INFINEON V23838-M305-M56

Fiber Optics
V23838-M305-M56
SFP - Small Form-factor Pluggable
1.25 Gigabit Ethernet (1000 Base-SX)
2.125/1.0625 Gbit/s Fibre Channel (200-M5/M6-SN-I / 100-M5/M6-SN-I)
Multimode 850 nm Transceiver with LC™ Connector
Features
• Small Form-factor Pluggable (SFP) MSA compatible
transceiver1)
• Advanced release mechanism
• Easy access, even in belly to belly applications
• Wire handle release for simplicity
• Color coded black tab (multimode)
• PCI height compatible
File: 1130
• Excellent EMI performance
• Common ground concept
• RJ-45 style LC™ connector system
• Single power supply (3.3 V)
• Extremely low power consumption of 530 mW typical
• Small size for high channel density
• UL-94 V-0 certified
• ESD Class 1C per JESD22-A114-B (MIL-STD 883D
Method 3015.7)
• According to FCC (Class B) and EN 55022
File: 1131
• For distances of up to 860 m (50 µm fiber)
• Laser safety according to Class 1 FDA and IEC
• AC/AC Coupling according to MSA
• Extended operating temperature range of –20°C to 85°C
• SFP evaluation kit V23848-S5-V4 available upon request
• A press fit cage and cage plugs are available as accessory products from Infineon
(see SFP Accessories)
1)
MSA documentation can be found at www.infineon.com/fiberoptics under Transceivers, SFP Transceivers.
LC™ is a trademark of Lucent
Data Sheet
1
2004-06-23
V23838-M305-M56
Pin Configuration
Pin Configuration
20
VEET
1
VEET
19
TD−
2
Tx Fault
18
TD+
3
Tx Disable
17
VEET
4
MOD-DEF(2)
16
VCCT
5
MOD-DEF(1)
15
VCCR
6
MOD-DEF(0)
14
VEER
7
Rate Select
13
RD+
8
LOS
12
RD−
9
VEER
11
VEER
10
VEER
Bottom of transceiver (as viewed
through top of transceiver)
Top of transceiver
Figure 1
Data Sheet
File: 1306
SFP Transceiver Electrical Pad Layout
2
2004-06-23
V23838-M305-M56
Pin Configuration
Pin Description
Pin No.
Name
Logic Level
Function
1
VEET
N/A
Transmitter Ground1)
2
Tx Fault
LVTTL
Transmitter Fault Indication2) 8)
3
Tx Disable
LVTTL
Transmitter Disable3)
4
MOD-DEF(2)
LVTTL
Module Definition 24) 8)
5
MOD-DEF(1)
LVTTL
Module Definition 15) 8)
6
MOD-DEF(0)
N/A
Module Definition 06) 8)
7
Rate Select
N/A
Not connected
8
LOS
LVTTL
Loss Of Signal7) 8)
9
N/A
Receiver Ground1)
N/A
Receiver Ground1)
11
VEER
VEER
VEER
N/A
Receiver Ground1)
12
RD–
LVPECL
Inv. Received Data Out9)
13
RD+
LVPECL
Received Data Out9)
14
N/A
Receiver Ground1)
N/A
Receiver Power
N/A
Transmitter Power
17
VEER
VCCR
VCCT
VEET
N/A
Transmitter Ground1)
18
TD+
LVPECL
Transmit Data In10)
19
TD–
LVPECL
Inv. Transmit Data In10)
20
VEET
N/A
Transmitter Ground1)
10
15
16
1)
2)
3)
4)
5)
6)
7)
8)
9)
10)
Common transmitter and receiver ground within the module.
A high signal indicates a laser fault of some kind and that laser is switched off.
A low signal switches the transmitter on. A high signal or when not connected switches the transmitter off.
MOD-DEF(2) is the data line of two wire serial interface for serial ID.
MOD-DEF(1) is the clock line of two wire serial interface for serial ID.
MOD-DEF(0) is grounded by the module to indicate that the module is present.
A low signal indicates normal operation, light is present at receiver input. A high signal indicates the received
optical power is below the worst case receiver sensitivity.
Should be pulled up on host board to VCC by 4.7 - 10 kΩ.
AC coupled inside the transceiver. Must be terminated with 100 Ω differential at the user SERDES.
AC coupled and 100 Ω differential termination inside the transceiver.
Data Sheet
3
2004-06-23
V23838-M305-M56
Description
Description
The Infineon Fibre Channel / Gigabit Ethernet multimode transceiver – part of Infineon
SFP family – is compatible to the Physical Medium Depend (PMD) sublayer and
baseband medium, type 1000 Base-SX (short wavelength) as specified in IEEE Std
802.3 and Fibre Channel
FC-PI-2 (Rev. 5.0) 200-M5-SN-I, 200-M6-SN-I for 2.125 Gbit/s, and
FC-PI-2 (Rev. 5.0) 100-M5-SN-I, 100-M6-SN-I for 1.0625 Gbit/s.
The appropriate fiber optic cable is 62.5 µm or 50 µm multimode fiber with LC™
connector.
Link Length as Defined by IEEE and Fibre Channel Standards
Fiber Type
Reach
min.1)
max.2)
50 µm, 2000 MHz*km
2
860
50 µm, 500 MHz*km
2
500
50 µm, 400 MHz*km
2
450
62.5 µm, 200 MHz*km
2
300
62.5 µm, 160 MHz*km
2
250
50 µm, 500 MHz*km
2
550
50 µm, 400 MHz*km
2
500
62.5 µm, 200 MHz*km
2
275
62.5 µm, 160 MHz*km
2
220
50 µm, 2000 MHz*km
2
500
50 µm, 500 MHz*km
2
300
50 µm, 400 MHz*km
2
260
62.5 µm, 200 MHz*km
2
150
62.5 µm, 160 MHz*km
2
120
Unit
at 1.0625 Gbit/s
meters
at 1.25 Gbit/s
meters
at 2.125 Gbit/s
1)
2)
meters
Minimum reach as defined by IEEE and Fibre Channel Standards. A 0 m link length (loop-back connector) is
supported.
Maximum reach as defined by IEEE and Fibre Channel Standards. Longer reach possible depending upon link
implementation.
Data Sheet
4
2004-06-23
V23838-M305-M56
Description
The Infineon SFP multimode transceiver is a single unit comprised of a transmitter, a
receiver, and an LC™ receptacle.
This transceiver supports the LC™ connectorization concept. It is compatible with RJ-45
style backpanels for high end datacom and telecom applications while providing the
advantages of fiber optic technology.
The module is designed for low cost SAN, LAN, Fibre Channel and Gigabit Ethernet
applications. It can be used as the network end device interface in mainframes,
workstations, servers, and storage devices, and in a broad range of network devices
such as bridges, routers, hubs, and local and wide area switches.
This transceiver operates at 1.0625 Gbit/s / 1.25 Gbit/s / 2.125 Gbit/s from a single power
supply (+3.3 V). The 100 Ω differential data inputs and outputs are LVPECL and CML
compatible.
Functional Description of SFP Transceiver
This transceiver is designed to transmit serial data via multimode cable.
Tx Fault
Automatic
Shut-Down
Tx Disable
Tx Coupling Unit
TD+
TD−
Laser
Driver
e/o
Laser
Power
Control
o/e
Multimode Fiber
Monitor
Rx Coupling Unit
RD+
RD−
Limiting
Amp
TIA
o/e
LOS
MOD-DEF(2)
MOD-DEF(1)
EEPROM
File: 1361
Figure 2
Data Sheet
Functional Diagram
5
2004-06-23
V23838-M305-M56
Description
The receiver component converts the optical serial data into CML compatible electrical
data (RD+ and RD–). The Loss Of Signal (LOS) shows whether an optical signal is
present.
The transmitter converts CML compatible electrical serial data (TD+ and TD–) into
optical serial data. Data lines are differentially 100 Ω terminated.
The transmitter contains a laser driver circuit that drives the modulation and bias current
of the laser diode. The currents are controlled by a power control circuit to guarantee
constant output power of the laser over temperature and aging. The power control uses
the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a
controlling signal, to prevent the laser power from exceeding the operating limits.
Single fault condition is ensured by means of an integrated automatic shutdown circuit
that disables the laser when it detects laser fault to guarantee the laser Eye Safety.
The transceiver contains a supervisory circuit to control the power supply. This circuit
makes an internal reset signal whenever the supply voltage drops below the reset
threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage
has risen above the reset threshold. During this time the laser is inactive.
A low signal on TxDis enables transmitter. If TxDis is high or not connected the
transmitter is disabled.
The serial ID interface defines a 256 byte memory map in EEPROM, accessible over a
2 wire, serial interface at the 8 bit address 1010000X (A0h).
Data Sheet
6
2004-06-23
V23838-M305-M56
Description
Regulatory Compliance (EMI)
Feature
Standard
Comments
ESD:
Electrostatic Discharge
to the Electrical Pins
EIA/JESD22-A114-B
(MIL-STD 883D
method 3015.7)
Class 1C
Immunity:
Against Electrostatic
Discharge (ESD) to the
Duplex LC Receptacle
EN 61000-4-2
IEC 61000-4-2
Discharges ranging from ±2 kV to
±15 kV on the receptacle cause no
damage to transceiver (under
recommended conditions).
Immunity:
Against Radio
Frequency
Electromagnetic Field
EN 61000-4-3
IEC 61000-4-3
With a field strength of 10 V/m,
noise frequency ranges from
10 MHz to 2 GHz. No effect on
transceiver performance between
the specification limits.
Emission:
FCC 47 CFR Part 15,
Radiated Field Strength Class B
CISPR 22
EN 55022 Class B
Compliant with
89/336/EEC
Noise frequency range:
30 MHz to 18 GHz
EN 55022
EN 55024
File: 1400
SFP
This device complies with part 15 of
the FCC Rules1). Operation is
subject to the following two
conditions:
1 This device may not cause
harmful interference.
2 This device must accept any
interference received, including
interference that may cause
undesired operation.
V23838-M305-M56
Tested To Comply
With FCC Standards
FOR HOME OR OFFICE USE
File: 1406
1)
Any kind of modification not expressly approved by Infineon Technologies may affect the regulatory
compliance of the concerned product. As a consequence thereof this could void the user’s authority to operate
the equipment.
Data Sheet
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2004-06-23
V23838-M305-M56
Technical Data
Technical Data
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
min.
Unit
max.
Operating Case Temperature1)
VID max
VIDpk-pk
TS
TC
Storage Relative Humidity
RHs
5
95
%
Operating Relative Humidity
RHo
5
85
%
Supply Voltage
4
V
Data Output Current
VCC max
Idata
50
mA
Receiver Optical Input Power
RxP max
3
dBm
Data Input Voltage
Differential Data Input Voltage Swing
Storage Ambient Temperature
1)
VCC+0.5
V
5
V
–40
85
°C
–20
85
°C
Operating case temperature measured at transceiver reference point (in cage through 2nd centre hole from
rear, see Figure 9).
Exceeding any one of these values may permanently destroy the device.
Data Sheet
8
2004-06-23
V23838-M305-M56
Technical Data
Electrical Characteristics (VCC = 2.97 V to 3.63 V, TC = –20°C to 85°C)
Parameter
Symbol
Values
Unit
min.
typ.
max.
2.97
3.3
3.63
V
In-rush Current
VCC–VEE
IIR max
30
mA
Power Dissipation
P
400
700
mW
Differential Data Input Voltage
Swing2)
VIDpk-pk
500
3200
mV
Tx Disable Voltage
TxDis
2
VCC
V
Tx Enable Voltage
TxEn
VEE
0.8
V
Tx Fault High Voltage
TxFH
2.4
VCC
V
Tx Fault Low Voltage
TxFL
VEE
0.5
V
Supply Current3)
ITx
150
mA
Differential Data Output Voltage VODpk-pk 500
Swing 4)
1000
mV
LOS Active
LOSA
2.4
VCC
V
LOS Normal
LOSN
VEE
0.5
V
Receiver 3 dB Cut-off
Frequency5)
1.5
GHz
Receiver 10 dB Cut-off
Frequency5)
3
GHz
Common
Supply Voltage
1)
Transmitter
100
Receiver
tR-Rx
tF-Rx
Rise Time6)
Fall Time6)
125
ps
170
ps
Contributed Deterministic Jitter7) DJRx
47
ps
Contributed Total Jitter8)
TJRx
124
ps
Jitter (pk-pk)9)
JRx
Power Supply Noise Rejection10) PSNR
Supply Current 3)
1)
2)
3)
11)
IRx
60
ps
100
mVpp
80
90
mA
Measured with MSA recommended supply filter network (Figure 7). Maximum value above that of the steady
state value.
Internally AC coupled. Typical 100 Ω differential input impedance.
MSA defines maximum current at 300 mA.
Data Sheet
9
2004-06-23
V23838-M305-M56
Technical Data
4)
5)
6)
7)
8)
9)
10)
11)
Internally AC coupled. Load 50 Ω to GND or 100 Ω differential. For dynamic measurement a tolerance of
50 mV should be added.
Fibre Channel PI Standard.
Measured values are 20% - 80%.
Deterministic Jitter is that jitter measured by a bathtub scan, using a 27–1 NRZ PRBS, and extrapolating to
1 BER.
Total Jitter is that jitter measured by a bathtub scan, using a 27–1 NRZ PRBS, and extrapolating to 1x10–12 BER.
Jitter (pk-pk) is measured using a 27–1 NRZ PRBS and a Digital Communications Analyzer.
Measured using a 20 Hz to 1 MHz sinusoidal modulation with the MSA recommended power supply filter
network (Figure 7) in place. A change in sensitivity of less than 1 dB can be typically expected.
Supply current excluding Rx output load.
Data Sheet
10
2004-06-23
V23838-M305-M56
Technical Data
Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = –20°C to 85°C)
Parameter
Symbol
Values
min.
typ.
196
156
450
450
Unit
max.
Transmitter
Optical Modulation Amplitude 1)
@ 2.125 Gbit/s
@ 1.0625 Gbit/s
OMA
Launched Power (Average)2)
PO
–8.5
–6
Extinction Ratio (Dynamic)
ER
9
14.5
Center Wavelength
λC
830
850
860
nm
Spectral Width (rms)
σI
0.15
0.85
nm
Relative Intensity Noise
RIN
–117
dB/Hz
Tx Disable Laser Output Power PO-TxDis
–50
dBm
Deterministic Jitter3)
DJTx
56
ps
Total Jitter4)
TJTx
120
ps
Jitter (pk-pk)5)
JTx
35
85
ps
Rise Time6)
tR-Tx
tF-Tx
85
150
ps
135
150
ps
Fall Time6)
µW
20
–4
dBm
dB
Receiver7)
Min. Optical Modulation
Amplitude 8)
@ 2.125 Gbit/s
@ 1.0625 Gbit/s
OMA
Sensitivity (Average Power)9)
@ 2.125 Gbit/s
@ 1.25 Gbit/s
@ 1.0625 Gbit/s
PIN
Stressed Receiver Sensitivity
50 µm Fiber10)
@ 2.125 Gbit/s
@ 1.0625 Gbit/s
SPIN
Stressed Receiver Sensitivity
62.5 µm Fiber10)
@ 2.125 Gbit/s
@ 1.0625 Gbit/s
SPIN
LOS Assert Level 11)
PLOSA
Data Sheet
µW
24
19
49
31
–22
–19
–19
–19
dBm
µW
50 µm
29
24
96
55
µW
62.5 µm
34
32
–30
11
–28
109
67
dBm
2004-06-23
V23838-M305-M56
Technical Data
Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = –20°C to 85°C) (cont’d)
Parameter
Symbol
Values
min.
typ.
max.
–25
–20
LOS Hysteresis11)
PLOSD
PLOSA
–PLOSD
1
2
Input Center Wavelength
λC
770
850
Optical Return Loss
ORL
12
LOS Deassert Level 11)
1)
2)
3)
4)
5)
6)
7)
8)
9)
10)
11)
Unit
dBm
dB
860
nm
dB
Fibre Channel PI Standard. Typical OMA values based on –6 dBm launched power (average) and 15 dB
extinction ratio.
Into multimode fiber, 62.5 µm or 50 µm diameter.
Deterministic Jitter is that jitter measured by a bathtub scan, using a 27–1 NRZ PRBS, and extrapolating to
1 BER.
Total Jitter is that jitter measured by a bathtub scan, using a 27–1 NRZ PRBS, and extrapolating to 1x10–12 BER.
Jitter (pk-pk) is measured using a 27–1 NRZ PRBS and a Digital Communications Analyzer.
Values are 20% - 80%. Measured at nominal data rate, unfiltered, using an O/E plug-in with a bandwidth of
2.85 GHz or higher. Complies with FC 1x, FC 2x and Gigabit Ethernet eye mask when filtered.
Receiver characteristics are measured with a worst case reference laser.
Fibre Channel PI Standard.
Average optical power at which the BER is 1x10–12. Measured with a 27–1 NRZ PRBS and ER = 9 dB.
Measured at the given Stressed Receiver Eye Closure Penalty and DCD component given in Fibre Channel
PI Standard (2.03/2.18 dB & 40/80 ps).
See Figure 3.
1
LOS Level
0
LOS Deassert
(Maximum)
LOS
deassertion
range
Hysteresis
(Minimum)
LOS
persistence
LOS
assertion
range
LOS Assert
(Minimum)
Received Optical
Power Level
[dBm]
LOS / Hysteresis
(Typical)
File: 1522
Figure 3
Data Sheet
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2004-06-23
V23838-M305-M56
Technical Data
Timing of Control and Status I/O
Parameter
Symbol
Values
min.
Unit
Condition
max.
Tx Disable
Assert Time
t_off
10
µs
Time from rising edge of Tx
Disable to when the optical
output falls below 10% of
nominal
Tx Disable
Negate Time
t_on
1
ms
Time from falling edge of Tx
Disable to when the modulated
optical output rises above 90%
of nominal
Time to Initialize, t_init
Including Reset
of Tx Fault
300
ms
From power on or negation of
Tx Fault using Tx Disable
Tx Fault Assert
Time
t_fault
100
µs
Time from fault to Tx Fault on
Tx Disable to
Reset
t_reset
µs
Time Tx Disable must be held
high to reset Tx Fault
10
LOS Assert Time t_loss_on
100
µs
Time from LOS state to Rx
LOS assert
LOS Deassert
Time
t_loss_off
100
µs
Time from non-LOS state to Rx
LOS deassert
I2C Bus
Clock Rate
f_i2cbus_
clock
100
kHz
Data Sheet
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2004-06-23
V23838-M305-M56
Eye Safety
Eye Safety
This laser based multimode transceiver is a Class 1 product. It complies with IEC
60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10
and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001.
CLASS 1 LASER PRODUCT
To meet laser safety requirements the transceiver shall be operated within the Absolute
Maximum Ratings.
Note: All adjustments have been made at the factory prior to shipment of the devices.
No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result in voided
product warranty.
Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification of
the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Laser Emission Data
Wavelength
850 nm
Maximum total output power
(as defined by IEC: 7 mm aperture at 14 mm distance)
709 µW / –1.5 dBm
Beam divergence (full angle) / NA (half angle)
20° / 0.18 rad
FDA
IEC
Complies with 21 CFR
1040.10 and 1040.11
Class 1 Laser Product
File: 1401
Figure 4
Required Labels
Laser
Emission
Tx
Top view
Rx
File: 1333
Figure 5
Data Sheet
Laser Emission
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2004-06-23
V23838-M305-M56
Application Notes
Application Notes
EMI Recommendations
To avoid electromagnetic radiation exceeding the required limits set by the standards,
please take note of the following recommendations.
When Gigabit switching components are found on a PCB (e.g. multiplexer,
serializer-deserializer, clock data recovery, etc.), any opening of the chassis may leak
radiation; this may also occur at chassis slots other than that of the device itself. Thus
every mechanical opening or aperture should be as small as feasible and its length
carefully considered.
On the board itself, every data connection should be an impedance matched line (e.g.
strip line or coplanar strip line). Data (D) and Data-not (Dn) should be routed
symmetrically. Vias should be avoided. Where internal termination inside an IC or a
transceiver is not present, a line terminating resistor must be provided. The decision of
how best to establish a ground depends on many boundary conditions. This decision
may turn out to be critical for achieving lowest EMI performance. At RF frequencies the
ground plane will always carry some amount of RF noise. Thus the ground and VCC
planes are often major radiators inside an enclosure. As a general rule, for small systems
such as PCI cards placed inside poorly shielded enclosures, the common ground
scheme has often proven to be most effective in reducing RF emissions. In a common
ground scheme, the PCI card becomes more equipotential with the chassis ground. As
a result, the overall radiation will decrease. In a common ground scheme, it is strongly
recommended to provide a proper contact between signal ground and chassis ground at
every location where possible. This concept is designed to avoid hotspots which are
places of highest radiation, caused when only a few connections between chassis and
signal grounds exist. Compensation currents would concentrate at these connections,
causing radiation. However, as signal ground may be the main cause for parasitic
radiation, connecting chassis ground and signal ground at the wrong place may result in
enhanced RF emissions.
For example, connecting chassis ground and signal ground at a front
panel/bezel/chassis by means of a fiber optic transceiver/cage may result in a large
amount of radiation especially where combined with an inadequate number of grounding
points between signal ground and chassis ground. Thus the transceiver becomes a
single contact point increasing radiation emissions. Even a capacitive coupling between
signal ground and chassis ground may be harmful if it is too close to an opening or an
aperture. For a number of systems, enforcing a strict separation of signal ground from
chassis ground may be advantageous, providing the housing does not present any slots
or other discontinuities. This separate ground concept seems to be more suitable in large
systems where appropriate shielding measures have also been implemented. The return
path of RF current must also be considered. Thus a split ground plane between Tx and
Rx paths may result in severe EMI problems.
Data Sheet
15
2004-06-23
V23838-M305-M56
Application Notes
The bezel opening for a transceiver should be sized so that all contact springs of the
transceiver cage make good electrical contact with the face plate. Please consider that
the PCB may behave like a dielectric waveguide. With a dielectric constant of 4, the
wavelength of the harmonics inside the PCB will be half of that in free space. Thus even
the smallest PCBs may have unexpected resonances.
Large systems can have many openings in the front panel for SFP transceivers. In
typical applications, not all of these ports will hold transceivers; some may be
intentionally left empty. These empty slots may emit significant amounts of radiation.
Thus it is recommended that empty ports be plugged with an EMI plug as shown in
Figure 6. Infineon offers an EMI/dust plug, P/N V23818-S5-B1.
SFP Accessories
Cage:
Infineon Technologies
Part Number: V23838-S5-N1/V23838-S5-N1-BB
Host Board Connector:
Tyco Electronics
Part Number: 1367073-1
Cage EMI/Dust Plug:
Infineon Technologies
Part Number: V23818-S5-B1
Cage Dust Plug:
Infineon Technologies
Part Number: V23818-S5-B2
CAGE
HOST BOARD
CONNECTOR
CAGE EMI/DUST PLUG
iSFP™
HOST BOARD
DUST PLUG
File: 1521
Figure 6
Data Sheet
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2004-06-23
V23838-M305-M56
Application Notes
EEPROM Serial ID Memory Contents (A0h)
Addr. Hex ASCII Name/Description
0
03
Identifier
1
04
Extended identifier
2
07
Connector
34
62
b
3
4
00
00
35
36
48
00
H
5
6
00
01
37
38
00
03
7
8
9
10
11
40
40
0C
05
01
Encoding
39
40
41
42
43
19
56
32
33
38
V
2
3
8
12
15
BR, nominal
44
33
3
13
00
Reserved
45
38
8
14
00
Length (9 µm) - km
46
2D
-
15
00
Length (9 µm)
47
4D
M
16
1E
Length (50 µm)
48
33
3
17
0F
Length (62.5 µm)
49
30
0
18
00
Length (copper)
50
35
5
19
00
Reserved
51
2D
-
20
21
22
23
24
25
49
6E
66
69
6E
65
I
n
f
i
n
e
Vendor name
52
53
54
55
56
57
4D
35
36
20
41
34
M
5
6
26
27
6F
6E
o
n
58
59
41
39
A
9
28
29
20
46
03
52
Wavelength
F
60
61
30
4F
O
62
00
Reserved
31
20
63
21
Check sum of
bytes 0 - 62
Data Sheet
Addr. Hex ASCII Name/Description
32
47
G
Vendor name
33
6D m
Transceiver optical
compatibility
17
Reserved
Vendor OUI
A
4
Vendor part number
Vendor revision,
product status
dependent
2004-06-23
V23838-M305-M56
Application Notes
EEPROM Serial ID Memory Contents (A0h) (cont’d)
Addr.
64
65
66
Addr.
96
97
98
Hex ASCII Name/Description
20
Vendor specific
EEPROM
20
20
99
20
100
101
102
103
104
20
20
20
20
20
73
74
105
106
20
20
75
76
20
107
108
20
20
77
20
109
20
78
20
110
20
79
20
111
20
80
20
112
20
81
20
113
20
82
20
114
20
83
20
115
20
116
117
20
20
20
20
20
20
20
67
Hex ASCII Name/Description
00
Transceiver signal
options
1A
00
BR, maximum
32
BR, minimum
68
69
70
71
72
Vendor serial number
84
85
Vendor manufacturing
date code
86
87
88
89
90
20
118
119
120
121
122
91
20
123
20
92
00
Diagnostic monitoring
type
124
20
93
00
Enhanced options
125
20
94
00
SFF-8472 compliance
126
20
Low order 8 bits of the
sum of the contents of
all the bytes from byte
64 to byte 94, inclusive
127
128 255
20
00
95
Data Sheet
18
Vendor specific.
Reserved for future
use
2004-06-23
V23838-M305-M56
Application Notes
Multimode 850 nm SFP Transceiver, AC/AC TTL
Host Board
Infineon
SFP
Transceiver
3.3 V
1 µH
Protocol VCC
10 µF
VCCT
1 µH
0.1 µF
0.1 µF
Protocol VCC
16
xx 1)
VEET
4.7 to
10 kΩ
1/17/20
4.7 to
10 kΩ
Tx Disable
Tx Fault
Tx Disable
3
Tx Fault
2
TD–
19
0.1 µF
Laser
Driver
100 Ω
TD+
18
VCCR
15
0.1 µF
Protocol IC
ASIC IC
4.7 to
10 kΩ
10 µF
0.1 µF
xx 1)
VEER
9/10/11/14
RD+
13
0.1 µF
RD–
12
0.1 µF
LOS
8
Rate Select 2)
7
Pre-Amp./
Post Amp.
100 Ω
LOS
Rate Select 2)
Diagnostic IC / EEPROM
3.3 V
PLD / PAL
4.7 to
10 kΩ
4.7 to
10 kΩ
4.7 to
10 kΩ
6
5
4
MOD-DEF(0)
MOD-DEF(1)
MOD-DEF(2)
1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal
data rate. Use of single layer capacitors recommended. Short trace lengths are mandatory.
2) Not implemented.
File: 1320
Figure 7
Data Sheet
Example SFP Host Board Schematic and
Recommended Host Board Supply Filtering Network
19
2004-06-23
V23838-M305-M56
Package Outlines
13.4
13.7
Package Outlines
56.5
6.25
8.5
1.3
13.7
10.3
11.6
47.5
Dimensions in mm
File: 1215
Figure 8
TRANSCEIVER TEMPERATURE
REFERENCE POINT
29.80
Dimensions in mm
File: 1224
Figure 9
Data Sheet
20
2004-06-23
V23838-M305-M56
Revision History:
2004-06-23
Previous Version:
2004-01-09
Page
Subjects (major changes since last revision)
1
Features changed
4
Description changed
9, 17
Tables changed
19
Figure 7 Host Board Schematic changed
DS3
Edition 2004-06-23
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München, Germany
© Infineon Technologies AG 2004.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
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