Fairchild FAN100 Design and application of primary-side regulation (psr) pwm controller Datasheet

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AN-6067
Design and Application of Primary-Side Regulation (PSR)
PWM Controller
FAN100 / FAN102 / FSEZ1016A / FSEZ1216
Abstract
Features
This application note describes a typical charger using the
PSR controller. Both the features of this controller, as well
as the operation of the power supply adaptor, are presented
in detail. Based on the proposed design guideline, a design
example with detailed parameters is given to demonstrate
the superior performance of the controller.
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Applications
ƒ
Battery chargers for cellular phones, cordless phones,
PDAs, digital cameras, power tools
ƒ
Optimal choice for the replacement of linear
transformers and RCC SMPS
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Constant-Voltage (CV) and Constant-Current (CC)
Control without Secondary-Feedback Circuitry
Accurate Constant Current Achieved by Fairchild’s
Proprietary TRUECURRENT™ Technique
Green-Mode Function: PWM Frequency Decreasing
Linearly
Fixed PWM Frequency at 42kHz with Frequency
Hopping to Solve EMI Problems
Low Startup Current: 10μA (Typical)
Low Operating Current: 3.5mA (Typical)
Peak-Current-Mode Control
Cycle-by-Cycle Current Limiting
VDD Over-Voltage Protection (OVP)
VDD Under-Voltage lockout (UVLO)
Gate Output Maximum Voltage Clamped at 18V
Fixed Over-Temperature Protection (OTP)
Cable Compensation for Tight CV Regulation
(FAN102 / FSEZ1216)
PSR PWM Controller
FAN100
FAN102
FSEZ1016A
FSEZ1216
PSR PWM Controller
FAN100 + Cable Compensation
FAN100 + MOSFET (1A/600V)
FAN102 + MOSFET (1A/600V)
Pin Configurations
Figure 1. FAN100
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
Figure 2. FAN102
Figure 3. FSEZ1016A
Figure 4. FSEZ1216
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AN-6067
APPLICATION NOTE
Typical Applications
Vbus
3 COMI
8
3 COMI
CS
1
4 COMV
PGND
2
6 GND
GATE
4 COMV
6
7 VDD
VS 5
7 VDD
SGND
VS 5
GATE
8
CS 1
COMR 2
FAN100
Figure 5. FAN100
Figure 6. FAN102 (FAN100 + Cable Compensation)
Vbus
Vbus
6 VDD
3 COMI
4 COMV
2 GND
6 VDD
VS 5
DRAIN
CS
8
3 COMI
1
4 COMV
N.C. 7
7
DRAIN
CS
8
1
COMR 2
FSEZ1216
FSEZ1016A
Figure 7. FSEZ1016A (FAN100 + MOSFET)
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
GND
VS 5
Figure 8. FSEZ1216 (FAN102 + MOSEFET)
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AN-6067
APPLICATION NOTE
Block Diagrams
Figure 9. FSEZ1016A (FAN100 + MOSFET)
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
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AN-6067
APPLICATION NOTE
Block Diagrams (Continued)
Figure 10. FSEZ1216 (FAN102 + MOSFET)
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
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AN-6067
APPLICATION NOTE
Introduction
protection function shuts down the controller with auto
recovery when over heating occurs.
This highly integrated PSR PWM controller contains several
features to enhance the performance of low-power flyback
converters. The patented topology of the PSR controller
allows for simplified of circuit designs, particularly battery
charger applications. CV and CC control can be accurately
achieved without secondary feedback circuitry. With the
addition of frequency-hopping in PWM operation, EMI
problems can be solved using minimized filter components.
As a result, a low-cost, smaller, and lighter charger is
produced when compared to a conventional design or a
linear transformer.
By using the PSR controller, a charger can be implemented
with few external components and at a minimized cost.
Internal Block Operation
Constant Voltage Output Regulation
PSR controller’s innovative method can achieve accurate
output CV/CC characteristic without voltage and current
sensing circuitry on the secondary side. The application
circuit and a conceptualized internal block diagram relating
to the constant voltage regulation are shown in Figure 11,
and the key waveform is shown in Figure 12. The secondary
output status is taken from the primary auxiliary winding
when the MOSFET is off. A unique sampling method is
used to acquire a duplication of the output voltage (Vsah) and
the output diode discharge time (tdis). The sampled voltage
(Vsah) is then compared with the precise internal reference
voltage (Vref) to determine the on-time of the MOSFET by
modulating error amplifier’s output. This inexpensive
method achieves accurate output voltage regulation.
To minimize standby power consumption, the proprietary
green-mode function provides off-time modulation to
linearly decrease the PWM frequency under light-load
conditions. This green-mode function is designed to help the
power supply meet power conservation requirements. The
startup current is only 10µA, which allows for the use of
large startup resistance for further power savings.
The PSR controller also provides numerous protection
functions. The VDD pin is equipped with over-voltage
protection and under-voltage lockout. Pulse-by-pulse current
limiting and CC control ensure over-current protection
during heavy loads. The GATE output is clamped at 15V to
protect the external/internal MOSFET from over-voltage
damage. Additionally, the internal over-temperature-
Vin
Naux
iS
IO
Nsec
Npri
CO
R1
S/H
−
n :1
Vref
VS
RO
+
VO
iP
PWM
Vsah
R2
CS
COMV
RS
Figure 11. Internal Block of Constant Voltage Output Operation
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
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AN-6067
APPLICATION NOTE
Constant Current Output Regulation
Green-Mode Operation
As shown in Figure 12, the output current IO can be
expressed by Equation 1 when the flyback converter is
operated in DCM. As a result, the output current IO can be
calculated by the signal ipk, tdis. The PSR controller then
determines the on-time of the MOSFET to modulate input
power and provide constant output current.
The proprietary green-mode function of the PSR controller
provides off-time modulation to linearly decrease the PWM
frequency at light-load conditions, as low as 500Hz. With
the green-mode function, the power supply can easily meet
the most stringent of power conservation requirements.
Figure 13 shows the characteristics of the PWM frequency
vs. the output voltage of the error amplifier (VCOMV). The
PSR controller uses the positive, proportional, output load
parameter (VCOMV) as an indication of the output load for
modulating the PWM frequency. In heavy load conditions,
the PWM frequency is fixed at 42KHz. Once VCOMV is lower
than VN, the PWM frequency starts to linearly decrease from
42KHz to 500Hz. Figure 14 is a measured waveform at
burst-mode operation.
Gate
Vin
Lp
iP
Ts
i pk
tdis
ton
Frequency
n ⋅ Vo
Lp
2
iS
-
IO
42KHz
40KHz
sampling voltage
1KHz
500Hz
VS
VG
Figure 12. Principal Operation Waveform of the
Flyback Converter (DCM)
[
1
⋅ t dis ⋅ is , pk
2Ts
[
Vo(AC)
100mV/Div
Gate
10V/Div
]
]
1
⋅ n p ⋅ i pk ⋅ t dis
2Ts
⎤
V
1 ⎡
=
⋅ ⎢n p ⋅ CS ⋅ t dis ⎥
2Ts ⎣
RCS
⎦
=
VCOMV
Figure 13. PWM Frequency vs. VCOMV
The current-sense resistor can adjust the value of the
constant current. Through better design of the transformer
operations under discontinuous current mode, the PSR
controller’s proprietary control structure is able to achieve
accurate and constant current characteristics. Detailed
design guideline for the transformer is introduced in the
following section.
Io =
VN
VCOMV
500mV/Div
(1)
Figure 14. Measured Waveform at Burst-Mode Operation
where:
is,pk is the peak inductor current of the secondary side,
ipk is the peak inductor of primary side.
tdis is discharge-time of transformer inductor current.
np is the turn ratio between primary and secondary winding.
RCS is the current-sense resistor.
VCS is the voltage on current-sense resistor.
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
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APPLICATION NOTE
42kHz frequency, the MOSFET’s on-time is determined by
VCOMI to modulate the output current.
Frequency Hopping Operation
A frequency hopping function is built in to further improve
EMI system performance. The frequency hopping period is
no longer than 3ms and the PWM switching frequency range
is 42kHz +/- 2.6kHz.
CC Regulation
CV Regulation
decreasing output impedance
VCOMV
VCOMI
4.5V
Deep Green Mode
Charging Sequence
44.6KHz
Figure 17. CV/CC Regulation Charging Sequence
+/- 2.6KHz
39.4KHz
Temperature Compensation
Frequency Hopping Period → 3mS
The PSR controller has built-in temperature compensation
circuitry to provide constant reliable voltage regulation even
at a different ambient temperature. This internal positive
temperature coefficient (PTC) compensation current is used
to compensate for the temperature due to the forwardvoltage drop of the diode output. Without temperature
compensation, the output voltage is distinctly higher in high
temperatures than in lower temperature condition, as shown
in Figure 18.
Figure 15. Gate Signal with Frequency Hopping
CV / CC Regulation
Battery chargers are typically designed for two modes of
operation, constant-voltage charging and constant-current
charging. The basic charging characteristic is shown in
Figure 16. When the battery voltage is low, the charger
operates on a constant current charging. This is the main
method for charging batteries and most of the charging
energy is transferred into the batteries. When the battery
voltage reaches its end-of-charge voltage, the current begins
to taper-off. The charger then enters the constant voltage
method of charging. Finally, the charging current continues
to taper-off until reaching zero.
Vo
high temp.
after compensation at high temp.
room temp.
Vo(V)
CV Regulation
Sequence
Io
CC Regulation
Charging
Figure 18. Output V-I Curve with Temperature
Compensation
As shown in Figure 19, the accuracy value of R1 and R2
determines the voltage regulation amount. The suggested
deviation for R1 and R2 is a +/-1% tolerance.
Temperature
Compensation
Io(mA)
Figure 16. Basic Charging V-I Characteristic
As mentioned in the CV regulation region section, the VCOMV
modulates MOSFET’s on-time and PWM frequency to
provide enough power to the output load. As shown in
Figure 17, as the output load increases, VCOMV gradually
rises until the system shifts into the CC regulation region. At
the same time, VCOMV increases to 4.5V and the MOSEFT’s
on time is controlled by VCOMI. However, when power
system operates in the CC regulation region at a fixed
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
PTC
Vs
S/H
Auxiliary
Winding
Vref
PSR
Controller
Figure 19. Temperature Compensation
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AN-6067
APPLICATION NOTE
The maximum power dissipation of RIN is:
Startup Circuitry
When the power is activated, the input voltage charges the
hold-up capacitor (C1) via the startup resistors, as shown in
Figure 20. As the voltage (VDD) reaches the startup voltage
threshold (VDD-ON), the PSR controller activates and drives
the entire power supply.
PRIN ,MAX
− VDD )
2
dc , max
RIN
V
≅ dc ,max
RIN
2
(3)
where Vdc,max is the maximum rectified input voltage.
Vdc
Take a wide-ranging input (90VAC~264VAC) as an example,
Vdc =100V~380V:
R IN
PRIN ,MAX
TD_ON
VDD
380 2
=
≅ 96mW
1.5 ×10 6
(4)
D1
PSR
Controller
Built-in Slope Compensation
C1
The sensed voltage across the current sense resistor is used
for peak-current-mode control and cycle-by-cycle current
limiting. Within every switching cycle, the PSR controller
produces a positively sloped, synchronized ramp signal. The
built-in slope compensation function improves power supply
stability and prevents peak-current-mode control from
causing sub-harmonic oscillations.
GND
Figure 20. Single-Step Circuit Connected to the
PSR Controller
The power-on delay is determined as follows:
TD _ ON
(V
=
⎛
VDD −ON
= − RIN ⋅ C1 ⋅ ln⎜⎜1 −
⎝ Vac ⋅ 2 − I DD − ST ⋅ RIN
⎞
⎟
⎟
⎠
Leading Edge Blanking (LEB)
Each time the MOSFET is powered on, a spike, induced by
the diode reverse recovery and by the output capacitances of
the MOSFET and diode, appears on the sensed signal. To
avoid premature termination of the MOSEFT, a leadingedge blanking time is introduced in the PSR controller.
During the blanking period, the current-limit comparator is
disabled and unable to switch off the gate driver.
(2)
where IDD-ST is the startup current of the PSR controller.
Due to the low startup current, a large RIN value, such as
1.5MΩ can be used. With a hold-up capacitor of 4.7µF, the
power-on delay TD_ON is less than 3s for a 90VAC input.
If a shorter startup time is required, a two-step startup
circuit, as shown in Figure 21, is recommended. In this
circuit, a smaller C1 capacitor can be used to decrease
startup time without a need for a smaller startup resistor
(RIN) and increase the power dissipation on the RIN resistor.
The energy supporting the PSR controller after startup is
mainly from a larger capacitor C2.
Under-Voltage Lockout (UVLO)
The power-on and off thresholds of the PSR controller are
fixed at 16V/5V. During startup, the hold-up capacitor must
be charged to 16V through the startup resistor to enable PSR
controller. The hold-up capacitor continues to supply VDD
until power can be delivered from the auxiliary winding of
the main transformer (VDD must not drop below 5V during
this startup process). This UVLO hysteresis window ensures
that the hold-up capacitor can adequately supply VDD during
startup.
Vdc
R IN
VDD Over-Voltage Protection (OVP)
TD_ON
VDD over-voltage protection prevents damage due to overvoltage conditions. When VDD exceeds 28V due to abnormal
conditions, PWM output is turned off. Over-voltage
conditions are usually caused by open feedback loops.
VDD
PSR
Controller
C1
C2
GND
Over-Temperature Protection (OTP)
The PSR controller has a built-in temperature sensing circuit
to shut down the PWM output if the junction temperature
exceeds 145°C. When the PWM output shuts down, the VDD
voltage gradually drops to the UVLO voltage. Some of the
internal circuits shut down and VDD gradually starts
Figure 21. Two Steps of Providing Power to the
PSR Controller
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
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APPLICATION NOTE
increasing again. When VDD reaches 16V, all the internal
circuits, including the temperature sensing circuit, start
operating normally. If the junction temperature is still higher
than 145°C, the PWM controller shuts down immediately.
This continues until the temperature drops below 120°C.
For example, a power board for a charger application is
5V/1A. Short the COMR pin to GND first and measure the
output voltage from light load to maximum load. If the
output voltage with cable is 4.7V at 1A, the percentage to
5V is 6%. Calculate the RCOMR as:
RCOMR =
GATE Output
The PSR controller BiCMOS output stage is a fast totem
pole gate driver. Cross conduction design elimination was
used to minimize heat dissipation, increase efficiency, and
enhance reliability. The output driver is clamped by an
internal 15V Zener diode for the protection of power
MOSFET against over-voltage gate signals.
6
≅ 59.5KΩ
100.8 × 10 −6
(6)
Choose the approximate value of RCOMR and let the output
voltage compensate gradually. Figure 23 is RCOMR compared
to percentage curve for reference.
12
10
Percentage (%)
Brownout Protection
The PSR controller has a built-in brownout protection
circuit to shut down the PWM output. As the input voltage
decreases, the flowing current from VS pin is less than IVSUVP, the PWM output shuts down immediately and enters an
auto restart mode. The VDD voltage gradually drops to the
UVLO voltage.
8
6
4
2
0
10
20
30
39
51
60
R COMR (K ohm)
68
81
91
100
Figure 23. RCOMR vs. Percentage
R VS
Vs
Lab Note
Auxiliary
Before reworking or soldering / desoldering on the power
supply, discharge the primary capacitors by way of the
external bleeding resistor. If not, the PWM IC may be
destroyed by external high-voltage discharge during the
soldering / desoldering.
Winding
I VS-UVP
PSR
Controller
MOS turns on
Figure 22. Brownout Protection
Cable Compensation
The FAN102/FSEZ1216 PWM controller has a cable
compensation function used to compensate the output
voltage drop due to output cable loss. Use an external
resistor connected from COMR pin to GND adjusts the
amount of cable compensation.
In CV regulation control, the on-time of MOSFET only
regulates on-board voltage, not including output cable.
Different cable wire gauge or length results in different
output voltage. As previous mentioned in the CC regulation
control section that can calculate the output current. This
calculated signal can provide the controller the output load
condition and determine the amount of cable compensation,
then rescue output voltage drop. To calculate compensation
percentage, use the equation below:
RCOMR =
Percentage
100.8 × 10 −6
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
(5)
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APPLICATION NOTE
Determine Maximum and Minimum Input Voltage
Figure 26 shows the corrected input voltage waveform. The
red line shows ripple voltage on the bulk capacitor and the
minimum and maximum voltage on the bulk capacitor is
expressed in equations 7 and 8, respectively. The CBULK is
the input capacitor and a typical value is 2-3µF per watt of
output power for wide range input voltage (90-264V).
Application Information
Transformer Design
The transformer inductor current must operate in DCM
under any conditions. A typical output V-I curve is shown in
Figure 24. For discontinuous current mode operation, the
transformer inductor should be small enough to meet this
condition. Point “B” is the lowest output voltage within the
CC regulation and the widest discharge time of the
transformer inductor due to the reflected voltage on the
primary inductor. It is the easiest into CCM condition for
transformer inductor.
Vin.min
Assume
2.5mS
Point “A” is the maximum output power of the power
system. Ensure that the magnetic flux density falls within
0.25~0.3 Tesla, considered a safe range. The number of
turns for primary transformer inductor can be determined on
point “A.” Figure 25 shows the characteristic curve of turn
ratio and transformer inductance.
Vo
Figure 26. Bridge Rectifier and Bulk Capacitor Voltage
Waveform
Vin. min = 2 ⋅ Vac ,min 2 -
maximum output power
(determine turn number )
2 ⋅Vo ⋅ I o ⋅ (1- 0.3)
η ⋅ Cbulk ⋅ 120
(7)
Vin.max = 2 ⋅Vac.max
(8)
A
Determine the Turn Ratio
The transformer turn ratio (np=Npri/Nsec) is an important
parameter of the flyback converter; it affects the maximum
duty ratio when the input voltage is at a minimum value. It
also influences the voltage stresses on the MOSFET and the
secondary rectifier. The permissible voltage stresses and the
maximum voltage stresses on the MOSFET, as well as the
secondary rectifier, can be expressed as:
determine
primary inductor
B
Io
Figure 24. Critical Operating Points to Determine
the Transformer
VDS .max = Vin.max + n p ⋅ (Vo + V f )
B=0.5V
B=1V
B=1.5V
B=2V
VF .max =
3.5
inductance(mH)
3
Vin.max
+ Vo
np
(9)
(10)
The leakage spike due to leakage inductance on the
MOSFET and rectifier must also be taken into account.
2.5
2
1.5
Determine Transformer Inductance
Determine the VDD voltage level and if the output voltage is
defined. The turn ratio between auxiliary winding and
secondary winding can be calculated as:
1
0.5
Io = 1A, Vf = 0.45V
0
5
6
7
8
9
10
11
12
13
14
15
na =
n(turn ratio)
Figure 25. Characteristic Curve of Turn Ratio
and Inductance
VDD + V fa
VO + V f
(11)
where VDD is voltage on VDD cap, usually ranging from
about 15V~20V.
In the CC regulation region, on point “B,” the power system
shuts down if the output voltage is too low and the VDD
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
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APPLICATION NOTE
voltage reaches the turn-off threshold voltage of the PSR
controller. Therefore, if na was calculated, the Vo,“B” can be
obtained as:
⎛ V fa + 6.75 - V f ⋅ na ⎞
VO ," B " = ⎜
⎟
na
⎝
⎠
Determine Primary Inductance Turn Number
Based on Faraday’s law and the peak inductor current, the
minimum turns for the primary inductance is calculated as:
N pri =
(12)
Lp ⋅ i pk ," A"
Bmax ⋅ Ae
⋅ 106
(17)
where:
where:
Vfa is forward-voltage of rectifier diode of auxiliary winding.
Bmax is the saturation magnetic flux density,
Vf is forward-voltage of output diode.
Ae is the effective area of the core-section.
6.75V is typically the turn-off threshold voltage of the PSR
controller.
The number of turns for the secondary winding is defined as:
N sec =
The maximum duty ratio can be calculated by using a point
“B” output condition:
d on.max," B " =
n p ⋅ (Vo ," B " + V f )
Vin.min," B " + n p ⋅ (Vo ," B " + V f )
Lp =
2 ⋅Vo," B " ⋅ I o ⋅ f s
N aux = na ⋅ Nsec
(14)
⎡n
⎤
R1 = R2 ⋅ ⎢ a ⋅ (VO + V f ) − 1⎥
⎥⎦
⎣⎢ Vref
η,”B” is the estimated system efficiency of point “B.”
If no values are available, use 0.45~0.5 as an initial value.
fs is the PWM frequency.
As discussed in the Constant Current Output Regulation
section, the region of constant current output operation can be
adjusted by the current-sense resistor. After the turn ratio (np)
has been determined, the relationship between the output
current IO and current sense resistor Rs is expressed as:
(15)
where Ts is the switching period.
The primary peak inductor current (IPK) of point “A” at full
load and low line input voltage condition is:
i pk ," A" =
Vin.min," A"
Lp
⋅ don.max," A" ⋅ TS
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
(20)
where Vref=2.5V, R2 is typically set to 15~20KΩ.
After the primary inductance is calculated, the maximum
duty ratio of point “A” can be expressed as:
d on . max," A"
(19)
Determine the Divider Resistor (R1) and CurrentSense Resistor (RS)
Once the output voltage VO and auxiliary winding have been
defined, the feedback signal divider resistor, R1, can be
calculated as:
where:
2 ⋅ VO ," A" ⋅ I O ⋅ LP
=
η," A" ⋅ Vin . min," A" 2 ⋅ Ts
(18)
np
Once the secondary winding has been calculated, the
number of turns for the auxiliary winding is defined as:
(13)
The transformer inductance (Lp) is designed specifically for
DCM operation and a CC tolerance of +/-10% should be
considered. The transformer inductance can be obtained as:
η," B " ⋅ Vin. min," B "2 ⋅ d max," B " 2
N pri
RS =
0.111875 ⋅ n p
IO
(21)
As Figure 27 shows, a design spreadsheet can be used to
calculate the transformer design and select the power system
components for a first prototype. A 5V/1A design example
is shown in Figure 27.
(16)
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APPLICATION NOTE
Figure 27. Calculated System Parameter by Design Spreadsheet
The parameters in Figure 27 can be found in the corresponding components in Figure 28.
Vdc
Rin
Vdc
- VFa +
Naux
+ VF -
+
VO
Nsec
Npri
R1
VDD
VDD Cap.
−
+
n : n p :1
Vds a
VS
Vs Cap.
R2
RS
-
Figure 28. Application Circuit
Primary
Winding
Transformer Structure
N1
Drain
N2
Secondary
Winding
2
MOS ' s
As mentioned in the Constant Voltage Output Regulation
section, the PSR controller incorporates a proprietary
control design to achieve CV/CC regulations. A correct
sampling voltage of the auxiliary winding is critical to the
CV/CC performance. Therefore, the coupling of the
auxiliary winding and the secondary winding should be
precise. The suggested transformer structure is shown in
Figure 29 and Figure 30. The coupling coefficient between
the secondary winding and the auxiliary winding can be
effectively improved by sloughing off the EMI shielding
between auxiliary winding and secondary winding. Further
effectiveness is achieved by increasing the coupling area
through a well-paved the auxiliary winding on the top layer.
6
1
Vin
8
3
Auxiliary
Winding
4
N3
EMI Shielding
Figure 29. Transformer Winding
3
6
EMI Shielding
4
8
Auxiliary
Winding ( N 3)
Secondary
Winding ( N 2)
( Insulated )
1
Primary
Winding ( N1)
2
EMI Shielding
Figure 30. Recommended Transformer Structure
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
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APPLICATION NOTE
Effect of the Vs Pin Capacitor
A VS capacitor with 22~68pF placed closely between Vs pin
and the GND pin is recommended. The capacitor is used to
bypass switching induced noise and keep the accuracy of the
sampled voltage. The value of the capacitor affects the load
regulation and constant current performance. Figure 31
illustrates the measured waveform on the Vs pin with a
different VS capacitor. If a higher value VS capacitor is used,
the charging time becomes longer and the sampled voltage is
higher than the actual value. Figure 32 shows the effect on
the sampled voltage with a different VS capacitor.
No-Load
Figure 33 shows a measured Vs pin waveform at a no-load
condition. As illustrated, the feedback voltage is too narrow.
Additionally, a large VS capacitor causes the inaccurate
sampling of the voltage; resulting in the rising of the output
voltage. Figure 24 shows the influence of the VS capacitor
on the V-I curve.
VS
Gate COMV
Vf
Figure 33. Measured Vs Pin Waveform at No Load
Vo
Lower Vs Cap.
Higher Vs Cap.
Io
Figure 34. Comparison of V-I Curve
with Different Vs Capacitor
Effect of VDD and Snubber Capacitors
VDD voltage and snubber capacitors are related to the
feedback signal inaccuracy and cause output voltage to rise
at no-load condition.
If the VDD capacitor is not big enough, the decreasing PWM
frequency at no-load condition causes VDD voltage to drop
quickly. In such a condition, the feedback signal is
dominated by the VDD voltage, but not the secondary output
voltage. To avoid this, it is recommended the VDD capacitor
value be larger than 4.7µF(6.8~10µF).
Figure 31. Measured Waveform with
Different VS Capacitor
higher Vs Cap
lower Vs Cap
Vs pin waveform
sampling voltage
On the other hand, the value of the snubber capacitor also
affects the output voltage performance. When the MOSEFT
is turned off, the polarity of the transformer primary side
inductor is reversed and the energy stored in the transformer
inductor is delivered to the secondary to supply load current.
In the meantime, if the output voltage is higher than the
voltage on the secondary winding (Vsec), the output diode is
still reversed. The resulting voltage Vpri is then applied to
the primary inductor, Lp, which charges the snubber
capacitor. The charge time influences the feedback voltage
signal on the auxiliary winding. It is recommended that the
snubber capacitor remain under 472pF(332~102pF).
sampling voltage
No - Load
Figure 32. Effect on Sampling Voltage with
Different VS Capacitor
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
www.fairchildsemi.com
13
AN-6067
APPLICATION NOTE
- V fa +
Vin
Ra
+
R1
VDD
SGP100
VDD Cap.
+
Vaux
Vpri
-
-
VS
Vs Cap.
+ Vf -
+
Vsec
+
VO
-
−
na : n p : 1
VO > Vsec
R2
Figure 35. VDD and Snubber Capacitors Effect on Output Voltage
Reducing No-Load Output Voltage with a
“Dummy” Load
At no-load and very light load conditions, due to the very
low PWM frequency caused by feedback signal deviations
and output voltage rises, especially at low-line input voltage
condition. Increasing the addition of a dummy load can fix
this problem. Figure 36 shows the effect of a higher and
lower dummy load on the V-I curve. The level of the
dummy load is suggested at about 25~100mW.
Vo
lower snubber cap,
higher VDD cap , dummy load
higher snubber cap,
lower VDD cap , dummy load
Io
Figure 36. Dummy Load Effect on Output Characteristic
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
www.fairchildsemi.com
14
AN-6067
APPLICATION NOTE
PCB Layout Considerations
High-frequency switching current / voltage make PCB
layout a very important design issue. Good PCB layout
minimizes excessive EMI and helps the power supply
survive during surge/ESD tests.
Suggestion for the Ground Connections
GND 3→2→4→1: May make it possible to avoid common
impedance interference for the sense signal.
Regarding the ESD discharge path, the charges go from
secondary through the transformer stray capacitance to
GND2 first. Then the charges go from GND2 to GND1 and
back to the mains. It should be noted that control circuits
should not be placed on the discharge path.
General Guidelines
The numbers in the following guidelines refer to Figure 37.
To improve EMI performance and reduce line frequency
ripples, the output of the bridge rectifier should be
connected to capacitors C1 and C2 first, then to the
switching circuits.
5 Should a point-discharge route to bypass the static
electricity energy. As shown in Figure 38, it is suggested to
map out this discharge route.
The high-frequency current loop is in C2 – Transformer –
MOSFET – R7 – C2. The area enclosed by this current
loop should be as small as possible.
Start in secondary GND to the positive terminal of C2, then
to front terminal of bridge rectifier. If this discharge route is
connected to the primary GND, it should be connected to the
negative terminal of C2 (GND1) directly.
Keep the traces (especially 4→1) short, direct, and wide.
High voltage traces related to the drain of MOSFET and
RCD snubber should be kept far way from control circuits to
prevent unnecessary interference. If a heatsink is used for
the MOSFET, connect this heatsink to a ground.
However, the creepage distance between these two pointed
ends should be long enough to satisfy the requirements of
applicable standards.
As indicated by 3, the ground of the control circuits should
be connected first, then to other circuitry.
As indicated by 2, the area enclosed by the transformer
aux winding, D1 and C3, should also be kept small.
Place C3 close to the PSR controller for good decoupling.
5
R13
5
T1
BD1
R8
C1
C6
C2
D4
L1
R1
1
D1
R2
C3
R3
U1
7
3 COMI
C8 R10
C7 R9
VS 5
VDD
4
COMV
6
SGND
GATE
CS
PGND
PSR Controller
8
1
2
D3
C5
R4
R5
R6
2
R7
4
3
Figure 37. Layout Consideration
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
www.fairchildsemi.com
15
AN-6067
APPLICATION NOTE
PCB Layout Considerations (Continued)
Figure 38. PCB Layout Example (5V/1A, 5W Power Board)
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
www.fairchildsemi.com
16
AN-6067
APPLICATION NOTE
Reference Circuits
R13
R11
L1
C8
D4
L2
T1
BD1
R8
C1
C5
C2
C9
C10
R12
D3
R1
D1
R2
C3
R3
U1
7
VDD
3
COMI
R4
VS 5
C4
C7 R10
C6 R9
4 COMV
6
SGND
GATE
8
CS
1
PGND
2
R5
R6
R7
Figure 39. Application Circuit FAN100 (5V/1A)
BOM List
Symbol Component
Symbol Component
R1
Resistor 1.5MΩ 1/2W
D4
Diode 5A/60V SB560
R2
Resistor 4.7Ω
C1
Electrolytic Capacitor 1µF/400V
R3
Resistor 115KΩ 1%
C2
Electrolytic Capacitor 10µF/400V
R4
Resistor 18KΩ 1%
C3
Electrolytic Capacitor 10µF/50V
R5
Resistor 47Ω
C4
MLCC X7R 22pF
R6
Resistor 100Ω
C5
Snubber Capacitor 472pF/1KV
R7
Resistor 1.4Ω 1/2W 1%
C6
MLCC X7R 683pF
R8
Resistor 100KΩ 1/2W
C7
MLCC X7R 103pF
R9
Resistor 200KΩ
C8
MLCC 102pF/100V
R10
Resistor 30KΩ
C9
Electrolytic Capacitor 560uF/10V L-ESR
R11
Resistor 47Ω
C10
Electrolytic Capacitor 330µF/10V L-ESR
R12
Resistor 510Ω
L1
Inductor 1mH
R13
WireWound Resistor 18Ω
L2
Inductor 5µH
BD1
Rectifier Diode 1N4007 *4
Q1
Fairchild 2A/600V 2N60 TO-251
D1
Diode 1A/200V FR103
U1
FAN100
D3
Diode 1A/1000V 1N4007
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
TR1
EE-16 Lm=1.5mH Pri:Sec:Aux=135:10:33
www.fairchildsemi.com
17
AN-6067
APPLICATION NOTE
Reference Circuits (Continued)
R10
R8
L1
C8
D4
L2
T1
BD1
R5
C1
C5
C2
C9
C10
D3
R9
R1
D1
C3
R2
U1
6 VDD
VS
R3
5
C4
C7
R7
3
COMI
4
COMV
DRAIN
CS
8
1
R4
C6 R6
2 GND
N.C.
7
Figure 40. Application Circuit FSEZ1016A (FAN100 + MOSFET) (5V/1A)
BOM List
Symbol
Symbol
Component
Component
R1
Resistor 1.5MΩ
C1
Electrolytic Capacitor 1µF/400V
R2
Resistor 127KΩ 1%
C2
Electrolytic Capacitor 10µF/400V
R3
Resistor 20KΩ 1%
C3
Electrolytic Capacitor 10µF/50V
R4
Resistor 1.36Ω 1/2W 1%
C4
MLCC X7R 47pF
R5
Resistor 100KΩ 1/2W
C5
Snubber Capacitor 472pF/1KV
R6
Resistor 200KΩ
C6
MLCC X7R 683pF
R7
Resistor 39KΩ
C7
MLCC X7R 103pF
R8
Resistor 47Ω
C8
MLCC 102pF/100V
R9
Resistor 510Ω
C9
Electrolytic Capacitor 560µF/10V
R10
WireWound Resistor 18Ω
C10
Electrolytic Capacitor 330µF/10V
BD1
Rectifier Diode 1N4007 *4
L1
Inductor 1mH
D1
Diode 1A/200V FR103
L2
Inductor 5µH
D3
Diode 1A/1000V 1N4007
U1
FSEZ1016A
D4
Diode 5A/60V SB560
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
TR1
EE-16 Lm=1.5mH Pri:Sec:Aux=135:10:33
www.fairchildsemi.com
18
AN-6067
APPLICATION NOTE
Reference Circuits (Continued)
R13
R11
L1
D4
C9
L2
T1
BD1
C6
R8
C1
C2
C10
C11
R12
D3
R1
D1
C3
R3
U1
7
VDD
VS
R4
5
C5
3 COMI
C8 R10
C7 R9
4
COMV
6 GND
GATE
CS
COMR
8
R5
1
2
Q1
R6
R7
R2
C4
Figure 41. Application Circuit FAN102 (5V/1A)
BOM List
Symbol Component
Symbol Component
Symbol Component
R1
Resistor 1.5MΩ 1/2 W
D3
Diode 1A/1000V 1N4007
Q1
1A/600V 1N60 TO-251
R2
Resistor 82KΩ 1%
D4
Diode 5A/60V SB560
TR1
EE-16 Lm=1.5mH Pri:Sec:Aux=135:10:33
R3
Resistor 110KΩ 1%
C1
Electrolytic Capacitor 1µF/400V
R4
Resistor 18KΩ 1%
C2
Electrolytic Capacitor 10µF/400V
R5
Resistor 47Ω
C3
Electrolytic Capacitor 10µF/50V
R6
Resistor 100Ω
C4
MLCC 104pF
R7
Resistor 1.4Ω 1/4W 1%
C5
MLCC X7R 22pF
R8
Resistor 100KΩ 1/2W
C6
Snubber Capacitor 472pF/1KV
R9
Resistor 200KΩ
C7
MLCC X7R 683pF
R10
Resistor 47KΩ
C8
MLCC X7R 103pF
R11
Resistor 20Ω
C9
MLCC 102pF/100V
R12
Resistor 510Ω
C10
R13
WireWound Resistor 18Ω
C11
BD1
Rectifier Diode 1N4007 *4
L1
Inductor 1mH 1/2W
Diode 1A/200V FR103
L2
Inductor 5µH
D1
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
U1
FAN102
Electrolytic Capacitor 560µF/10V
L-ESR
Electrolytic Capacitor 330µF/10V
L-ESR
www.fairchildsemi.com
19
AN-6067
APPLICATION NOTE
Reference Circuits (Continued)
R10
R8
L1
C8
D4
L2
T1
BD1
R5
C1
C5
C2
C9
C10
D3
R9
R1
D1
C3
R2
U1
6 VDD
VS
R3
5
C4
C7
R7
C6 R6
3
COMI
DRAIN
8
4
COMV
CS
1
7 GND
COMR
2
R4
R11
C11
Figure 42. Application Circuit FSEZ1216 (5V/1A)
BOM List
Symbol Component
Symbol Component
Symbol Component
R1
Resistor 1.5M Ω
D4
Diode 5A/60V SB560
R2
Resistor 110KΩ 1%
C1
Electrolytic Capacitor 1µF/400V
R3
Resistor 18KΩ 1%
C2
Electrolytic Capacitor 10µF/400V
R4
Resistor 1.4Ω 1/2W 1%
C3
Electrolytic Capacitor 10µF/50V
R5
Resistor 100KΩ 1/2W
C4
MLCC X7R 47pF
R6
Resistor 200KΩ
C5
Snubber Capacitor 472pF/1KV
R7
Resistor 47KΩ
C6
MLCC X7R 683pF
R8
Resistor 47Ω
C7
MLCC X7R 103pF
R9
Resistor 510Ω
C8
MLCC 102pF/100V
R10
WireWound Resistor 18Ω
C9
Electrolytic Capacitor 560µF/10V
R11
Resistor 82KΩ 1%
C10
Electrolytic Capacitor 330µF/10V
BD1
Rectifier Diode 1N4007 *4
C11
MLCC X7R 104pF
D1
Diode 1A/200V FR103
L1
Inductor 1mH
D3
Diode 1A/1000V 1N4007
L2
Inductor 5µH
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
U1
TR1
FSEZ1216
EE-16 Lm=1.5mH
Pri:Sec:Aux=135:10:33
www.fairchildsemi.com
20
AN-6067
APPLICATION NOTE
Related Datasheets
FAN100 — Primary-Side Regulation PWM Controller
FAN102 — Primary-Side Regulation PWM Controller
FSEZ1016A — Primary-Side Regulation PWM with Integrated Power MOSFET
FSEZ1216 — Primary-Side Regulation PWM with Integrated Power MOSFET
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1.
Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
© 2008 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 1/26/10
2.
A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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