Fairchild MTD48 Low voltage 16-bit buffer/line driver with 26ohm series resistors in output Datasheet

Revised May 2005
74LCX162244
Low Voltage 16-Bit Buffer/Line Driver
with 26: Series Resistors in Outputs
General Description
Features
The LCX162244 contains sixteen non-inverting buffers with
3-STATE outputs designed to be employed as a memory
and address driver, clock driver, or bus oriented transmitter/receiver. The device is nibble controlled. Each nibble
has separate 3-STATE control inputs which can be shorted
together for full 16-bit operation.
The LCX162244 is designed for low voltage (2.5V or 3.3V)
VCC applications with capability of interfacing to a 5V signal
environment.
In addition, the outputs include equivalent 26: (nominal)
series resistors to reduce overshoot and undershoot and
are designed to sink/source up to 12 mA at VCC 3.0V.
■ 5V tolerant inputs and outputs
The LCX162244 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintaining CMOS low power dissipation.
■ 2.3V–3.6V VCC specifications provided
■ Outputs include equivalent series resistance of 26: to
make external termination resistors unnecessary and
reduce overshoot and undershoot
■ 5.3 ns tPD max (VCC
3.0V), 20 PA ICC max
■ Power down high impedance inputs and outputs
■ r12 mA output drive (VCC
3.0V)
■ Implements patented noise/EMI reduction circuitry
■ Latch-up performance exceeds 500 mA
■ ESD performance:
Human body model ! 2000V
Machine model ! 200V
■ Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Order Number
74LCX162244GX
(Note 1)
Package Number
BGA54A
(Preliminary)
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74LCX162244MEA
(Note 2)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LCX162244MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 1: BGA package available in Tape and Reel only.
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
© 2005 Fairchild Semiconductor Corporation
DS500471
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74LCX162244 Low Voltage 16-Bit Buffer/Line Driver with 26: Series Resistors in Outputs
September 2000
74LCX162244
Connection Diagrams
Pin Descriptions
Pin Assignment for SSOP and TSSOP
Pin Names
Description
OEn
Output Enable Input (Active LOW)
I0–I15
Inputs
O0–O15
Outputs
NC
No Connect
FBGA Pin Assignments
1
2
3
4
5
6
A
O0
NC
OE1
OE2
NC
I0
B
O2
O1
NC
NC
I1
I2
C
O4
O3
VCC
VCC
I3
I4
D
O6
O5
GND
GND
I5
I6
E
O8
O7
GND
GND
I7
I8
F
O10
O9
GND
GND
I9
I10
I12
G
O12
O11
VCC
VCC
I11
H
O14
O13
NC
NC
I13
I14
J
O15
NC
OE4
OE3
NC
I15
Truth Tables
Inputs
I0–I3
OE1
Pin Assignment for FBGA
Outputs
L
L
L
L
H
H
H
X
Z
Inputs
Outputs
OE2
I4–I7
L
L
L
L
H
H
H
X
Inputs
(Top Thru View)
Z
Outputs
I8–I11
L
L
L
L
H
H
H
X
Z
I12–I15
O12–O15
Inputs
O8–O11
Outputs
L
L
L
L
H
H
H
X
Z
H HIGH Voltage Level
L LOW Voltage Level
X Immaterial
Z High Impedance
2
O4–O7
OE3
OE4
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O0–O3
can be shorted together to obtain full 16-bit operation. The
3-STATE outputs are controlled by an Output Enable (OEn)
input for each nibble. When OEn is LOW, the outputs are in
2-state mode. When OEn is HIGH, the outputs are in the
high impedance mode, but this does not interfere with
entering new data into the inputs.
The LCX162244 contains sixteen non-inverting buffers with
3-STATE standard outputs. The device is designed with
26: series resistors in the outputs. This design reduces
line noise in applications such as memory address drivers,
clock drivers and bus transceiver/transmitters. The device
is nibble (4 bits) controlled with each nibble functioning
identically, but independent of the other. The control pins
Logic Diagram
3
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74LCX162244
Functional Description
74LCX162244
Absolute Maximum Ratings(Note 3)
Symbol
Parameter
VCC
Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
Value
IO
DC Output Source/Sink Current
ICC
DC Supply Current per Supply Pin
IGND
DC Ground Current per Ground Pin
TSTG
Storage Temperature
Conditions
0.5 to 7.0
0.5 to 7.0
0.5 to 7.0
0.5 to VCC 0.5
50
50
50
r50
r100
r100
65 to 150
Units
V
V
Output in 3-STATE
Output in HIGH or LOW State (Note 4)
VI GND
V
mA
VO GND
mA
VO ! VCC
mA
mA
mA
qC
Recommended Operating Conditions (Note 5)
Symbol
VCC
Parameter
VI
Input Voltage
VO
Output Voltage
IOH/IOL
Min
Max
Operating
2.0
3.6
Data Retention
1.5
3.6
Supply Voltage
Output Current
TA
Free-Air Operating Temperature
't/'V
Input Edge Rate, VIN
0.8V–2.0V, VCC
0
5.5
HIGH or LOW State
0
VCC
3-STATE
0
5.5
VCC
3.0V 3.6V
VCC
2.7V 3.0V
VCC
2.3V 2.7V
r12
r8
r4
Units
V
V
V
mA
40
85
qC
0
10
ns/V
3.0V
Note 3: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation.
Note 4: IO Absolute Maximum Rating must be observed.
Note 5: Unused control inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
Symbol
VIH
VIL
VOH
VOL
Parameter
Conditions
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
LOW Level Output Voltage
TA
40qC to 85qC
(V)
Min
2.3 2.7
1.7
2.7 3.6
2.0
Max
0.7
2.7 3.6
0.8
100 PA
2.3 3.6
VCC 0.2
IOH
4 mA
2.3
1.8
IOH
4 mA
2.7
2.2
IOH
6 mA
3.0
2.4
IOH
8 mA
2.7
2.0
IOH
12 mA
3.0
2.0
Units
V
2.3 2.7
IOH
V
V
IOL
100 PA
2.3 3.6
0.2
IOL
4 mA
2.3
0.6
IOL
4 mA
2.7
0.4
IOL
6 mA
3.0
0.55
IOL
8 mA
2.7
0.6
IOL
12 mA
3.0
0.8
2.3 3.6
r5.0
PA
2.3 3.6
r5.0
PA
II
Input Leakage Current
0 d VI d 5.5
IOZ
3-STATE Output Leakage
0 d VO d 5.5V
VI
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VCC
V IH or VIL
4
V
Symbol
(Continued)
Parameter
VCC
Conditions
TA
(V)
40qC to 85qC
Min
Units
Max
IOFF
Power-Off Leakage Current
VIN or VO
0
10
PA
ICC
Quiescent Supply Current
VI
VCC or GND
2.3 3.6
20
PA
'ICC
Increase in ICC per Input
VIH
V CC 0.6V
2.3 3.6
500
PA
5.5V
Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
AC Electrical Characteristics
TA
Symbol
Parameter
VCC
CL
40qC to 85qC, RL
3.3V r 0.3V
VCC
50 pF
CL
500 :
2.7V
50 pF
VCC
CL
2.5V r 0.2V
30 pF
Min
Max
Min
Max
Min
tPHL
Propagation Delay
1.0
5.3
1.0
6.0
1.0
6.4
tPLH
Data to Output
1.0
5.3
1.0
6.0
1.0
6.4
tPZL
Output Enable Time
1.0
6.3
1.0
7.1
1.0
8.2
1.0
6.3
1.0
7.1
1.0
8.2
1.0
5.4
1.0
5.7
1.0
6.5
1.0
5.4
1.0
5.7
1.0
6.5
tPZH
tPLZ
Output Disable Time
tPHZ
tOSHL
Output to Output Skew (Note 8)
Max
1.0
tOSLH
Units
ns
ns
ns
ns
1.0
Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Parameter guaranteed by design.
Dynamic Switching Characteristics
Symbol
VOLP
VOLV
Parameter
Quiet Output Dynamic Peak VOL
Quiet Output Dynamic Valley VOL
VCC
Conditions
TA
25qC
(V)
Typical
CL
50 pF, VIH
3.3V, VIL
0V
3.3
0.35
CL
30 pF, VIH
2.5V, VIL
0V
2.5
0.25
CL
50 pF, VIH
3.3V, VIL
0V
3.3
0.35
CL
30 pF, VIH
2.5V, VIL
0V
2.5
0.25
Units
V
V
Capacitance
Symbol
Parameter
Conditions
CIN
Input Capacitance
VCC
Open, VI
COUT
Output Capacitance
VCC
3.3V, VI
0V or VCC
CPD
Power Dissipation Capacitance
VCC
3.3V, VI
0V or VCC, f
5
0V or VCC
10 MHz
Typical
Units
7
pF
8
pF
20
pF
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74LCX162244
DC Electrical Characteristics
74LCX162244
AC LOADING and WAVEFORMS Generic for LCX Family
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)
CL
VI
6V for VCC
3.3V, 2.7V
VCC * 2 for VCC
50 pF
2.5V
30 pF
Waveform for Inverting and Non-Inverting Functions
3-STATE Output High Enable and
Disable Times for Logic
Propagation Delay. Pulse Width and trec Waveforms
Setup Time, Hold Time and Recovery Time for Logic
trise and tfall
3-STATE Output Low Enable and
Disable Times for Logic
FIGURE 2. Waveforms
(Input Characteristics; f =1MHz, tr = tf = 3ns)
Symbol
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VCC
3.3V r 0.3V
2.7V
2.5V r 0.2V
Vmi
1.5V
1.5V
VCC/2
Vmo
1.5V
1.5V
VCC/2
Vx
VOL 0.3V
VOL 0.3V
VOL 0.15V
Vy
VOH 0.3V
VOH 0.3V
VOH 0.15V
6
74LCX162244
Schematic Diagram Generic for LCX Family
7
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74LCX162244
Physical Dimensions inches (millimeters) unless otherwise noted
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
Package Number BGA54A
Preliminary
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8
74LCX162244
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
Package Number MS48A
9
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74LCX162244 Low Voltage 16-Bit Buffer/Line Driver with 26: Series Resistors in Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD48
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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10
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