOP(1)
(Top View)
A15
A14
A13
A12
A11
A10
A9
A8
A19
N.C.
WE
RESET
N.C.
N.C.
RY/BY
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
(Marking Side)
FPT-48P-M19
48-pin FBGA
(Top View)
Marking Side
A6
B6
C6
D6
E6
A13
A12
A14
A15
A16
A5
B5
C5
D5
A9
A8
A10
A11
A4
B4
C4
D4
WE RESET N.C.
A3
B3
RY/BY N.C.
A19
C3
D3
A18
N.C.
F6
H6
BYTE DQ15/ VSS
A-1
E5
F5
G5
H5
DQ7 DQ14 DQ13 DQ6
E4
F4
DQ5 DQ12
E3
F3
G4
H4
VCC
DQ4
G3
H3
DQ2 DQ10 DQ11 DQ3
A2
B2
C2
D2
E2
F2
G2
H2
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
A1
B1
C1
D1
E1
F1
G1
H1
A3
A4
A2
A1
A0
CE
OE
VSS
BGA-48P-M20
4
G6
A16
BYTE
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE
VSS
CE
A0
MBM29LV160TM/BM90
■ PIN DESCRIPTIONS
MBM29LV160TM/BM Pin Configuration
Pin
Function
A19 to A0, A-1
Address Inputs
DQ15 to DQ0
Data Inputs/Outputs
CE
Chip Enable
OE
Output Enable
WE
Write Enable
RESET
Hardware Reset Pin/Temporary Sector Unprotection
BYTE
Select Byte or Word mode
RY/BY
Ready/Busy Output
VCC
Device Power Supply
VSS
Device Ground
N.C.
No Internal Connection
5
MBM29LV160TM/BM90
■ BLOCK DIAGRAM
DQ15 to DQ0
VCC
VSS
RY/BY Buffer
Input/Output
Buffers
Erase Voltage
Generator
WE
State
Control
RESET
BYTE
RY/BY
Command
Register
Program Voltage
Generator
Chip Enable
Output Enable
Logic
CE
OE
STB
Low VCC Detector
Timer for
Program/Erase
Address
Latch
Y-Gating
X-Decoder
Cell Matrix
A -1
■ LOGIC SYMBOL
A-1
20
16 or 8
DQ 15 to DQ 0
CE
OE
WE
RESET
BYTE
6
RY/BY
Data Latch
Y-Decoder
A19 to A0
A19 to A0
STB
MBM29LV160TM/BM90
■ DEVICE BUS OPERATION
MBM29LV160TM/BM User Bus Operations (Word Mode : BYTE = VIH)
CE
OE
WE
A0
A1
A6
A9
DQ15 to
DQ0
RESET
H
X
X
X
X
X
X
Hi-Z
H
L
L
H
L
L
L
VID
Code
H
Autoselect Device Code *1
L
L
H
H
L
L
VID
Code
H
Read
L
L
H
A0
A1
A6
A9
DOUT
H
Output Disable
L
H
H
X
X
X
X
Hi-Z
H
Write (Program/Erase)
L
H
L
A0
A1
A6
A9
*3
H
Enable Sector Protection *2
L
H
L
L
H
L
X
*3
VID
Temporary Sector Unprotection
X
X
X
X
X
X
X
*3
VID
Reset (Hardware)
X
X
X
X
X
X
X
Hi-Z
L
Operation
Standby
Autoselect Manufacture Code
*1
Legend : L = VIL, H = VIH, X = VIL or VIH. See “1. DC Characteristics” in ■ELECTRICAL CHARACTERISTICS for
voltage levels.
Hi-Z = High-Z, VID = 11.5 V to 12.5 V
*1 : Manufacturer and device codes may also be accessed via a command register write sequence. See
“MBM29LV160TM/BM Standard Command Definitions”.
*2 : Refer to “Sector Protection” in ■FUNCTIIONAL DESCRIPTION.
*3 : DIN or DOUT as required by command sequence, data polling, or sector protect algorithm.
7
MBM29LV160TM/BM90
MBM29LV160TM/BM User Bus Operations (Byte Mode : BYTE = VIL)
CE
OE
WE
DQ15/
A-1
A0
A1
A6
A9
DQ7 to
DQ0
RESET
Standby
H
X
X
X
X
X
X
X
Hi-Z
H
Autoselect Manufacture Code *1
L
L
H
L
L
L
L
VID
Code
H
Autoselect Device Code *1
L
L
H
L
H
L
L
VID
Code
H
Read
L
L
H
A-1
A0
A1
A6
A9
DOUT
H
Output Disable
L
H
H
X
X
X
X
X
Hi-Z
H
Write (Program/Erase)
L
H
L
A-1
A0
A1
A6
A9
*3
H
Enable Sector Protection *2
L
H
L
L
L
H
L
X
*3
VID
Temporary Sector Unprotection
X
X
X
X
X
X
X
X
*3
VID
Reset (Hardware)
X
X
X
X
X
X
X
X
Hi-Z
L
Operation
Legend : L = VIL, H = VIH, X = VIL or VIH. See “1. DC Characteristics” in ■ELECTRICAL CHARACTERISTICS for
voltage levels.
Hi-Z = High-Z, VID = 11.5 V to 12.5V
*1 : Manufacturer and device codes may also be accessed via a command register write sequence.
See “MBM29LV160TM/BM Standard Command Definitions”.
*2 : Refer to “Sector Protection” in ■FUNCTIIONAL DESCRIPTION.
*3 : DIN or DOUT as required by command sequence, data polling, or sector protect algorithm.
8
MBM29LV160TM/BM90
MBM29LV160TM/BM Standard Command Definitions*1
Bus
Bus Fifth Bus
First Bus Second Bus Third Bus Fourth
Sixth Bus
Write Write
Read/Write Write
Cycle
Write
Cycle
Write
Cycle
Cycle
Write
Cycle
CyCycle
cles
Req'd Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Command
Sequence
Reset *2
Reset *2
Autoselect(Device ID)
Program
Chip Erase
Sector Erase
Word
/Byte
Word
Byte
Word
Byte
Word
Byte
Word
Byte
Word
Byte
1
3
3
4
6
6
XXXh F0h
555h
AAAh
555h
AAAh
555h
AAAh
555h
AAAh
555h
AAAh
AAh
AAh
AAh
AAh
AAh
—
2AAh
555h
2AAh
555h
2AAh
555h
2AAh
555h
2AAh
555h
—
55h
55h
55h
55h
55h
—
555h
AAAh
555h
AAAh
555h
AAAh
555h
AAAh
555h
AAAh
—
—
F0h RA*10
—
—
—
—
—
RD
*10
—
—
—
—
90h
00h
*10
04h
*10
—
—
—
—
A0h
PA
PD
—
—
—
—
80h
80h
555h
AAAh
555h
AAAh
AAh
AAh
2AAh
555h
2AAh
555h
55h
555h
AAAh
10h
55h
SA
30h
Program/Erase Suspend *3
1
XXXh B0h
—
—
—
—
—
—
—
—
—
—
Program/Erase Resume *3
1
XXXh 30h
—
—
—
—
—
—
—
—
—
—
20h
—
—
—
—
—
—
Set to Fast Mode *4
Word
Byte
3
555h
AAAh
AAh
Fast Program*4
Word
/Byte
2
XXXh A0h
Reset from Fast
Mode *5
Word
/Byte
2
Extended Sector
Protection*6,*7
Word
4
Query*8
Byte
Word
Byte
1
2AAh
555h
555h
AAAh
PD
—
—
—
—
—
—
—
—
XXXh 90h XXXh
00h
*9
—
—
—
—
—
—
—
—
XXXh 60h
SA
60h
SA
SD
*10
—
—
—
—
—
—
—
—
—
—
—
—
55h
AAh
98h
PA
55h
40h SA*10
—
—
(Continued)
9
MBM29LV160TM/BM90
(Continued)
Legend : Address bits A19 to A12 = X = “H” or “L” for all address commands except for Program Address (PA),
Sector Address (SA).
Bus operations are defined in “MBM29LV160TM/BM User Bus Operations (Word Mode: BYTE = VIH)”
and “MBM29LV160TM/BM User Bus Operations (Byte Mode : BYTE = VIL)”.
RA = Address of the memory location to be read.
PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of
the write pulse.
SA = Address of the sector to be programmed / erased. The combination of A19, A18, A17, A16, A15, A14,
A13 and A12 will uniquely select any sector. See “Sector Address Table (MBM29LV160TM)” and
“Sector Address Table (MBM29LV160BM)”.
SD = Sector protection verify data. Output 01h at protected sector addresses and output
00h at unprotected sector addresses.
RD = Data read from location RA during read operation.
PD = Data to be programmed at location PA. Data is latched on the rising edge of write pulse.
*1 : The command combinations not described in “MBM29LV160TM/BM Standard Command Definitions” are
illegal.
*2 : Both of these reset commands are equivalent.
*3 : The Erase Suspend and Erase Resume command are valid only during a sector erase operation.
*4 : The Set to Fast Mode command is required prior to the Fast Program command.
*5 : The Reset from Fast Mode command is required to return to the read mode when the device is in fast mode.
*6 : This command is valid while RESET = VID.
*7 : Sector Address (SA) with A6 = 0, A1 = 1, and A0 = 0
*8 : The valid address are A6 to A0.
*9 : The data “F0h” is also acceptable.
*10 : Indicates read cycle.
10
MBM29LV160TM/BM90
Sector Protection Verify Autoselect Codes
Type
Manufacturer’s Code
MBM29LV160TM
Device Code
MBM29LV160BM
Sector Protection
Word
Byte
Word
Byte
A19 to A12
A6
A1
A0
A-1*1
Code (HEX)
X
VIL
VIL
VIL
VIL
04h
X
VIL
VIL
VIH
X
22C4h
VIL
C4h
X
VIL
VIL
VIH
X
2249h
VIL
49h
Sector
Addresses
VIL
VIH
VIL
VIL
*2
*1 : A-1 is for Byte mode.
*2 : Outputs 01h at protected sector addresses and outputs 00h at unprotected sector addresses.
11
MBM29LV160TM/BM90
Sector Address Table (MBM29LV160TM)
Sector
A19 A18 A17 A16 A15 A14 A13 A12
Address
12
Sector Size
(Kbytes/
Kwords)
Address Range
(x8)
Address Range
( x 16 )
SA0
0
0
0
0
0
X
X
X
64/32
00000h to 0FFFFh
000000h to 007FFFh
SA1
0
0
0
0
1
X
X
X
64/32
10000h to 1FFFFh
008000h to 00FFFFh
SA2
0
0
0
1
0
X
X
X
64/32
20000h to 2FFFFh
010000h to 017FFFh
SA3
0
0
0
1
1
X
X
X
64/32
30000h to 3FFFFh
018000h to 01FFFFh
SA4
0
0
1
0
0
X
X
X
64/32
40000h to 4FFFFh
020000h to 027FFFh
SA5
0
0
1
0
1
X
X
X
64/32
50000h to 5FFFFh
028000h to 02FFFFh
SA6
0
0
1
1
0
X
X
X
64/32
60000h to 6FFFFh
030000h to 037FFFh
SA7
0
0
1
1
1
X
X
X
64/32
70000h to 7FFFFh
038000h to 03FFFFh
SA8
0
1
0
0
0
X
X
X
64/32
80000h to 8FFFFh
040000h to 047FFFh
SA9
0
1
0
0
1
X
X
X
64/32
90000h to 9FFFFh
048000h to 04FFFFh
SA10
0
1
0
1
0
X
X
X
64/32
A0000h to AFFFFh
050000h to 057FFFh
SA11
0
1
0
1
1
X
X
X
64/32
B0000h to BFFFFh
058000h to 05FFFFh
SA12
0
1
1
0
0
X
X
X
64/32
C0000h to CFFFFh
060000h to 067FFFh
SA13
0
1
1
0
1
X
X
X
64/32
D0000h to DFFFFh
068000h to 06FFFFh
SA14
0
1
1
1
0
X
X
X
64/32
E0000h to EFFFFh
070000h to 077FFFh
SA15
0
1
1
1
1
X
X
X
64/32
F0000h to FFFFFh
078000h to 07FFFFh
SA16
1
0
0
0
0
X
X
X
64/32
100000h to 10FFFFh
080000h to 087FFFh
SA17
1
0
0
0
1
X
X
X
64/32
110000h to 11FFFFh 088000h to 08FFFFh
SA18
1
0
0
1
0
X
X
X
64/32
120000h to 12FFFFh
SA19
1
0
0
1
1
X
X
X
64/32
130000h to 13FFFFh 098000h to 09FFFFh
SA20
1
0
1
0
0
X
X
X
64/32
140000h to 14FFFFh 0A0000h to 0A7FFFh
SA21
1
0
1
0
1
X
X
X
64/32
150000h to 15FFFFh 0A8000h to 0AFFFFh
SA22
1
0
1
1
0
X
X
X
64/32
160000h to 16FFFFh 0B0000h to 0B7FFFh
SA23
1
0
1
1
1
X
X
X
64/32
170000h to 17FFFFh 0B8000h to B0FFFFh
SA24
1
1
0
0
0
X
X
X
64/32
180000h to 18FFFFh 0C0000h to 0C7FFFh
SA25
1
1
0
0
1
X
X
X
64/32
190000h to 19FFFFh 0C8000h to 0CFFFFh
SA26
1
1
0
1
0
X
X
X
64/32
1A0000h to 1AFFFFh 0D0000h to 0D7FFFh
SA27
1
1
0
1
1
X
X
X
64/32
1B0000h to 1BFFFFh 0D8000h to 0DFFFFh
SA28
1
1
1
0
0
X
X
X
64/32
1C0000h to 1CFFFFh 0E0000h to 0E7FFFh
SA29
1
1
1
0
1
X
X
X
64/32
1D0000h to 1DFFFFh 0E8000h to 0EFFFFh
SA30
1
1
1
1
0
X
X
X
64/32
1E0000h to 1EFFFFh 0F0000h to 0F7FFFh
SA31
1
1
1
1
1
0
X
X
32/16
1F0000h to 1F7FFFh 0F8000h to 0FBFFFh
SA32
1
1
1
1
1
1
0
0
8/4
1F8000h to 1F9FFFh 0FC000h to 0FCFFFh
SA33
1
1
1
1
1
1
0
1
8/4
1FA000h to 1FBFFFh 0FD000h to 0FDFFFh
SA34
1
1
1
1
1
1
1
X
16/8
1FC000h to 1FFFFFh 0FE000h to 0FEFFFh
090000h to 097FFFh
MBM29LV160TM/BM90
Sector Address Table (MBM29LV160BM)
Sector
A19 A18 A17 A16 A15 A14 A13 A12
Address
Sector Size
(Kbytes/
Kwords)
Address Range
(x8)
Address Range
( x 16 )
SA0
0
0
0
0
0
0
0
X
16/8
00000h to 03FFFh
000000h to 001FFFh
SA1
0
0
0
0
0
0
1
0
8/4
04000h to 05FFFh
002000h to 002FFFh
SA2
0
0
0
0
0
0
1
1
8/4
06000h to 07FFFh
003000h to 003FFFh
SA3
0
0
0
0
0
1
0
X
32/16
08000h to 0FFFFh
004000h to 007FFFh
SA4
0
0
0
0
1
X
X
X
64/32
10000h to 1FFFFh
008000h to 00FFFFh
SA5
0
0
0
1
0
X
X
X
64/32
20000h to 2FFFFh
010000h to 017FFFh
SA6
0
0
0
1
1
X
X
X
64/32
30000h to 3FFFFh
018000h to 01FFFFh
SA7
0
0
1
0
0
X
X
X
64/32
40000h to 4FFFFh
020000h to 027FFFh
SA8
0
0
1
0
1
X
X
X
64/32
50000h to 5FFFFh
028000h to 02FFFFh
SA9
0
0
1
1
0
X
X
X
64/32
60000h to 6FFFFh
030000h to 037FFFh
SA10
0
0
1
1
1
X
X
X
64/32
70000h to 7FFFFh
038000h to 03FFFFh
SA11
0
1
0
0
0
X
X
X
64/32
80000h to 8FFFFh
040000h to 047FFFh
SA12
0
1
0
0
1
X
X
X
64/32
90000h to 9FFFFh
048000h to 04FFFFh
SA13
0
1
0
1
0
X
X
X
64/32
A0000h to AFFFFh
050000h to 057FFFh
SA14
0
1
0
1
1
X
X
X
64/32
B0000h to BFFFFh
058000h to 05FFFFh
SA15
0
1
1
0
0
X
X
X
64/32
C0000h to CFFFFh
060000h to 067FFFh
SA16
0
1
1
0
1
X
X
X
64/32
D0000h to DFFFFh
068000h to 06FFFFh
SA17
0
1
1
1
0
X
X
X
64/32
E0000h to EFFFFh
070000h to 077FFFh
SA18
0
1
1
1
1
X
X
X
64/32
F0000h to FFFFFh
078000h to 07FFFFh
SA19
1
0
0
0
0
X
X
X
64/32
100000h to 1FFFFFh 080000h to 087FFFh
SA20
1
0
0
0
1
X
X
X
64/32
110000h to 11FFFFh 088000h to 08FFFFh
SA21
1
0
0
1
0
X
X
X
64/32
120000h to 12FFFFh 090000h to 097FFFh
SA22
1
0
0
1
1
X
X
X
64/32
130000h to 13FFFFh 098000h to 09FFFFh
SA23
1
0
1
0
0
X
X
X
64/32
140000h to 14FFFFh 0A0000h to 0A7FFFh
SA24
1
0
1
0
1
X
X
X
64/32
150000h to 15FFFFh 0A8000h to 08FFFFh
SA25
1
0
1
1
0
X
X
X
64/32
160000h to 16FFFFh 0B0000h to 0B7FFFh
SA26
1
0
1
1
1
X
X
X
64/32
170000h to 17FFFFh 0B8000h to 0BFFFFh
SA27
1
1
0
0
0
X
X
X
64/32
180000h to 18FFFFh 0C0000h to 0C7FFFh
SA28
1
1
0
0
1
X
X
X
64/32
190000h to 19FFFFh 0C8000h to 0CFFFFh
SA29
1
1
0
1
0
X
X
X
64/32
1A0000h to 1AFFFFh 0D0000h to 0D7FFFh
SA30
1
1
0
1
1
X
X
X
64/32
1B0000h to 1BFFFFh 0D8000h to 0DFFFFh
SA31
1
1
1
0
0
X
X
X
64/32
1C0000h to 1CFFFFh 0E0000h to 0E7FFFh
SA32
1
1
1
0
1
X
X
X
64/32
1D0000h to 1DFFFFh 0E8000h to 0EFFFFh
SA33
1
1
1
1
0
X
X
X
64/32
1E0000h to 1EFFFFh 0F0000h to 0F7FFFh
SA34
1
1
1
1
1
X
X
X
64/32
1F0000h to 1FFFFFh 0F8000h to 0FFFFFh
13
MBM29LV160TM/BM90
Common Flash Memory Interface Code
A0 to A6
DQ15 to DQ0
Description
10h
11h
12h
0051h
0052h
0059h
Query-unique ASCII string “QRY”
13h
14h
0002h
0000h
Primary OEM Command Set
(02h = Fujitsu standard)
15h
16h
0040h
0000h
Address for Primary Extended Table
17h
18h
0000h
0000h
Alternate OEM Command Set
(00h = not applicable)
19h
1Ah
0000h
0000h
Address for Alternate OEM Extended Table
(00h = not applicable)
1Bh
0027h
VCC Min (write/erase)
DQ7 to DQ4: 1V/bit,
DQ3 to DQ0: 100 mV/bit
1Ch
0036h
VCC Max (write/erase)
DQ7 to DQ4: 1V/bit,
DQ3 to DQ0: 100 mV/bit
1Dh
0000h
VPP Min voltage (00h = no Vpp pin)
1Eh
0000h
VPP Max voltage (00h =no Vpp pin)
1Fh
0007h
Typical timeout per single write 2N µs
20h
0000h
Typical timeout for Min size buffer write 2N µs
21h
000Ah
Typical timeout per individual sector erase 2N ms
22h
0000h
Typical timeout for full chip erase 2N ms
23h
0001h
Max timeout for write 2N times typical
24h
0000h
Max timeout for buffer write 2N times typical
25h
0004h
Max timeout per individual sector erase 2N times typical
26h
0000h
Max timeout for full chip erase 2N times typical
27h
0015h
Device Size = 2N byte
28h
29h
0002h
0000h
Flash Device Interface description
2Ah
2Bh
0000h
0000h
Max number of byte in
multi-byte write = 2N
2Ch
0004h
Number of Erase Block Regions within device (01h = uniform)
2Dh
2Eh
2Fh
30h
0000h
0000h
0040h
0000h
Erase Block Region 1 Information
(Continued)
14
MBM29LV160TM/BM90
(Continued)
A0 to A6
DQ15 to DQ0
Description
31h
32h
33h
34h
0001h
0000h
0020h
0000h
Erase Block Region 2 Information
35h
36h
37h
38h
0000h
0000h
0080h
0000h
Erase Block Region 3 Information
39h
3Ah
3Bh
3Ch
001Eh
0000h
0000h
0001h
Erase Block Region 4 Information
40h
41h
42h
0050h
0052h
0049h
Query-unique ASCII string “PRI”
43h
0031h
Major version number, ASCII
44h
0033h
Minor version number, ASCII
45h
0000h
Address Sensitive Unlock
Required
46h
0002h
Erase Suspend
(02h = To Read & Write)
47h
0001h
Number of sectors in per group
48h
0001h
Sector Temporary Unprotection
(01h = Supported)
49h
0004h
Sector Protection Algorithm
4Ah
0000h
Dual Operation
(00h = Not Supported)
4Bh
0000h
Burst Mode Type
(00h = Not Supported)
4Ch
0000h
Page Mode Type
(00h = Not Supported)
50h
0001h
Program Suspend
(01h = Supported)
15
MBM29LV160TM/BM90
■ FUNCTIONAL DESCRIPTION
Standby Mode
There are two ways to implement the standby mode on the device, one using both the CE and RESET pins, and
the other via the RESET pin only.
When using both pins, CMOS standby mode is achieved with CE and RESET input held at VCC ±0.3 V. Under
this condition the current consumed is less than 5 µA Max. During Embedded Algorithm operation, VCC active
current (ICC2) is required even when CE = “H”. The device can be read with standard access time (tCE) from either
of these standby modes.
When using the RESET pin only, CMOS standby mode is achieved with RESET input held at VSS ±0.3 V (CE =
“H” or “L”) . Under this condition the current consumed is less than 5 µA Max. Once the RESET pin is set high,
the device requires tRH as a wake-up time for output to be valid for read access.
During standby mode, the output is in the high impedance state, regardless of OE input.
Automatic Sleep Mode
Automatic sleep mode works to restrain power consumption during read-out of device data. It can be useful in
applications such as handy terminal, which requires low power consumption.
To activate this mode, the device automatically switch themselves to low power mode when the device addresses
remain stable after tACC+30 ns from data valid. It is not necessary to control CE, WE, and OE in this mode. The
current consumed is typically 1 µA (CMOS Level).
Since the data are latched during this mode, the data are continuously read out. When the addresses are
changed, the mode is automatically canceled and the device read-out the data for changed addresses.
Autoselect
The Autoselect mode allows reading out of a binary code and identifies its manufacturer and type.It is intended
for use by programming equipment for the purpose of automatically matching the device to be programmed with
its corresponding programming algorithm.
To activate this mode, the programming equipment must force VID on address pin A9. Two identifier bytes may
then be sequenced from the devices outputs by toggling A0. All addresses can be either High or Low except A6,
A1 and A0. See “MBM29LV160TM/BM User Bus Operations (Word Mode: BYTE = VIH)” and “MBM29LV160TM/
BM User Bus Operations (Byte Mode : BYTE = VIL)” in ■DEVICE BUS OPERATION.
The manufacturer and device codes may also be read via the command register, for instances when the device
is erased or programmed in a system without access to high voltage on the A9 pin. The command sequence is
illustrated in “MBM29LV160TM/BM Standard Command Definitions” in ■DEVICE BUS OPERATION.Refer to
“Autoselect Command” in ■COMMAND DEFINITIONS.
In Word mode, a read cycle from address 00h returns the manufacturer’s code (Fujitsu = 04h) . A read cycle at
address 01h outputs device code(MBM29LV160TM: 22C4h; MBM29LV160BM: 2249h). Notice that the above
applies to Word mode. The addresses and codes differ from those of Byte mode. Refer to “Sector Protection
Verify Autoselect Codes” in ■DEVICE BUS OPERATION.
Read Mode
The device has two control functions required to obtain data at the outputs. CE is the power control and used
for a device selection. OE is the output control and used to gate data to the output pins.
Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable
access time (tCE) is the delay from stable addresses and stable CE to valid data at the output pins. The output
enable access time is the delay from the falling edge of OE to valid data at the output pins. (Assuming the
addresses have been stable for at least tACC-tOE time.) When reading out a data without changing addresses after
power-up, input hardware reset or to change CE pin from “H” or “L”.
Output Disable
With the OE input at logic high level (VIH), output from the devices are disabled. This may cause the output pins
to be in a high impedance state.
16
MBM29LV160TM/BM90
Write
Device erasure and programming are accomplished via the command register. The contents of the register serve
as inputs to the internal state machine. The state machine outputs dictate the device function.
The command register itself does not occupy any addressable memory location. The register is a latch used to
store the commands, along with the address and data information needed to execute the command. The command register is written by bringing WE to VIL, while CE is at VIL and OE is at VIH. Addresses are latched on the
falling edge of WE or CE, whichever starts later; while data is latched on the rising edge of WE or CE, whichever
starts first. Standard microprocessor write timings are used.
Refer to AC Write Characteristics and “Alternate WE Controlled Program Operation Timing Diagram” in
■SWITCHING WAVEFORMS for specific timing parameters.
Sector Protection
The device features hardware sector protection. This feature will disable both program and erase operations in
any combination of 35 sectors of memory. The user‘s side can use the sector protection using programming
equipment. The device is shipped with all sectors that are unprotected.
To activate it, the programming equipment must force VID on address pin A9 and control pin OE, CE = VIL and
A6 = A0 = VIL, A1 = VIH. The sector addresses (A19, A18, A17, A16, A15, A14, A13, and A12) should be set to the sector
to be protected. “Sector Address Table (MBM29LV160TM)” and “Sector Address Table (MBM29LV160BM)” in
■DEVICE BUS OPERATION defines the sector address for each of the thirty-five (35) individual sectors. Programming of the protection circuitry begins on the falling edge of the WE pulse and is terminated with the rising
edge of the same. Sector addresses must be held constant during the WE pulse. See “Sector Protection Timing
Diagram” in ■SWITCHING WAVEFORMS and “Sector Protection Algorithm” in ■FLOW CHART for sector
protection timing diagram and algorithm.
To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9
with CE and OE at VIL and WE at VIH. Scanning the sector addresses (A19, A18, A17, A16, A15, A14, A13, and A12)
while (A6, A1, A0) = (0, 1, 0) will produce a logical “1” code at device output DQ0 for a protected sector. Otherwise
the device will produce “0” for unprotected sectors. In this mode, the lower order addresses, except for A0, A1,
and A6 can be either High or Low. Address locations with A1 = VIL are reserved for Autoselect manufacturer and
device codes. A-1 requires applying to VIL on Byte mode.
It is also possible to determine if a sector is protected in the system by writing an Autoselect command. Performing
a read operation at the address location XX02h, where the higher order addresses (A19, A18, A17, A16, A15, A14,
A13, and A12) are the desired sector address will produce a logical “1” at DQ0 for a protected sector. See “Sector
Protection Verify Autoselect Codes” in ■DEVICE BUS OPERATION for Autoselect codes.
Temporary Sector Unprotection
This feature allows temporary unprotection of previously protected sectors of the devices in order to change
data. The Sector Unprotection mode is activated by setting the RESET pin to high voltage (VID). During this
mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once the
VID is taken away from the RESET pin, all the previously protected sectors will be protected again. Refer to
“Temporary Sector Unprotection Timing Diagram” in ■SWITCHING WAVEFORMS and “Temporary Sector Unprotection Algorithm” in ■FLOW CHART.
Hardware Reset
The devices may be reset by driving the RESET pin to VIL from VIH. The RESET pin has a pulse requirement
and has to be kept low (VIL) for at least “tRP” in order to properly reset the internal state machine. Any operation
in the process of being executed will be terminated and the internal state machine will be reset to the read mode
“tREADY” after the RESET pin is driven low. Furthermore, once the RESET pin goes high, the devices require an
additional “tRH” before it will allow read access. When the RESET pin is low, the devices will be in the standby
mode for the duration of the pulse and all the data output pins will be tri-stated. If a hardware reset occurs during
a program or erase operation, the data at that particular location will be corrupted.
17
MBM29LV160TM/BM90
■ COMMAND DEFINITIONS
Device operations are selected by writing specific address and data sequences into the command register.
“MBM29LV160TM/BM Standard Command Definitions” in ■DEVICE BUS OPERATION shows the valid register
command sequences. Note that the Erase Suspend (B0h) and Erase Resume (30h) commands are valid only
while the Sector Erase operation is in progress. Also the Program Suspend (B0h) and Program Resume (30h)
commands are valid only while the Program operation is in progress.Moreover Reset commands are functionally
equivalent, resetting the device to the read mode. Please note that commands must be asserted to DQ7 to DQ0
and DQ15 to DQ8 bits are ignored.
Reset Command
In order to return from Autoselect mode or Exceeded Timing Limits (DQ5 = 1) to Read mode, the Reset operation
is initiated by writing the Reset command sequence into the command register. The devices remain enabled for
reads until the command register contents are altered.
The devices will automatically be in the reset state after power-up. In this case, a command sequence is not
required in order to read data.
Autoselect Command
Flash memories are intended for use in applications where the local CPU alters memory contents. Therefore,
manufacture and device codes must be accessible while the devices reside in the target system. PROM programmers typically access the signature codes by raising A9 to a high voltage. However applying high voltage
onto the address lines is not generally desired system design practice.
The device contains an Autoselect command operation to supplement traditional PROM programming methodology. The operation is initiated by writing the Autoselect command sequence into the command register.
The Autoselect command sequence is initiated first by writing two unlock cycles. This is followed by a third write
cycle that contains the address and the Autoselect command. Then the manufacture and device codes can be
read from the address, and an actual data of memory cell can be read from the another address.
Following the command write, a read cycle from address 00h returns the manufactures’s code (Fujitsu = 04h).
A read cycle at address 01h outputs device code (MBM29LV160TM : C4h in byte mode and 22C4h in word
mode ; MBM29LV160BM : 49h in byte mode and 2249h in word mode). Refer to “Sector Protection Verify
Autoselect Codes” in ■DEVICE BUS OPERATION.
To terminate the operation, it is necessary to write the Reset command into the register. To execute the Autoselect
command during the operation, Reset command must be written before the Autoselect command.
Programming
The devices are programmed on a word-by-word (or byte-by-byte ) basis. Programming is a four bus cycle
operation. There are 2 “unlock” write cycles. These are followed by the program set-up command and data write
cycles. Addresses are latched on the falling edge of CE or WE, whichever happens later and the data is latched
on the rising edge of CE or WE, whichever happens first. The rising edge of CE or WE (whichever happens first)
starts programming. Upon executing the Embedded Program Algorithm command sequence, the system is not
required to provide further controls or timings. The device will automatically provide adequate internally generated
program pulses and verify the programmed cell margin.
The system can determine the status of the program operation by using DQ7 (Data Polling), DQ6 (Toggle Bit) or
RY/BY. The Data Polling and Toggle Bit are automatically performed at the memory location being programmed.
The programming operation is completed when the data on DQ7 is equivalent to data written to this bit at which
the devices return to the read mode and plogram addresses are no longer latched. Therefore, the devices require
that a valid address to the devices be supplied by the system at this particular instance. Hence Data Polling
requires the same address which is being programmed.
If hardware reset occurs during the programming operation, the data being written is not guaranteed.
Programming is allowed in any address sequence and across sector boundaries. Beware that a data “0” cannot
be programmed back to a “1”. Attempting to do so may result in either failure condition or an apparent success
18
MBM29LV160TM/BM90
according to the data polling algorithm. But a read from Reset mode will show that the data is still “0”. Only erase
operations can convert “0”s to “1”s.
Note that attempting to program a “1” over a “0” will result in programming failure. This precaution is the same
with Fujitsu standard NOR devices. “Embedded ProgramTM Algorithm” in ■FLOW CHART illustrates the Embedded ProgramTM Algorithm using typical command strings and bus operations.
Program Suspend/Resume
The Program Suspend command allows the system to interrupt a program operation so that data can be read
from any address. Writing the Program Suspend command (B0h) during Embedded Program operation immediately suspends the programming. Refer to "Erase Suspend/Resume" for the detail.
When the Program Suspend command is written during a programming process, the device halts the program
operation within 1us and updates the status bits.After the program operation has been suspended, the system
can read data from any address. The data at program-suspended address is not valid. Normal read timing and
command definitions apply.
After the Program Resume command (30h) is written, the device reverts to programming. The system can
determine the status of the program operation using the DQ7 or DQ6 status bits, just as in the standard program
operation. See "Write Operation Status" for more information. When issuing program suspend command in
4 µs after issuing program command, determine the status of program operation by reading status bit at more
4 µs after issuing program resume command.
The system also writes the Autoselect command sequence in the Program Suspend mode. The device allows
reading Autoselect codes at the addresses within programming sectors, since the codes are not stored in the
memory. When the device exits the Autoselect mode, the device reverts to the Program Suspend mode, and is
ready for another valid operation. See "Autoselect Command" for more information.
The system must write the Program Resume command to exit from the Program Suspend mode and continue
the programming operation. Further writes of the Resume command are ignored. Another Program Suspend
command can be written after the device resumes programming.
Do not read CFI code after HiddenROM Entry and Exit in program suspend mode.
Chip Erase
Chip erase is a six bus cycle operation. It begins 2 “unlock” write cycles followed by writing the “set-up” command,
and 2 “unlock” write cycles followed by the chip erase command which invokes the Embedded Erase Algorithm.
The device does not require the user to program the device prior to erase. Upon executing the Embedded Erase
Algorithm the devices automatically programs and verifies the entire memory for an all zero data pattern prior
to electrical erase (Preprogram function). The system is not required to provide any controls or timings during
these operations.
The system can determine the erase operation status by using DQ7 (Data Polling), DQ6 (Toggle Bit I) and DQ2
(Toggle Bit II) or RY/BY output signal. The chip erase begins on the rising edge of the last CE or WE, whichever
happens first from last command sequence and completes when the data on DQ7 is “1” (See “Write Operation
Status”.) at which time the device returns to read mode.
Sector Erase
Sector erase is a six bus cycle operation. There are 2 “unlock” write cycles. These are followed by writing the
“set-up” command. 2 more “unlock” write cycles are then followed by the Sector Erase command.
Multiple sectors may be erased concurrently by writing the same six bus cycle operations. This sequence is
followed by writes of the Sector Erase command to addresses in other sectors desired to be concurrently erased.
The time between writes must be less than Erase Time-out time(tTOW). Otherwise that command will not be
accepted and erasure will not start. It is recommended that processor interrupts be disabled during this time to
guarantee this condition. The interrupts can reoccur after the last Sector Erase command is written. A time-out
of “tTOW” from the rising edge of last CE or WE, whichever happens first, will initiate the execution of the Sector
Erase command(s). If another falling edge of CE or WE, whichever happens first occurs within the “tTOW” timeout window the timer is reset (monitor DQ3 to determine if the sector erase timer window is still open, see section
19
MBM29LV160TM/BM90
“DQ3”, Sector Erase Timer). Resetting the devices once execution has begun will corrupt the data in the sector.
In that case, restart the erase on those sectors and allow them to complete (refer to “Write Operation Status”).
Loading the sector erase buffer may be done in any sequence and with any number of sectors (0 to 34).
Sector erase does not require the user to program the devices prior to erase. The devices automatically program
all memory locations in the sector(s) to be erased prior to electrical erase using the Embedded Erase Algorithm.
When erasing a sector, the remaining unselected sectors remain unaffected. The system is not required to
provide any controls or timings during these operations.
The system can determine the status of the erase operation by using DQ7 (Data Polling), DQ6 (Toggle Bit) or
RY/BY.
The sector erase begins after the “tTOW” time-out from the rising edge of CE or WE whichever happens first for
the last sector erase command pulse and completes when the data on DQ7 is “1” (see “Write Operation Status”),
at which the devices return to the read mode. Data polling and Toggle Bit must be performed at an address
within any of the sectors being erased.
Erase Suspend/Resume
The Erase Suspend command allows the user to interrupt Sector Erase operation and then perform read to a
sector not being erased. This command is applicable ONLY during the Sector Erase operation within the timeout period for sector erase. Writting the Erase Suspend command (B0h) during the Sector Erase time-out results
in immediate termination of the time-out period and suspension of the erase operation.
Writing the "Erase Resume" command (30h) resumes the erase operation.
When the "Erase Suspend" command is written during the Sector Erase operation, the device takes maximum
of “tSPD” to suspend the erase operation. When the devices enter the erase-suspended mode, the RY/BY output
pin will be at Hi-Z and the DQ7 bit will be at logic “1” and DQ6 will stop toggling. The user must use the address
of the erasing sector for reading DQ6 and DQ7 to determine if the erase operation has been suspended. Further
writes of the Erase Suspend command are ignored.
When the erase operation is suspended, the devices default to the erase-suspend-read mode. Reading data in
this mode is the same as reading from the standard read mode, except that the data must be read from sectors
that have not been erase-suspended. Reading successively from the erase-suspended sector while the device
is in the erase-suspend-read mode will cause DQ2 to toggle. see the section on DQ2.
To resume the operation of Sector Erase, the Resume command (30h) should be written. Any further writes of
the Resume command at this point will be ignored. Another Erase Suspend command can be written after the
chip has resumed erasing.
Do not issue program command after entering erase-suspend-read mode.
Fast Mode Set/Reset
The device has Fast Mode function. It dispenses with the initial two unclock cycles required in the standard
program command sequence by writing Fast Mode command into the command register. In this mode, the
required bus cycle for programming consists of two cycles instead of four bus cycles in standard program
command. During the Fast mode, do not write any commands other than the Fast program/Fast mode reset
command. The read operation is also executed after exiting this mode. To exit from this mode, write Fast Mode
Reset command into the command register. (Refer to the “Embedded ProgramTM Algorithm for Fast Mode” in
■FLOW CHART.) The VCC active current is required even CE = VIH during Fast Mode.
20
MBM29LV160TM/BM90
Fast Programming
During Fast Mode, the programming can be executed with two bus cycles operation. The Embedded Program
Algorithm is executed by writing program set-up command (A0h) and data write cycles (PA/PD). See “Embedded
ProgramTM Algorithm for Fast Mode” in ■FLOW CHART.
Extended Sector Protection
In addition to normal sector protection, the device has Extended Sector Protection as extended function. This
function enables protection of the sector by forcing VID on RESET pin and writes a command sequence. Unlike
conventional procedures, it is not necessary to force VID and control timing for control pins. The only RESET pin
requires VID for sector protection in this mode. The extended sector protection requires VID on RESET pin. With
this condition, the operation is initiated by writing the set-up command (60h) into the command register. Then
the sector addresses pins (A19, A18, A17, A16, A15, A14, A13 and A12) and (A6, A1, A0) = (0, 0, 1, 0) should be set to
the sector to be protected (set VIL for the other addresses pins is recommended), and write extended sector
protection command (60h). A sector is typically protected in 250 µs. To verify programming of the protection
circuitry, the sector addresses pins (A19, A18, A17, A16, A15, A14, A13 and A12) and (A6, A1, A0) = (0, 1, 0) should be
set and write a command (40h). Following the command write, a logical “1” at device output DQ0 will produce
for protected sector in the read operation. If the output data is logical “0”, write the extended sector protection
command (60h) again. To terminate the operation, set RESET pin to VIH. (Refer to the “Extended Sector Protection
Timing Diagram” in ■SWITCHING WAVEFORMS and “Extended Sector Protection Algorithm” in ■FLOW
CHART.)
Query Command (CFI : Common Flash Memory Interface)
The CFI (Common Flash Memory Interface) specification outlines device and host system software interrogation
handshake which allows specific vendor-specified software algorithms to be used for entire families of devices.
This allows device-independent, JEDEC ID-independent, and forward-and backward-compatible software support for the specified flash device families. Refer to CFI specification in detail.
The operation is initiated by writing the query command (98h) into the command register. Following the command
write, a read cycle from specific address retrieves device information. Please note that output data of upper byte
(DQ15 to DQ8) is “0”. Refer to “Common Flash Memory Interface Code” in ■DEVICE BUS OPERATION. To
terminate operation, it is necessary to write the Reset command sequence into the register. (See “Common
Flash Memory Interface Code” in ■DEVICE BUS OPERATION.)
Write Operation Status
Detailed in “Hardware Sequence Flags” are all the status flags which can determine the status of the device for
current mode operation. When checking Hardware Sequence Flags during program operations, it should be
checked 4 µs after issuing program command. During sector erase, the part provides the status flags automatically to the I/O ports. The information on DQ2 is address sensitive. If an address from an erasing sector is
consecutively read, then the DQ2 bit will toggle. However DQ2 will not toggle if an address from a non-erasing
sector is consecutively read. This allows the user to determine which sectors are erasing.
Once erase suspend is entered address sensitivity still applies. If the address of a non-erasing sector (one
available for read) is provided, then stored data can be read from the device. If the address of an erasing sector
(one unavailable for read) is applied, the device will output its status bits.
21
MBM29LV160TM/BM90
Hardware Sequence Flags
DQ7
DQ6
DQ5
DQ3
DQ2
DQ7
Toggle
0
0
1
0
Toggle
0
1
Toggle*1
Program-Suspend-Read
(Program Suspended Sector)
Data
Data
Data
Data
Data
Program-Suspend-Read
(Non-Program Suspended Sector)
Data
Data
Data
Data
Data
1
1
0
0
Toggle*1
Erase-Suspend-Read
(Non-Erase Suspended Sector)
Data
Data
Data
Data
Data
Erase-Suspend-Program
(Non-Erase Suspended Sector)
DQ7
Toggle
0
0
1*2
Embedded Program Algorithm
DQ7
Toggle
1
0
1
Exceeded Embedded Erase Algorithm
Time
Erase
Erase-Suspend-Program
Limits
Suspend
(Non-Erase Suspended Sector)
Mode
0
Toggle
1
1
N/A
DQ7
Toggle
1
0
N/A
Status
Embedded Program Algorithm
Embedded Erase Algorithm
In
Progress
Program
Suspend
Mode
Erase-Suspend-Read
(Erase Suspended Sector)
Erase
Suspend
Mode
*1 : Successive reads from the erasing or erase-suspend sector will cause DQ2 to toggle.
*2 : Reading from non-erase suspend sector address will indicate logic “1” at the DQ2 bit.
DQ7
Data Polling
The device features Data Polling as a method to indicate to the host that the Embedded Algorithms are in
progress or completed. During the Embedded Program Algorithm, an attempt to read devices will produce
reverse data last written to DQ7. Upon completion of the Embedded Program Algorithm, an attempt to read the
device will produce true data last written to DQ7. During the Embedded Erase Algorithm, an attempt to read the
device will produce a “0” at the DQ7 output. Upon completion of the Embedded Erase Algorithm, an attempt to
read device will produce a “1” at the DQ7 output. The flowchart for Data Polling (DQ7) is shown in “Data Polling
Algorithm” in ■FLOW CHART.
For programming, the Data Polling is valid after the rising edge of fourth write pulse in the four write pulse
sequence.
For chip erase and sector erase, the Data Polling is valid after the rising edge of the sixth write pulse in the six
write pulse sequence. Data Polling must be performed at sector addresses of sectors being erased, not protected
sectors. Otherwise, the status may become invalid.
If a program address falls within a protected sector, Data polling on DQ7 is active for approximately 1 µs, then
the device returns to read mode. After an erase command sequence is written, if all sectors selected for erasing
are protected, Data Polling on DQ7 is active for approximately 100 µs, then the device returns to read mode. If
not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and
ignores the selected sectors that are protected.
Once the Embedded Algorithm operation is close to being completed, the device data pins (DQ7) may change
asynchronously while the output enable (OE) is asserted low. This means that the device is driving status
information on DQ7 at one instant of time, and then that byte’s valid data the next. Depending on when the system
samples the DQ7 output, it may read the status or valid data. Even if the device completes the Embedded
22
MBM29LV160TM/BM90
Algorithm operation and DQ7 has a valid data, the data outputs on DQ6 to DQ0 may still be invalid. The valid data
on DQ7 to DQ0 will be read on the successive read attempts.
The Data Polling feature is active only during the Embedded Programming Algorithm, Embedded Erase Algorithm, Erase Suspend mode or sector erase time-out.
See “Data Polling during Embedded Algorithm Operation Timing Diagram” in ■SWITCHING WAVEFORMS for
the Data Polling timing specifications and diagram.
DQ6
Toggle Bit I
The device also features the “Toggle Bit I” as a method to indicate to the host system that the Embedded
Algorithms are in progress or completed.
During an Embedded Program or Erase Algorithm cycle, successive attempts to read (CE or OE toggling) data
from the devices will result in DQ6 toggling between one and zero. Once the Embedded Program or Erase
Algorithm cycle is completed, DQ6 will stop toggling and valid data will be read on the next successive attempts.
During programming, the Toggle Bit I is valid after the rising edge of the fourth write pulse in the four write pulse
sequences. For chip erase and sector erase, the Toggle Bit I is valid after the rising edge of the sixth write pulse
in the six write pulse sequences. The Toggle Bit I is active during the sector time out.
In programm operation, if the sector being written to is protected, the Toggle bit will toggle for about 1 µs and
then stop toggling with the data unchanged. In erase, the device will erase all the selected sectors except for
the protected ones. If all selected sectors are protected, the chip will toggle the Toggle bit for about 100 µs and
then drop back into read mode, having data kept remained.
Either CE or OE toggling will cause the DQ6 to toggle. See “Toggle Bit l Timing Diagram during Embedded
Algorithm Operations” in ■SWITCHING WAVEFORMS for the Toggle Bit I timing specifications and diagram.
DQ5
Exceeded Timing Limits
DQ5 will indicate if the program or erase time has exceeded the specified limits (internal pulse count). Under
these conditions DQ5 will produce a “1”. This is a failure condition indicating that the program or erase cycle was
not successfully completed. Data Polling is the only operating function of the device under this condition. The
CE circuit will partially power down the device under these conditions. The OE and WE pins will control the
output disable functions as described in “MBM29LV160TM/BM User Bus Operations (Word Mode : BYTE = VIH)”
and “MBM29LV160TM/BM User Bus Operations (Byte Mode : BYTE = VIL)” in ■DEVICE BUS OPERATION.
The DQ5 failure condition may also appear if a user tries to program a non blank location without pre-erase. In
this case the device locks out and never completes the Embedded Algorithm operation. Hence, the system never
reads a valid data on DQ7 bit and DQ6 never stop toggling. Once the device has exceeded timing limits, the DQ5
bit will indicate a “1”. Note that this is not a device failure condition since the device was incorrectly used. If this
occurs, reset the device with command sequence.
DQ3
Sector Erase Timer
After the completion of the initial sector erase command sequence the sector erase time-out will begin. DQ3 will
remain low until the time-out is complete. Data Polling and Toggle Bit are valid after the initial sector erase
command sequence.
If Data Polling or the Toggle Bit I indicates a valid erase command has been written, DQ3 may be used to
determine whether the sector erase timer window is still open. If DQ3 is “1” the internally controlled erase cycle
has begun. If DQ3 is “0”, the device will accept additional sector erase commands. To insure the command has
been accepted, the system software should check the status of DQ3 prior to and following each subsequent
Sector Erase command. If DQ3 were high on the second status check, the command may not have been accepted.
See “Hardware Sequence Flags”.
23
MBM29LV160TM/BM90
DQ2
Toggle Bit II
This Toggle bit II, along with DQ6, can be used to determine whether the devices are in the Embedded Erase
Algorithm or in Erase Suspend.
Successive reads from the erasing sector will cause DQ2 to toggle during the Embedded Erase Algorithm. If the
devices are in the erase-suspended-read mode, successive reads from the erase-suspended sector will cause
DQ2 to toggle. When the device is in the erase-suspended-program mode, successive reads from the non-erase
suspended sector will indicate a logic “1” at the DQ2 bit.
DQ6 is different from DQ2 in that DQ6 toggles only when the standard program or erase, or Erase Suspend
Program operation is in progress. The behavior of these two status bits, along with that of DQ7, is summarized
as follows:
For example, DQ2 and DQ6 can be used together to determine if the erase-suspend-read mode is in progress.
(DQ2 toggles while DQ6 does not.) See also “Hardware Sequence Flags” and “DQ2 vs. DQ6” in ■SWITCHING
WAVEFORMS.
Furthermore, DQ2 can also be used to determine which sector is being erased. At the erase mode, DQ2 toggles
if this bit is read from an erasing sector.
Reading Toggle Bits DQ6 / DQ2
Whenever the system initially begins reading Toggle bit status, it must read DQ7 to DQ0 at least twice in a row
to determine whether a Toggle bit is toggling. Typically a system would note and store the value of the Toggle
bit after the first read. After the second read, the system would compare the new value of the Toggle bit with the
first. If the Toggle bit is not toggling, the device has completed the program or erase operation. The system can
read array data on DQ7 to DQ0 on the following read cycle.
However, if, after the initial two read cycles, the system determines that the Toggle bit is still toggling, the system
also should note whether the value of DQ5 is high (see the section on “DQ5”) . If it is, the system should then
determine again whether the Toggle bit is toggling, since the Toggle bit may have stopped toggling just as DQ5
went high. If the Toggle bit is no longer toggling, the device has successfully completed the program or erase
operation. If it is still toggling, the device did not complete the operation successfully, and the system must write
the reset command to return to reading array data.
The remaining scenario is that the system initially determines that the Toggle bit is toggling and DQ5 has not
gone high. The system may continue to monitor the Toggle bit and DQ5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system
tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the
status of the operation. (Refer to “Toggle Bit Algorithm” in ■FLOW CHART.)
Toggle Bit Status
DQ7
DQ6
DQ2
DQ7
Toggle
1
Erase
0
Toggle
Toggle*1
Erase-Suspend-Read
(Erase-Suspended Sector)
1
1
Toggle*1
DQ7
Toggle
1*2
Mode
Program
Erase-Suspend-Program
*1 : Successive reads from the erasing or erase-suspend sector will cause DQ2 to toggle.
*2 : Reading from the non-erase suspend sector address will indicate logic “1” at the DQ2 bit.
24
MBM29LV160TM/BM90
RY/BY
Ready/Busy
The device provides a RY/BY open-drain output pin to indicate to the host system that the Embedded Algorithms
are either in progress or has been completed. If the output is low, the device is busy with either a program or
erase operation. If the output is high, the device is ready to accept any read/write or erase operation. If the
device is placed in an Erase Suspend mode, the RY/BY output will be high, by means of connecting with a pullup resister to VCC.
During programming, the RY/BY pin is driven low after the rising edge of the fourth WE pulse. During an erase
operation, the RY/BY pin is driven low after the rising edge of the sixth WE pulse. The RY/BY pin will indicate a
busy condition during the RESET pulse. See “RY/BY Timing Diagram during Program/Erase Operation Timing
Diagram”, “RESET Timing Diagram ( Not during Embedded Algorithms )” and “RESET Timing Diagram ( During
Embedded Algorithms )” in ■SWITCHING WAVEFORMS for a detailed timing diagram. The RY/BY pin is pulled
high in standby mode.
Since this is an open-drain output, RY/BY pins can be tied together in parallel with a pull-up resistor to VCC.
Word/Byte Configuration
BYTE pin selects the byte (8-bit) mode or word (16-bit) mode for the device. When this pin is driven high, the
device operates in the word (16-bit) mode. Data is read and programmed at DQ15 to DQ0. When this pin is driven
low, the device operates in byte (8-bit) mode. In this mode, DQ15/A-1 pin becomes the lowest address bit, and
DQ14 to DQ8 bits are tri-stated. However, the command bus cycle is always an 8-bit operation and hence commands are written at DQ7 to DQ0 and DQ15 to DQ8 bits are ignored.
Data Protection
The device is designed to offer protection against accidental erasure or programming caused by spurious system
level signals that may exist during power transitions. During power up the device automatically reset the internal
state machine in Read mode. Also, with its control register architecture, alteration of memory contents only
occurs after successful completion of specific multi-bus cycle command sequences.
The device also incorporates several features to prevent inadvertent write cycles resulting form VCC power-up
and power-down transitions or system noise.
(1) Low VCC Write Inhibit
To avoid initiation of a write cycle during VCC power-up and power-down, a write cycle is locked out for VCC less
than VLKO. If VCC < VLKO, the command register is disabled and all internal program/erase circuits are disabled.
Under this condition, the device will reset to the read mode. Subsequent writes will be ignored until the VCC level
is greater than VLKO. It is the user’s responsibility to ensure that the control pins are logically correct to prevent
unintentional writes when VCC is above VLKO.
If Embedded Erase Algorithm is interrupted, the intervened erasing sector(s) is(are) not valid.
(2) Write Pulse “Glitch” Protection
Noise pulses of less than 3 ns (typical) on OE, CE, or WE will not initiate a write cycle.
(3) Logical Inhibit
Writing is inhibited by holding any one of OE = VIL, CE = VIH, or WE = VIH. To initiate a write, CE and WE must
be a logical zero while OE is a logical one.
(4) Power-up Write Inhibit
Power-up of the devices with WE = CE = VIL and OE = VIH will not accept commands on the rising edge of WE.
The internal state machine is automatically reset to read mode on power-up.
(5) Sector Protection
Device user is able to protect each sector group individually to store and protect data. Protection circuit voids
both write and erase commands that are addressed to protected sectors.
Any commands to write or erase addressed to protected sector are ignored .
25
MBM29LV160TM/BM90
■ ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Symbol
Unit
Min
Max
Tstg
–55
+125
°C
TA
–20
+70
°C
VIN, VOUT
–0.5
VCC + 0.5
V
Power Supply Voltage *1
VCC
–0.5
+4.0
V
*1,*3
VIN
–0.5
+12.5
V
Storage Temperature
Ambient Temperature with Power Applied
Voltage with Respect to Ground All Pins Except
A9, OE, and RESET *1,*2
A9, OE, and RESET
*1 : Voltage is defined on the basis of VSS = GND = 0V.
*2 : Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input or I/O pins may undershoot
VSS to –0.2 V for periods of up to 20 ns. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage
transitions, input or I/O pins may overshoot to VCC +2.0 V for periods of up to 20 ns.
*3 : Minimum DC input voltage is –0.5V. During voltage transitions, these pins may undershoot VSS to –0.2 V for
periods of up to 20 ns.Voltage difference between input and supply voltage ( VIN–VCC) dose not exceed to
+9.0 V. Maximum DC input voltage is +12.5 V which may overshoot to +14.0 V for periods of up to 20 ns .
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS*1
Parameter
Symbol
Value
Min
Max
Unit
Ambient Temperature
TA
–20
+70
°C
VCC Supply Voltage *2
VCC
+3.0
+3.6
V
*1 : Operating ranges define those limits between which the functionality of the device is guaranteed.
*2 : Voltage is defined on the basis of VSS = GND = 0V.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
26
MBM29LV160TM/BM90
■ MAXIMUM OVERSHOOT/MAXIMUM UNDERSHOOT
+0.6 V
20 ns
20 ns
–0.5 V
–2.0 V
20 ns
Maximum Undershoot Waveform
20 ns
VCC +2.0 V
VCC +0.5 V
0.7 × VCC
20 ns
20 ns
Maximum Overshoot Waveform 1
20 ns
+14.0 V
+12.5 V
VCC +0.5 V
20 ns
20 ns
Note: This waveform is applied for A9, OE, and RESET.
Maximum Overshoot Waveform 2
27
MBM29LV160TM/BM90
■ ELECTRICAL CHARACTERISTICS
1. DC Characteristics
Parameter
Symbol
Value
Conditions
Min
Typ
Max
Input Leakage Current
ILI
VIN = VSS to VCC,
VCC = VCC Max
–1.0
—
+1.0
µA
Output Leakage Current
ILO
VOUT = VSS to VCC, VCC = VCC Max
–1.0
—
+1.0
µA
A9, OE, RESET Inputs Leakage
Current
ILIT
VCC = VCC Max,
A9, OE, RESET = 12.5 V
—
—
35
µA
VCC Active Current
(Read ) *1,*2
CE = VIL, OE = VIH,
f = 5 MHz
Word
—
18
20
Byte
—
16
20
CE = VIL, OE = VIH,
f = 10 MHz
Word
—
35
50
Byte
—
35
50
ICC1
mA
VCC Active Current
(Program / Erase) *2,*3
ICC3
CE = VIL, OE = VIH
—
50
60
mA
VCC Standby Current *2
ICC4
CE = VCC ±0.3 V, RESET = VCC ±0.3 V,
OE = VIH
—
1
5
µA
VCC Reset Current *2
ICC5
RESET = VCC ±0.3 V
—
1
5
µA
VCC Automatic Sleep Current *4
ICC6
CE = VSS ±0.3 V, RESET = VCC ±0.3 V,
VIN = VCC ±0.3V or Vss ±0.3V
—
1
5
µA
VCC Active Current
(Erase-Suspend-Program) *2
ICC7
CE = VIL, OE = VIH
—
50
60
mA
Input Low Level
VIL
—
–0.5
—
0.6
V
Input High Level
VIH
—
0.7×VCC
—
VCC +
0.3
V
Voltage for Autoselect, and
Temporary Sector Unprotected
VID
VCC = 3.0 V to 3.6 V
11.5
12.0
12.5
V
Output Low Voltage Level
VOL
IOL = 4.0 mA, VCC = VCC Min
—
—
0.45
V
Output High Voltage Level
VOH
IOH = –2.0 mA, VCC = VCC Min
0.85×VCC
—
—
V
Low VCC Lock-Out Voltage
VLKO
2.3
—
2.5
V
—
*1 : The lCC current listed includes both the DC operating current and the frequency dependent comnent.
*2 : Maximum ICC values are tested with VCC = VCC Max.
*3 : lCC active while Embedded Erase or Embedded Program is in progress.
*4 : Automatic sleep mode enables the low power mode when address remain stable for tACC + 30 ns.
28
Unit
MBM29LV160TM/BM90
2. AC Characteristics
• Read Only Operations Characteristics
Symbol
Parameter
JEDEC
Standard
Read Cycle Time
tAVAV
tRC
Address to Output Delay
tAVQV
tACC
Chip Enable to Output Delay
tELQV
tCE
Output Enable to Output Delay
tGLQV
tOE
Chip Enable to Output High-Z
tEHQZ
tDF
—
tOEH
Output Enable to Output High-Z
tGHQZ
Output Hold Time From Addresses,
CE or OE, Whichever Occurs First
Output Enable
Hold Time
Read
Toggle and Data Polling
RESET Pin Low to Read Mode
Condition
Value*
Unit
Min
Max
90

ns
CE = VIL,
OE = VIL

90
ns
OE = VIL

90
ns
—

25
ns
—

25
ns
—
0

ns
—
10

ns
tDF
—

25
ns
tAXQX
tOH
—
0

ns
—
tREADY
—

20
µs
—
* : Test Conditions : Output Load
: 1 TTL gate and 30 pF
Input rise and fall times : 5 ns
Input pulse levels
: 0.0 V or VCC
Timing measurement reference level
Input
: VCC / 2
Output : VCC / 2
3.3 V
Diode = 1N3064
or Equivalent
2.7 kΩ
Device
Under
Test
6.2 kΩ
CL
Diode = 1N3064
or Equivalent
Test Conditions
29
MBM29LV160TM/BM90
• Write (Erase/Program) Operations
Symbol
Parameter
Value
Unit
JEDEC
Standard
Min
Typ
Max
Write Cycle Time
tAVAV
tWC
90


ns
Address Setup Time
tAVWL
tAS
0


ns
—
tASO
15


ns
tWLAX
tAH
45


ns
—
tAHT
0


ns
Data Setup Time
tDVWH
tDS
35


ns
Data Hold Time
tWHDX
tDH
0


ns
Output Enable Setup Time
—
tOES
0


ns
CE High During Toggle Bit Polling
—
tCEPH
20


ns
OE High During Toggle Bit Polling
—
tOEPH
20


ns
Read Recover Time Before Write
(OE High to WE Low)
tGHWL
tGHWL
0


ns
Read Recover Time Before Write
(OE High to CE Low)
tGHEL
tGHEL
0


ns
CE Setup Time
tELWL
tCS
0


ns
WE Setup Time
tWLEL
tWS
0


ns
CE Hold Time
tWHEH
tCH
0


ns
WE Hold Time
tEHWH
tWH
0


ns
CE Pulse Width
tELEH
tCP
35


ns
Write Pulse Width
tWLWH
tWP
35


ns
CE Pulse Width High
tEHEL
tCPH
25


ns
Write Pulse Width High
tWHWL
tWPH
30


ns
tWHWH1
tWHWH1

25


25

tWHWH2
tWHWH2

1.0

s
VCC Setup Time
—
tVCS
50


µs
Recovery Time From RY/BY
—
tRB
0


ns
Address Setup Time to OE Low During
Toggle Bit Polling
Address Hold Time
Address Hold Time from CE or OE High
During Toggle Bit Polling
Programming Time
Sector Erase Operation *1
Word
Byte
µs
(Continued)
30
MBM29LV160TM/BM90
(Continued)
Symbol
Parameter
Value
Unit
JEDEC
Standard
Min
Typ
Max
—
tBUSY


90
ns
—
tVIDR
500


ns
—
tVLHT
4


µs
—
tWPP
100


µs
OE Setup Time to WE Active *2
—
tOESP
4


µs
2
CE Setup Time to WE Active *
—
tCSP
4


µs
RESET Pulse Width
—
tRP
500


ns
RESET High Time Before Read
—
tRH
100


ns
Delay Time from Embedded Output Enable
—
tEOE


90
ns
Erase Time-out Time
—
tTOW
50


µs
Erase Suspend Transition Time
—
tSPD


20
µs
Erase/Program Valid to RY/BY Delay
2
Rise Time to VID *
Voltage Transition Time *
2
Write Pulse Width*2
*1 : This does not include the preprogramming time.
*2 : This timing is for Sector Protection operation.
31
MBM29LV160TM/BM90
■ ERASE AND PROGRAMMING PERFORMANCE
Value
Parameter
Unit
Remarks
15
s
Excludes programming time prior to
erasure
25
1000
µs
Excludes system-level overhead
—
—
100
s
100,000
—
—
cycle
Min
Typ
Max
Sector Erase Time
—
1
Programming Time
—
Chip Programming Time
Erase/Program Cycle
■ TSOP (1) PIN CAPACITANCE
Value
Parameter
Input Capacitance
Symbol
CIN
Test Setup
VIN = 0
Unit
Typ
Max
8
10
pF
8.5
12
pF
Output Capacitance
COUT
VOUT = 0
Control Pin Capacitance
CIN2
VIN = 0
8
10
pF
OE Pin and RESET Pin Capacitance
CIN3
VIN = 0
20
25
pF
Note : Test conditions TA = +25°C, f = 1.0 MHz
■ FBGA PIN CAPACITANCE
Value
Parameter
Input Capacitance
Symbol
CIN
VIN = 0
Unit
Typ
Max
8
10
pF
8.5
12
pF
Output Capacitance
COUT
VOUT = 0
Control Pin Capacitance
CIN2
VIN = 0
8
10
pF
OE Pin and RESET Pin Capacitance
CIN3
VIN = 0
15
20
pF
Note : Test conditions TA = +25°C, f = 1.0 MHz
32
Test Setup
MBM29LV160TM/BM90
■ SWITCHING WAVEFORMS
• Key to Switching Waveforms
WAVEFORM
INPUTS
OUTPUTS
Must Be
Steady
Will Be
Steady
May
Change
from H to L
Will Be
Changing
from H to L
May
Change
from L to H
Will Be
Changing
from L to H
“H” or “L”
Any Change
Permitted
Changing
State
Unknown
Does Not
Apply
Center Line is
HighImpedance
“Off” State
tRC
Address
Address Stable
tACC
CE
tOE
tDF
OE
tOEH
WE
tCE
Data
High-Z
tOH
Output Valid
High-Z
Read Operation Timing Diagram
33
MBM29LV160TM/BM90
tRC
Address
Address Stable
tACC
CE
tRH
tRP
tRH
tCE
RESET
tOH
Data
High-Z
Output Valid
Hardware Reset/Read Operation Timing Diagram
34
MBM29LV160TM/BM90
3rd Bus Cycle
Data Polling
555h
Address
PA
tWC
tAS
PA
tRC
tAH
CE
tCH
tCS
tCE
OE
tGHWL
tWP
tWPH
tOE
tWHWH1
WE
tDS
Data
A0h
tOH
tDF
tDH
PD
DQ7
DOUT
DOUT
Notes : • PA is address of the memory location to be programmed.
• PD is data to be programmed at word address.
• DQ7 is the output of the complement of the data written to the device.
• DOUT is the output of the data written to the device.
• Figure indicates the last two bus cycles out of four bus cycle sequence.
Alternate WE Controlled Program Operation Timing Diagram
35
MBM29LV160TM/BM90
3rd Bus Cycle
Address
Data Polling
PA
555h
tWC
tAS
PA
tAH
WE
tWS
tWH
OE
tGHEL
tCP
tCPH
tWHWH1
CE
tDS
tDH
Data
A0h
PD
DQ 7
D OUT
Notes : • PA is address of the memory location to be programmed.
• PD is data to be programmed at word address.
• DQ7 is the output of the complement of the data written to the device.
• DOUT is the output of the data written to the device.
• Figure indicates the last two bus cycles out of four bus cycle sequence.
Alternate CE Controlled Program Operation Timing Diagram
36
MBM29LV160TM/BM90
555h
Address
tWC
2AAh
tAS
555h
555h
2AAh
SA*
SA*
tAH
CE
tCS
tCH
OE
tGHWL
tWP
tWPH
tDS
tDH
tTOW
WE
AAh
10h for Chip Erase
55h
80h
AAh
55h
Data
10h/
30h
30h
tBUSY
RY/BY
tVCS
VCC
* : SA is the sector address for Sector Erase. Addresses = 555h (Word), AAAh (Byte) for Chip Erase.
Chip/Sector Erase Operation Timing Diagram
37
MBM29LV160TM/BM90
XXXh
Address
tWC
CE
tCS
tCH
tWP
WE
tDS
tSPD
B0h
Data
RY/BY
Erase Suspend Operation Timing Diagram
38
MBM29LV160TM/BM90
VA
Address
CE
tCH
tDF
tOE
OE
tOEH
WE
4 ms
tCE
*
Data
DQ7
DQ7
DQ7 =
Valid Data
High-Z
tWHWH1 or 2
DQ6 to DQ0
DQ6 to DQ0 =
Output Flag
Data
tBUSY
DQ6 to DQ0
Valid Data
High-Z
tEOE
RY/BY
* : DQ7 = Valid Data (The device has completed the Embedded operation.)
Note : When checking Hardware Sequence Flags during program operations, it should be
checked 4 µs after issuing program command.
Data Polling during Embedded Algorithm Operation Timing Diagram
39
MBM29LV160TM/BM90
Address
tAHT tASO
tAHT tAS
CE
tCEPH
WE
tOEPH
4 ms
tOEH
OE
tOE
tDH
DQ 6/DQ2
tCE
Toggle
Data
Data
Toggle
Data
*
Toggle
Data
Stop
Toggling
Output
Valid
tBUSY
RY/BY
* : DQ6 stops toggling (The device has completed the Embedded operation).
Note : When checking Hardware Sequence Flags during program operations, it should be
checked 4 µs after issuing program command.
Toggle Bit l Timing Diagram during Embedded Algorithm Operations
Enter
Embedded
Erasing
WE
Erase
Suspend
Erase
Enter Erase
Suspend Program
Erase Suspend
Read
Erase
Suspend
Program
DQ6
DQ2*
Toggle
DQ2 and DQ6
with OE or CE
* : DQ2 is read from the erase-suspended sector.
DQ2 vs. DQ6
40
Erase
Resume
Erase Suspend
Read
Erase
Erase
Complete
MBM29LV160TM/BM90
CE
Rising edge of the last WE signal
WE
Entire programming
or erase operations
RY/BY
tBUSY
RY/BY Timing Diagram during Program/Erase Operation Timing Diagram
CE, OE
tRH
RESET
tRP
tREADY
RESET Timing Diagram (Not during Embedded Algorithms)
41
MBM29LV160TM/BM90
WE
RESET
tRP
tRB
RY/BY
tREADY
RESET Timing Diagram (During Embedded Algorithms)
42
MBM29LV160TM/BM90
A19 to A12
SPAX
SPAY
A6, A0
A1
VID
VIH
A9
t VLHT
VID
VIH
OE
t VLHT
t VLHT
t VLHT
t WPP
WE
t OESP
t CSP
CE
Data
01h
t VCS
t OE
VCC
SPAX : Sector Address to be protected
SPAY : Next Sector Address to be protected
Sector Protection Timing Diagram
43
MBM29LV160TM/BM90
VCC
tVCS tVIDR
tVLHT
VID
VSS, VIL or VIH
RESET
CE
WE
tVLHT
Program or Erase Command Sequence
RY/BY
Unprotection period
Temporary Sector Unprotection Timing Diagram
44
tVLHT
MBM29LV160TM/BM90
VCC
tVCS
RESET
tVLHT
tVIDR
Add
SAX
SAX
SAY
A6, A0
A1
CE
OE
TIME-OUT
WE
Data
60h
60h
40h
01h
60h
tOE
SPAX
: Sector Address to be protected
SPAY
: Next Sector Address to be protected
TIME-OUT : Time-Out window = 250 µs (Min)
Extended Sector Protection Timing Diagram
45
MBM29LV160TM/BM90
■ FLOW CHART
EMBEDDED ALGORITHMS
Start
Write Program
Command Sequence
(See Below)
Data Polling
No
Increment Address
No
Verify Data
?
Yes
Embedded
Program
Algorithm
in progress
Last Address
?
Yes
Programming Completed
Program Command Sequence (Address/Command):
555h/AAh
2AAh/55h
555h/A0h
Program Address/Program Data
Note : The sequence is applied for Word ( ×16 ) mode.
The addresses differ from Byte ( × 8 ) mode.
Embedded ProgramTM Algorithm
46
MBM29LV160TM/BM90
EMBEDDED ALGORITHMS
Start
Write Erase
Command Sequence
(See Below)
Data Polling
No
Data = FFh
?
Yes
Embedded
Erase
Algorithm
in progress
Erasure Completed
Chip Erase Command Sequence
(Address/Command):
Individual Sector/Multiple Sector
Erase Command Sequence
(Address/Command):
555h/AAh
555h/AAh
2AAh/55h
2AAh/55h
555h/80h
555h/80h
555h/AAh
555h/AAh
2AAh/55h
2AAh/55h
555h/10h
Sector Address
/30h
Sector Address
/30h
Sector Address
/30h
Additional sector
erase commands
are optional.
Note : The sequence is applied for Word ( ×16 ) mode.
The addresses differ from Byte ( × 8 ) mode.
Embedded EraseTM Algorithm
47
MBM29LV160TM/BM90
Start
Wait 4 ms
after issuing
Program Command
Read Byte
(DQ 7 to DQ 0)
Addr. = VA
DQ 7 = Data?
VA = Valid address for programming
= Any of the sector addresses within
the sector being erased during
sector erase or multiple sector
erases operation
= Any of the sector addresses within
the sector not being protected
during chip erase operation
Yes
No
No
DQ 5 = 1?
Yes
Read Byte
(DQ 7 to DQ 0)
Addr. = VA
DQ 7 = Data?
*
Yes
No
Fail
Pass
* : DQ7 is rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5.
Data Polling Algorithm
48
MBM29LV160TM/BM90
Start
Wait 4 ms
after issuing
Program Command
*1
Read DQ7 to DQ0
Addr. = "H" or "L"
*1
Read DQ7 to DQ0
Addr. = "H" or "L"
No
DQ6 = Toggle
?
Yes
No
DQ5 = 1?
Yes
*1, *2
Read DQ7 to DQ0
Addr. = "H" or "L"
*1, *2
Read DQ7 to DQ0
Addr. = "H" or "L"
DQ6 = Toggle
?
Yes
No
Program/Erase
Operation Not
Complete.Write
Reset Command
Program/Erase
Operation
Complete
*1 : Read Toggle bit twice to determine whether it is toggling.
*2 : Recheck Toggle bit because it may stop toggling as DQ5 changes to “1”.
Toggle Bit Algorithm
49
MBM29LV160TM/BM90
Start
Setup Sector Addr.
(A19 to A12)
PLSCNT = 1
OE = VID, A9 = VID
CE = VIL, RESET = VIH
A6 = A0 = VIL, A1 = VIH
Activate WE Pulse
Increment PLSCNT
Time out 250 µs
WE = VIH, CE = OE = VIL
(A9 should remain VID)
(
Read from Sector
Addr. = SA, A1 = VIH
A6 = A0 = VIL
)
No
No
PLSCNT = 25?
Yes
Data = 01h?
Yes
Remove VID from A9
Write Reset Command
Protect Another Sector?
No
Remove VID from A9
Write Reset Command
Device Failed
Sector Protection
Completed
Note : A-1 is VIL in Byte ( × 8 ) mode.
Sector Protection Algorithm
50
Yes
MBM29LV160TM/BM90
Start
RESET = VID
*1
Perform Erase or
Program Operations
RESET = VIH
Temporary Sector
Unprotection Completed
*2
*1 : All protected sectors are unprotected.
*2 : All previously protected sectors are protected.
Temporary Sector Unprotection Algorithm
51
MBM29LV160TM/BM90
Start
RESET = VID
Wait to 4 µs
Device is Operating in
Temporary Sector
Unprotection Mode
No
Extended Sector
Protection Entry?
Yes
To Setup Sector
Protection Write XXXh/60h
PLSCNT = 1
To Protect Sector
Write 60h to Sector Address
(A6 = A0 =VIL, A1 = VIH)
Time Out 250 µs
Increment PLSCNT
Setup Next Sector
Address
To Verify Sector Protection
Write 40h to Sector Address
(A6 = A0 =VIL, A1 = VIH)
Read from Sector
Address
(A6 = A0 =VIL, A1 = VIH)
No
No
PLSCNT = 25?
Yes
Remove VID from RESET
Write Reset Command
Data = 01h?
Yes
Yes
Protection Other Sector?
No
Device Failed
Remove VID from RESET
Write Reset Command
Sector Protection
Completed
Extended Sector Protection Algorithm
52
MBM29LV160TM/BM90
FAST MODE ALGORITHM
Start
555h/AAh
Set Fast Mode
2AAh/55h
555h/20h
XXXh/A0h
Program Address/Program Data
Data Polling
Verify Data?
No
In Fast Program
Yes
Increment Address
No
Last Address
?
Yes
Programming Completed
XXXh/90h
Reset Fast Mode
XXXh/F0h
Notes : • The sequence is applied for Word ( ×16 ) mode.
• The addresses differ from Byte ( × 8 ) mode.
Embedded ProgramTM Algorithm for Fast Mode
53
MBM29LV160TM/BM90
■ ORDERING INFORMATION
Part No.
MBM29LV160TM90TN
Package
Access Time (ns)
Remarks
48-pin, plastic TSOP (1)
(FPT-48P-M19)
(Normal Bend)
90 ns
Top Sector
90 ns
Bottom Sector
MBM29LV160TM90PBT
48-ball, plastic FBGA
(BGA-48P-M20)
MBM29LV160BM90TN
48-pin, plastic TSOP (1)
(FPT-48P-M19)
(Normal Bend)
MBM29LV160BM90PBT
MBM29LV160TM/BM
48-ball, plastic FBGA
(BGA-48P-M20)
90
TN
PACKAGE TYPE
TN = 48-Pin Thin Small Outline Package
(TSOP(1)) Standard Pinout
PBT = 48-Ball Fine Pitch Ball Grid Array
Package (FBGA)
SPEED OPTION
90 = 90 ns access time
DEVICE NUMBER/DESCRIPTION
16 Mega-bit (2M × 8/1M × 16) MirrorFlash,
Boot Sector
3.0 V-only Read, Program, and Erase
54
MBM29LV160TM/BM90
■ PACKAGE DIMENSIONS
Note 1) * : Values do not include resin protrusion.
Resin protrusion and gate protrusion are +0.15(.006)Max(each side).
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
48-pin plastic TSOP(1)
(FPT-48P-M19)
LEAD No.
1
48
INDEX
Details of "A" part
0.25(.010)
0~8˚
0.60±0.15
(.024±.006)
24
25
* 12.00±0.20
20.00±0.20
(.787±.008)
* 18.40±0.20
(.724±.008)
"A"
0.10(.004)
(.472±.008)
+0.10
1.10 –0.05
+.004
.043 –.002
(Mounting
height)
+0.03
0.17 –0.08
+.001
.007 –.003
C
0.10±0.05
(.004±.002)
(Stand off height)
0.50(.020)
0.22±0.05
(.009±.002)
0.10(.004)
M
2003 FUJITSU LIMITED F48029S-c-6-7
Dimensions in mm (inches)
Note : The values in parentheses are reference values.
(Continued)
55
MBM29LV160TM/BM90
(Continued)
48-ball plastic FBGA
(BGA-48P-M20)
+0.12
8.00±0.20(.315±.008)
+.003
1.08 –0.13 .043 –.005
(Mounting height)
0.38±0.10(.015±.004)
(Stand off)
5.60(.220)
0.80(.031)TYP
6
5
6.00±0.20
(.236±.008)
4
4.00(.157)
3
2
1
H
(INDEX AREA)
G
F
E
D
48-ø0.45±0.05
(48-ø.018±.002)
C
B
A
ø0.08(.003)
M
0.10(.004)
C
2003 FUJITSU LIMITED B48020S-c-2-2
Dimensions in mm (inches)
Note : The values in parentheses are reference values.
56
MBM29LV160TM/BM90
FUJITSU LIMITED
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information, such as descriptions of function and application
circuit examples, in this document are presented solely for the
purpose of reference to show examples of operations and uses of
Fujitsu semiconductor device; Fujitsu does not warrant proper
operation of the device with respect to use based on such
information. When you develop equipment incorporating the
device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu
assumes no liability for any damages whatsoever arising out of
the use of the information.
Any information in this document, including descriptions of
function and schematic diagrams, shall not be construed as license
of the use or exercise of any intellectual property right, such as
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Fujitsu assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result
from the use of information contained herein.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
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of those products from Japan.
F0312
 FUJITSU LIMITED Printed in Japan
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