Siemens HYB314100BJ-60 4m x 1-bit dynamic ram low power 4m x 1-bit dynamic ram Datasheet

4M x 1-Bit Dynamic RAM
Low Power 4M x 1-Bit Dynamic RAM
HYB 314100BJ/BJL -50/-60/-70
Advanced Information
•
4 194 304 words by 1-bit organization
•
0 to 70 ˚C operating temperature
•
Fast Page Mode Operation
•
Performance:
-50
-60
-70
tRAC
RAS access time
50
60
70
ns
tCAC
CAS access time
13
15
20
ns
tAA
Access time from address
25
30
35
ns
tRC
Read/Write cycle time
95
110
130
ns
tPC
Fast page mode cycle time
35
40
45
ns
Single + 3.3 V (± 0.3 V ) supply with a built-in Vbb generator
• Low power dissipation
max. 252 mW active (-50 version)
max. 216 mW active (-60 version)
max. 198 mW active (-70 version)
• Standby power dissipation:
7.2 mW max. standby (TTL)
3.6 mW max. standby (CMOS)
720 µW max. standby (CMOS) for Low Power Version
•
Output unlatched at cycle end allows two-dimensional chip selection
• Read, write, read-modify write, CAS-before-RAS refresh, RAS-only refresh,
hidden refresh and test mode capability
• All inputs and outputs TTL-compatible
• 1024 refresh cycles / 16 ms
•
1024 refresh cycles / 128 ms Low Power Version
• Plastic Packages: P-SOJ-26/20-5 with 300 mil width
•
Semiconductor Group
1
4.96
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
The HYB 314100BJ/BJL is the new generation dynamic RAM organized as 4 194 304 words by
1-bit. The HYB 314100BJ/BJL utilizes CMOS silicon gate process as well as advances circuit
techniques to provide wide operation margins, both internally and for the system user. Multiplexed
address inputs permit the HYB 514100BJ/BJL to be packed in a standard plastic P-SOJ-26/20
package. This package size provides high system bit densities and is compatible with commonly
used automatic testing and insertion equipment. System oriented features include single + 3.3 V
(± 0.3 V) power supply, direct interfacing with high performance logic device families.
Ordering Information
Type
Ordering Code
Package
Descriptions
HYB 314100BJ-50
Q67100-Q2035
P-SOJ-26/20-5
3.3 V DRAM
(access time 50 ns)
HYB 314100BJ-60
Q67100-Q2037
P-SOJ-26/20-5
3.3 V DRAM
(access time 60 ns)
HYB 314100BJ-70
Q67100-Q2039
P-SOJ-26/20-5
3.3 V DRAM
(access time 70 ns)
HYB 314100BJL-50
on request
P-SOJ-26/20-5
3.3 V Low Power DRAM
(access time 50 ns)
HYB 314100BJL-60
on request
P-SOJ-26/20-5
3.3 V Low Power DRAM
(access time 60 ns)
HYB 314100BJL-70
on request
P-SOJ-26/20-5
3.3 V Low Power DRAM
(access time 70 ns)
Semiconductor Group
2
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Pin Configuration
(top view)
P-SOJ-26/20-5
Pin Names
A0-A10
Address Input
RAS
Row Address Strobe
CAS
Column Address Strobe
WE
Read/Write Input
DI
Data In
DO
Data Out
VCC
Power Supply (+ 3.3 V)
VSS
Ground (0 V)
N.C.
No Connection
Semiconductor Group
3
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Block Diagram
Semiconductor Group
4
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Absolute Maximum Ratings
Operating temperature range ............................................................................................0 to 70 ˚C
Storage temperature range......................................................................................– 55 to + 150 ˚C
Input/output voltage ........................................................................... – 1 to + min (VCC + 0.5, 4.6) V
Power Supply voltage .................................................................................................. – 1 to + 4.6 V
Data out current (short circuit) ................................................................................................ 50 mA
Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent
damage of the device. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
DC Characteristics
TA = 0 to 70 ˚C, VSS = 0 V, VCC = 3.3 V ± 0.3 V , tT = 5 ns
Parameter
Symbol
Limit Values
min.
max.
Unit Test
Condition
Input high voltage
VIH
2.0
VCC + 0.5 V
1)
Input low voltage
VIL
– 1.0
0.8
V
1)
TTL Output high voltage (IOUT = – 2 mA)
VOH
2.4
–
V
1)
TTL Output low voltage (IOUT = 2 mA)
VOL
–
0.4
V
1)
CMOS Output high voltage (IOUT = – 100 µA)
VOH
VCC – 0.2 –
V
CMOS Output low voltage (IOUT = 100 µA)
VOL
–
0.2
V
Input leakage current, any input
(0 V < Vin < VCC + 0.3 V, all other input = 0 V)
II(L)
– 10
10
µA
1)
Output leakage current
(DO is disabled, 0 V < VOUT < VCC)
IO(L)
– 10
10
µA
1)
Average VCC supply current
-50 version
-60 version
-70 version
ICC1
mA
2) 3)4)
Standby VCC supply current
(RAS = CAS = WE = VIH)
ICC2
mA
–
Average VCC supply current during RAS-only
refresh cycles
-50 version
-60 version
-70 version
ICC3
mA
2)4)
Average VCC supply current during fast page
mode operation
-50 version
-60 version
-70 version
ICC4
mA
2) 3)4)
Standby VCC supply current
(RAS = CAS = WE = VCC – 0.2 V)
ICC5
mA
µA
1)
Semiconductor Group
5
_
–
–
70
60
55
–
2
_
–
–
70
60
55
–
–
50
45
40
–
1
200
L-version
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
DC Characteristics (cont’d)
TA = 0 to 70 ˚C, VSS = 0 V, VCC = 3.3 V ± 0.3 V , tT = 5 ns
Parameter
Symbol
Limit Values
min.
Average VCC supply current during
CAS before RAS refresh mode
-50 version
-60 version
-70 version
ICC6
For Low Power Version only:
Battery backup current (average power supply
current in battery backup mode):
(CAS = CAS before RAS cycling or 0.2 V,
WE = VCC – 0.2 V or 0.2 V,
A0 to A10 = VCC – 0.2 V or 0.2 V;
DI = VCC – 0.2 V or 0.2 V or open,
tRC = 125 µs, tRAS = tRAS min = 1 µs)
ICC7
max.
–
–
–
70
60
55
–
250
Unit Test
Condition
mA
2)4)
µA
–
Capacitance
TA = 0 to 70 ˚C; VCC = 3.3 V ± 0.3 V; f = 1 MHz
Parameter
Symbol
Limit Values
min.
max.
Unit
Input capacitance (A0 to A10, DI)
CI1
–
5
pF
Input capacitance (RAS, CAS, WE)
CI2
–
7
pF
Output capacitance (DO)
CIO
–
7
pF
Semiconductor Group
6
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
AC Characteristics 5)6)
TA = 0 to 70 ˚C, VCC = 3.3 V ± 0.3 V, tT = 5 ns
Parameter
Symbol
Limit Values
-50
Unit
-60
Note
-70
min.
max. min.
max. min.
max.
Common Parameters
Random read or write cycle time
tRC
95
–
110
–
130
–
ns
RAS precharge time
tRP
35
–
40
–
50
–
ns
RAS pulse width
tRAS
50
10k
60
10k
70
10k
ns
CAS pulse width
tCAS
13
10k
15
10k
20
10k
ns
Row address setup time
tASR
0
–
0
–
0
–
ns
Row address hold time
tRAH
8
–
10
–
10
–
ns
Column address setup time
tASC
0
–
0
–
0
–
ns
Column address hold time
tCAH
10
–
15
–
15
–
ns
RAS to CAS delay time
tRCD
18
37
20
45
20
50
ns
RAS to column address delay
time
tRAD
13
25
15
30
15
35
ns
RAS hold time
tRSH
13
15
–
20
–
ns
CAS hold time
tCSH
50
60
–
70
–
ns
CAS to RAS precharge time
tCRP
5
–
5
–
5
–
ns
Transition time (rise and fall)
tT
3
50
3
50
3
50
ns
Refresh period
tREF
–
16
–
16
–
16
ms
Refresh period for L-version
tREF
–
128
–
128
–
128
ms
Access time from RAS
tRAC
–
50
–
60
–
70
ns
8, 9
Access time from CAS
tCAC
–
13
–
15
–
20
ns
8, 9
Access time from column
address
tAA
–
25
–
30
–
35
ns
8,10
Column addr. to RAS lead time
tRAL
25
–
30
–
35
–
ns
Read command setup time
tRCS
0
–
0
–
0
–
ns
Read command hold time
tRCH
0
–
0
–
0
–
ns
11
Read command hold time
referenced to RAS
tRRH
0
–
0
–
0
–
ns
11
CAS to output in low-Z
tCLZ
0
–
0
–
0
–
ns
8
7
Read Cycle
Semiconductor Group
7
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
AC Characteristics (cont’d) 5)6)
TA = 0 to 70 ˚C, VCC = 3.3 V ± 0.3 V, tT = 5 ns
Parameter
Symbol
Limit Values
-50
-60
Unit
Note
12
-70
min.
max. min.
max. min.
max.
tOFF
0
13
0
15
0
20
ns
Write command hold time
tWCH
8
–
10
–
10
–
ns
Write command pulse width
tWP
8
–
10
–
10
–
ns
Write command setup time
tWCS
0
–
0
–
0
–
ns
Write command to RAS lead time tRWL
13
–
15
–
20
–
ns
Write command to CAS lead time tCWL
13
–
15
–
20
–
ns
Output buffer turn-off delay
Write Cycle
13
Data setup time
tDS
0
–
0
–
0
–
ns
14
Data hold time
tDH
10
–
10
–
15
–
ns
14
Read-write cycle time
tRWC
115
–
130
–
155
–
ns
RAS to WE delay time
tRWD
50
–
60
–
70
–
ns
13
CAS to WE delay time
tCWD
13
–
15
–
20
–
ns
13
Column address to WE delay
time
tAWD
25
–
30
–
35
–
ns
13
Fast page mode cycle time
tPC
35
–
40
–
45
–
ns
CAS precharge time
tCP
10
–
10
–
10
–
ns
Access time from CAS
precharge
tCPA
–
30
–
35
–
40
ns
RAS pulse width
tRAS
50
200 k 60
200 k 70
200 k ns
CAS precharge to RAS Delay
tRHCP
30
–
–
–
Read-Modify-Write Cycle
Fast Page Mode Cycle
Semiconductor Group
8
35
40
ns
7
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
AC Characteristics (cont’d) 5)6)
TA = 0 to 70 ˚C, VCC = 3.3 V ± 0.3 V, tT = 5 ns
Parameter
Symbol
Limit Values
-50
min.
Unit
-60
-70
max. min.
max. min.
max.
Fast Page Mode Read-Modify-Write Cycle
Fast page mode read-write cycle tPRWC
time
55
–
60
–
70
–
ns
tCPWD
30
–
35
–
40
–
ns
CAS setup time
tCSR
10
–
10
–
10
–
ns
CAS hold time
tCHR
10
–
10
–
10
–
ns
RAS to CAS precharge time
tRPC
5
–
5
–
5
–
ns
Write to RAS precharge time
tWRP
10
–
10
–
10
–
ns
Write hold time referenced to
RAS
tWRH
10
–
10
–
10
–
ns
tCPT
35
–
40
–
40
–
ns
Write command setup time
tWTS
10
–
10
–
10
–
ns
Write command hold time
tWTH
10
–
10
–
10
–
ns
CAS precharge to WE
CAS-before-RAS refresh cycle
CAS-before-RAS counter test
cycle
CAS precharge time
Test Mode
Semiconductor Group
9
Note
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Notes:
1) All voltages are referenced to VSS.
2) ICC1, ICC3, ICC4 and ICC6 depend on cycle rate.
3) ICC1 and ICC4 depend on output loading. Specified values are measured with the output open.
4) Address can be changed once or less while RAS = VIL. In the case of ICC4 it can be changed once or less during
a fast page mode cycle (tPC).
5) An initial pause of 200 µs is required after power-up followed by 8 RAS cycles of which at least one cycle has
to be a refresh cycle, before proper device operation is achieved. In case of using internal refresh counter, a
minimum of 8 CAS-before-RAS initialization cycles instead of 8 RAS cycles are required.
6) AC measurements assume tT = 5 ns.
7) VIH (min.) and VIL (max.) are reference levels for measuring timing of input signals. Transition times are also
measured between VIH and VIL.
8) Measured with the specified current load and 100 pF at VOL = 0.8 and VOH = 2.0 V.
9) Operation within the tRCD (max.) limit ensures that tRAC (max.) can be met. tRCD (max.) is specified as a reference point
only: If tRCD is greater than the specified tRCD (max.) limit, then access time is controlled by tCAC.
10)Operation within the tRAD (max.) limit ensures that tRAC (max.) can be met. tRAD (max.) is specified as a reference point
only: If tRAD is greater than the specified tRAD (max.) limit, then access time is controlled by tAA.
11)Either tRCH or tRRH must be satisfied for a read cycle.
12)tOFF (max.) defines the time at which the outputs achieve the open-circuit condition and are not referenced to
output voltage levels.
13)tWCS, tRWD, tCWD, tAWD and tCPWD are not restrictive operating parameters. They are included in the data sheet as
electrical characteristics only. If tWCS > tWCS (min.), the cycle is an early write cycle and the data out pin will remain
open-circuit (high impedance) through the entire cycle; if tRWD > tRWD (min.), tCWD > tCWD (min.), tAWD > tAWD (min.) and
tCPWD > tCPWD (min.), the cycle is a read-write cycle and DO will contain data read from the selected cells. If neither
of the above sets of conditions is satisfied, the condition of the DO pin (at access time) is indeterminate.
14)These parameters are referenced to the CAS leading edge in early write cycles and to the WE leading edge
in read-write cycles.
Semiconductor Group
10
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Read Cycle
Semiconductor Group
11
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Write Cycle (Early Write)
Semiconductor Group
12
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Read-Write (Read-Modify-Write) Cycle
Semiconductor Group
13
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Fast Page Mode Read-Modify-Write Cycle
Semiconductor Group
14
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Fast Page Mode Read Cycle
Semiconductor Group
15
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Fast Page Mode Early Write Cycle
Semiconductor Group
16
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
RAS-Only Refresh Cycle
Semiconductor Group
17
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
CAS-Before-RAS Refresh Cycle
Semiconductor Group
18
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Hidden Refresh Cycle (Read)
Semiconductor Group
19
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Hidden Refresh Cycle (Early Write)
Semiconductor Group
20
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
CAS-Before-RAS Refresh Counter Test Cycle
Semiconductor Group
21
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Test Mode Entry
Test Mode
The HYB314100BJ/BJL is organized 4 194 304 words by 1- bit but can internally be configured as
524 288 words by 8-bits. A WE, CAS-before-RAS cycle puts the device into Test Mode.
In Test Mode, data is written into 8 sectors in parallel and retrieved the same way. If, upon reading,
all bits are equal, the data output pin indicates a “1”. If any of the bits differ, the data output pin
indicates a “0”. In Test Mode the 4M DRAM can be tested as if it were a 512K DRAM. Test Mode
is exited by any refresh operation which is not a WE, CAS- before-RAS cycle. Addresses A10R,
A10C and A0C do not care during Test Mode.
Semiconductor Group
22
HYB 314100BJ/BJL-50/-60/-70
3.3V 4M x 1 DRAM
Package Outlines
GPJ05627
Plastic Package P-SOJ-26/20-5
(Plastic Small Outline J-leaded Package)
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.
SMD = Surface Mounted Device
Semiconductor Group
23
Dimensions in mm
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