FPF1013/4 tm IntelliMAXTM 1V Rated Advanced Load Management Products Features General Description 0.8V to 1.8V Input Voltage Range The FPF1013/4 series is an IntelliMAX advanced slew rate loadswitch offering a very low operating voltage. These devices consist of a 17mΩ N-channel MOSFET that supports an input voltage up to 2.0V. These slew rate devices control the switch turn-on and prevent excessive in-rush current from the supply rails. The input voltage range operates from 0.8V to 1.8V to fulfill today's lowest Ultraportable Device's supply requirements. Switch control is via a logic input (ON) capable of interfacing directly with low voltage control signals. Typical RDS(ON) = 17mΩ @ VON - VIN = 2.0V Output Discharge Function Internal Pull-down at ON Pin Accurate Slew Rate Controlled Turn-on time Low < 1µA Quiescent Current ESD Protected, above 8000V HBM, 2000V CDM RoHS Compliant The FPF1014 has an On-Chip pull down allowing for quick and controlled output discharge when switch is turned off. The FPF1013/4 series is available in a space-saving 1X1.5 CSP-6L package. Free from Halogenated Compounds and Antimony Oxides Applications PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Notebook Computer Pin 1 VIN VOUT VIN VOUT ON GND TOP BOTTOM Typical Application Circuit TO LOAD VOUT VIN FPF1013/4 - OFF ON ON GND Ordering Information Part Switch Turn-on Time FPF1013 17mΩ, NMOS FPF1014 17mΩ, NMOS ©2008 Fairchild Semiconductor Corporation FPF1013/4 Rev. B1 Output Discharge ON Pin Activity 43µs N/A Active HI CSP1X1.5 43µs 60Ω Active HI CSP1X1.5 1 Package www.fairchildsemi.com FPF1013/4 IntelliMAXTM 1V Rated Advanced Load Management Products December 2008 FPF1013/4 IntelliMAXTM 1V Rated Advanced Load Management Products Functional Block Diagram VIN CONTROL LOGIC ON Turn-on Slew Rate Controlled Driver VOUT ESD protection Output Discharge (Optional for FPF1014) FPF1013/4 GND Pin Configuration A2 A1 B2 B1 C2 C1 1.0 x 1.5 CSP Bottom View Pin Description Pin Name Function A2, B2 VIN Supply Input: Input to the power switch and the supply voltage for the IC ON Control Input C2 ON A1, B1 VOUT Switch Output: Output of the power switch C1 GND Ground Absolute Maximum Ratings Parameter Min Max Unit VIN, VOUT to GND VON to GND -0.3 2 V -0.3 4.2 V Maximum Continuous Switch Current 1.5 A Power Dissipation @ TA = 25°C (Note 1) 1.2 W Operating Temperature Range -40 85 °C Storage Temperature -65 150 °C 85 °C/W Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM 8000 V CDM 2000 V Note 1: Package power dissipation on 1 square inch pad, 2 oz. copper board 2 FPF1013/4 Rev. B1 www.fairchildsemi.com Parameter Min Max Unit VIN 0.8 1.8 V Ambient Operating Temperature, TA -40 85 °C Electrical Characteristics VIN = 0.8 to 1.8V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN =1.8V and TA = 25°C. Parameter Symbol Conditions Min Typ Max Units 1.8 V Basic Operation Operating Voltage ON Input Voltage 0.8 VIN VON(MIN) VIN = 0.8V VON(MAX) VIN = 1.8V (Note 2) 1.8 2.8 4.0 V 2.8 3.8 4.0 V Operating Current ICC VIN = 1V, VON = 3.3V, VOUT = Open 1 µA Quiescent Current IQ VIN = 1V, VON = GND, VOUT = Open 2 µA Off Switch Current ISWOFF 2 µA On-Resistance RON Output Pull Down Resistance RPD ON Input Logic Low Voltage VIL VIN = 1.8V, VON = GND, VOUT = GND VIN = 1V, VON = 3V, IOUT = 1A, TA = 25C 17 27 VIN = 1V, VON = 2.3V, IOUT = 1A, TA = 25°C 25 38 VIN = 1V, VON = 0V, IOUT = 1mA, TA = 25°C, FPF1014 60 120 VIN = 0.8V, RL = 1KΩ 0.3 VIN = 1.8V, RL = 1KΩ 0.8 VON = VIN or GND ON Input Leakage -1 1 mΩ Ω V µA Dynamic (VIN = 1.0V, VON = 3.0V, TA = 25°C) VOUT Rise Time Turn On Time VOUT Fall Time Turn Off Time TR TON TF TOFF RL = 500Ω, CL = 0.1µF 28 RL = 3.3Ω, CL = 10µF 38 RL = 500Ω, CL = 0.1µF 43 RL = 3.3Ω, CL = 10µF 58 FPF1014, RL = 500Ω, CL = 0.1µF 14 FPF1014, RL = 3.3Ω, CL = 10µF 76 FPF1014, RL = 500Ω, CL = 0.1µF 50 FPF1014, RL = 3.3Ω, CL = 10µF 96 µs µs µs µs Note 2: VON(MAX) is limited by the absolute rating. 3 FPF1013/4 Rev. B1 www.fairchildsemi.com FPF1013/4 IntelliMAXTM 1V Rated Advanced Load Management Products Recommended Operating Range 1.20 0.04 1.00 0.03 IQ CURRENT (uA) SUPPLY CURRENT (uA) 0.05 0.02 VON = 3.3V 0.01 0.00 VON = 0V 1.0 1.2 VIN = 1.8V 0.80 0.60 VIN = 1V 0.40 VIN = 0.8V 0.20 -0.01 -0.02 0.8 VON = 0 V VOUT = Open 1.4 1.6 0.00 -40 1.8 -15 Figure 1. Supply Current vs.VIN 60 85 1.20 VON = 3.3 V VOUT = Open 1.00 ISWOFF CURRENT (uA) 0.04 0.03 ICC CURRENT (uA) 35 Figure 2. Off Quiescent Current vs. Temperature 0.05 0.02 VIN = 0.8V VIN = 1V 0.01 0.00 VIN = 1.8V -0.02 -40 -15 10 35 60 0.80 0.60 0.40 0.00 -40 85 TJ, JUNCTION TEMPERATURE (°C) 24 40 ON RESISTANCE (mOhms) 45 22 20 18 16 10 -40 VIN = 1 V VON = 3 V IOUT = 1A -15 10 35 35 60 85 60 35 30 25 20 15 10 VON = 3 V IOUT = 1 A 5 0 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 85 TJ, JUNCTION TEMPERATURE (°C) 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 VON-VIN VOLTAGE (V) Figure 5. RON vs. Temperature Figure 6. RON vs. VON-VIN 4 FPF1013/4 Rev. B1 10 Figure 4. Off Switch Current vs. Temperature 26 12 -15 TJ, JUNCTION TEMPERATURE (°C) Figure 3. Operating Current vs. Temperature 14 VIN = 1.8 V VON = 0 V VOUT = 0 V 0.20 -0.01 ON Resistance (mOhm) 10 TJ, JUNCTION TEMPERATURE (°C) SUPPLY VOLTAGE (V) www.fairchildsemi.com FPF1013/4 IntelliMAXTM 1V Rated Advanced Load Management Products Typical Characteristics 1.600 1.8 1.400 ON THRESHOLD VOLTAGE (V) ON THRESHOLD VOLTAGE (V) 2.0 1.5 1.3 1.0 0.8 0.5 0.3 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.000 0.800 VIN = 1V 0.600 0.400 VIN = 0.8V 0.200 0.000 -40 0.0 0.8 VIN = 1.8V 1.200 1.8 -15 Figure 7. VIL vs. VIN 90 TURN ON/OFF TIME (us) RISE/FALL TIME (us) 120 60 FPF1013/4 TRISE 40 30 20 10 VIN = 1 V VON = 2.5 V CL = 10 µF RL = 3.3 Ω 0 -40 -15 35 60 FPF1014 TOFF 80 FPF1013/4 TON 60 40 VIN = 1 V VON = 2.5 V CL = 10 µF RL = 3.3 Ω 0 -40 85 -15 TJ, JUNCTION TEMPERATURE (°C) 35 60 85 Figure 10. TON/TOFF vs. Temperature VON 2V/DIV VON 2V/DIV IOUT 500mA/DIV IOUT 500mA/DIV VIN 500mV/DIV VIN 500mV/DIV VIN = 1 V VON = 2.6 V CIN = 10 µF CL = 10 µF RL = 3.3 Ω VOUT 500mV/DIV 100µs/DIV Figure 11. FPF1013/4 Turn ON Response VIN = 1 V VON = 2.6 V CIN = 10 µF CL = 10 µF RL = 3.3 Ω 100µs/DIV Figure 12. FPF1014 Turn OFF Response 5 FPF1013/4 Rev. B1 10 TJ, JUNCTION TEMPERATURE (°C) Figure 9. TRISE/TFALL vs. Temperature VOUT 500mV/DIV 85 100 20 10 60 140 70 50 35 Figure 8. VIL vs. Temperature FPF1014 TFALL 80 10 TJ, JUNCTION TEMPERATURE (°C) SUPPLY VOLTAGE (V) www.fairchildsemi.com FPF1013/4 IntelliMAXTM 1V Rated Advanced Load Management Products Typical Characteristics VON 2V/DIV VON 2V/DIV IOUT 500mA/DIV IOUT 500mA/DIV VIN 500mV/DIV VIN 500mV/DIV VIN = 1 V VON = 2.6 V CIN = 10 µF CL = 4.7 µF RL = 1 Ω VOUT 500mV/DIV VIN = 1 V VON = 2.6 V CIN = 10 µF CL = 4.7 µF RL = 1 Ω VOUT 500mV/DIV 100µs/DIV 100µs/DIV Figure 13. FPF1013/4 Turn ON Response Figure 14. FPF1014 Turn OFF Response VON 2V/DIV VIN 500mV/DIV VIN = 1 V VON = 2.6 V RL = 499 Ω VOUT 500mV/DIV 500ns/DIV Figure 15. FPF1014 Output Pull-down Response 6 FPF1013/4 Rev. B1 www.fairchildsemi.com FPF1013/4 IntelliMAXTM 1V Rated Advanced Load Management Products Typical Characteristics Timing Diagram The FPF1013/4 are low RDS(ON) N-Channel load switches with controlled turn-on. The core of each device is a 17mΩ (VIN = 1V, VON = 3V) N-Channel MOSFET and is customized for a low input operating range of 0.8 to 1.8V. The ON pin controls the state of the switch. 90% VON The FPF1014 contains a 60Ω(typ) on-chip resistor which is connected internally from VOUT to GND for quick output discharge when the switch is turned off. 10% 90% 90% VOUT 10% 10% tdON tR On/Off Control The ON pin is active high and it controls the state of the switch. Applying a continuous high signal will hold the switch in the ON state. In order to minimize the switch on resistance, the ON pin voltage should exceed the input voltage by 2V. This device is compatible with a GPIO (General Purpose Input/Output) port, where the logic voltage level can be configured to 4V ≥ VON ≥ VIN+2V and power consumed is less than 1µA in steady state. where: tdON tR tON tdOFF tF tOFF tdOFF tF tON = = = = = = tOFF Delay On Time VOUT Rise Time Turn On Time Delay Off Time VOUT Fall Time Turn Off Time Application Information Typical Application VOUT VIN VIN = 0.8-1.8V FPF1013/4 CIN OFF ON RL CL ON GND Input Capacitor Board Layout To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on, a capacitor must be placed between VIN and GND. For minimized voltage drop, especially when the operating voltage approaches 1V a 10µF ceramic capacitor should be placed close to the VIN pins. Higher values of CIN can be used to further reduce the voltage drop during higher current modes of operation. For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces or large copper planes for all pins (VIN, VOUT, ON and GND) will help minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. Output Capacitor A 0.1µF capacitor, CL, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductance from forcing VOUT below GND when the switch turns-off. If the application has a capacitive load, the FPF1014 can be used to discharged that load through an on-chip output discharge path. 7 FPF1013/4 Rev. B1 www.fairchildsemi.com FPF1013/4 IntelliMAXTM 1V Rated Advanced Load Management Products Description of Operation Demo Board Layout An improper layout could result in higher junction temperature. This concern applies when continuous operation current is set to maximum allowed current and switch turns into a large capacitive load that introduce high inrush current in the transient. Since FPF1013/4 does not have thermal shutdown feature a proper layout can essentially reduce power dissipation of the switch in transient and prevents switch to exceed the maximum absolute power dissipation of 1.2W. FPF1013/4 Demo board has the components and circuitry to demonstrate FPF1013/4 load switches functions. Thermal performance of the board is improved using a few techniques recommended in the layout recommendations section of datasheet. The VIN, VOUT and GND pins will dissipate most of the heat generated during a high load current condition. The layout suggested in Figure 16 provides each pin with adequate copper so that heat may be transferred as efficiently as possible out of the device. The ON pin trace may be laid-out diagonally from the device to maximize the area available to the ground pad. Placing the input and output capacitors as close to the device as possible also contributes to heat dissipation, particularly during high load currents. Figure 17. FPF1013/4 Demo Board Layout Figure 16: Proper layout of output, input and ground copper area 8 FPF1013/4 Rev. B1 www.fairchildsemi.com FPF1013/4 IntelliMAXTM 1V Rated Advanced Load Management Products Improving Thermal Performance FPF1013/4 IntelliMAXTM 1V Rated Advanced Load Management Products Dimensional Outline and Pad Layout 9 FPF1013/4 Rev. B1 www.fairchildsemi.com TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidianries, and is not intended to be an exhaustive list of all such trademarks. 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Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I37 10 FPF1013/4 Rev. B1 www.fairchildsemi.com