STMicroelectronics HSP061-2 2-line esd protection for high speed line Datasheet

HSP061-2
2-line ESD protection for high speed lines
Features
■
Flow-through routing to keep signal integrity
■
Ultralarge bandwidth: 6 GHz
■
Ultralow capacitance: 0.6 pF
■
Low leakage current: 100 nA at 25 °C
■
Extended operating junction temperature
range: -40 °C to 150 °C
■
HSP061-2M6
µQFN-6L
HSP061-2N4
µQFN-4L
RoHS compliant
Benefits
■
High ESD robustness of the equipment
■
Suitable for high density boards
Figure 1.
HSP061-2P6
SOT-666
Functional schematic (top view)
I/O1
1
6
I/O1
VBUS
GND
2
5
VBUS
I/O2
I/O2
3
4
I/O2
I/O1
1
6
I/O1
GND
2
5
I/O2
3
4
Complies with following standards
■
MIL-STD 883G Method 3015-7 Class 3B:
– 8 kV
■
IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
µQFN 6 leads
SOT666
I/O1
NC
Applications
GND
I/O2
NC
µQFN 4 leads
The HSP061-2 series is designed to protect
against electrostatic discharge on sub micron
technology circuits driving:
■
HDMI 1.3 and 1.4
■
Digital Video Interface
■
Display Port
■
USB 3.0
■
Serial ATA
■
Ethernet
■
HMI
February 2012
Description
The HSP061-2 is a 2-channel ESD array with a
rail to rail architecture designed specifically for the
protection of high speed differential lines.
The ultralow variation of the capacitance ensures
very low influence on signal-skew. The large
bandwidth makes it compatible with 5 Gbps.
The HSP061-2P6 is housed in SOT-666. The
HSP061-2M6 is packaged in µQFN-6L (1.45 x
1.0 mm) with a 500 µm pitch. The HSP061-2N4 is
packaged in µQFN-4L (1.0 x 0.8 mm) with a
400 µm pitch.
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12
Characteristics
HSP061-2
1
Characteristics
Table 1.
Absolute maximum ratings Tamb = 25 °C
Symbol
Parameter
Value
IEC 61000-4-2 contact discharge
8
IEC 61000-4-2 air discharge
15
Unit
VPP
Peak pulse voltage
Ipp
Repetitive peak pulse current (8/20 µs)
3
A
Tj
Operating junction temperature range
-40 to +150
°C
Storage temperature range
-65 to +150
°C
260
°C
Tstg
kV
TL
Maximum lead temperature for soldering during 10 s
Table 2.
Electrical characteristics Tamb = 25 °C
Symbol
Test conditions
Min.
Typ.
Max.
Unit
VBR
Breakdown voltage
IR = 1 mA
IRM
Leakage current
VRM = 3 V
VCL
Clamping voltage
IEC 61000-4-2, +8 kV contact
(IPP = 30 A), measured at 30 ns
18
Capacitance (input/output to
ground)
VI/O = 0 V, F = 200 to 3000 MHz,
VOSC = 30 mV
0.6
0.85
pF
Capacitance variation
(input/output to ground)
VI/O = 0 V F = 200 to 3000 MHz,
VOSC = 30 mV
0.03
0.13
pF
HSP061-2M6,
HSP061-2P6
5.5
HSP061-2N4
6
CI/O - GND
ΔCI/O - GND
fC
2/12
Parameter
Cut-off frequency
-3 dB
6
V
100
Doc ID 022777 Rev 1
nA
V
GHz
HSP061-2
Figure 2.
Characteristics
Leakage current versus junction
temperature (typical values)
Figure 3.
S21 attenuation measurement
(HSP061-2P6, HSP061-2M6)
S21(db)
10.00
0.00
VR = V RM = 3 V
IR (nA)
- 4.00
1.00
- 8.00
0.10
- 12.00
F(Hz)
Tj (°C)
0.01
25
50
Figure 4.
0
75
100
125
150
S21 attenuation measurement
(HSP061-2N4)
S21 (dB)
- 16.00
300.0k
Figure 5.
1.0M
3.0M
10.0M
30.0M
100.0M
300.0M
1.0G
3.0G
Eye diagram - HDMI mask at
3.4 Gbps per channel(1)
(HSP061-2P6)
250 mV/div
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
300k
F (Hz)
1M
3M
IO1
10M
30M
100M 300M 1G
IO2
3G
49 ps/div
1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office.
Figure 6.
Eye diagram - HDMI mask at
3.4 Gbps per channel(1)
(HSP061-2M6)
250 mV/div
Figure 7.
Eye diagram - HDMI mask at
3.4 Gbps per channel(1)
(HSP061-2N4)
250 mV/div
49 ps/div
Doc ID 022777 Rev 1
49 ps/div
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Ordering information scheme
Figure 8.
HSP061-2
ESD response to IEC 61000-4-2
(+8 kV contact discharge)
Figure 9.
ESD response to IEC 61000-4-2
(-8 kV contact discharge)
10V/Div
10V/Div
100ns/Div
100ns/Div
2
Ordering information scheme
Figure 10. Ordering information scheme
HSP 06 1 - 2 xx
High speed line protection
Breakdown voltage
Version
Number of lines
Package
P6 = SOT-666
M6 = µQFN-6L
N4 = µQFN-4L
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HSP061-2
3
Package information
Package information
●
Epoxy meets UL94, V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 3.
SOT-666 dimensions
Dimensions
b1
Ref.
L1
Millimeters
Min.
L3
Typ.
Max.
Inches
Min.
Typ.
Max.
A
0.45
0.60 0.018
0.024
A3
0.08
0.18 0.003
0.007
b
0.17
0.34 0.007
0.013
b1
0.19
D
1.50
1.70 0.059
0.067
E
1.50
1.70 0.059
0.067
E1
1.10
1.30 0.043
0.051
b
D
E1
A
L2
E
A3
0.27
0.34 0.007 0.011 0.013
e
0.50
0.020
L1
0.19
0.007
L2
0.10
0.30 0.004
0.012
e
L3
Figure 11. Footprint recommendations
dimensions in mm (inches)
0.10
0.004
Figure 12. Marking
0.50
(0.019)
0.62 2.60
(0.024) (0.01)
R
0.99
(0.039)
0.30
(0.012)
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Package information
HSP061-2
Table 4.
µQFN 1.45x1.00 6L dimensions
Dimensions
1
2
L
Ref.
k
b
e
A
A1
D
N
E
1
2
Figure 13. Footprint recommendations
dimensions in mm (inches)
0.50
[0.020]
Typ.
Max.
Min.
Typ.
A
0.50
0.55
0.60
0.020 0.022 0.024
A1
0.00
0.02
0.05
0.000 0.001 0.002
b
0.18
0.25
0.30
0.007 0.010 0.012
D
1.45
0.057
E
1.00
0.039
e
0.50
0.020
K
0.20
L
0.30
Max.
0.008
0.35
0.40
0.012 0.014 0.016
Figure 14. Marking
0.25
[0.010]
0.30
[0.012]
6/12
Inches
Min.
0.65
[0.026]
Note:
Millimeters
1.60
[0.063]
T
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
Doc ID 022777 Rev 1
HSP061-2
Package information
Table 5.
µQFN-4L dimensions
Dimensions
Ref.
Side
view
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.45
0.50
0.55
0.018 0.020 0.022
A1
0.00
0.02
0.05
0.000 0.001 0.002
b
0.15
0.20
0.25
0.006 0.008 0.010
D
0.75
0.80
0.85
0.030 0.031 0.033
D2
0.55
0.6
0.65
0.022 0.024 0.026
e
0.35
0.40
0.45
0.014 0.016 0.018
E
0.95
1.00
1.05
0.037 0.039 0.041
E2
0.15
0.20
0.25
0.006 0.008 0.010
k
0.17
0.20
0.23
0.007 0.008 0.009
L
0.15
0.20
0.25
0.006 0.008 0.010
A
A1
D
D2
e
Bottom
view
k
E2
E
L
b
Figure 15. Footprint recommendations
(dimensions in mm)
Figure 16. Marking
0.4
(0.016)
Pin 1
0.4
(0.016)
0.2 (0.008)
0.2 (0.008)
1.4
(0.055)
1
0.6
(0.024)
Note:
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.
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Recommendation on PCB assembly
HSP061-2
4
Recommendation on PCB assembly
4.1
Stencil opening design
1.
General recommendation on stencil opening design
a)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 17. Stencil opening dimensions
L
T
b)
W
General design rule
Stencil thickness (T) = 75 ~ 125 µm
W
Aspect Ratio = ----- ≥ 1.5
T
L×W
Aspect Area = ---------------------------- ≥ 0.66
2T ( L + W )
2.
Reference design
a)
Stencil opening thickness: 100 µm
b)
Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 18. Recommended stencil window position for µQFN-6L
7 µm
7 µm
620 µm
650 µm
15 µm
236 µm
15 µm
Footprint
250 µm
Stencil window
Footprint
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Doc ID 022777 Rev 1
HSP061-2
Recommendation on PCB assembly
Figure 19. Recommended stencil window position for µQFN-4L
T=100 µm and opening
ratio is 100%
430 µm
0.4
0.4
0.2
0.2
1.4
0.6
180 µm
580 µm
0.6
200 µm
Footprint
Stencil windo w
Footprint
4.2
4.3
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste is recommended.
3.
Offers a high tack force to resist component movement during high speed.
4.
Solder paste with fine particles: powder particle size is 20-45 µm.
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3.
Standard tolerance of ± 0.05 mm is recommended.
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Recommendation on PCB assembly
4.4
4.5
HSP061-2
4.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Reflow profile
Figure 20. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
2°C/s recommended
2°C/s recommended
6°C/s max
6°C/s max
3°C/s max
3°C/s max
0
0
1
2
3
4
5
10-30 sec
90 to 150 sec
Note:
10/12
6
7
Time (min)
90 sec max
Minimize air convection currents in the reflow oven to avoid component movement.
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HSP061-2
5
Ordering information
Ordering information
Table 6.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
HSP061-2P6
R
SOT-666
2.85 mg
3000
Tape and reel (7”)
HSP061-2M6
(1)
µQFN-6L
2.3 mg
3000
Tape and reel (7”)
(1)
µQFN-4L
1.17 mg
10000
Tape and reel (7”)
T
HSP061-2N4
1
1. The marking can be rotated by multiple of 90° to differentiate assembly location
6
Revision history
Table 7.
Document revision history
Date
Revision
07-Feb-2012
1
Changes
Initial release.
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HSP061-2
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