Mitsubishi MF-27WXE-M11ZA270 100mbps-2.7gbps, multi-rate dwdm sfp transceiver module Datasheet

MITSUBISHI (OPTICAL DEVICES)
Mitsubishi Electric Corp.
Series
Datasheet 100Mbps-2.7Gbps, Multi-Rate DWDM MF-27WXE
SFP TRANSCEIVER MODULE
2.7Gbps Multi-Rate DWDM SFP Transceiver with Digital Diagnostic
Monitoring Interface MF-27WXE Series
1. Description
This transceiver is compliant with Small
Form-factor Pluggable (SFP) MSA, and
optimized for 100Mbps to 2.7Gbps Dense
Wavelength Division Multiplexing (DWDM)
applications.
The optical subassembly consists of two parts,
the transmitter with a cooled DFB laser in a
hermetic sealed module, and the receiver with
an APD preamp in a hermetic sealed coaxial
module and integrated circuits for reshaping
received optical signals.
The built-in serial ID recognition is
incorporated, which allows users to interface
with two wire serial interface that displays
information on manufacturer, part number,
link, distance, and other parameters.
The Digital Diagnostic Monitoring interface is
incorporated, which monitors transceiver
parameters including Temperature, Supply
voltage, Laser bias current, Laser power and
Received optical power.
2. Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Small Form-factor Pluggable (SFP) MSA compliant transceiver with SONET/SDH system Quality
All 100GHz C-band wavelengths line-up for DWDM ITU-T grid
100Mbps to 2.7Gbps Multi-Rate operation capability
Transmission target distance up to 80km (1600ps/nm) / 120km (2400ps/nm) / 160km (3200ps/nm)
LC duplex receptacle
Single +3.3V power supply
Differential data inputs and outputs
Operating case temperature range -5°C to +70°C
Comply with SFF-8472 MSA
Incorporating Digital Diagnostic Monitoring Interface with Internal calibration
Serial ID Functionality
APD receiver
Bail latch type
RoHS Compliant
UQ9-06-010
Ed:1.4
Date:02.Nov.2006
Page 1 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
3. Block diagram
APD BIAS CIRCUIT
(DC/DC Converter)
Rx Received Po
Monitor Circuit
Signal Detect
RX_LOS
Circuit
RD-
APD
OPT_IN
Limiting Amp
&Low pass Fil.
RD+
TIA
MOD_DEF[2]
Memory
MOD_DEF[1]
Control
Circuits
(DDM)
ROSA
Temperature
Monitor Circuit
Supply Voltage
Monitor Circuit
TX_FAULT
LD Bias & Pout
Monitor Circuit
Fault Detector
TDDriver
LD
TD+
OPT_OUT
L
Bias
TX_DISABLE
Monitor
PD
circuit
A.T.C
Cooler/
Sensor
TOSA
4. Absolute Maximum Ratings
Stress below listed absolute maximum rating may cause permanent damage to the module.
This is a stress only and functional operation of the module at these or any other conditions in excess of
those given in the operational sections of this data sheet.
Exposure to Absolute Maximum Rating for extended periods may affect module reliability.
Parameters
Supply voltage
Storage temperature
Operating case temperature
Relative humidity (non condensation)
UQ9-06-010
Ed:1.4
Symbol
Vcc
Tstg
Tc
-
Ratings
0 to +4.0
-40 to +85
-5 to +70
5 to 85
Unit
V
°C
°C
%
Date:02.Nov.2006
Page 2 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
5. Electrical characteristics
All parameters are specified over the operating case temperature.
Measurement conditions are at 2.666057Gbps +/-20ppm, NRZ PN223-1 and 50%duty cycle data signal.
The DATA input/output signal interface is AC-coupled internally.
TX_DISABLE input signal level is LVTTL compatible. (With internally pull-up 4.7k to 10kΩ)
TX_FAULT and LOS (Loss Of Signal) output are Open-Collector/drain, and the levels indicated assuming 4.7k
to 10k ohm pull up resistor to Host_Vcc is present.
Parameters
Supply voltage
Power consumption
TX_DISABLE Input voltage
TX_FAULT Output voltage
RX_LOS Output voltage
MOD_DEF[2] Output voltage
MOD_DEF[1], [2] Input voltage
Input Amplitude, Differential
Input Impedance, Differential
Output Amplitude, Differential
Output Impedance, Differential
Data Output Rise/Fall Time
(20% to 80%)
Electrical Input Data Return Loss
100MHz < f < 1.2GHz(Differential)
Electrical Input Data Return Loss
1.2GHz < f < 2.7GHz(Differential)
UQ9-06-010
Ed:1.4
Symbol
Vcc
Pc
VIH
VIL
VOH
VOL
VOH
VOL
VOH
VOL
VIH
VIL
VT
RT
VO
RO
Min.
3.13
2.0
0
2.0
0
2.0
0
Vcc × 0.8
Vcc × 0.7
0
500
370
-
Typ.
3.3
1.0
100
100
Max.
3.47
1.4
Vcc
0.8
Vcc
0.5
Vcc
0.5
Vcc
0.4
Vcc
Vcc × 0.3
1800
1600
-
Unit
V
W
V
V
V
V
V
V
V
V
V
V
mVP-P
Ω
mVP-P
Ω
Tr/Tf
-
-
150
ps
Rld1
12
-
-
dB
Rld2
8
-
-
dB
Date:02.Nov.2006
Page 3 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
6. Optical characteristics
All parameters are specified over the operating case temperature.
Measurement conditions are at 2.666057Gbps +/-20ppm, NRZ PN223-1 and 50%duty cycle data signal.
Transmitter
Parameter
Wavelength (note 1)
Optical source
Optical power BOL (3.3V, 25degC)
Optical power EOL
Optical power when disable
Spectral width (-20dB)
Wavelength deviation BOL
Wavelength deviation EOL
SMSR
Extinction ratio
Optical waveform
Return Loss at S
Chromatic Dispersion (-M31)
Chromatic Dispersion (-M11)
Chromatic Dispersion (-M21)
Path penalty (-M31)
Path penalty (-M11, M21)
Jitter Generation (note 2)
-Bandwidth 12KHz to 20MHz
Jitter Generation (note 2)
-Bandwidth 12KHz to 20MHz
note1: Wavelength table
Code
Wavelength
630
1527.22
620
1527.99
610
1528.77
600
1529.55
590
1530.33
580
1531.12
570
1531.90
560
1532.68
550
1533.47
540
1534.25
530
1535.04
520
1535.82
UQ9-06-010
Ed:1.4
Code
510
500
490
480
470
460
450
440
430
420
410
400
Min.
1527.22
Max.
1563.86
SLM
+1
+4
0
+4
-40
0.4
-50
+50
-100
+100
30
8.2
SONET/SDH Mask compliant
24
1600
2400
3200
2
3
Wavelength
1536.61
1537.40
1538.19
1538.98
1539.77
1540.56
1541.35
1542.14
1542.94
1543.73
1544.53
1545.32
Unit
nm
dBm
dBm
dBm
nm
pm
pm
dB
dB
dB
ps/nm
ps/nm
ps/nm
dB
dB
-
0.007
UIrms
-
0.07
UIpp
Code
390
380
370
360
350
340
330
320
310
300
290
280
Wavelength
1546.12
1546.92
1547.72
1548.51
1549.32
1550.12
1550.92
1551.72
1552.52
1553.33
1554.13
1554.94
Code
270
260
250
240
230
220
210
200
190
180
170
Wavelength
1555.75
1556.55
1557.36
1558.17
1558.98
1559.79
1560.61
1561.42
1562.23
1563.05
1563.86
Date:02.Nov.2006
Page 4 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
note2: Jitter Generation (ITU-T G.783 compliant)
Jitter
Electrical Output
of Jitter Analyzer
Data out+
Analyzer
SFP Rx
Data out-
SFP Tx
Opt.
ATT
TxDTxD+
Receiver
Parameter
Wavelength
Sensitivity BOL
(3.3V, 25degC, BER=1E-10)
Sensitivity EOL (BER=1E-10)
Overload BOL (3.3V, 25degC)
Overload EOL
RX_LOS Assert Level
RX_LOS De-assert Level
RX_LOS Hysteresis
Jitter Tolerance, Transfer
Maximum reflectance of receiver at R
UQ9-06-010
Ed:1.4
Min.
1525
Max.
1565
Unit
nm
-
-29
dBm
-28
-7
-8
-39
-29
0.3
4.0
ITU-T G.783 Compliant (with reference CDR)
-27
dBm
dBm
dBm
dBm
dBm
dB
dB
Date:02.Nov.2006
Page 5 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
7. Digital Diagnostic Monitoring Accuracy
The diagnostic monitoring features internal calibration, and is calibrated over operating temperature and
voltage range. The monitor parameters are represented as defined in SFF-8472.
These parameters of the monitoring accuracy are guaranteed, as long as operating conditions of this SFP
transceiver do not exceed ranges defined below.
Digital Diagnostic Monitoring Accuracy
Parameter
Min.
Max.
Unit
Range for Accurate Monitoring
*
Transceiver Temperature
-3
+3
°C
-5 to 70°C
Supply Voltage
-3
+3
%
3 to 3.6 V
TX Bias Current
-10
+10
%
TX Optical Power
-3
+3
dB
0 to 4 dBm
RX Optical Power
-3
+3
dB
-29 to -7dBm
*Transceiver Temperature is defined as an internal temperature.
8. Transceiver pin allocation
No.
Symbol
Description
No.
Symbol
Description
1
TX GND
Transmitter Ground
11
RX GND
Receiver Ground
2
TX_FAULT
Transmitter Fault Indication
12
RD-
Receiver Data Output-Bar
3
TX_DISABLE
Transmitter Disable
13
RD+
Receiver Data Output
4
MOD_DEF[2]
Module Definition 2
14
RX GND
Receiver Ground
5
MOD_DEF[1]
Module Definition 1
15
RX Vcc
Receiver Power Supply
6
MOD_DEF[0]
Module Definition 0
16
TX Vcc
Transmitter Power Supply
7
NUC
No user connection
17
TX GND
Transmitter Ground
8
RX_LOS
Loss of Signal
18
TD+
Transmitter Data in
9
RX GND
Receiver Ground
19
TD-
Transmitter Data in-Bar
10
RX GND
Receiver Ground
20
TX GND
Transmitter Ground
UQ9-06-010
Ed:1.4
Date:02.Nov.2006
Page 6 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
9. Pin Descriptions
Pin No.
1,17,20
Function
TX GND
9,10,
11,14
16
RX GND
I
TX Vcc *
I
15
RX Vcc *
I
18,19
TD+ / TD-
I
3
TX_DISABLE
I
12,13
RD+ / RD-
O
8
RX_LOS
O
2
TX_FAULT
O
6,5,4
MOD_DEF
[0:2]
-
7
NUC
-
UQ9-06-010
Ed:1.4
I/O
I
Pin description
These pins are the Transmitter ground connections.
They should be connected to a low impedance ground plane (0V).
These pins are the Receiver ground connections.
They should be connected to a low impedance ground plane (0V).
This is the power supply pin for the Transceiver part.
It should be connected to +3.3V.
Recommended power supply decoupling. (See Figure 8)
This is the power supply pin for the Receiver part.
It should be connected to +3.3V.
Recommended power supply decoupling. (See Figure 8)
* Both TX Vcc and RX Vcc have been internally connected due to supply of
control circuit Vcc.
This data input pin modulates the laser diode. When the TD+ input is asserted,
the laser diode is turned on.
They are internally AC-coupled into an equivalent load of RI differential, as
shown in Figure 8.
Active high TTL input, with internal 7.4k ohm pull-up resistor to Vcc.
Asserting the transmitter disable will deactivate the laser within the assert time.
Table 1 indicates the timing of TX_DISABLE.
Received Data Out and Inverted Received Data Out are differential serial
output from the receiver.
These are AC-coupled 100 ohm differential lines which should be terminated
with a 100 ohm (differential) at the user SERDES, as shown in Figure 8. AC
coupling is done inside the module and is thus not required on the host board.
Active high open collector/drain output that indicates a loss-of-signal condition
(LOS). When the average optical power received by the module is below the
Assert Level, RX_LOS is indicated.
Table 1 indicates the timing of RX_LOS. RX_LOS requires a 4.7k to 10k ohm
pull-up resistor external to the module, i.e., in the host system Host_Vcc, as
shown in Figure 8.
The pull-up voltage is between 2.0 V and VccR (VccT) + 0.3 V.
Active high open collector/drain output that indicates a fault in the module.
This can be failure of the laser diode. Under this condition, TX_FAULT will
activate and be latched. And then the laser will be deactivated within the assert
time.
TX_FAULT also requires a 4.7k to 10k ohm pull-up resistor externally, i.e. in
the host system Host_Vcc, as shown in Figure 8.
The pull-up voltage is between 2.0 V and VccT (VccR) +0.3V.
Toggling TX_DISABLE high for at least t_reset can reset it.
See Figure 8 and Figure 5.
This module has a serial ID function, which provides information about the
transceiver’s capabilities, standard interfaces, manufacturer and other
information.
This function is provided via a two wire serial EEPROM interface.
MOD_DEF[0] is connected to ground inside the module.(LOW)
MOD_DEF[1] is the serial clock signal input.(SCL)
MOD_DEF[2] is the data output/input.(SDA)
They should be pulled up with 4.7Kohm -10Kohm resistor on the host board.
The pull-up voltage shall be VccT or VccR.
The serial ID definitions are as given in the “SFP-MSA” standard.
These pins are No User Connection and should be left open.
Date:02.Nov.2006
Page 7 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
Table 1
Timing of control and status I/O
The timing of the control and status line are listed in below and Figure 1 to 7.
Parameter
TX_DISABLE Assert
Time
TX_DISABLE Negate
Time
Time to Initialize,
Including Reset of
TX_FAULT
TX_FAULT Assert
Time
TX_DISABLE to Reset
RX_LOS Assert Time
RX_LOS Negate Time
Serial ID Clock Rate
Symbol
Min
Max
Unit
Condition
Time from rising edge of TX_DISABLE to
when the optical output falls below 10% of
nominal
Time from falling edge of TX_DISABLE to
when the modulated optical output rises
above 90% of nominal
From power on or negation of TX_FAULT
using TX_DISABLE
t_off
-
10
μs
t_on
-
1
ms
t_init
-
300
ms
T_fault
-
100
μs
Time from fault to TX_FAULT on
T_reset
10
-
μs
t_losson
-
100
μs
t_lossoff
-
100
μs
f_clock
-
100
kHz
Time TX_DISABLE must be held high to
reset TX_FAULT
Time from LOS state to RX_LOS Assert
Time from non-LOS state to RX_LOS
de-assert
-
Figure 1
Power on initialization of SFP transceiver, TX_DISABLE negated
Figure 2
Power on initialization of SFP transceiver, TX_DISABLE asserted
Figure 3
SFP TX_DISABLE timing during normal operation
UQ9-06-010
Ed:1.4
Date:02.Nov.2006
Page 8 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
Figure 4
Detection of transmitter fault condition
Figure 5
Successful recovery from transient fault condition
Figure 6
Unsuccessful recovery from fault condition
Figure 7
Timing of RX_LOS detection
UQ9-06-010
Ed:1.4
Date:02.Nov.2006
Page 9 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
Figure 8
Example of SFP Host Board Schematic
SFP Module
Host Board
Protocol Vcc
TD+
LASER
DRIVER
100 ohm
TD-
4.7k to 10k
ohm
TX_FAULT
TX_DISABLE
7.4k ohm
TX GND
TX Vcc
0.1 uF
1 uH
10 uF
+3.3V
1 uH
RX Vcc
PROTOCOL
IC
0.1 uF 10 uF
RX GND
SERDES
IC
0.1 uF 10 uF
RD+
PREAMP
&
POSTAMP
100 ohm
RDRX_LOS
4.7k to 10k
ohm
Rate Select 0
Rate Select 1
33k ohm
33k ohm
+3.3V
4.7k to 10k
ohm
4.7k to 10k
ohm
MOD_DEF[0]
SERIAL ID
MOD_DEF[1]
PLD/PAL
MOD_DEF[2]
4.7k to 10k
ohm
UQ9-06-010
Ed:1.4
Date:02.Nov.2006
Page 10 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
10. Type Number
MF - 27WXE – M 1 1 Z A 630
Center Wavelength
(See Table 1)
M1: 120km (2400ps/nm) version
M2: 160km (3200ps/nm) version
M3: 80km (1600ps/nm) version
Table 1
Code
630
620
610
600
590
580
570
560
550
540
530
520
Wavelength
1527.22
1527.99
1528.77
1529.55
1530.33
1531.12
1531.90
1532.68
1533.47
1534.25
1535.04
1535.82
Code
510
500
490
480
470
460
450
440
430
420
410
400
Wavelength
1536.61
1537.40
1538.19
1538.98
1539.77
1540.56
1541.35
1542.14
1542.94
1543.73
1544.53
1545.32
Code
390
380
370
360
350
340
330
320
310
300
290
280
Wavelength
1546.12
1546.92
1547.72
1548.51
1549.32
1550.12
1550.92
1551.72
1552.52
1553.33
1554.13
1554.94
Code
270
260
250
240
230
220
210
200
190
180
170
Wavelength
1555.75
1556.55
1557.36
1558.17
1558.98
1559.79
1560.61
1561.42
1562.23
1563.05
1563.86
11. Reliability reference
Telcordia GR-468-CORE
Radiated Emission:IEC61000-6-3
Immunity:IEC61000-4-2, IEC61000-4-3
Flammability: UL94V-0
ESD for PIN Interface: 500V by Human body model (with Rd=1500ohm and Cd=100pF)
12. Laser Safety Information
Class 1 Laser Product (IEC60825 and CDRH compliant)
UQ9-06-010
Ed:1.4
Date:02.Nov.2006
Page 11 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
13. General Outline Drawing
[unit: mm]
UQ9-06-010
Ed:1.4
Date:02.Nov.2006
Page 12 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
14. Packing
Ten SFPs are packed up in this packing box.
Presses Plate
SFP
Dust Cap
Packing box
- Capacity: 10pcs. / box
- Packing box and Presses Plate material :
Cardboard with ESD protection coat.
This product is sensitive to electrostatic discharge. Take precautions to prevent ESD; use wrist straps,
grounded work surfaces and recognized anti-static techniques when handling SFP module.
Mitsubishi reserves the right to change the circuitry and specifications without notice at any time.
No liability is assumed as a result of their use or application. No rights under any patent accompany
the sale of any such product(s) or information.
UQ9-06-010
Ed:1.4
Date:02.Nov.2006
Page 13 of 14
MITSUBISHI (OPTICAL DEVICES)
MF-27WXE Series
100Mbps-2.7Gbps, Multi-Rate DWDM SFP TRANSCEIVER MODULE
Safety Cautions for Use of Optoelectronic Devices
General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with semiconductor products.
Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that result in injury, death, fire or
environmental damage even when semiconductor products happen to error. Especially it is recommended to take in consideration about redundancy, fire
prevention, error prevention safeguards. And the following requirements must be strictly observed.
Warning!
1. Eye safety : Semiconductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human eyes. Don't look
at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-viewer, or other appropriate
instruments.
2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if made into powder
or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in one's mouth or swallow it.
3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general industrial waste and
general garbage.
Handling Cautions for Optoelectronic Devices
1. General:
(1) The products described in this specification are designed and manufactured for use in general communication systems or electronic devices, unless
their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for installation in devices or systems that
may affect human life or that are used in social infrastructure requiring high reliability.
(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains, vessels), medical
equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi Electric or an authorized distributor.
2. Shipping Conditions:
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes upside down,
tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical fiber, or other problems.
(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.
(3) Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not taking
enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The main points are described
below (if special storage conditions are given to the product in the specification sheet, they have priority over the following general cautions):
(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent RH, should be
maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in case of long-term storage for
six months or more.
(2) The atmosphere should be particularly free from toxic gases and dust.
(3) Do not apply any load on the product.
(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead causing soldering
problems in the customer’s assembling process.
(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for storing.
Temperature in storage locations should be stable.
(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the atmosphere.
(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls
than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive
gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly lower the reliability, but also may
lead to serious accidents.
(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested to design not to exceed
those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When handling this
product, please observe the following countermeasures:
<Countermeasures against Static Electricity and Surge>
To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:
(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot plates, solder
irons and other items for which the commercial power supplies are prone to leakage.
(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at work is highly
recommended.
(3) Use conductive materials for this product’s container, etc.
(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work area, etc.
(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention
to the static electricity in those parts. ESD may damage the product.
(6) Humidity in working environment should be controlled to be 40 percent RH or higher. These countermeasures are most general, and there is a need to
carefully confirm the line before starting mass production using this product (in the trial production, etc.). It is extremely important to prevent surge,
eliminate it rapidly, and prevent it from spreading.
The end of document
UQ9-06-010
Ed:1.4
Date:02.Nov.2006
Page 14 of 14
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