TI1 ADS8513IBDW 16-bit, 40ksps, low-power sampling analog-to-digital converter with internal reference and parallel/serial interface Datasheet

ADS8513
www.ti.com ...................................................................................................................................................... SLAS486C – JUNE 2007 – REVISED JANUARY 2009
16-Bit, 40kSPS, Low-Power Sampling ANALOG-TO-DIGITAL CONVERTER
with Internal Reference and Parallel/Serial Interface
FEATURES
APPLICATIONS
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40kSPS Minimum Sampling Rate
Very Low Power: 24mW Typ
±3.33V, ±5V, ±10V, 4V, and 10V Input Ranges
89dB SNR with 10kHz Input
±2LSB Max INL
–1/+2LSB Max DNL, 16-Bit NMC
±10mV BPZ, ±2.5ppm/°C BPZ Drift
89dB Min SINAD, 102dB Min SFDR
Uses Internal or External 2.5V Reference
No External Calibration Resistors Required
Single 5V Analog Supply:
– 32.5mW Max Power Dissipation
– 50µW Max Power-Down Mode
SPI™-Compatible Serial Port up to 20MHz,
with Master/Slave Feature
Global CONV and 3-Stated Bus for Multi-Chip
Simultaneous S/H Operation
Pin-Compatible with 16-Bit ADS7813 and
12-Bit ADS7812 and ADS8512
SO-16 Package
Industrial Process Control
Test Equipment
Robotics
DSP Servo Control
Medical Instrumentation
Portable Data Acquisition Systems
DESCRIPTION
The ADS8513 is a complete low-power, single 5V
supply, 16-bit sampling analog-to-digital (A/D)
converter.
It
contains
a
complete
16-bit
capacitor-based, successive approximation register
(SAR) A/D converter with sample and hold, clock,
reference, and serial data interface. The converter
can be configured for a variety of input ranges
including ±10V, ±5V, 0V to 10V, and 0.5V to 4.5V. A
high-impedance, 0.3V to 2.8V input is also available
with input impedance greater than 10MΩ. For most
input ranges, the input voltage can swing to 25V or
–25V without damage to the converter.
An SPI-compatible serial interface allows data to be
synchronized to an internal or external clock. The
ADS8513 is specified at 40kSPS sampling rate over
the –40°C to +85°C industrial temperature range.
Successive Approximation Register
Clock
EXT/INT
CDAC
40kΩ
R1IN
PWRD
8kΩ
R2IN
20kΩ
R3IN
Comparator
Serial
Data
Out
and
Control
BUSY
CS
CONV
SDATA
DATACLK
BUF
CAP
Buffer
4kΩ
REF
Internal
+2.5 V Ref
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI, QSPI are trademarks of Motorola, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2009, Texas Instruments Incorporated
ADS8513
SLAS486C – JUNE 2007 – REVISED JANUARY 2009 ...................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
MINIMUM
INL
(LSB)
NO
MISSING
CODES
MINIMUM
SINAD
(dB)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
LEAD
PACKAGE
DESIGNATOR
ADS8513IB
±2
16-Bit
89
–40°C to +85°C
SO-16
DW
ADS8513I
±3
15-Bit
88
–40°C to +85°C
SO-16
DW
(1)
ORDERING
NUMBER
TRANSPORT
MEDIA, QTY
ADS8513IBDW
Tube, 20
ADS8513IBDWR
Tape and Reel, 1000
ADS8513IDW
Tube, 20
ADS8513IDWR
Tape and Reel, 1000
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted).
PARAMETER
Analog inputs
Ground voltage differences
UNIT
R1IN
±25V
R2IN
±25V
R3IN
±25V
REF
VS + 0.3V to GND – 0.3V
GND
±0.3V
VS
6V
Digital inputs
–0.3V to +VS + 0.3V
Maximum junction temperature
+165°C
Storage temperature range
–65°C to +150°C
Internal power dissipation
700mW
Lead temperature (soldering, 1,6 mm from case 10 seconds)
+260°C
(1)
(2)
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
ELECTRICAL CHARACTERISTICS
At TA = –40°C to +85°C, fS = 40kSPS, VS = 5V, and using internal reference and fixed resistors, unless otherwise specified.
ADS8513I
PARAMETER
TEST CONDITIONS
MIN
TYP
ADS8513IB
MAX
Resolution
MIN
TYP
16
MAX
16
UNIT
Bits
ANALOG INPUT
Voltage ranges
see Table 1
see Table 1
V
Impedance
see Table 1
see Table 1
Ω
Capacitance
45
45
pF
THROUGHPUT SPEED
2
Conversion time
Acquire and convert
20
20
Complete cycle
Acquire and convert
25
25
Throughput rate
Acquire and convert
40
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40
µs
µs
kSPS
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS8513
ADS8513
www.ti.com ...................................................................................................................................................... SLAS486C – JUNE 2007 – REVISED JANUARY 2009
ELECTRICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, fS = 40kSPS, VS = 5V, and using internal reference and fixed resistors, unless otherwise specified.
ADS8513I
PARAMETER
TEST CONDITIONS
MIN
TYP
ADS8513IB
MAX
MIN
TYP
MAX
UNIT
DC ACCURACY
INL
Integral linearity error
–3
3
–2
2
LSB (1)
DNL
Differential linearity error
–2
3
–1
2
LSB
No missing codes
15
16
Transition noise (2)
0.6
Full-scale error (3) (4)
–0.5
0.5
Full-scale error drift
Bits
0.6
–0.25
10
LSB
0.25
10
%
ppm/°C
Full-scale error (3) (4)
External 2.5V reference
Full-scale error drift
External 2.5V reference
Bipolar zero error (3)
Bipolar ranges
Bipolar zero error drift
Bipolar ranges
Unipolar zero error (3)
Unipolar ranges
Unipolar zero error drift
Unipolar ranges
2.5
2.5
ppm/°C
Recovery time to rated accuracy from
power down (5)
1µF capacitor to CAP
300
300
µs
Power-supply sensitivity
+4.75V < VS < +5.25V
–0.5
0.5
–0.25
0.2
–10
10
–10
2.5
–6
0.25
0.2
10
2.5
6
–6
mV
ppm/°C
6
±8
%
ppm/°C
±8
mV
LSB
AC ACCURACY
SFDR
Spurious-free dynamic range
fIN = 1kHz, ±10V
THD
Total harmonic distortion
fIN = 1kHz, ±10V
SINAD
Signal-to-(noise+distortion)
SNR
Signal-to-noise
fIN = 1kHz, ±10V
90
100
–98
85
–90
89
-60 dB Input
fIN = 1kHz, ±10V
96
–100
87
30
85
dB (6)
102
–96
89
dB
32
89
87
dB
89
dB
Usable bandwidth (7)
130
130
kHz
Full-power bandwidth (–3dB)
600
600
kHz
Aperture delay
40
40
ns
Aperture jitter
20
20
ps
5
5
µs
750
750
ns
SAMPLING DYNAMICS
Transient response
FS step
Overvoltage recovery (8)
REFERENCE
Internal reference voltage
No load
2.48
(6)
(7)
(8)
2.48
2.5
2.52
V
1
µA
Internal reference drift
8
8
ppm/°C
External reference current drain
(5)
2.52
1
External reference voltage range for
specified linearity
(1)
(2)
(3)
(4)
2.5
Internal reference source current (must
use external buffer)
2.3
External 2.5V ref
2.5
2.7
100
2.3
2.5
2.7
V
100
µA
LSB means Least Significant Bit. 1 LSB for the ±10V input range is 305µV.
Typical rms noise at worst case transitions.
As measured with fixed resistors. Adjustable to zero with external potentiometer.
Full-scale error is the worst case of –Full Scale or +Full Scale deviation from ideal first and last code transitions, divided by the full-scale
range; includes the effect of offset error. Tested at –40°C to +85°C.
Time delay after the ADS8513 is brought out of Power-Down mode until all internal settling occurs and the analog input is acquired to
rated accuracy. A Convert command after this delay will yield accurate results.
All specifications in dB are referred to a full-scale input.
Usable bandwidth defined as full-scale input frequency at which Signal-to-(Noise + Distortion) degrades to 60dB.
Recovers to specified performance after 2 x FS input overvoltage.
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ELECTRICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, fS = 40kSPS, VS = 5V, and using internal reference and fixed resistors, unless otherwise specified.
ADS8513I
PARAMETER
TEST CONDITIONS
MIN
TYP
ADS8513IB
MAX
MIN
TYP
MAX
UNIT
V
DIGITAL INPUTS
VIL
Low-level input voltage
–0.3
+0.8
–0.3
+0.8
VIH
High-level input voltage
2.0
VD +0.3 V
2.0
VD +0.3 V
IIL
Low-level input current
VIL = 0V
±10
µA
IIH
High-level input current
VIH = 5V
±10
µA
V
DIGITAL OUTPUTS
Data format
Serial
Serial
Data coding
Binary twos complement
Binary twos complement
VOL
Low-level output voltage
ISINK = 1.6mA
VOH
High-level output voltage
ISOURCE = 500µA
0.4
Leakage Current
High-Z state,
VOUT = 0V to VS
±1
±1
µA
Output capacitance
High-Z state
15
15
pF
Bus access time
RL = 3.3kΩ, CL = 50pF
83
83
ns
Bus relinquish time
RL = 3.3kΩ, CL = 10pF
83
83
ns
5.25
V
4
0.4
4
V
V
DIGITAL TIMING
POWER SUPPLIES
VS
Supply voltage
4.75
IDIG
Digital current
0.6
0.6
IANA
Analog current
4.2
4.2
Power dissipation
5
VS = 5V, fS = 40kSPS
24
PWRD and REFD high
50
5.25
4.75
32.5
5
24
mA
mA
32.5
mW
µW
50
TEMPERATURE RANGE
θJA
Specified performance
–40
+85
–40
+85
°C
Derated performance
–55
+125
–55
+125
°C
Storage temperature
–65
+150
–65
+150
Thermal resistance
46
46
°C
°C/W
Table 1. Input Ranges
ANALOG INPUT RANGE
CONNECT R1IN
TO
CONNECT R2IN
TO
CONNECT R3IN
TO
4
INPUT IMPEDANCE
(kΩ)
±10V
VIN
BUF
GND
45.7
0.3125V to 2.8125V
VIN
VIN
VIN
> 10,000
±5V
GND
BUF
VIN
26.7
0V to 10V
BUF
GND
VIN
26.7
0V to 4V
BUF
VIN
GND
21.3
±3.33V
VIN
BUF
VIN
21.3
0.5V to 4.5V
GND
VIN
GND
21.3
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Product Folder Link(s): ADS8513
ADS8513
www.ti.com ...................................................................................................................................................... SLAS486C – JUNE 2007 – REVISED JANUARY 2009
PIN CONFIGURATION
DW PACKAGE
SO-16
(TOP VIEW)
R1IN 1
GND 2
16 VS
R2IN 3
14 BUSY
R3IN 4
13 CS
15 PWRD
BUF 5
12 CONV
CAP 6
11 EXT/INT
REF 7
10 DATA
GND 8
9
DATACLK
Pin Assignments
PIN
DIGITAL
I/O
NAME
NO.
R1IN
1
Analog input. See Table 1 and Table 3.
R2IN
3
Analog input. See Table 1 and Table 3.
R3IN
4
Analog input. See Table 1 and Table 3.
BUF
5
Reference buffer output. Connect to R1IN, R2IN, or R3IN as needed
6
Reference buffer compensation node. Decouple to ground with a 1-µF tantalum capacitor in parallel
with a 0.01µF ceramic capacitor.
7
Reference input/output. Outputs internal 2.5V reference via a series 4kΩ resistor. Decouple this
voltage with a 1µF to 2.2µF tantalum capacitor to ground. If an external reference voltage is applied
to this pin, it overrides the internal reference.
CAP
REF
9
I/O
Data clock pin. With EXT/INT low, this pin is an output and provides the synchronous clock for the
serial data. The output is 3-stated when CS is high. With EXT/INT high, this pin is an input and the
serial data clock must be provided externally.
10
O
Serial data output. The serial data are always the result of the last completed conversion and are
synchronized to DATACLK. If DATACLK is from the internal clock (EXT/INT low), the serial data are
valid on both the rising and falling edges of DATACLK. DATA is 3-stated when CS is high.
11
I
External/Internal DATACLK pin. Selects the source of the synchronous clock for serial data. If high,
the clock must be provided externally. If low, the clock is derived from the internal conversion clock.
Note that the clock used to time the conversion is always interna,l regardless of the status of
EXT/INT.
DATACLK
DATA
EXT/INT
12
Convert input. A falling edge on this input puts the internal sample/hold into the hold state and starts
a conversion regardless of the state of CS. If a conversion is already in progress, the falling edge is
ignored. If EXT/INT is low, data from the previous conversion are serially transmitted during the
current conversion.
CONV
13
I
Chip select. This input 3-states all outputs when high and enables all outputs when low, including
DATA, BUSY, and DATACLK (when EXT/INT is low). Note that a falling edge on CONV initiates a
conversion even when CS is high.
14
O
Busy output. When a conversion starts, BUSY goes low and remains low throughout the conversion.
If EXT/INT is low, data are serially transmitted while BUSY is low. BUSY is 3-stated when CS is
high.
15
I
Power-down input. When high, the majority of the ADS8513 circuitry is placed in a low-power mode
and power consumption is significantly reduced. (The ADS7813 requires CONV be taken low before
PWRD goes low in order to achieve the lowest power consumption. This is not necessary for the
ADS8513 and it does not cause interference if performed.) The time required for the ADS7813 to
return to normal operation after power down depends on a number of factors. Consult the Chapter 0
section for more information.
CS
BUSY
PWRD
GND
VS
DESCRIPTION
2, 8
Ground.
16
+5V supply input. For best performance, decouple to ground with a 0.1µF ceramic capacitor in
parallel with a 10µF tantalum capacitor.
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TYPICAL CHARACTERISTICS
POWER-SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
INTERNAL REFERENCE VOLTAGE
vs
FREE-AIR TEMPERATURE
5
4.5
4
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA - Free-Air Temperature - ºC
2.510
2.505
2.500
2.495
2.490
2.485
5.5
5
4.5
4
10
2.480
-40 -25 -10 5 20 35 50 65 80 95 110125
TA - Free-Air Temperature - ºC
30
20
fs - Sampling Frequency - kHz
40
Figure 1.
Figure 2.
Figure 3.
BIPOLAR OFFSET ERROR
vs
FREE-AIR TEMPERATURE
BIPOLAR POSITIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
BIPOLAR NEGATIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
6
3
0
-3
-6
-45 -30 -15 0 15 30 45 60 75 90 105 120
TA - Free-Air Temperature - °C
0.1
Bipolar Negative Full-Scale Error - %FSR
20 V Bipolar Range,
Drift = 1.5 ppm/°C
Bipolar Positive Full-Scale Error - %FSR
9
20 V Bipolar Range,
Drift = 9.2 ppm/°C
0.05
0
-0.05
-0.1
-45 -30 -15 0 15 30 45 60 75 90 105 120
TA - Free-Air Temperature - °C
0.15
20 V Bipolar Range,
Drift = 12.2 ppm/°C
0.1
0.05
0
-0.05
-0.1
-0.15
-45 -30 -15 0 15 30 45 60 75 90 105 120
TA - Free-Air Temperature - °C
Figure 5.
Figure 6.
BIPOLAR OFFSET ERROR
vs
FREE-AIR TEMPERATURE
BIPOLAR POSITIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
BIPOLAR NEGATIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
0.2
9
10 V Bipolar Range,
Drift = 0.8 ppm/°C
6
3
0
-3
-6
-45 -30 -15 0 15 30 45 60 75 90 105 120
TA - Free-Air Temperature - °C
Figure 7.
10 V Bipolar Range,
Drift = 10.3 ppm/°C
0.15
0.1
0.05
0
-0.05
-45 -30 -15 0 15 30 45 60 75 90 105 120
TA - Free-Air Temperature - °C
Figure 8.
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Bipolar Negative Full-Scale Error - %FSR
Figure 4.
Bipolar Positive Full-Scale Error - %FSR
Bipolar Offset Error - mV
2.515
ICC - Power Supply Current - mA
Vref - Internal Reference Voltage - V
ICC - Power Supply Current - mA
5.5
Bipolar Offset Error - mV
6
2.520
6
6
POWER-SUPPLY CURRENT
vs
SAMPLING FREQUENCY
0.1
0.05
10 V Bipolar Range,
Drift = 13.5 ppm/°C
0
-0.05
-0.1
-0.15
-0.2
-45 -30 -15 0 15 30 45 60 75 90 105 120
TA - Free-Air Temperature - °C
Figure 9.
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TYPICAL CHARACTERISTICS (continued)
UNIPOLAR POSITIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
1
0
-1
2
10 V Unipolar Range,
Drift = 2.8 ppm/°C
4 V Unipolar Range,
Drift = 0.1 ppm/°C
1
0
-1
-2
-45 -30 -15 0 15 30 45 60 75 90 105 120
TA - Free-Air Temperature - °C
0.15
-45 -30 -15 0 15 30 45 60 75 90 105 120
TA - Free-Air Temperature - °C
Figure 10.
Figure 11.
Figure 12.
UNIPOLAR POSITIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
SPURIOUS FREE DYNAMIC RANGE
vs
FREE-AIR TEMPERATURE
TOTAL HARMONIC DISTORTION
vs
FREE-AIR TEMPERATURE
10 V Unipolar Range,
Drift = 0.4 ppm/°C
0.15
-45 -30 -15 0 15 30 45 60 75 90 105 120
TA - Free-Air Temperature - °C
-80
fi = 10 kHz, 0 dB
105
100
95
90
85
80
-50
50
-25
0
75 100
25
TA - Free-Air Temperature - ºC
125
fi = 10 kHz, 0 dB
-85
-90
-95
-100
-105
-110
-50
50
0
75 100
25
TA - Free-Air Temperature - ºC
-25
125
Figure 13.
Figure 14.
Figure 15.
SIGNAL-TO-NOISE RATIO
vs
FREE-AIR TEMPERATURE
SIGNAL-TO-NOISE + DISTORTION
vs
FREE-AIR TEMPERATURE
SIGNAL-TO-NOISE + DISTORTION
vs
FREQUENCY
SINAD - Signal-To-Noise + Distortion - dB
fi = 10 kHz, 0 dB
105
100
95
90
85
80
-50
110
THD - Total Harmonic Distortion - dB
0.2
110
SNR - Signal-To-Noise Ratio - dB
0.2
50
0
75 100
25
TA - Free-Air Temperature - ºC
-25
125
Figure 16.
110
SINAD - Signal-To-Noise + Distortion - dB
Unipolar Positive Full-Scale Error - %FSR
-2
-45 -30 -15 0 15 30 45 60 75 90 105 120
TA - Free-Air Temperature - °C
SFDR - Spurious Free Dynamic Range - dB
Unipolar Offset Error - mV
4 V Unipolar Range,
Drift = 2.8 ppm/°C
UNIPOLAR OFFSET ERROR
vs
FREE-AIR TEMPERATURE
Unipolar Offset Error - mV
2
Unipolar Positive Full-Scale Error - %FSR
UNIPOLAR OFFSET ERROR
vs
FREE-AIR TEMPERATURE
fi = 10 kHz, 0 dB
105
100
95
90
85
80
-50
50
75 100
25
TA - Free-Air Temperature - ºC
-25
0
Figure 17.
125
100
0 dB
90
80
-20 dB
70
60
50
40
-60 dB
30
20
10
0
2
4
6 8 10 12 14 16 18 20
f - Frequency - kHz
Figure 18.
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TYPICAL CHARACTERISTICS (continued)
SIGNAL-TO-NOISE RATIO
vs
FREQUENCY
95
fs = 20 kHz
fs = 40 kHz
fs = 30 kHz
fs = 10 kHz
90
85
80
75
-50
90
80
70
60
-25
0
25
50
75 100
TA - Free-Air Temperature - ºC
0
125
1
10
100
f - Frequency - kHz
1000
100
fi = 0 dB
90
80
70
60
0
1
10
100
f - Frequency - kHz
1000
Figure 20.
Figure 21.
SPURIOUS FREE DYNAMIC RANGE
vs
FREQUENCY
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
SPURIOUS FREE DYNAMIC RANGE
vs
ESR
110
SFDR - Spurious Free Dynamic Range - dB
Figure 19.
-70
fi = 0 dB
100
90
80
70
0
fi = 0 dB
-80
-90
-100
-110
-120
1
10
100
f - Frequency - kHz
1000
0
1
10
100
f - Frequency - kHz
110
fi = 10 kHz, 0 dB
105
100
95
90
85
80
0 1
1000
2
3
4
5 6
ESR - W
7
8
9
10
Figure 22.
Figure 23.
Figure 24.
TOTAL HARMONIC DISTORTION
vs
ESR
SIGNAL-TO-NOISE RATIO
vs
ESR
SIGNAL-TO-NOISE + DISTORTION
vs
ESR
SINAD - Signal-To-Noise + Distortion - dB
110
fi = 10 kHz, 0 dB
fi = 10 kHz, 0 dB
SNR - Signal-To-Noise Ratio - dB
THD - Total Harmonic Distortion - dB
fi = 0 dB
SINAD - Signal-To-Noise + Distortion - dB
SNR - Signal-To-Noise Ratio - dB
fi = 10 kHz, 0 dB
-80
-85
-90
-95
-100
-105
-110
105
100
95
90
85
80
0 1
2
3
4
5 6
ESR - W
7
8
9
10
Figure 25.
8
SIGNAL-TO-NOISE + DISTORTION
vs
FREQUENCY
100
100
THD - Total Harmonic Distortion - dB
SFDR - Spurious Free Dynamic Range - dB
SINAD - Signal-To-Noise + Distortion - dB
SIGNAL-TO-NOISE + DISTORTION
vs
FREE-AIR TEMPERATURE
0 1
2
3
4
5 6
ESR - W
7
8
9
Figure 26.
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10
110
fi = 10 kHz, 0 dB
105
100
95
90
85
80
0 1
2
3
4
5 6
ESR - W
7
8
9
10
Figure 27.
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TYPICAL CHARACTERISTICS (continued)
OUTPUT REJECTION
vs
POWER-SUPPLY RIPPLE
FREQUENCY
CONVERSION TIME
vs
FREE-AIR TEMPERATURE
-20
-25
Silicon tested under
10 V Bipolar range
17.7
Output Rejection - dB
tCONVERT - Conversion Time - μs
17.8
17.6
17.5
17.4
-30
-35
-40
-45
-50
-55
17.3
-60
17.2
-50
-25
0
25
50
75
100
TA - Free-Air Temperature - ºC
-65
10
125
100
1k
10 k
100 k
1M
Power Supply Ripple Frequency - Hz
Figure 28.
Figure 29.
INL
3
2
INL - LSBs
1
0
-1
-2
-3
0
8192
16384
24576
32768
40960
49152
57344
65535
40960
49152
57344
65535
Code
Figure 30.
DNL
3
2
DNL - LSBs
1
0
-1
-2
-3
0
8192
16384
24576
32768
Code
Figure 31.
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TYPICAL CHARACTERISTICS (continued)
FFT
0
-10
8192 Point FFT; fi = 20 kHz, 0 dB
-20
Amplitude - dB
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
0
5
10
f - Frequency - kHz
15
20
Figure 32.
Amplitude - dB
FFT
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
8192 Point FFT; fi = 10 kHz, 0 dB
0
5
10
f - Frequency - kHz
15
20
Figure 33.
10
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BASIC OPERATION
INTERNAL DATACLK
Figure 34 shows a basic circuit to operate the ADS8513 with a ±10V input range using an internal DATACLK. To
begin a conversion and serial transmission of the results from the previous conversion, a falling edge must be
provided to the CONV input. BUSY goes low to indicate that a conversion has started, and stays low until the
conversion is complete. During the conversion, the results of the previous conversion are transmitted via DATA
while DATACLK provides the synchronous clock for the serial data. The data format is 16-bit, binary twos
complement, MSB first. Each data bit is valid on both the rising and falling edge of DATACLK. BUSY is low
during the entire serial transmission and can be used as a frame synchronization signal.
C2
C1
0.1µF 10µF
ADS8513
±10V
C3
1µF
+
C4
0.01µF
C5
1µF
+
1
R1IN
VS 16
2
GND
PWRD 15
3
R2IN
BUSY 14
4
R3IN
CS 13
5
BUF
CONV 12
6
CAP
EXT/INT 11
7
REF
DATA
10
8
GND
DATACLK
9
+5V
+
Frame Sync (optional)
Convert Pulse
40ns min
Figure 34. Basic Operating Circuit, ±10V Input Range, Internal DATACLK
EXTERNAL DATACLK
Figure 35 shows another basic circuit to operate the ADS8513 with a ±10V input rangeusing an external
DATACLK. To begin a conversion, a falling edge must be provided to the CONV input. BUSY goes low to
indicate that a conversion has started,and stays low until the conversion is complete. Just before BUSY rises
near the end of the conversion, the conversion result held in the internal working register is transferred to the
internal shift register.
The internal shift register is clocked via the DATACLK input. The recommended method of reading the
conversion result is to provide the serial clock after the conversion has completed. See External DATACLK under
the Reading Data section of this data sheet for more information.
C1
C2
0.1µF 10µF
ADS8513
±10V
C3
1µF
+
C4
0.01µF
C5
1µF
+
1
R1IN
VS 16
2
GND
PWRD 15
3
R2IN
BUSY 14
4
R3IN
CS 13
5
BUF
CONV 12
6
CAP
EXT/INT 11
7
REF
DATA
10
8
GND
DATACLK
9
+5V
+
Interrupt (optional)
Chip Select (optional(1))
Convert Pulse
+5V
40ns min
External Clock
NOTE: (1) Tie CS to GND if the outputs will always be active.
Figure 35. Basic Operating Circuit, ±10V Input Range, External DATACLK
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STARTING A CONVERSION
If a conversion is not currently in progress, a falling edge on the CONV input places the sample-and-hold into the
hold mode and begins a conversion, as shown in Figure 36 according to the timing shown in Table 2. During the
conversion, the CONV input is ignored. Starting a conversion does not depend on the state of CS. A conversion
can be started once every 25µs (40kSPS maximum conversion rate). There is no minimum conversion rate.
t1
t2
t3
t4
t5
CONV
t6
t7
BUSY
t8
t10
t9
MODE
Acquire
t11
Convert
Acquire
Convert
Figure 36. Basic Conversion Timing
Table 2. Conversion and Data Timing, TA = –40°C to +85°C
SYMBOL
12
DESCRIPTION
MIN
TYP
MAX
UNITS
25
µs
19
µs
12
µs
t1
Conversion plus acquisition time
t2
CONV low to all digital inputs stable
t3
CONV low to initiate a conversion
t4
BUSY rising to any digital input active
5
ns
t5
CONV high prior to start of conversion (CONV high time)
15
ns
t6
BUSY low
18
20
µs
t7
CONV low to BUSY low
12
20
ns
t8
Aperture delay (CONV falling edge to actual conversion start)
5
0.04
ns
Conversion time
18
Conversion complete to BUSY rising
90
ns
t11
Acquisition time
7
µs
t12
CONV low to rising edge of first internal DATACLK
t13
Internal DATACLK high
300
410
425
t14
Internal DATACLK low
300
410
425
ns
t15
Internal DATACLK period
0.6
0.82
0.85
µs
t16
DATA valid to internal DATACLK rising
150
204
t17
Internal DATACLK falling to DATA not valid
150
208
t18
Falling edge of last DATACLK to BUSY rising
t19
External DATACLK rising to DATA not valid
4
14
t20
External DATACLK rising to DATA valid
2
12
t21
External DATACLK high
15
ns
t22
External DATACLK low
15
ns
t23
External DATACLK period
35
ns
t24
CONV low to external DATACLK active
15
t25
External DATACLK low or CS high to BUSY rising
t26
CS low to digital outputs enabled
15
ns
t27
CS high to digital outputs disabled
15
ns
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20
µs
t9
t10
µs
2.0
4.4
ns
ns
ns
5
µs
ns
20
ns
ns
5
µs
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Even though the CONV input is ignored while a conversion is in progress, this input should be held static during
the conversion period. Transitions on this digital input can easily couple into sensitive analog portions of the
converter, adversely affecting the conversion results (see the Sensitivity to External Digital Signals section of this
data sheet for more information).
Ideally, the CONV input should go low and remain low throughout the conversion. It should return high sometime
after BUSY goes high. In addition, it should be high before the start of the next conversion for a minimum time
period given by t5. This period ensures that the digital transition on the CONV input does not affect the signal that
is acquired for the next conversion.
An acceptable alternative is to return the CONV input high as soon after the start of the conversion as possible.
For example, a negative-going pulse 100ns wide would make a good CONV input signal. It is strongly
recommended that from time t2 after the start of a conversion until BUSY rises, the CONV input should be held
static (either high or low). During this time, the converter is more sensitive to external noise.
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READING DATA
The ADS8513 digital output is in Binary Two’s Complement (BTC) format. Table 3 shows the relationship
between the digital output word and the analog input voltage under ideal conditions.
Table 3. Output Codes and Ideal Input Voltages
DESCRIPTION
ANALOG INPUT RANGE
Full-scale range
±10V
Least significant bit (LSB)
+Full-scale (FS – 1LSB)
Midscale
One LSB below midscale
–Full-scale
DIGITAL OUTPUT
0.5V to 4.5V
BINARY TWOS COMPLEMENT
305µV
61µV
BINARY CODE
HEX CODE
9.999695V
4.499939V
0111 1111 1111 1111
7FFF
0V
2.5V
0000 0000 0000 0000
0000
–305µV
2.499939µV
1111 1111 1111 1111
FFFF
–10V
0.5V
1000 0000 0000 0000
8000
Figure 37 shows the relationship between the various digital inputs, digital outputs, and internal logic of the
ADS8513. Figure 38 illustrates when the internal shift register of the ADS8513 is updated and how this update
relates to a single conversion cycle. Together, these two figures define a very important aspect of the ADS8513:
the conversion result is not available until after the conversion is complete. The implications of this
protocol are discussed in the following sections.
Converter Core
REF
CDAC
CONV
Clock
Control Logic
BUSY
Each flip-flop in the
working register is
latched as the
conversion proceeds
Working Register
D
Q
D
Q
D
Q
D
Q
D
Q
•••
W0
W1
W2
W14
W15
Update of the shift
register occurs just prior
to BUSY Rising(1)
Shift Register
D
Q
D
Q
D
Q
D
Q
D
Q
D
DATA
Q
EXT/INT
S0
S1
S2
S14
S15
SOUT
Delay
DATACLK
CS
NOTE: (1) If EXT/INT is HIGH (external clock), DATACLK is HIGH, and CS is LOW during
this time, the shift register will not be updated and the conversion result will be lost.
Figure 37. Block Diagram of the ADS8513 Digital Inputs and Outputs
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CONV
t25
t6 – t25
BUSY
NOTE: Update of the internal shift register occurs in the
shaded region. If EXT/INT is HIGH, then DATACLK
must be LOW or CS must be HIGH during this time.
Figure 38. Shift Register Update Timing
INTERNAL DATACLK
With EXT/INT tied low, the result from conversion ‘n’ is serially transmitted during conversion ‘n+1’, as shown in
Figure 39 and with the timing given in Table 2. Serial transmission of data occurs only during a conversion.
When a transmission is not in progress, DATA and DATACLK are low.
t1
CONV
BUSY
t13
t12
t15
DATACLK
1
2
t16
3
t18
14
15
16
Bit 2
Bit 1
LSB
1
t14
t17
DATA
MSB
Bit 14
Bit 13
MSB
Figure 39. Serial Data Timing, Internal Clock (EXT/INT and CS Low)
During the conversion, the results of the previous conversion are transmitted via DATA, while DATACLK
provides the synchronous clock for the serial data. The data format is 16-bit, Binary Two’s Complement, MSB
first. Each data bit is valid on both the rising and falling edges of DATACLK. BUSY is low during the entire serial
transmission and can be used as a frame synchronization signal.
EXTERNAL DATACLK
With EXT/INT tied high, the result from conversion ‘n’ is clocked out after the conversion has completed, during
the next conversion (‘n+1’), or a combination of these two. Figure 40 shows the case of reading the conversion
result after the conversion is complete. Figure 41 describes reading the result during the next conversion.
Figure 42 combines the important aspects of Figure 40 and Figure 41 for reading part of the result after the
conversion is complete and the balance during the next conversion.
The serial transmission of the conversion result is initiated by a rising edge on DATACLK. The data format is
16-bit, Binary Two’s Complement, MSB first. Each data bit is valid on the falling edge of DATACLK. In some
cases, it might be possible to use the rising edge of the DATACLK signal. However, one extra clock period (not
shown in Figure 40, Figure 41, and Figure 42) is needed for the final bit.
The external DATACLK signal must be low or CS must be high before BUSY rises (see time t25 in Figure 41 and
Figure 42). If this limit is not observed during this time, the output shift register of the ADS8513 is not updated
with the conversion result. Instead, the previous contents of the shift register remain and the new result is lost.
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Before reading the next three paragraphs, consult the Sensitivity to External Digital Signals section of this data
sheet. This section explains many of the concerns regarding how and when to apply the external DATACLK
signal.
External DATACLK Active After the Conversion
The preferred method of obtaining the conversion result is to provide the DATACLK signal after the conversion
has been completed and before the next conversion starts, as shown in Figure 40. Note that the DATACLK
signal should be static before the start of the next conversion. If this limit is not observed, the DATACLK signal
could affect the acquired.
t1
t5
CONV
BUSY
t21
t4
t23
DATACLK
1
2
3
4
t19
14
15
16
t22
t20
DATA
MSB
Bit 14
Bit 13
Bit 2
Bit 1
LSB
Figure 40. Serial Data Timing, External Clock, Clocking After the Conversion Completes (EXT/INT High,
CS Low)
External DATACLK Active During the Next Conversion
Another method of obtaining the conversion result is shown in Figure 41. Because the output shift register is not
updated until the end of the conversion, the previous result remains valid during the next conversion. If a fast
clock (≥ 2MHz) can be provided to the ADS8513, the result can be read during time t2. During this time, the noise
from the DATACLK signal is less likely to affect the conversion result.
t1
t2
CONV
BUSY
t21
t24
t23
DATACLK
1
2
3
t19
t25
4
15
16
1
t22
t20
DATA
MSB
Bit 14
Bit 13
Bit 1
LSB
MSB
Figure 41. Serial Data Timing, External Clock, Clocking During the Next Conversion (EXT/INT High, CS
Low)
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External DATACLK Active After the Conversion and During the Next Conversion
Figure 42 shows a method that combines the two previous approaches. This method works very well for
microcontrollers that do serial transfers eight bits at a time and for slower microcontrollers. For example, if the
fastest serial clock that the microcontroller can produce is 1µs, the approach shown in Figure 40 would result in a
diminished throughput (26kSPS maximum conversion rate). The method described in Figure 41 could not be
used without risk of affecting the conversion result (the clock would have to be active after time t2). Therefore, the
approach in Figure 42 results in an improved throughput rate (33kSPS maximum with a 1µs clock), and
DATACLK is not active after time t2.
CONV
BUSY
t5
t24
t4
DATACLK
DATA
1
2
MSB
t25
n
n+1
Bit n-1
Bit n
Bit 14
15
16
Bit 1
LSB
Figure 42. Serial Data Timing, External Clock, Clocking After the Conversion Completes and During the
Next Conversion (EXT/INT High, CS Low)
CHIP SELECT
The CS input allows the digital outputs of the ADS8513 to be disabled and gates the external DATACLK signal
when EXT/INT is high. See Figure 43 for the enable and disable time associated with CS and Figure 37 for a
logic diagram of the ADS8513. The digital outputs can be disabled at any time.
Note that a conversion is initiated on the falling edge of CONV even if CS is high. If the EXT/INT input is low
(internal DATACLK) and CS is high during the entire conversion, the previous conversion result is lost (that is,
the serial transmission occurs but DATA and DATACLK are disabled).
CS
t26
BUSY, DATA,
DATACLK (1)
t27
HI-Z
Active
HI-Z
NOTE: (1) DATACLK is an output only when EXT/INT is LOW.
Figure 43. Enable and Disable Timing for Digital Outputs
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ANALOG INPUT
The ADS8513 offers a number of input ranges. This set of options is accomplished by connecting the three input
resistors to either the analog input (VIN), to ground (GND), or to the 2.5V reference buffer output (BUF). Table 1
shows the input ranges that are typically used in most data acquisition applications. These ranges are all
specified to meet the specifications given in the Electrical Characteristics table. Table 4 contains a complete list
of ideal input ranges, associated input connections, and comments regarding the range.
Table 4. Complete list of Ideal Input Ranges
ANALOG
INPUT
RANGE (V)
CONNECT
R1IN
TO
CONNECT
R2IN
TO
CONNECT
R3IN
TO
INPUT
IMPEDANCE
(kΩ)
0.3125 to 2.8125
VIN
–0.417 to 2.916
VIN
VIN
VIN
> 10,000
VIN
BUF
26.7
0.417 to 3.750
VIN cannot go below GND – 0.3V
VIN
VIN
GND
26.7
Offset and gain not specified
±3.333
VIN
BUF
VIN
21.3
Specified offset and gain
–15 to 5
VIN
BUF
BUF
45.7
Offset and gain not specified
±10
VIN
BUF
GND
45.7
Specified offset and gain
0.833 to 7.5
VIN
GND
VIN
21.3
Offset and gain not specified
–2.5 to 17.5
VIN
GND
BUF
45.7
Exceeds absolute maximum VIN
2.5 to 22.5
VIN
GND
GND
45.7
Exceeds absolute maximum VIN
0 to 2.857
BUF
VIN
VIN
45.7
Offset and gain not specified
–1 to 3
BUF
VIN
BUF
21.3
VIN cannot go below GND – 0.3V
0 to 4
BUF
VIN
GND
21.3
Specified offset and gain
–6.25 to 3.75
BUF
BUF
VIN
26.7
Offset and gain not specified
0 to 10
BUF
GND
VIN
26.7
Specified offset and gain
0.357 to 3.214
GND
VIN
VIN
45.7
Offset and gain not specified
–0.5 to 3.5
GND
VIN
BUF
21.3
VIN cannot go below GND – 0.3V
0.5 to 4.5
GND
VIN
GND
21.3
Specified offset and gain
±5
GND
BUF
VIN
26.7
Specified offset and gain
1.25 to 11.25
GND
GND
VIN
26.7
Offset and gain not specified
COMMENT
Specified offset and gain
+15V
2.2mF
22pF
ADS8513
100nF
R1IN
GND
2kW
Pin 7
2kW
VIN
Pin 2
22pF
Pin3
GND
Pin 1
R2IN
−
OPA627
or
OPA132
+
Pin 6
R3IN
Pin4
CAP
2.2mF
GND
100nF
REF
2.2mF
GND
2.2mF
GND
−15 V
GND
Figure 44. Typical Driving Circuit (±10V, No Trim)
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The input impedance results from the various connections and the internal resistor values (refer to the block
diagram on the front page of this data sheet). The internal resistor values are typical and can change by ±30%
as a result of process variations. However, the ratio matching of the resistors is considerably better than this
range. Thus, the input range only varies a few tenths of a percent from part to part, while the input impedance
can vary up to ±30%.
The Electrical Characteristics table contains the maximum limits for the variation of the analog input range, but
only for those ranges where the comment field shows that the offset and gain are specified (including all the
ranges listed in Table 1). For the other ranges, the offset and gain are not tested and are not specified.
Five of the input ranges in Table 4 are not recommended for general use. The upper-end of the –2.5V to +17.5V
range and +2.5V to +22.5V range exceeds the absolute maximum analog input voltage. These ranges can still
be used as long as the input voltage remains under the absolute maximum, but this limit may reduce the
full-scale range of the converter to a significant degree.
Likewise, three of the input ranges involve the connection at R2IN being driven below GND. This input has a
reverse-biased ESD protection diode connection to ground. If R2IN is taken below GND – 0.3V, this diode
becomes forward-biased and clamps the negative input at –0.4V to –0.7V, depending on the temperature.
Because the negative full-scale value of these input ranges exceeds –0.4V, they are not recommended.
Note that Table 4 assumes that the voltage at the REF pin is +2.5V. This assumption is true if the internal
reference is used or if the external reference is +2.5V. Using other reference voltages change the values in
Table 4.
HIGH IMPEDANCE MODE
When R1IN, R2IN, and R3IN are connected to the analog input, the input range of the ADS8513 is 0.3125V to
2.8125V and the input impedance is greater than 10MΩ. This input range can be used to connect the ADS8513
directly to a wide variety of sensors. Figure 45 shows the impedance of the sensor versus the change in integral
linearity error (ILE) and differential linearity error (DLE) of the ADS8513. The performance of the ADS8513 can
be improved for higher sensor impedance by allowing more time for acquisition. For example, 10µs of acquisition
time approximately doubles the sensor impedance for the same ILE/DLE performance.
The input impedance and capacitance of the ADS8513 are very stable over temperature. Assuming that this
performance is true of the sensor as well, the graph shown in Figure 45 will vary less than a few percent over the
ensured temperature range of the ADS8513. If the sensor impedance varies significantly with temperature, the
worst-case impedance should be used.
LINEARITY ERROR vs SOURCE IMPEDANCE
10
Change in Worst-Case
Linearity Error (LSBs)
9
TA = +25°C
Acquisition Time = 5µs
8
DLE
7
6
ILE
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
External Source Impedance (kΩ)
Figure 45. Linearity Error vs Source Impedance in the High Impedance Mode (R1IN = R2IN = R3IN = VIN)
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DRIVING THE ADS8513 ANALOG INPUT
In general, any reasonably fast, high-quality operational or instrumentation amplifier can be used to drive the
ADS8513 input. When the converter enters the acquisition mode, there is some charge injection from the
converter input to the amplifier output. This charge injection can result in inadequate settling time with slower
amplifiers. Be very careful with single-supply amplifiers, particularly if the output is required to swing very close to
the supply rails.
In addition, be careful with regard to the amplifier linearity. The outputs of single-supply and rail-to-rail amplifiers
can saturate as the outputs approach the supply rails. Rather than the amplifier transfer function being a straight
line, the curve can become severely S-shaped. Also, watch for the point where the amplifier switches from
sourcing current to sinking current. For some amplifiers, the transfer function can be noticeably discontinuous at
this point, causing a significant change in the output voltage for a much smaller change on the input.
Texas Instruments manufactures a wide variety of operational and instrumentation amplifiers that can be used to
drive the input of the ADS8513; these devices include the OPA627, OPA132, and INA110.
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REFERENCE
The ADS8513 can be operated with its internal 2.5V reference or an external reference. By applying an external
reference voltage to the REF pin, the internal reference voltage is overdriven. The voltage at the REF input is
internally buffered by a unity gain buffer. The output of this buffer is present at the BUF and CAP pins.
REF
The REF pin is the output of the internal 2.5V reference or the input for an external reference. A 1µF to 2.2µF
tantalum capacitor should be connected between this pin and ground. The capacitor should be placed as close
to the ADS8513 as possible.
When using the internal reference, the REF pin should not be connected to any type of significant load. An
external load causes a voltage drop across the internal 4kΩ resistor that is in series with the internal reference.
Even a 40MΩ external load to ground causes a decrease in the full-scale range of the converter by 6LSBs.
The range for the external reference is 2.3V to 2.7V. The voltage on REF determines the full-scale range of the
converter and the corresponding LSB size. Increasing the reference voltage increases the LSB size in relation to
the internal noise sources which, in turn, can improve signal-to-noise ratio. Likewise, decreasing the reference
voltage reduces the LSB size and signal-to-noise ratio.
CAP
The ADS8513 is factory-tested with 2.2µF capacitors connected to pin 6 (CAP) and pin 7 (REF). Each capacitor
should be placed as close as possible to its pin. The capacitor on pin 7 band-limits the internal reference noise.
A lower-value capacitor can be used, but it may degrade SNR and SINAD. The capacitor on pin 6 stabilizes the
reference buffer and provides a switching charge to the CDAC during conversion. Capacitors smaller than 1µF
can cause the buffer to become unstable and may not hold sufficient charge for the CDAC. The parts are tested
to specifications with 2.2µF, so larger capacitors are not necessary. The equivalent series resistance (ESR) of
these compensation capacitors is also critical. The total ESR must be kept under 3Ω. See the Typical
Characteristics section concerning how ESR affects performance.
BUF
The voltage on the BUF pin is the output of the internal reference buffer. This pin is used to provide +2.5V to the
analog input or inputs for the various input configurations. The BUF output can provide up to 1mA of current to
an external load. The load should be constant because variable load could affect the conversion result by
modulating the BUF voltage. Also note that the BUF output shows significant glitches as each bit decision is
made during a conversion. Between conversions, the BUF output is quiet.
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POWER DOWN
The ADS8513 has a power-down mode that is activated by taking CONV low and then PWRD high. This mode
powers down all of the analog circuitry including the reference, reducing power dissipation to under 50µW. To
exit the power-down mode, CONV is taken high and then PWRD is taken low. Note that a conversion is initiated
if PWRD is taken high while CONV is low.
While in the power-down mode, the voltage on the capacitors connected to CAP and REF begins to leak off. The
voltage on the CAP capacitor leaks off much more rapidly than on the REF capacitor (the REF input of the
ADS8513 becomes high-impedance when PWRD is high; this condition is not true for the CAP input). When
exiting power-down mode, these capacitors must be allowed to recharge and settle to a 16-bit level. Figure 46
shows the amount of time typically required to obtain a valid 16-bit result based on the amount of time spent in
power down (at room temperature). This figure assumes that the total capacitance on the CAP pin is 1.01µF.
Figure 47 shows a circuit that can significantly reduce the power-up time if the power-down time is fairly brief (a
few seconds or less). A low on-resistance MOSFET is used to disconnect the capacitance on the CAP pin from
the leakage paths internal to the ADS8513. This MOSFET allows the capacitors to retain the respective charges
for a much longer period of time, reducing the time required to recharge them at power-up. With this circuit, the
power-down time can be extended to tens or hundreds of milliseconds with almost instantaneous power-up.
Power-Up Time to Rated Accuracy (µs)
POWER-DOWN TO POWER-UP RESPONSE
300
TA = +25°C
250
200
150
100
50
0
0.1
1
10
100
Power-Down Duration (ms)
Figure 46. Power-Down to Power-Up Response
1RF7604
+
1µF
1
8
1
R1IN
VS 16
2
7
2
GND
PWRD 15
3
6
3
R2IN
BUSY 14
4
5
4
R3IN
CS 13
5
BUF
CONV 12
6
CAP
EXT/INT 11
7
REF
DATA
10
8
GND
DATACLK
9
0.01µF
Power-Down Signal
Figure 47. Improved Power-Up Response Circuit
22
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LAYOUT
POWER FOR TSSOP-20 PACKAGE
For optimum performance, tie the analog and digital power pins to the same +5V power supply and tie the
analog and digital grounds together. As noted in the Electrical Characteristics table, the ADS8513 uses 90% of
its power for the analog circuitry. The ADS8513 should be considered as an analog component.
The +5V power for the A/D converter should be separate from the +5V used for the system digital logic.
Connecting +VBD directly to a digital supply can reduce converter performance because of switching noise from
the digital logic. For best performance, the +5V supply can be produced from whatever analog supply is used for
the rest of the analog signal conditioning. If +12V or +15V supplies are present, a simple +5V regulator can be
used. Although it is not suggested, if the digital supply must be used to power the converter, be sure to properly
filter the supply. Either using a filtered digital supply or a regulated analog supply, both +VBD and +VA should be
tied to the same +5V source.
GROUNDING
All of the ground pins of the A/D converter should be tied to an analog ground plane, separated from the system
digital logic ground to achieve optimum performance. Both analog and digital ground planes should be tied to the
system ground as close to the power supplies as possible. This layout helps to prevent dynamic digital ground
currents from modulating the analog ground through a common impedance to power ground.
SIGNAL CONDITIONING
The FET switches used for the sample-and-hold on many CMOS A/D converters release a significant amount of
charge injection that can cause the driving op amp to oscillate. The amount of charge injection that results from
the sampling FET switch on the ADS8513 is approximately 5% to 10% of the amount on similar A/D converters
with the charge redistribution digital-to-analog converter (DAC) CDAC architecture. There is also a resistive
front-end that attenuates any charge which is released. The end result is a minimal requirement for the drive
capability on the signal conditioning preceding the A/D converter. Any op amp sufficient for the signal in an
application is sufficient to drive the ADS8513.
The resistive front-end of the ADS8513 also provides a specified ±25V overvoltage protection. In most cases,
this architecture eliminates the need for external over-voltage protection circuitry.
SENSITIVITY TO EXTERNAL DIGITAL SIGNALS
All successive approximation register-based A/D converters are sensitive to external noise sources. For the
ADS8513 and similar A/D converters, this noise most often originates because of the transition of external digital
signals. While digital signals that run near the converter can be the source of the noise, the biggest problem
occurs with the digital inputs to the converter itself.
In many cases, the system designer may not be aware that there is a problem or the potential for a problem. For
a 12-bit system, these problems typically occur at the least significant bits and only at certain places in the
converter transfer function. For a 16-bit converter, the problem can be much easier to spot.
For example, the timing diagram in Figure 36 shows that the CONV signal should return high sometime during
time t2. In fact, the CONV signal can return high at any time during the conversion. However, after time t2, the
transition of the CONV signal has the potential of creating a good deal of noise on the ADS8513 die. If this
transition occurs at just precisely the wrong time, the conversion results could be affected. In a similar manner,
transitions on the DATACLK input could affect the conversion result.
For the ADS8513, there are 16 separate bit decisions that are made during the conversion. The most significant
bit decision is made first, proceeding to the least significant bit at the end of the conversion. Each bit decision
involves the assumption that the bit being tested should be set. This action is combined with the result that has
been achieved so far. The converter compares this combined result with the actual input voltage. If the combined
result is too high, the bit is cleared. If the result is equal to or lower than the actual input voltage, the bit remains
high. This effect is why the basic architecture is referred to as a successive approximation register (SAR).
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If the result so far is getting very close to the actual input voltage, then the comparison involves two voltages that
are very close together. The ADS8513 has been designed so that the internal noise sources are at a minimum
just before the comparator result is latched. However, if an external digital signal transitions at this time, a great
deal of noise will be coupled into the sensitive analog section of the ADS8513. Even if this noise produces a
difference between the two voltages of only 2mV, the conversion result will be off by 52 counts or least significant
bits (LSBs). (The internal LSB size of the ADS8513 is 38µV, regardless of the input range.)
Once a digital transition has caused the comparator to make a wrong bit decision, the decision cannot be
corrected (unless some type of error correction is employed). All subsequent bit decisions will then be wrong.
Figure 48 shows a successive approximation process that has gone wrong. The dashed line represents what the
correct bit decisions should have been. The solid line represents the actual result of the conversion.
External Noise
SAR Operation after
Wrong Bit Decision
Actual Input
Voltage
Converter
Full-Scale
Input Voltage
Range
Proper SAR Operation
Internal DAC
Voltage
Wrong Bit Decision Made Here
t
Conversion Clock
Conversion Start
(Hold Mode)
1
1
0
0
0
0
Incorrect Result
(1
0
1
1
0
1)
Correct Result
Figure 48. SAR Operation When External Noise Affects the Conversion
Keep in mind that the time period when the comparator is most sensitive to noise is fairly small. Also, the peak
portion of the noise event produced by a digital transition is fairly brief, because most digital signals transition in a
few nanoseconds. The subsequent noise may last for a period of time longer than this and may induce further
effects that require a longer settling time. However, in general, the event is over within a few tens of
nanoseconds.
For the ADS8513, error correction is done when the tenth bit is decided. During this bit decision, it is possible to
correct limited errors that may have occurred during previous bit decisions. However, after the tenth bit, no such
correction is possible. Note that for the timing diagrams shown in Figure 36, Figure 39, Figure 40, Figure 41, and
Figure 42, all external digital signals should remain static from 8µs after the start of a conversion until BUSY
rises. The tenth bit is decided approximately 10µs to 11µs into the conversion.
24
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APPLICATION INFORMATION
TRANSITION NOISE
Apply a dc input to the ADS8513 and initiate 1000 conversions. The digital output of the converter varies in
output codes because the internal noise of the ADS8513. This condition is true for all 16-bit SAR converters. The
transition noise specification found in the Electrical Characteristics table is a statistical figure that represents the
1σ limit or rms value of these output codes.
Using a histogram to plot the output codes, the distribution should appear bell-shaped with the peak of the bell
curve representing the nominal output code for the input voltage value. The ±1σ, ±2σ, and ±3σ distributions
represent 68.3%, 95.5%, and 99.7% of all codes. Multiplying transition noise by 6 yields the ±3σ distribution, or
99.7% of all codes. Statistically, up to three codes could fall outside the five-code distribution when executing
1000 conversions. The ADS8513 has a transition noise of 0.8 LSBs which yields five output codes for a ±3σ
distribution. Figure 49 shows 16,384 conversion histogram results.
7595
4099
3975
484
201
29
7FFC
7FFD
7FFE
7FFF
8000
8001
1
8002
Figure 49. Histogram of 16384 Conversions With VIN = 0V in ±10V Bipolar Range
AVERAGING
Converter noise can be compensated by averaging the digital codes. By averaging conversion results, transition
noise is reduced by a factor of 1/√n, where n is the number of averages. For example, averaging four conversion
results reduces the transition noise by half to 0.4 LSBs. Note that averaging should only be used for input signals
with frequencies near dc.
For ac signals, a digital filter can be used to low-pass filter and decimate the output codes. This action works in a
similar manner to averaging: for every decimation by 2, the signal-to-noise ratio improves 3dB.
QSPI™ INTERFACE
Figure 50 shows a simple interface between the ADS8513 and any QSPI-equipped microcontroller. This interface
assumes that the convert pulse does not originate from the microcontroller and that the ADS8513 is the only
serial peripheral.
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ADS8513
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Convert Pulse
QSPI
ADS8513
CONV
PCS0/SS
MOSI
SCK
BUSY
SDATA
DATACLK
CS
EXT/INT
CPOL = 0 (Inactive State is LOW)
CPHA = 1 (Data Valid on Falling Edge)
QSPI Port is in Slave Mode
The ADC is the SPI master.
Figure 50. QSPI Interface to the ADS8513
Before enabling the QSPI interface, the microcontroller must be configured to monitor the slave select line. When
a transition from high to low occurs on slave select (SS) from BUSY (indicating the end of the current
conversion), the port can be enabled. If this enabling is not done, the microcontroller and the A/D converter may
be out-of-sync.
Figure 51 shows another interface between the ADS8513 and a QSPI-equipped microcontroller that allows the
microcontroller to give the convert pulses while also allowing multiple peripherals to be connected to the serial
bus. This interface and the following discussion assume a master clock for the QSPI interface of 16.78MHz.
Notice that the serial data input of the microcontroller is tied to the MSB (D7) of the ADS8513 instead of the
serial output (SDATA). Using D7 instead of the serial port offers 3-state capability that allows other peripherals to
be connected to the MISO pin. When communication is desired with those peripherals, PCS0 and PCS1 should
be left high, which keeps D7 3-stated.
+5V
QSPI
ADS8513
PCS0
CONV
PCS1
CS
SCK
MISO
EXT/INT
DATACLK
DATA
BYTE
CPOL = 0
CPHA = 0
Figure 51. QSPI Interface to the ADS8513, Processor Initiates Conversions
In this configuration, the QSPI interface is actually set to do two different serial transfers. The first, an 8-bit
transfer, causes PCS0 (CONV) and PCS1 (CS) to go low, starting a conversion. The second, a 16-bit transfer,
causes only PCS1 (CS) to go low. This point is when the valid data are transferred.
For both transfers, the DT register (delay after transfer) is used to cause a 19µs delay. The interface is also set
up to wrap to the beginning of the queue. In this manner, the QSPI is a state machine that generates the
appropriate timing for the ADS8513. This timing is thus locked to the crystal-based timing of the microcontroller
and not interrupt-driven. So, this interface is appropriate for both ac and dc measurements.
26
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For the fastest conversion rate, the baud rate should be set to 2 (4.19MHz SCK), DT set to 10, the first serial
transfer set to 8 bits, the second set to 16 bits, and DSCK disabled (in the command control byte). This allows for
a 23kSPS maximum conversion rate. For slower rates, DT should be increased. Do not slow SCK as this may
increase the chance of affecting the conversion results or accidently initiating a second conversion during the first
8-bit transfer.
In addition, CPOL and CPHA should be set to zero (SCK normally low and data captured on the rising edge).
The command control byte for the 8-bit transfer should be set to 20h and for the 16-bit transfer to 61h.
SPI INTERFACE
The SPI interface is generally only capable of 8-bit data transfers. For some microcontrollers with SPI interfaces,
it might be possible to receive data in a similar manner as shown for the QSPI interface in Figure 50. The
microcontroller must fetch the eight most significant bits before the contents are overwritten by the least
significant bits.
A modified version of the QSPI interface shown in Figure 51 might be possible. For most microcontrollers with a
SPI interface, the automatic generation of the start-of-conversion pulse is impossible and has to be done with
software. This configuration limits the interface to dc applications because of the insufficient jitter performance of
the convert pulse itself.
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ADS8513
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (August 2008) to Revision C ................................................................................................ Page
•
Changed note 4 at the bottom of the Electrical Characteristics table.................................................................................... 3
Changes from Revision A (March 2008) to Revision B .................................................................................................. Page
•
•
•
•
28
Changed feature bullet for max power dissipation from 32.5W to 32.5mW ..........................................................................
Changed feature bullet for SPI serial port from 10Mhz to 20Mhz .........................................................................................
Changed Absolute Maximum Ratings to show actual device voltage and ground................................................................
Changed Electrical Characteristics to show actual device voltage and ground ....................................................................
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1
2
2
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PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ADS8513IBDW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8513IBDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8513IBDWR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8513IBDWRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8513IDW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8513IDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8513IDWR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8513IDWRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ADS8513IBDWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
ADS8513IDWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS8513IBDWR
SOIC
DW
16
2000
367.0
367.0
38.0
ADS8513IDWR
SOIC
DW
16
2000
367.0
367.0
38.0
Pack Materials-Page 2
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Texas Instruments:
ADS8513IDWG4 ADS8513IBDW ADS8513IBDWR ADS8513IDW ADS8513IDWR ADS8513IBDWRG4
ADS8513IBDWG4 ADS8513IDWRG4