Infineon BBY66-05W Silicon tuning diode Datasheet

BBY66...
Silicon Tuning Diodes
• High capacitance ratio
• High Q hyperabrupt tuning diode
• Low series resistance
• Designed for low tuning voltage operation
for VCO's in mobile communications equipment
• Very low capacitance spread
• Pb-free (RoHS compliant) package 1)
• Qualified according AEC Q101
BBY66-02V
BBY66-05
BBY66-05W
!
, ,
Type
BBY66-02V
BBY66-05
BBY66-05W
Package
SC79
SOT23
SOT323
Configuration
single
common cathode
common cathode
LS(nH)
0.6
1.8
1.4
Marking
h
O1s / O2s**
OBs
**For differences see next page Capacitance groups
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
Diode reverse voltage
VR
12
V
Forward current
IF
50
mA
Operating temperature range
Top
-55 ... 150
°C
Storage temperature
Tstg
-55 ... 150
1Pb-containing
Value
Unit
package may be available upon special request
1
2007-04-20
BBY66...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Values
Parameter
min.
typ.
Unit
max.
DC Characteristics
Reverse current
IR
nA
VR = 10 V
-
-
20
VR = 10 V, TA = 65 °C
-
-
200
AC Characteristics
Diode capacitance1)
pF
CT
VR = 1 V, f = 1 MHz
66
68.7
71.5
VR = 2 V, f = 1 MHz
33
35.4
38
VR = 3 V, f = 1 MHz
19.7
20.95
22.2
12
12.7
13.5
CT1 /CT4.5
5
5.41
-
rS
-
0.25
0.4
VR = 4.5 V, f = 1 MHz
Capacitance ratio
VR = 1 V, VR = 4.5 V
Series resistance
Ω
VR = 1 V, f = 470 MHz
1Capacitance
CT/groups
groups at 1V, coded 01; 02 (only BBY66-05)
01
02
C1V
min
66pF
68.5pF
C1V
max
69pF
71.5pF
Deliveries contain either CT group 01 or group 02 (marked on reel).
No direct order of CT groups possible
2
2007-04-20
BBY66...
Diode capacitance CT = ƒ (VR)
Temperature coefficient of the diode
f = 1MHz
capacitance TCc = ƒ (VR)
1200
80
pF
ppm/°C
TCC
CT
60
50
600
40
30
300
20
10
0
0
1
2
V
3
0
1
5
VR
2
3
V
5
VR
Reverse current IR = ƒ(VR)
TA = Parameter
10 4
pA
TA=+85°C
10 3
IR
TA=+65°C
TA=+25°C
10 2
10 1
10 0
2
3
4
5
6
7
8
9
10
V
12
VR
3
2007-04-20
Package SC79
BBY66...
Package Outline
0.2
M
A
+0.05
0.13 -0.03
0.8 ±0.1
0.2 ±0.05
10˚MAX.
1.6 ±0.1
1
0.3 ±0.05
Cathode
marking
10˚MAX.
1.2 ±0.1
A
2
0.55 ±0.04
0.35
1.35
Foot Print
0.35
Marking Layout (Example)
2005, June
Date code
BAR63-02V
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
Cathode
marking
0.4
0.93
0.2
8
1.96
Reel with 2 mm Pitch
2
1.33
Standard
4
Cathode
marking
4
0.66
2007-04-20
BBY66...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75 1) ) CES-Code
Month 2 0 03
2 0 04
2005
2006
2 0 07
2008
2009
2010
2011
2012
2 0 13
2014
01
a
p
A
P
a
p
A
P
a
p
A
P
02
b
q
B
Q
b
q
B
Q
b
q
B
Q
03
c
r
C
R
c
r
C
R
c
r
C
R
04
d
s
D
S
d
s
D
S
d
s
D
S
05
e
t
E
T
e
t
E
T
e
t
E
T
06
f
u
F
U
f
u
F
U
f
u
F
U
07
g
v
G
V
g
v
G
V
g
v
G
V
08
h
x
H
X
h
x
H
X
h
x
H
X
09
j
y
J
Y
j
y
J
Y
j
y
J
Y
10
k
z
K
Z
k
z
K
Z
k
z
K
Z
11
l
2
L
4
l
2
L
4
l
2
L
4
12
n
3
N
5
n
3
N
5
n
3
N
5
1) New Marking Layout for SC75, implemented at October 2005.
.
5
2007-04-20
Package SOT23
BBY66...
0.4 +0.1
-0.05
1)
2
0.08...0.1
C
0.95
1.3 ±0.1
1
2.4 ±0.15
3
0.1 MAX.
10˚ MAX.
B
1 ±0.1
10˚ MAX.
2.9 ±0.1
0.15 MIN.
Package Outline
A
5
0...8˚
1.9
0.2
0.25 M B C
M
A
1) Lead width can be 0.6 max. in dambar area
Foot Print
0.8
0.9
1.3
0.9
0.8
1.2
Marking Layout (Example)
Manufacturer
EH s
2005, June
Date code (YM)
Pin 1
BCW66
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
8
2.13
2.65
0.9
Pin 1
1.15
3.15
6
2007-04-20
Package SOT323
BBY66...
Package Outline
0.9 ±0.1
2 ±0.2
0.3 +0.1
-0.05
0.1 MAX.
3x
0.1
M
0.1
A
1
2
1.25 ±0.1
0.1 MIN.
2.1 ±0.1
3
0.15 +0.1
-0.05
0.65 0.65
0.2
M
A
Foot Print
0.8
1.6
0.6
0.65
0.65
Marking Layout (Example)
Manufacturer
2005, June
Date code (YM)
BCR108W
Type code
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
2.3
8
4
Pin 1
2.15
1.1
7
2007-04-20
BBY66...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
8
2007-04-20
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