Da t a S h ee t , V e rs i on 1. 2 , D ec e m be r 2 00 3 P re s c a l e r C i rc u i t 1 . 1 G H z P M B 2 31 3 T V e r s i o n 1. 5 W i re l e s s In f r a s tr u c t ur e N e v e r s t o p t h i n k i n g . Edition 2003-12-01 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2003. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Prescaler Circuit 1.1 GHz Draft Copy Revision History: 2003-12-01 Previous Version: 1.1 Page Subjects (major changes since last revision) 20 Replacing the PMB 2312 by the PMB 2313 removed We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Version 1.2 PMB 2313T Version 1.5 Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8 Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Definition of Modulus Set-Up Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 10 Phase Noise Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 11 Measured Spectrum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 12 GSM Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Data Sheet 4 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Overview 1 Overview – Prescaler Circuit 1.1 GHz 1.1 Functional Description/ Application This IC is designed for use in mobile radio communication devices up to 1100 MHz. Due to low power consumption and low phase noise generation, the PMB2313T is suitable for use in battery powered handheld systems, e.g. GSM, cordless telephones and cordless consumer products, as well as in basestations. Low supply voltage down to 2.7V. It can be switched to a low-power standby mode. Internal current source at the emitter follower output. No external resistor needed in typical applications. The divide ratio is 1:64/65 or 1:128/129 depending on the external circuit configuration. The IC is board level compatible to the PMB 2312 prescaler. 1.2 Circuit Description The differential inputs of the IC may be connected either balanced or single ended. In the latter case the unused input must be RF-grounded with a capacitor (about 1.5 nF) with a low serial inductance. Depending on the logic level at SW input the basic divide ratio of the ECL-stages is fixed to 1:64/65 or 1:128/129. The MOD input determines whether modulus 1:n or 1:n+1 (n=64 or 128 according to SW-level) is active. The IC can be switched to a low-power standby mode (input STB). The MOD input is TTL/CMOS compatible. The emitter follower output is CMOS compatible according to the application circuit on page 11. The minimum logic swing is 0.8 Vpp. Table 1 Function Table Input pin Logic level Prescaler function SW HIGH = US-0.1 V to US LOW = GND to 0.8 V or open 1:64/65 1:128/129 MOD HIGH = 2.0 V to US or open LOW = GND to 0.8 V 1:64/1:128 1:65/1:129 STB HIGH = US-0.1 V to US LOW = GND to 0.8 V Divider Q=HIGH, STANDBY-mode Data Sheet 5 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Pin Assignment 2 Pin Assignment Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Data Sheet I1 1 8 I2 US 2 7 STB SW 3 6 MOD Q 4 5 GND RF-input I1 supply voltage US divide ratio 1:64/65 - 1:128/129 control input (SW) output Q GND modulus 1:n/n+1 (n=64 or 128) control input (MOD) standby mode control input (STB) RF-input I2 6 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Block Diagram 3 Block Diagram US STB I2 2 7 Uref 4 8 Q 1:64/65 1:128/129 I1 SW 1 I 6 3 MOD 5 GND Data Sheet 7 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Absolute Maximum Ratings 4 Absolute Maximum Ratings TA = -40 to 85 °C Parameter Symbol Supply voltage Input level (Pin 1; Pin 8) Voltage swing (Pin 1 to 8) Input level (Pin 3; Pin 6; Pin 7) Output level (Pin 4) Output current (Pin 4) Junction temperature Storage temperature Thermal resistance system-ambient Unit Remarks US UI Limit Values min. max. -0.3 6 2 V V US=0V UI18 -2 2 V USW, UMOD, USTB, -0.3 V UQ US+0.7V or 5.5V if US+0.7V > 5.5V US V -IQ 5 mA Tj TS Rthsa 125 125 185 °C °C K/W -65 US=2.7...5.5V The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the IC will result. ESD-integrity ( according MIL-STD 883D, Meth. 3015.7): 500V 5 Operating Range Parameter Symbol Supply Voltage Input frequency Ambient temperature US ƒ TA Limit Values min. max. 2.7 5.5 50 1400 -40 85 Unit Remarks V MHz °C Within the operational range the IC operates as described in the circuit description. The AC / DC characteristic limits are not guaranteed. Data Sheet 8 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 AC/DC Characteristics 6 AC/DC Characteristics Supply voltage US=2.7 to 5.5V Ambient temperature TA = -20 to 85 °C (refered to the test circuit) Parameter Symbol Limit Values min. Supply current Supply current in standby-mode Input level dynamicrange (see diagram 2) Output logic swing SW voltage High SW voltage Low SW input current High SW input current Low MOD voltage High MOD voltage Low MOD input current High MOD input current Low STB voltage High STB voltage Low STB input current High STB input current Low Internal current source (see block diagram) Unit Test Condition inputs RF-grounded, US=2.7, TA = 25 °C, STB= US output open inputs RF-grounded, US=4.0, TA = 25 °C, STB= US output open inputs RF-grounded, US=5.5, TA = 25 °C, STB= US output open inputs RF-grounded, output open, STB = GND 100-1000MHz (sine wave) 100-1000MHz (sine wave) 1000-1100MHz (sine wave) 1000-1100MHz (sine wave) CL <= 12pF, RL=2kΩ CL <= 8pF typ. max. IS 1.9 2.4 mA IS 1.95 2.45 mA IS 2.00 2.5 mA 0.1 mA 400 5 280 2 US 0.8 60 mVrms dBm mVrms dBm VPP VPP V V µA 30 µA SW=GND US 0.8 50 V V µA MOD=US 120 µA MOD=GND US 0.8 30 V V µA STB = US 60 µA STB = GND ISTB Uin Pin Uin Pin UQ UQ USWH USWL ISWH 25 -19 25 -19 1 0.8 US-0.1V GND 1.1 1.1 -ISWL UMODH UMODL 2.3 GND IMODH SW=US IMODL USTBH USTBL ISTBH US-0.1 GND -ISTBL I µA 400 Delay times MOD setup time (diagram 1) 29 tset ns AC /DC characteristics involve the spread of values guaranteed within the specified suply voltage and ambient temperature range. Typical characteristics are the median of the production. Data Sheet 9 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Test Circuit 7 Test Circuit Calibration of the signal generator Signal generator (50Ω) Power meter 6dB attenuator (50Ω) 50Ω attenuator directly connected to power meter Input sensitivity and output logic swing measurement spectrum analyser GND 5 US 6 UMOD Signal generator (50Ω) 6dB attenuator (50Ω) USTB 1n UI2 7 8 4 PMB 2313 3 UQ USW US Scope US 2 1 Frequency counter UI 1n RL Cload 1n Cload <= 8pF inc. jig and instrument input capacitance attenuator directly connected to power meter RL only needed for enhanced driving capability. Data Sheet 10 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Application Circuit 8 Application Circuit MOD CMOS-PLL GND MOD 5 6 STB 7 I2 8 1nF 4 PMB 2313 3 2 1 Q F PMB 2304 ca. 1nF SW US US PD I1 1n LF VCO (SW connected for 1:64/65 divider ratio) Data Sheet 11 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Definition of Modulus Set-Up Time 9 Definition of Modulus Set-Up Time Diagram 1 ≈ I MOD tset ≈ Q Changes of the mod-level made up to this time will still affect the Q-output Data Sheet 12 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Definition of Modulus Set-Up Time Diagram 2 Input Dynamic Range Test Configuration 1 VCC C3 VCC C1 I2 6 dB SW STB stand by Attenuator C2 50 Ohm I1 max. +13dBm Q MOD GND CL C1 = C2 = 1nF C3 = 10 pF || 22nF CL < 8pF modulus control input Pin / [ dBm ] PMB 2313 Dynamic Range 4V Ratio 65 Test Configuration 1 10 Max. power of signal source 0 operating window -10 -20 -30 -40 -50 0 Data Sheet 200 400 600 800 1000 f / [ MHz ] 13 1200 1400 1600 1800 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Definition of Modulus Set-Up Time Diagram 3 Input Dynamic Range Test Configuration 2 VCC C3 VCC C1 SW I2 50 Ohm 50 Ohm STB stand by C2 max. +13dBm I1 Q MOD GND CL C1 = C2 = 1nF C3 = 10pF || 22nF CL < 8pF modulus control input PMB 2313 Dynamic Range 4V Ratio 65 Test Configuration 2 20 Pin / [ dBm ] Max. output power of signal source 10 0 operating window -10 -20 -30 -40 -50 0 Data Sheet 200 400 600 800 1000 f / [ MHz ] 14 1200 1400 1600 1800 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Phase Noise Measurement 10 Phase Noise Measurement Test Setup +4.0V PMB 2304 GSM Application Board with PMB 2313 Spectrum Analyser Rhode & Schwarz FSBS RF REF Plotter 10MHz Ref Out 3 wire bus MAC Board serial port PC PMB 2306 register programming: N = 70, A = 20 (fout = 900.0 MHz) R = 50 (fref = 200 kHz) Status =11111100011111 IPD=2mA Port 1=high Dual Mode Preamplifier Select= MOD A AAnti-Bachlash Width=1.3ns Standby 1/2=active PD-polarity=positive Mode 1/2=internal charge pump Data Acquisition=synchronous Data Sheet 15 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Measured Spectrum 11 Measured Spectrum Using PMB 2306T Data Sheet 16 Version 1.2, 2003-12-01 PMB 2313T Version 1.5 GSM Application Board 12 GSM Application Board PMB 2304 GSM Application Board C 19 22 µ F R9 C 20 22 pF R7 100 Ω C 12 22 pF R6 220 Ω C 16 22 pF 8.2 kΩ R8 330 Ω L1 22 nH RF C 15 22 pF R 13 150 Ω R 10 3.3 kΩ X2 SMA T3 R 11 BFT 92 T1 R4 18 kΩ C8 10 pF 8.2 kΩ C 13 C 11 1.2 pF T2 BFR 280 2.2 pF C 10 22 pF C9 100 pF D1 BFR 280 C14 22 pF R 12 6.8 kΩ R 15 2.2 kΩ R 14 150 Ω RX 1.36 GHz BBY 51 R5 8.2 kΩ C7 5.6 nF R3 8.2 kΩ C5 560 pF R2 22 kΩ C 17 33 pF R A* 4.7 kΩ R1 39 kΩ C1 33 pF C3 330 pF LD MFO2 MFO1 VDD1 PD VSS1 FI IC 1 PMB PMB2304 2306 RI VSS EN DA CLK Q SW VS I1 IC2 PMB 2313 VDD MOD GND MOD STB I2 C4 1 nF C2 33 pF C4 100 nF X1 SMA REF Data Sheet EN DA 17 CLK R*) Only needed when using the PMB 2312 prescaler. A Version 1.2, 2003-12-01 PMB 2313T Version 1.5 GSM Application Board PMB 2306 GSM Application Board List of Components Data Sheet Item Quantity Reference Part 1 2 3 4 5 6 7 8 9 10 11 12 1 2 1 1 1 1 1 1 4 1 1 1 R7 R13, R14 R6 R8 R15 R10 RA R12 R3, R5, R9, R11 R4 R2 R1 100Ω 150Ω 220Ω 330Ω 2.2kΩ 3.3kΩ 4.7kΩ 6.8kΩ 8.2kΩ 18kΩ 22kΩ 39kΩ 13 1 L1 22nH 14 15 16 17 1 1 1 6 1.2pF 2.2pF 10pF COG/0805 B37940-K5010-C262 COG/0805 B37940-K5020-C262 COG/0805 B37940-K5100-J62 18 19 20 21 22 23 24 25 3 1 1 1 1 1 1 1 C11 C13 C8 C10, C12, C14 C15, C16, C30 C1, C2, C17 C9 C3 C5 C4 C7 C6 C19 22pF 33pF 100pF 330pF 560pF 1.0nF 5.6nF 100nF 22µF COG/0805 COG/0805 COG/0805 COG/0805 COG/0805 26 27 28 1 2 1 D1 T2, T3 T1 BBY51 BFR280 BFT92 Q62702-B631 Q62702-F1298 Q62702-F1062 29 30 2 1 X1, X2 RX SMA 1.3GHz Connector B69620-G1307-A410 31 1 32 1 IC1 or IC2 or PMB 2304T P-DSO-14 PMB 2304T P-DSO-14 PMB 2313T P-DSO-8-1 PMB 2313T P-DSO-8-1 Q 67106-H9101 (TUBE) Q 67106-H9101 (T+R) 18 SMD/0805 SMD/0805 SMD/0805 SMD/0805 SMD/0805 SMD/0805 SMD/0805 SMD/0805 SMD/0805 SMD/0805 SMD/0805 SMD/0805 B54102-A1101-X60 B54102-A1151-J60 B54102-A1221-J60 B54102-A1331-J60 B54102-A1222-J60 B54102-A1332-J60 B54102-A1472-J60 B54102-A1682-J60 B54102-A1822-J60 B54102-A1183-J60 B54102-A1223-J60 B54102-A1393-J60 SIMID 01 B82412-A3220-M B37940-K5220-J62 B37940-K5330-J62 B37940-K5101-J62 B37940-K5331-J62 B37940-K5561-J62 COG/1210 X7R/1210 B37950-K5104-K62 Q 67006-A6116 (TUBE) Q 67006-A6116 (T+R) Version 1.2, 2003-12-01 PMB 2313T Version 1.5 Package Outlines Package Outlines 5,2 max 5 1,45-0,2 4 -0,2 0,7 0,19+0,06 1,75 max 13 6±0,2 8 5 1 4 0,35+0,15 0,7 max 1,27 3,81 Plastic-Package, P-DSO-8, Dual-in-Line-Package, 20 A 8 DIN 41870 T16 (SMD) Data Sheet 19 Version 1.2, 2003-12-01 www.infineon.com Published by Infineon Technologies AG