ON NSD914XV2T1G High−speed switching diode Datasheet

NSD914XV2T1
Preferred Device
High−Speed
Switching Diode
Features
•
•
•
•
•
High−Speed Switching Applications
Lead Finish: 100% Matte Sn (Tin)
Qualified Maximum Reflow Temperature: 260°C
Extremely Small SOD−523 Package
Pb−Free Package is Available
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1
CATHODE
MAXIMUM RATINGS (TA = 25°C)
Rating
2
ANODE
2
Symbol
Max
Unit
Reverse Voltage
VR
100
V
Forward Current
IF
200
mAdc
IFM(surge)
500
mAdc
MARKING
DIAGRAM
1
Peak Forward Surge Current
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board (Note 1)
TA = 25°C
Derate above 25°C
Thermal Resistance
Junction-to-Ambient
Junction and Storage Temperature
Symbol
Max
Unit
200
1.57
mW
mW/°C
RqJA
635
°C/W
TJ, Tstg
150
°C
PD
Symbol
Min
Max
Unit
V(BR)
100
−
Vdc
−
−
25
5.0
nAdc
mAdc
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(IBR = 100 mAdc)
Reverse Voltage Leakage Current
(VR = 20 Vdc)
(VR = 75 Vdc)
IR
Diode Capacitance
(VR = 0 V, f = 1.0 MHz)
CD
−
4.0
pF
Forward Voltage
(IF = 10 mAdc)
VF
−
1.0
Vdc
Reverse Recovery Time
(IF = IR = 10 mAdc)
trr
−
4.0
ns
© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 3
1
5D MG
G
2
5D
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
1. FR−4 @ Minimum Pad.
Characteristic
SOD−523
CASE 502
PLASTIC
1
Device
Package
Shipping†
NSD914XV2T1
SOD−523
3000/Tape & Reel
NSD914XV2T1G
SOD−523
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
NSD914XV2T1/D
NSD914XV2T1
820 Ω
+10 V
2.0 k
IF
100 μH
tr
0.1 μF
tp
IF
t
trr
10%
t
0.1 μF
90%
DUT
50 Ω INPUT
SAMPLING
OSCILLOSCOPE
50 Ω OUTPUT
PULSE
GENERATOR
IR
VR
INPUT SIGNAL
iR(REC) = 1.0 mA
OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)
Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
TA = 85°C
I R , REVERSE CURRENT (m A)
10
TA = −40°C
10
TA = 25°C
1.0
0.1
0.2
0.4
0.6
0.8
1.0
TA = 125°C
1.0
TA = 85°C
0.1
TA = 55°C
0.01
0.001
1.2
TA = 150°C
TA = 25°C
10
0
20
30
VF, FORWARD VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68
C D , DIODE CAPACITANCE (pF)
I F, FORWARD CURRENT (mA)
100
0.64
0.60
0.56
0.52
0
2.0
4.0
6.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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2
8.0
40
50
NSD914XV2T1
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE B
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
A
−Y−
B
1
2
D 2 PL
0.08 (0.003)
M
MILLIMETERS
MIN
NOM
MAX
1.10
1.20
1.30
0.70
0.80
0.90
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
0.15
0.20
0.25
1.50
1.60
1.70
DIM
A
B
C
D
J
K
S
T X Y
MIN
0.043
0.028
0.020
0.010
0.0028
0.006
0.059
INCHES
NOM
MAX
0.047
0.051
0.032
0.035
0.024
0.028
0.012
0.014
0.0055 0.0079
0.008
0.010
0.063
0.067
C
−T−
K
J
SEATING
PLANE
S
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
0.40
0.0157
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NSD914XV2T1/D
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