STMicroelectronics EMIF02-MIC01F2 2-line ipad, emi filter including esd protection Datasheet

EMIF02-MIC01F2
2-line IPAD™, EMI filter including ESD protection
Features
■
2-line symetrical low-pass filter
■
Lead-free package
■
High-density capacitor
■
High-efficiency EMI filtering
■
Very small PCB footprint: 1.42 mm x 1.92 mm
■
Very thin package: 0.65 mm
■
High-efficiency ESD suppression
(IEC 61000-4-2 level 4)
■
Flip Chip
11 bumps
Figure 1.
Pin configuration (bump side
view)
High reliability offered by monolithic integration
Complies with the standards:
■
3
4
2
1
IEC61000-4-2 Level 4 on inputs and outputs
– 15 kV (air discharge)
– 8 kV (contact discharge)
A
B
C
Application
■
Mobile phones (differential microphone filtering
and ESD protection).
Figure 2.
Schematic
GND
A4
Description
GND
Meas
GND
C5
The EMIF02-MIC01F2 is a highly integrated
device designed to suppress EMI / RFI noise for
microphone line filtering.
GND
GND
Vcc
A2
C3
C1
B4
The EMIF02-MIC01F2 Flip Chip packaging
means the package size is equal to the die size.
This is why the EMIF02-MIC01F2 is a very small
device.
R3
R5
R1
B1
R2
to pre-amp
C1codec
To Mic
C4
C2
C4
R4
R6
C2
GND
GND
GND
C6
GND
Additionally, the filter includes an ESD protection
circuit to prevent damage to the protected device
when subjected to ESD surges up to 15 kV.
GND
GND
A3,B2,B3,C3 are ground pins
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 6
1/7
www.st.com
7
Electrical characteristics
1
EMIF02-MIC01F2
Electrical characteristics
Table 1.
Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
VPP
ESD IEC 61000-4-2, input and output pins - air discharge
ESD IEC 61000-4-2, in put and output pins - contact discharge
15
8
kV
Junction temperature
125
°C
Tj
Unit
Top
Operating temperature range
-40 to +85
°C
Tstg
Storage temperature range
-55 to +150
°C
Max
Unit
18
V
0.5
µA
1.2
nF
Table 2.
Electrical characteristics (Tamb = 25 °C)
Symbol
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
VCL
Clamping voltage
Rd
Dynamic impedance
IPP
Peak pulse current
Symbol
Test condition
VBR
IR = 1 mA per line
IRM
VRM = 3 V per line
C1, C2, C3
VLINE = 0 V, VOSC = 30 mV, F = 1 MHz
C4, C5, C6
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Min
Typ
14
0.8
1.0
R1, R2
Tolerance ± 5 %
50
Ω
R3, R4
Tolerance ± 5 %
1.00
kΩ
R5, R6
Tolerance ± 5 %
2.20
kΩ
EMIF02-MIC01F2
Figure 3.
Electrical characteristics
Filter response
Figure 4.
dB
10
10
Tj = 25° C
0
dB
Tj = 25° C
0
-10
-10
-20
-20
-30
-30
-40
Analog crosstalk
-40
Line B4/B1
-50
-50
-60
-60
-70
-70
C1/B4
-80
-80
Line C4/C1
-90
100 k
Figure 5.
1.0 M
10.0 M
100 M
1.0 G
F (Hz)
-90
F (Hz)
-100
10.0 G
ESD response to IEC 61000-4-2
(+15 kV air discharge) on
output (VOUT)
-100
100 k
Figure 6.
1.0 M
10 M
100 M
1.0 G
10 G
ESD response to IEC 61000-4-2
(-15 kV air discharge) on
output (VOUT)
10 V/div
10 V/div
20 ns/div
20 ns/div
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Ordering information scheme
2
EMIF02-MIC01F2
Ordering information scheme
Figure 7.
Ordering information scheme
EMIF
yy
-
xx zz
Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 (pF)
or
2 letters = application
2 digits = version
Package
F = Flip Chip
x = 2: Lead-free, Pitch = 500 µm, Bump = 310 µm
3
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 8.
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Flip Chip dimensions
EMIF02-MIC01F2
Ordering information
Figure 9.
Footprint
Figure 10. Marking
Copper pad Diameter:
250 µm recommended, 300 µm max
Dot, ST logo
E
Solder stencil opening: 330 µm
x x z
y ww
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
Figure 11. Flip Chip tape and reel specification
Dot identifying Pin A1 location
3.5 ± 0.1
1.56
ST E
User direction of unreeling
Ordering information
Table 3.
Ordering information
Order code
EMIF02-MIC01F2
Note:
xxx
yww
4 ± 0.1
All dimensions in mm
4
2.02
ST E
xxx
yww
ST E
xxx
yww
8 ± 0.3
0.73 ± 0.05
1.75 ± 0.1
Ø 1.5 ± 0.1
4 ± 0.1
Marking
Package
Weight
Base qty
Delivery mode
GB
Flip Chip
3.8 mg
5000
Tape and reel (7”)
More packing information is available in the application notes:
AN1235: “Flip Chip: package description and recommendations for use”
AN 1751: “EMI filters: Recomendations and measurements”
5/7
Revision history
5
Revision history
Table 4.
6/7
EMIF02-MIC01F2
Document revision history
Date
Revision
Changes
Sep-2004
3
Previous issue.
09-Feb-2006
4
Added ECOPACK statement. Updated graphics to current standards.
06-Oct-2006
5
Reformatted to current standards. Updated characteristic curves, removed
Aplac information and updated tape and reel pocket dimensions.
17-Apr-2008
6
Updated ECOPACK statement. Updated Figure 7, Figure 8 and Figure 11.
Reformatted to current standards.
EMIF02-MIC01F2
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