Rohm BA15JC5WT Secondary fixed output ldo regulator Datasheet

Secondary LDO Regulators
Secondary Fixed Output
LDO Regulators
BA□□JC5 Series
Secondary Variable Output
LDO Regulator
BA00JC5WT
No.11024EBT03
Description
The BA□□JC5 are low-saturation regulators with an output current of 1.5 A and a voltage accuracy of 1%. A broad output
voltage range is offered, from 1.5V to 12V, and built-in overcurrent protection and thermal shutdown (TSD) circuits prevent
damage due to short-circuiting and overloading, respectively.
Features
1) Output current: 1.5A (min.)
2) Output voltage accuracy: 1%
3) Broad output voltage range available: 1.5V -12V (BA□□JC5 series)
4) Low saturation-voltage type with PNP output
5) Built-in overcurrent protection circuit
6) Built-in thermal shutdown circuit
7) Integrated shutdown switch (BA□□JC5WT)
8) Operating temperature range: −40℃ to +105℃
Applications
All electronic devices that use microcontrollers and logic circuits
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1/10
2011.02 - Rev.B
Technical Note
BA□□JC5 Series,BA00JC5WT
Product Lineup
Part Number
1.5
1.8
2.5
3.0
3.3
5.0
6.0
6.3
8.0
9.0
12.0 Variable
Package
BA□□JC5T











-
TO220FP-3
BA□□JC5WT
-
-
-
-
-
-
-
-
-
-
-

TO220FP-5 (V5)
Part Number: BA□□JC5□ □
a
b c
Symbol
Description
Output voltage specification
□□
Output voltage (V)
□□
Output voltage (V)
15
1.5 V typ
60
6.0 V typ
18
1.8 V typ
63
6.3 V typ
25
2.5 V typ
80
8.0 V typ
30
3.0 V typ
90
9.0 V typ
33
3.3 V typ
J2
12.0 V typ
50
5.0 V typ
00
Variable
a
b
Existence of switch With W: A shutdown switch is provided.
Without W: No shutdown switch is provided.
c
Package T:
TO20FP-5, TO220FP-5V5, TO220FP-3
Absolute Maximum Ratings (Ta = 25℃)
Parameter
Power supply voltage
Symbol
Ratings
Unit
VCC
18*1
V
2000*2
TO220FP-3
Power dissipation
TO220FP-5
2000*2
Pd
mW
2000*2
TO220FP-5V5
Operating temperature range
Topr
−40 to +105
℃
Ambient storage temperature
Tstg
−55 to +150
℃
Tjmax
150
℃
Maximum junction temperature
*1
*2
Must not exceed Pd
Derated at 16mW/℃ at Ta>25℃
Recommended Operating Conditions
Parameter
Symbol
Ratings
Min.
Max.
Unit
Input power supply voltage
VCC*3
3.0
16.0
V
Input power supply voltage
VcC*4
Vo + 1.0
16.0
V
Output current
Io
-
1.5
A
Variable output voltage setting value
Vo
1.5
12
V
*3
*4
When output voltage is 1.5 V, 1.8 V, or 2.5 V.
When output voltage is 3.0 V or higher.
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2/10
2011.02 - Rev.B
Technical Note
BA□□JC5 Series,BA00JC5WT
Electrical Characteristics
BA□□JC5T(Unless otherwise specified, Ta = 25℃; Vcc = VCCDC*5)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Vo
Vo (T)
 0.99
Vo (T)
Vo (T)
 1.01
V
Io = 200 mA
∆Vd
-
0.3
0.5
V
Io = 200 mA,
Vcc = 0.95  Vo
Io
1.5
-
-
A
Input stability*7
Reg.I
-
5
60
mV
Vcc = Vo + 1.0 V→16 V,
Io = 200 mA
Load stability
Reg.L
-
5
60
mV
Io = 5 mA→1.5 A
Tcvo
-
0.02
-
%/℃
Io = 5 mA,
Tj = 0℃ to 125℃
Output voltage
Minimum I/O voltage difference*6
Output current capacity
Temperature coefficient of output voltage*8
Vo (T): Set output voltage
*5
Vo = 1.5 V, 1.8 V, 2.5 V : Vcc = 3.3 V, Vo = 3.0 V, 3.3 V : Vcc = 5 V,
Vo = 5.0 V : Vcc : 8 V, Vo = 6.0 V, 6.3 V : Vcc = 9.0 V, Vo = 8.0 V : Vcc = 11 V,
Vo = 9.0 V : Vcc = 12 V, Vo = 12 V : Vcc = 15 V
*6
Vo ≥ 3.3 V
*7
Change Vcc from 3.0 V to 16 V if 1.5 V ≤ Vo ≤ 2.5 V.
*8
Operation guaranteed
BA00JC5WT (−V5)(Unless otherwise specified, Ta = 25℃, Vcc = 3.3 V, VCTL = 3 V, R1 = 30 k, R2 = 30 k*9)
Limits
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Reference voltage
Vo
1.2375
1.250
1.2625
V
Io = 50 mA
Shutdown circuit current
Isd
-
0
10
A
VCTL = 0 V
while in OFF mode
Minimum I/O voltage difference
∆Vd
-
0.3
0.5
V
Io = 500 mA,
Vcc = 2.5 V
Io
1.5
-
-
A
Input stability
Reg.I
-
5
60
mV
Vcc = 4.5 V→16 V,
Io = 200 mA
Load stability
Reg.L
-
5
60
mV
Io = 5 mA →1.5 A
Tcvo
-
0.02
-
%/℃
Io = 5 mA,
Tj = 0℃ to 125℃
Output current capacity
Temperature coefficient of output voltage*10
*9
*10
VOUT = Vc  (R1 + R2) / R1 (V)
Design guarantee (No total shipment inspection is made.)
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3/10
2011.02 - Rev.B
Technical Note
BA□□JC5 Series,BA00JC5WT
Electrical Characteristics Curves (Unless otherwise specified, Ta = 25℃; Vcc = 8 V; VCTL = 3 V; IO = 0 mA)
0.6
6
6
[BA50JC5T]
[BA50JC5T]
0.4
0.3
0.2
0.1
0
OUTPUT VOLTAGE : VOUT [V]
0.5
OUTPUT VOLTAGE : VOUT [V]
5
4
3
2
1
2
4
6
8
10 12
14
SUPPLY VOLTAGE : Vcc [V]
16
0
2
Fig.1 Circuit Current
1
4
6
8
10
12
14
SUPPLY VOLTAGE : Vc c [V]
0
16
4
3
2
1
0
0.5
0.4
0.3
0.2
0.1
0
0.5
1
1.5
2
OUTPUT CURRENT : IOUT [A]
0
2.5
Fig.4 Load Stability
500
1000
OUTPUT CURRENT : IOUT [ mA]
CIRCUI T CURRENT : Icc [mA]
7
6
5
4
3
2
0.4
0.3
0.2
10
10
-20
0
20
40
60
80
TEMPERATURE : Ta [℃]
3
2
1
0
Fig.10 CTL Voltage vs
Output Voltage
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60
50
40
30
20
500
1 000
OUTPUT CURRENT : IOUT [ A]
150 0
8
[BA50JC5T]
0.5
0.4
0.3
0.2
0.1
0
10
1000000
Fig.9 Circuit Current Classified
by Load
O UTPUT VOLTAG E : VOUT [V]
CO NTRO L CURRENT : ICTL [μA]
[BA50JC5T]
100000
[BA50JC5T]
0
0.6
4
10000
70
100
Fig.8 Circuit Current
Temperature
5
1000
0
-40
6
100
10
Fig.7 Output Voltage vs
Temperature
2
4
6
8
CONTROL VOLTAGE : VCTL [V]
20
80
0.5
0
100
[BA50JC5T]
0.6
0
0
30
Fig.6 Ripple Rejection
0.7
0.1
0
20
40
60
80
TEMPERATURE : Ta [℃]
40
FREQUENCY : f [Hz]
0.8
1
-20
50
90
0.9
8
-40
60
0
15 00
1
[BA50JC5T]
9
16
[BA50JC5T]
70
Fig.5 I/O Voltage Difference
10
4
6
8
10
12
14
SUPPLY VOLTAGE : Vc c [V]
80
RIPPLE REJECTION : R.R. [dB]
5
0
2
.3 Input Stability
(Io = 1.5 A)
[BA50JC5T]
DROPOUT VO LTAGE : ΔVd [mV]
OUTPUT VOLTAGE : VOUT [ V]
2
0.6
[BA50JC5T]
OUTPUT VOLTAGE : VOUT [ V]
3
Fig.2 Input Stability(Io=0mA)
6
OUTPUT VOLTAGE : VOUT [V]
4
0
0
0
5
CIRCUI T CURRENT : Icc [mA]
CI RCUI T CURRENT : Icc [mA]
[BA50JC5T]
0
2
4
6
8 10 12 14 16
CONTROL VOLTAG E : VCTL [V]
Fig.11 CTL Voltage vs
CTL Current
4/10
18
7
[BA50JC5T]
6
5
4
3
2
1
0
100
120
140
160
1 80
TEMPERATURE : Ta [℃ ]
200
Fig.12 Thermal Shutdown Circuit
(Io = 5 mA)
2011.02 - Rev.B
Technical Note
BA□□JC5 Series,BA00JC5WT
 Block Diagrams / Standard Example Application Circuits
[BA□□JC5T]
TOP VW
Vref
TSD
1
Pin No.
1
2
3
Driver
Function
Power supply voltage input
GND
Voltage output
OCP
2
Vcc
Pin name
Vcc
GND
OUT
3
GND
OUT
PIN
Vcc (1 Pin)
OUT (3 Pin)
Vcc
1 2 3
0.33μF
External capacit setting range
Approximately 0.33 F
22 F to 1000 F
22μF
TO220FP-3
Fig.13
[BA00JC5WT]
Vcc
Vref
Driver
TSD
1
CTL
2
Vcc
TOP VIEW
Pin No.
1
2
3
4
5
Pin name
CTL
Vcc
GND
OUT
C
Function
Output voltage on/off control
Power supply voltage input
GND
Voltage output
ADJ pin
OCP
3
GND
4
OUT
5
C
PIN
Vcc (2 Pin)
OUT (4 Pin)
R2
R1
12345
Vcc
External capacit setting range
Approximately 0.33 F
22 F to 1000 F
12345
22μF
0.33μF
TO220FP-5 TO220FP-5 (V5)
Fig.14
 Input / Output Equivalent Circuits
Vcc
* For the BA00JC5WT, connect R1 and R2
externally between the ADJ and GND pins
and between the OUT and ADJ pins.
Vcc
CTL
27kΩ
2kΩ
31kΩ
OUT
R2
Equation: VOUT = Vc  (R1 + R2) / R1
(Vc = 1.25 V (Typ.))
The recommended R1 value is approximately
30 k to 150 k.
R1
Fig.15
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5/10
2011.02 - Rev.B
Technical Note
BA□□JC5 Series,BA00JC5WT
Thermal Derating Curve
 TO220FP-3/TO220FP-5/TO220FP-5 (V5)
POWER DISSIPATION:Pd [W]
25
(1) When using an infinite heat sink.
j-c = 6.25 (°C/W)
(1)20.0
(2) During IC without heat sink operation.
j-a = 62.5 (°C/W)
20
15
10
5
0
(2)2.0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE:Ta [°C]
Fig.17
The characteristics of the IC are greatly influenced by the operating temperature. If the temperature exceeds the maximum
junction temperature Tjmax, deterioration or damage may occur. Implement proper thermal designs to ensure that power
dissipation is within the permissible range in order to prevent instantaneous damage resulting from heat and maintain the
reliability of the IC for long-term operation.
The following method is used to calculate the power consumption Pc (W):
Pc = (Vcc – Vo)  Io + Vcc  Icca
Power dissipation Pd ≥ Pc
The load current Io is calculated:
Io ≤
Vcc
Vo
IO
Icca
: Input voltage
: Output current
: Load current
: Circuit current
Pd − Vcc  Icca
Vcc − Vo
Calculation Example:
Vcc = 6.0V and Vo = 5.0V at Ta = 85℃
1.040 − 6.0  Icca
6.0 − 5.0
ja = 62.5°C/W  −16.0mW/°C
25°C = 2000mW  85°C = 1040mW
Io ≤ 860mA (Icca  30mA)
Refer to the above and implement proper thermal designs so that the IC will not be used under excessive power dissipation
conditions under the entire operating temperature range.
The power consumption Pc of the IC in the event of shorting (i.e. the Vo and GND pins are shorted) can be obtained from the
following equation: Pc = Vcc  (Icca + Ishort) (Ishort: short current)
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6/10
2011.02 - Rev.B
Technical Note
BA□□JC5 Series,BA00JC5WT
Operation Notes
 Vcc pin
Insert a capacitor (0.33 F approx.) between VCC and GND.
The capacitance will vary depending on the application.
Use a suitable capacitance and implement designs with sufficient margins.
 GND pin
Verify that there is no potential difference between the ground of the application board and the IC.
If there is a potential difference, the set voltage will not be output accurately, resulting in unstable IC operation.
Therefore, lower the impedance by designing the ground pattern as wide and as short as possible.
 CTL pin
The CTL pin turns on at an operating power supply voltage of 2.0 V or higher and turns off at 0.8 V or lower.
There is no particular order when turning the power supply and CTL pins on or off.
CTL
27 k
2 k
31 k
Fig.18 Input Equivalent Circuit
Vo pin
Insert a capacitor between the Vo and GND pins in order to prevent output oscillation.
10.0
Oscillation region
2.0
IC
22 F
ESR []
OUT
1.0
0.5
Stable region
0.2
0.1
0.075
0.05
Fig.19 Output Equivalent Circuit
Oscillation region
0
200
400
600
800
1000 Io [mA]
Fig. 20 IO vs ESR
The capacitance may vary greatly with temperature changes, thus making it impossible to completely prevent oscillation.
Therefore, use a tantalum aluminum electrolytic capacitor with a low ESR (Equivalent Serial Resistance). The output will
oscillate if the ESR is too high or too low, so refer to the ESR characteristics in Fig. 20 and operate the IC within the stable
region. Use a capacitor within a capacitance between 22F and 1,000F.
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7/10
2011.02 - Rev.B
Technical Note
BA□□JC5 Series,BA00JC5WT
Notes for use
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit.
If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such
as fuses.
2.
GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
3.
Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4.
Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
5.
Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
6.
Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting
it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an
antistatic measure. Use similar precaution when transporting or storing the IC.
7.
Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated.P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should
8.
Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external components, either.
9.
Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this
circuit is assumed.
10. Overcurrent Protection Circuit
An overcurrent protection circuit is incorporated in order to prevention destruction due to short-time overload currents.
Continued use of the protection circuits should be avoided. Please note that the current increases negatively impact the temperature.
11. Damage to the internal circuit or element may occur when the polarity of the Vcc pin is opposite to that of the other pins in
applications. (I.e. Vcc is shorted with the GND pin while an external capacitor is charged.) Use a maximum capacitance
of 1000μF for the output pins. Inserting a diode to prevent back-current flow in series with Vcc or bypass diodes
between Vcc and each pin is recommended.
Resistor
抵抗
Transistor
(NPN)
トランジスタ(NPN)
(端子A)
A)
(Pin
C
B
C
B
~
~
Back current prevention diode
(Pin B)
E
~
~
(端子
(Pin B)
B)
~
~
Bypass Diode
GND
VCC
GND
N
P+
N
PPsubstrate
基板
N
N
N
N
Output pin
P
P
P+
N
P+
N
寄生素子
Parasitic elements or
transistors
N
N
(Pin A)
~
~
P
P+
P substrate
P 基板
Parasitic element
GND
Parasitic element
GND
GND
Parasitic element
Fig. 21 Bypass Diode
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E
Fig. 22 Example of Simple Bipolar IC Architecture
8/10
2011.02 - Rev.B
Technical Note
BA□□JC5 Series,BA00JC5WT
●Ordering part number
B
A
0
Part number
0
J
Output voltage
00:Variable
Other:Fixed
C
5
Current capacity
1.5A
W
T
Shutdown
switch
-
Package
T :TO220FP-3
TO220FP-5
TO220FP-5(V5)
W : Include
Packaging and forming specification
None:Tube Contener
TO220FP-3
+0.2
2.8 −0.1
φ3.2±0.1
Container
Tube
Quantity
500pcs
Direction of feed
Direction of products is fixed in a container tube
8.0±0.2
12.0±0.2
<Tape and Reel information>
+0.3
4.5 −0.1
7.0 +0.3
−0.1
5.0±0.2
13.5Min.
+0.4
17.0 −0.2
1.8±0.2
+0.3
10.0 −0.1
1.3
0.8
2.54±0.5
2.54±0.5
0.55 +0.1
−0.05
2.6±0.5
1 2 3
∗ Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
<Tape and Reel information>
+0.3
4.5 −0.1
+0.2
2.8 −0.1
φ3.2±0.1
Container
Tube
Quantity
500pcs
Direction of feed
Direction of products is fixed in a container tube
8.0±0.2
0.7
+0.4
17.0 −0.2
+0.3
10.0−0.1
+0.3
7.0 −0.1
13.5Min.
12.0±0.2
1.8±0.2
TO220FP-5
1.2
0.8
1.778
0.5±0.1
2.85
1 2 3 4 5
∗ Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
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9/10
2011.02 - Rev.B
Technical Note
BA□□JC5 Series,BA00JC5WT
23.4
(2.0)
φ3.2±0.1
<Tape and Reel information>
+0.2
2.8 −0.1
17.5
+0.3
4.5 −0.1
0.3
7.0 +
− 0.1
Container
Tube
Quantity
500pcs
Direction of feed
Direction of products is fixed in a container tube
25.8
+ 0.3
10.0 − 0.1
8.0±0.2
0.7
+0.4
17.0 −0.2
12.0±0.2
31.5Max.
1.8±0.2
TO220FP-5(V5)
1.2
0.8
0.5±0.1
1.778
(2.85)
4.25
8.15
1 2 3 4 5
∗ Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
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10/10
2011.02 - Rev.B
Notice
Notes
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consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
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