AVAGO HSMB-C152 Surface mount chipled Datasheet

HSMB-C1xx
Surface Mount ChipLEDs
Data Sheet
HSMB-C112, HSMB-C172, HSMB-C192,
HSMB-C196, HSMB-C152
Description
Features
This series of low current blue ChipLEDs is designed
specifically for low current application. This makes
them very suitable for cellular phone and portable
equipment which runs off a battery. These parts are
according to industry standard footprint. In order to
facilitate automated pick and place operation, these
ChipLEDs are shipped in tape and reel, with 4000 units
per reel for HSMB-C172/192/196 series and 3000
units per reel for the HSMB-C112/152 series. These
parts are compatible with IR soldering.
• Various size and mount options available
• Industry standard footprint
• Operating temperature range of –30˚C to +85˚C
• Compatible with IR solder reflow
• Available in 8 mm tape on 7" diameter reel
Applications
• LCD backlighting
• Keypad backlighting
• Pushbutton backlighting
• Symbol indicator
• Front panel indicator
CAUTION: HSMB-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions
during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
CATHODE
MARK
CATHODE
LINE
LED DIE
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
2.0 (0.079 )
3.2 (0.126 )
POLARITY
CLEAR
EPOXY
1.4
(0.055)
DIFFUSED
EPOXY
1.5 (0.059)
POLARITY
0.3 (0.012)
PC BOARD
PC BOARD
0.8 (0.031)
1.6 (0.063 )
0.3 (0.012)
0.5 (0.020)
CATHODE LINE
3.2 (0.126 )
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
0.4 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
1.0 (0.039)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C172
HSMx-C112
CATHODE
MARK
1.6 (0.063)
3.2 (0.126 )
DIFFUSED
EPOXY
POLARITY
2.0 (0.079)
0.6 (0.024)
1.1 (0.043)
PC BOARD
0.5 (0.020)
CATHODE LINE
0.5 ± 0.2
(0.020 ± 0.008)
0.5 ± 0.2
(0.020 ± 0.008)
SOLDERING
TERMINAL
HSMx-C152
2
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Package Dimensions
CATHODE
MARK
CATHODE
MARK
0.8 (0.031)
0.8 (0.031)
1.6
(0.063 )
1.6
(0.063 )
1.0
(0.039)
1.0
(0.039)
POLARITY
0.3 (0.012)
POLARITY
0.3 (0.012)
DIFFUSED EPOXY
DIFFUSED EPOXY
PC BOARD
0.8 (0.031)
0.3 (0.012)
0.6 (0.023)
0.3 (0.012)
CATHODE LINE
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
PC BOARD
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C192
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3
SOLDERING
TERMINAL
HSMx-C196
Device Selection Guide
Package Dimension (mm)
1.6 (L) x 0.8 (W) x 0.6 (H)
1.6 (L) x 0.8 (W) x 0.8 (H)
2.0 (L) x 1.25 (W) x 0.8 (H)
3.2 (L) x 1.5 (W) x 1.0 (H)[1]
3.2 (L) x 1.6 (W) x 1.1 (H)
GaN Blue
HSMB-C196
HSMB-C192
HSMB-C172
HSMB-C112
HSMB-C152
Package Description
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Nondiffused
Untinted, Diffused
Note:
1. Right angle package.
Absolute Maximum Ratings at TA = 25˚C
Parameter
DC Forward Current[1]
Power Dissipation
HSMB-C112/172/192/196/152
10
46
Units
mA
mW
Reverse Voltage (IR = 100 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
5
V
95
˚C
–30 to +85
˚C
–40 to +85
˚C
See reflow soldering profile (Figure 7 & 8)
Note:
1. Derate linearly as shown in Figure 4.
Electrical Characteristics at TA = 25˚C
Part Number
HSMB-C152/C172/C192/C196
HSMB-C112
Forward
Voltage
VF (Volts)
@ IF = 10 mA
Typ.
Max.
4.0
4.6
4.0
4.6
Reverse
Breakdown
VR (Volts)
@ IR = 100 µA
Min.
5
5
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
43
43
Thermal
Resistance
RθJ-PIN (˚C/W)
Typ.
550
550
Peak
Wavelength
λpeak (nm)
Typ.
428
428
428
428
428
Color
Dominant
Wavelength
λd[2] (nm)
Typ.
462
462
462
462
462
Viewing Angle
2 θ1/2 Degrees[3]
Typ.
130
170
170
170
170
Luminous
Efficacy
ηv (lm/w)
Typ.
55
55
55
55
55
VF Tolerance: ± 0.1 V
Optical Characteristics at TA = 25˚C
Part Number
HSMB-C112
HSMB-C172
HSMB-C192
HSMB-C196
HSMB-C152
Luminous
Intensity
Iv (mcd)
@ 10 mA[1]
Min.
Typ.
1.1
3.1
1.1
3.0
1.1
3.0
1.1
3.0
1.1
3.0
Notes:
1.The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2.The dominant wavelength λd is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3.θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4
IF – FORWARD CURRENT – mA
Dom. Wavelength (nm)
Min.
Max.
460
465
465
470
470
475
475
480
RELATIVE INTENSITY – %
Bin ID
A
B
C
D
100
100
Blue Color Bin Limits[1]
80
60
40
20
Tolerance: ±1 nm
0
400
450
500
550
600
650
10
1
0.1
700
WAVELENGTH – nm
3.0
3.2
3.4
3.6
3.8
4.0
4.2
VF – FORWARD VOLTAGE – V
Light Intensity (Iv) Bin Limits[1]
Tolerance: ± 15%
Notes:
1. Bin categories are established for
classification of products. Products may
not be available in all categories. Please
contact your Avago srepresentative for
information regarding currently available
bins.
2. The Iv binning specification set-up is for
lowest allowable Iv binning only. There are
no upper Iv bin limits.
5
Figure 2. Forward current vs. forward voltage.
IF MAX. – MAXIMUM FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
120
100
80
60
40
20
0
0
5
10
15
20
IF – FORWARD CURRENT – mA
Figure 3. Luminous intensity vs. forward
current.
12
10
8
6
4
2
0
0 10 20 30 40 50 60 70 80 90 100
TA – AMBIENT TEMPERATURE – °C
Figure 4. Maximum forward current vs.
ambient temperature.
100
90
RELATIVE INTENSITY – %
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Intensity (mcd)
Min.
Max.
0.11
0.18
0.18
0.29
0.29
0.45
0.45
0.72
0.72
1.10
1.10
1.80
1.80
2.80
2.80
4.50
4.50
7.20
7.20
11.20
11.20
18.00
18.00
28.50
28.50
45.00
45.00
71.50
71.50
112.50
112.50
180.00
180.00
285.00
285.00
450.00
450.00
715.00
715.00
1125.00
1125.00
1800.00
1800.00
2850.00
2850.00
4500.00
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C172, C192, C196, and C152.
10 SEC. MAX.
TEMPERATURE
RELATIVE INTENSITY – %
100
80
60
230°C MAX.
4°C/SEC. MAX.
140-160°C
–3°C/SEC.
4°C/SEC.
MAX.
40
OVER 2 MIN.
TIME
20
0
-100
Figure 7. Recommended reflow soldering profile.
-80
-60
-40
-20
0
20
40
60
80
100
ANGLE
10 - 30 SEC.
80
TEMPERATURE
RELATIVE INTENSITY – %
100
60
40
217 °C
200 °C
255 - 260 °C
3 °C/SEC. MAX.
6 °C/SEC. MAX.
150 °C
3 °C/SEC. MAX.
20
100 SEC. MAX.
60 - 120 SEC.
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
TIME
ANGLE
(Acc. to J-STD-020C)
Figure 8. Recommended Pb-free reflow soldering profile.
Figure 6. Relative intensity vs. angle for HSMx-C112.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.2 (0.047)
1.0 (0.039)
0.2 (0.008)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
CENTERING
BOARD
Figure 9. Recommended soldering pattern for HSMx-C112.
1.2
(0.047)
1.2
(0.047)
0.9
(0.035)
Figure 10. Recommended soldering pattern for HSMx-C172.
0.8 (0.031)
1.5 (0.059)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 11. Recommended soldering pattern for HSMx-C192
and HSMx-C196.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
6
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 12. Recommended soldering pattern for HSMx-C152.
USER FEED DIRECTION
CATHODE SIDE
xxx
xxxxx
xxxxx
xxxxx
xx
PRINTED LABEL
Figure 13. Reeling orientation.
;;
;;
;;
;;
;;
;;
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 14. Reel dimensions.
7
;;;
;;;;;;
;;;
;;;;;;;;;
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
;;;
;;;
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
HSMx-C110
POSITION IN
CARRIER TAPE
DIM. A
(SEE TABLE 1)
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
DIM. B
DIM. C
± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004)
PART NUMBER
HSMx-C196 SERIES
HSMx-C192 SERIES
HSMx-C172 SERIES
HSMx-C112 SERIES
HSMx-C152 SERIES
1.85 (0.073)
1.75 (0.069)
2.30 (0.091)
3.40 (0.134)
3.50 (0.138)
0.88 (0.035)
0.90 (0.035)
1.45 (0.057)
1.70 (0.067)
1.88 (0.074)
0.85 (0.033)
0.90 (0.035)
0.95 (0.037)
1.20 (0.047)
1.27 (0.050)
R 1.0 ± 0.05
(0.039 ± 0.002)
DIM. B
(SEE TABLE 1)
Figure 15. Tape dimensions.
END
START
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 16. Tape leader and trailer dimensions.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
8
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60 ± 5°C for 20 hours.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-0416EN
AV02-0976EN January 8, 2008
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