ETC MP108FD

POWER OPERATIONAL AMPLIFIER
MP108FD
HTTP://WWW.APEXMICROTECH.COM
M I C R O T E C H N O L O G Y
(800) 546-APEX
(800) 546-2739
FEATURES
• LOW COST
• HIGH VOLTAGE - 200 VOLTS
• HIGH OUTPUT CURRENT - 10 AMPS
• 100 WATT DISSIPATION CAPABILITY
• 300kHz POWER BANDWIDTH
APPLICATIONS
• INKJET PRINTER HEAD DRIVE
• PIEZO TRANSDUCER DRIVE
• INDUSTRIAL INSTRUMENTATION
• REFLECTOMETERS
• ULTRA-SOUND TRANSDUCER DRIVE
34-pin DIP
PACKAGE STYLE FD
TYPICAL APPLICATION
RF
+VS
DESCRIPTION
The MP108FD operational amplifier is a surface mount
constructed component that provides a cost effective
solution in many industrial applications. The MP108FD offers
outstanding performance that rivals much more expensive
hybrid components yet has a footprint of only 4 sq in. The
MP108FD has many optional features such as four-wire
current limit sensing and external compensation. The 300 kHz
power bandwidth and 10 amp output of the MP108FD makes
it a good choice for piezo transducer drive applications. The
MP108FD is built on a thermally conductive but electrically
insulating substrate that can be mounted to a heat sink.
+VS
RI
PRINT
NOZZLE
COMMAND
VOLTAGE
8
+Vb
4
C1
GND
3
BACK
PLATE
2
TP
1
R1
CC2
Cc2
R3
R5
Q8
D2
R7
Q11
Q14
Q15A
R10
Q16
C3
Q19
-Vb 30
-Vb 25
R19
C6
Q20
1
20 OUT
Q18
Q24
C1
+
C2
C5
CC
R17
GND 32
12 OUT
27 -Ilim
IC1
R12
Q23
EXTERNAL CONNECTIONS
28 +Ilim
R8
Q15B
R11
NOZZLE DRIVE
13 OUT
Q12 Q13
R9
Q3
11 OUT
Q9
R15
6
+IN 33
15 +Vs
Q7
Q4
PIEZO
TRANSDUCER
The MP108FD's fast slew rate and wide power bandwith
make it an ideal nozzle driver for industrial inkjet printers.
The 10 amp output capability can drive hundreds of nozzles
simultaneously.
Q6
5
-IN 34
INKJET
14 +Vs
Q2
D1
GND
RLIM
CC
16 +Vs
C5
-VB
-VS
OUT
CC1
+ILIM
-VS
Q17
Q1B
Q1A
SUBSTRATE
BACKPLATE
Cc1
R2
GND
-ILIM
EQUIVALENT CIRCUIT DIAGRAM
+Vb
+VB
TP
2
3
BACK GND
PLT
OUT
4
5
6
7
8
9
10
+VB
CC1
CC2
NC
+VB
NC
NC
21 OUT
-IN
+IN
GND
NC
-VB
VIEW FROM COMPONENT SIDE
NC +ILIM -ILIM
NC
NC -VB
NC
22 OUT
34
33
32
31
30
29
24
23
28
27
26
25
11
22
OUT OUT
12
21
13
20
14
15
16
+VS
+VS
+VS
-VS
-VS
-VS
19
18
17
OUT OUT OUT
Q22
C7
RLIM
C8
Q21
R20
17 -Vs
18 -Vs
19 -Vs
+
NOTES:
CC IS NPO (COG) RATED FOR FULL SUPPLY VOLTAGE +VS TO -VS
BOTH PINS 3 AND 32 REQUIRED CONNECTED TO SIGNAL GROUND
C2 AND C3 ELECTROLYTIC ≥ 10µF PER AMP OUTPUT CURRENT
C1,C4,C5-8 HIGH QUALITY CERAMIC ≥ 0.1µF
ALL OUTPUT PINS MUST BE TIED TOGETHER
C3
C4
LOAD &
FEEDBACK
CC
100pF
33pF
10pF
CC
470pF
220pF
33pF
PHASE COMPENSATION
TYP. SLEW RATE
GAIN W/O BOOST
55 V/µS
≥1
135 V/µS
≥4
170 V/µS
≥ 10
TYP. SLEW RATE
GAIN W BOOST
12 V/µS
≥1
35 V/µS
≥3
135 V/µS
≥ 10
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL [email protected]
1
MP108FD
ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
PARAMETER
INPUT
OFFSET VOLTAGE
OFFSET VOLTAGE vs. temperature
OFFSET VOLTAGE vs. supply
BIAS CURRENT, initial3
BIAS CURRENT vs. supply
OFFSET CURRENT, initial
INPUT RESISTANCE, DC
INPUT CAPACITANCE
COMMON MODE VOLTAGE RANGE
COMMON MODE VOLTAGE RANGE
COMMON MODE REJECTION, DC
NOISE
ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
SUPPLY VOLTAGE, +VS to -VS
SUPPLY VOLTAGE, +VB
SUPPLY VOLTAGE, -VB
OUTPUT CURRENT, peak
POWER DISSIPATION, internal, DC
INPUT VOLTAGE
TEMPERATURE, pin solder, 10s
TEMPERATURE, junction2
TEMPERATURE RANGE, storage
OPERATING TEMPERATURE, case
TEST CONDITIONS1
MIN
Full temperature range
200V
+VS + 15V6
-VS – 15V6
12A, within SOA
100W
+VB to -VB
225°C.
150°C.
-40 to 105°C.
-40 to 85°C.
TYP
MAX
UNITS
1
20
5
50
20
100
0.1
50
mV
µV/°C
µV/V
pA
pA/V
pA
Ω
pF
V
V
dB
µV RMS
1011
4
+VB - 15
-VB + 15
92
1MHz bandwidth, 1kΩ RS
10
GAIN
OPEN LOOP @ 15Hz
GAIN BANDWIDTH PRODUCT @ 1MHz
PHASE MARGIN
RL = 10KΩ, CC = 10pF
CC = 10pF
Full temperature range
96
dB
MHz
degrees
10
45
OUTPUT
VOLTAGE SWING
VOLTAGE SWING
VOLTAGE SWING
VOLTAGE SWING
CURRENT, continuous, DC
SLEW RATE, AV = -20
SETTLING TIME, to 0.1%
RESISTANCE
POWER BANDWIDTH 180VP-P
IO = 10A
IO = -10A
IO = 10A, +VB = +VS +10V
IO = -10A, -VB = -VS -10V
CC = 10pF
2V Step
No load, DC
CC = 10pF, +VS = 100V, -VS = -100V
+VS - 10
-VS + 10
+VS - 1.6
-VS + 5.1
10
150
+VS - 8.6
-VS + 7
±15
±75
50
V
V
V
V
A
V/µS
µS
Ω
kHz
170
1
5
300
POWER SUPPLY
VOLTAGE
CURRENT, quiescent
±100
65
V
mA
1
1.25
13
85
°C/W
°C/W
°C/W
°C
THERMAL
RESISTANCE, AC, junction to case5
RESISTANCE, DC, junction to case
RESISTANCE, junction to air
TEMPERATURE RANGE, case
Full temperature range, f ≤ 60Hz
Full temperature range, f < 60Hz
Full temperature range
-40
NOTES:
1. Unless otherwise noted: TC=25°C, compensation CC=100pF, DC input specifications are value given, power supply voltage
is typical rating.
2. Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation
to achieve high MTBF.
3. Doubles for every 10°C of case temperature increase.
4. +VS and -VS denote the positive and negative supply voltages to the output stage. +VB and -VB denote the positive and negative
supply voltages to the input stages.
5. Rating applies if the output current alternates between both output transistors at a rate faster than 60Hz.
6. Power supply voltages +VB and -VB must not be less than +VS and -VS respectively.
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739
2
MP108FD
POWER DERATING
100
2
60
40
1M
FREQUENCY, F (Hz)
180
300K
5M
SMALL SIGNAL RESPONSE W/O BOOST
0W
=
0.01 P = 10W
O
10
PO
100
1K
10K 30K
FREQUENCY, F (Hz)
TC = -40°C
60
40
0
40
80
120 160 200
TOTAL SUPPLY VOLTAGE, VS (V)
9
8
T FROM +V S
W/O BOOS
7
6
5
4
3
2
1
0
0
W/O
ST F
BOO
TC = 25°C
50mS PULSE
ROM
-V S
OM
FR
ST
-V S
O
ITH
BO
W
ROM +V S
OOST F
WITH B
2
4
6
8
10
OUTPUT CURRENT, IO (A)
OUTPUT VOLTAGE, VO(VP-P)
NORMALIZED QUIESCENT CURRENT, IO (%)
OPEN LOOP GAIN, A (dB)
NORMALIZED QUIESCENT CURRENT, IO (%)
TC = 25°C
OUTPUT CURRENT FROM +VS OR -VS (A)
PO
80
OUTPUT VOLTAGE SWING
VOLTAGE DROP FROM SUPPLY, (V)
20
TC = 85°C
pF
0W
=
100
100K
1M
FREQUENCY, F (Hz)
5M
QUIESCENT CURRENT vs. TEMPERATURE
115
110
105
100
95
90
-40 -20 0 20 40 60 80 100
CASE TEMPERATURE, (°C)
SAFE OPERATING AREA
20
10
1
C
5° C
=2 5°
T C =2
S, , T C 5°C
m
=2 5°C
10 0mS
C
, T =8
10
DC , T C
DC
AV = 20
CC = 10pF
±VS = 52V
RL = 4Ω
QUIESCENT CURRENT vs. SUPPLY
120
100
HARMONIC DISTORTION
1
20
10K
100 1K 10K 100K 1M 10M
FREQUENCY, F (Hz)
C C=
-25
0
25 50 75 100
CASE TEMPERATURE, TC (°C)
RL = 4Ω
IO = 1A DC
20
F
80
40
F
90
CC = 100pF
60
100
10p
100
CC = 33pF
80
pF
110
CC = 10pF
100
220
120
10M
POWER RESPONSE
pF
CURRENT LIMIT
130
1M
FREQUENCY, F (Hz)
200
0
10
10 100 1K 10K 100K 1M 10M
FREQUENCY, F (Hz)
1
C C=
RL = 4Ω
IO = 1A
150
470
40
2
1 CC = 10pF
2 CC = 33pF
3 CC = 100pF
RL = 4Ω
IO = 1A
C C=
CC = 470pF
120
33p
CC = 220pF
60
0.001
30
1
1
C C=
CC = 33pF
80
0.1
1 CC = 10pF
2 CC = 33pF
3 CC = 100pF
RL = 4Ω
IO = 1A
120
100
70
-50
2
150
210
100K
0
-40 -20 0 20 40 60 80 100
CASE TEMPERATURE, TC (°C)
0
1
1
180
20
20
3
C C=
OPEN LOOP GAIN, A (dB)
90
3
120
SMALL SIGNAL RESPONSE W/ BOOST
NORMALIZED CURRENT LIMIT, (%)
PHASE RESPONSE W/O BOOST
PHASE, Θ (°)
80
120
DISTORTION, THD (%)
PHASE RESPONSE W/ BOOST
90
2
PHASE, Θ (°)
INTERNAL POWER DISSIPATION, P(W)
TYPICAL PERFORMANCE
GRAPHS
0.2
1
10
100 200
SUPPLY TO OUTPUT DIFFERENTIAL, VS-VO (V)
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL [email protected]
3
MP108FD
OPERATING
CONSIDERATIONS
GENERAL
POWER SUPPLY BYPASSING
Please read Application Note 1 "General Operating
Considerations" which covers stability, power supplies, heat
sinking, mounting, current limit, SOA interpretation, and
specification interpretation. Visit www.apexmicrotech.com for
design tools that help automate tasks such as calculations
for stability, internal power dissipation, current limit, heat sink
selection, Apex's complete Application Notes library, Technical
Seminar Workbook and Evaluation Kits.
Bypass capacitors to power supply terminals +VS and -VS
must be connected physically close to the pins to prevent local
parasitic oscillation in the output stage of the MP108FD. Use
electrolytic capacitors at least 10µF per output amp required.
Bypass the electrolytic capacitors with high quality ceramic
capacitors (X7R) 0.1µF or greater. In most applications power
supply terminals +VB and -VB will be connected to +VS and
-VS respectively. Supply voltages +VB and -VB are bypassed
internally but both ground pins 3 and 32 must be connected
to the system signal ground to be effective. In all cases power
to the buffer amplifier stage of the MP108FD at pins 8 and 25
must be connected to +VB and -VB at pins 4 and 30 respectively.
Provide local bypass capacitors at pins 8 and 25. See the
external connections diagram on page 1.
GROUND PINS
The MP108FD has two ground pins (pins 3, 32). These pins
provide a return for the internal capacitive bypassing of the
small signal portions of the MP108FD. The two ground pins are
not connected together on the substrate. Both of these pins are
required to be connected to the system signal ground.
+Vs
Z1
SAFE OPERATING AREA
RF
The MOSFET output stage of the MP108FD is not limited by
second breakdown considerations as in bipolar output stages.
Only thermal considerations and current handling capabilities
limit the SOA (see Safe Operating Area graph on previous
page). The output stage is protected against transient flyback by
the parasitic body diodes of the output stage MOSFET structure.
However, for protection against sustained high energy flyback
external fast-recovery diodes must be used.
COMPENSATION
The external compensation capacitor C C is connected
between pins 5 and 6. Unity gain stability can be achieved with
any capacitor value larger than 100pF for a minimum phase
margin of 45 degrees. At higher gains more phase shift can
usually be tolerated in most designs and the compensation
capacitor value can be reduced resulting in higher bandwidth
and slew rate. Use the typical operating curves as a guide to
select CC for the application. An NPO (COG) type capacitor is
required rated for the full supply voltage (200V).
OVERVOLTAGE PROTECTION
Although the MP108FD can withstand differential input voltages
up to ±25V, additional external protection is recommended.
In most applications 1N4148 signal diodes connected antiparallel across the input pins is sufficient. In more demanding
applications where bias current is important diode connected
JFETs such as 2N4416 will be required. See Q1 and Q2 in
Figure 1. In either case the differential input voltage will be
clamped to ±0.7V. This is usually sufficient overdrive to produce
the maximum power bandwidth. Some applications will also
need over voltage protection devices connected to the power
supply rails. Unidirectional zener diode transient suppressors
are recommended. The zeners clamp transients to voltages
within the power supply rating and also clamp power supply
reversals to ground. Whether the zeners are used or not
the system power supply should be evaluated for transient
performance including power-on overshoot and power-off
polarity reversals as well as line regulation. See Z1 and
Z2 in Figure 1.
-IN
34
+Vs
3
GND
+Vb
Q2
RIN
OUT
34
IN
33
GND
+IN
-Vs
-Vs
-Vb
32
27
ILIM-
Q1
33
28
RP
ILIM+
OUT
11-13
20-22
RLIM
RL
Z2
FIGURE 1
OVERVOLTAGE PROTECTION
FIGURE 2
4 WIRE CURRENT LIMIT
CURRENT LIMIT
The two current limit sense lines are to be connected directly
across the current limit sense resistor. For the current limit to
work correctly pin 28 must be connected to the amplifier output
side and pin 27 connected to the load side of the current limit
resistor RLIM as shown in Figure 2. This connection will bypass
any parasitic resistances RP, formed by socket and solder joints
as well as internal amplifier losses. The current limiting resistor
may not be placed anywhere in the output circuit except where
shown in Figure 2. The value of the current limit resistor can be
calculated as follows: RLIM = .65/ILIMIT
BOOST OPERATION
With the boost feature the small signal stages of the amplifier
are operated at a higher supply voltages than the amplifierís
high current output stage. +VB (pins 4,8) and -VB (pins 25,30)
are connected to the small signal stages and +VS (pins 14-16)
and -VS (pins 17-19) are connected to the high current output
stage. An additional 10V on the +VB and -VB pins is sufficient
to allow the small signal stages to drive the output stage into
the triode region and improve the output voltage swing for extra
efficient operation when required. When the boost feature is
not needed +VS and -VS are connected to the +VB and -VB pins
respectively. The +VB and -VB pins must not be operated at
supply voltages less than +VS and -VS respectively.
BACKPLATE GROUNDING
The substrate of the MP108FD is an insulated metal substrate.
It is required that it be connected to signal ground. Connect pin
2 (back plate) to signal ground. The back plate will then be AC
grounded to signal ground through a 1µF capacitor.
This data
sheet has been carefully checked
and is believed• to5980
be reliable,
however,
no responsibility
for possible
inaccuracies
All specifications areHOTLINE:
subject to change
without
notice.
APEX
MICROTECHNOLOGY
CORPORATION
NORTH
SHANNON
ROAD •is assumed
TUCSON,
ARIZONA
85741or•omissions.
USA • APPLICATIONS
1 (800)
546-2739
4
MP108 REV B AUGUST 2004 © 2004 Apex Microtechnology Corp.