LATTICE ISPPAC-CLK5520V

ispClock 5500 Family
™
In-System Programmable Clock Generator
with Universal Fan-Out Buffer
August 2004
Data Sheet
■ Up to Five Clock Frequency Domains
■ Flexible Clock Reference Inputs
Features
■
■
■
■
10MHz to 320MHz Input/Output Operation
Low Output to Output Skew (<50ps)
Low Jitter Peak-to-Peak(<70ps)
Up to 20 Programmable Fan-out Buffers
• Programmable input standards
- LVTTL, LVCMOS, SSTL, HSTL, LVDS,
LVPECL
• Clock A/B selection multiplexer
• Programmable precision termination
• Programmable output standards and individual
enable controls
- LVTTL, LVCMOS, HSTL, SSTL, LVDS,
LVPECL
• Programmable precision output impedance
- 40 to 70Ω in 5Ω increments
• Programmable slew rate
• Up to 10 banks with individual VCCO and GND
- 1.5V, 1.8V, 2.5V, 3.3V
■ Four User-programmable Profiles Stored in
E2CMOS® Memory
• Supports both test and multiple operating
configurations
■ Full JTAG Boundary Scan Test In-System
Programming Support
■ Exceptional Power Supply Noise Immunity
■ Commercial (0 to 70°C) and Industrial
(-40 to 85°C) Temperature Ranges
■ 100-pin and 48-pin TQFP Packages
■ Applications
■ Fully Integrated High-Performance PLL
• Programmable lock detect
• Multiply and divide ratio controlled by
- Input divider (5 bits)
- Internal feedback divider (5 bits)
- Five output dividers (5 bits)
• Programmable On-chip Loop Filter
• Circuit board common clock generation and
distribution
• PLL-based frequency generation
• High fan-out clock buffer
■ Precision Programmable Phase Adjustment
(Skew) Per Output
• 16 settings; minimum step size 195ps
- Locked to VCO frequency
• Up to +/- 12ns skew range
• Coarse and fine adjustment modes
Product Family Block Diagram
OUTPUT
DIVIDERS
BYPASS
MUX
*
SKEW
CONTROL
V0
OUTPUT
DRIVERS
V1
M
PHASE/
FREQUENCY
DETECTOR
V2
FILTER
VCO
V3
N
V4
PLL CORE
JTAG
INTERFACE
&
E2CMOS
MEMORY
OUTPUT
ROUTING
MATRIX
CLOCK OUTPUTS
REFERENCE
INPUTS
LOCK DETECT
Multiple Profile
Management Logic
0
1
2
3
INTERNAL FEEDBACK PATH
* Input Available only on ispClock 5520
© 2004 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1
clk5500_04
Lattice Semiconductor
ispClock5500 Family Data Sheet
General Description and Overview
The ispClock5510 and ispClock5520 are in-system-programmable high-fanout PLL-based clock drivers designed
for use in high performance communications and computing applications. The ispClock5510 provides up to 10 single-ended or five differential clock outputs, while the ispClock5520 provides up to 20 single-ended or 10 differential
clock outputs. Each pair of outputs may be independently configured to support separate I/O standards (LVDS,
LVPECL, LVTTL, LVCMOS, SSTL, HSTL) and output frequency. In addition, each output provides independent programmable control of termination, slew-rate, and timing skew. All configuration information is stored on-chip in nonvolatile E2CMOS memory.
The ispClock5500’s PLL and divider systems supports the synthesis of clock frequencies differing from that of the
reference input through the provision of programmable input and feedback dividers. A set of five post-PLL V-dividers provides additional flexibility by supporting the generation of five separate output frequencies. Loop feedback
may be taken from the output of any of the five V-dividers.
The core functions of all members of the ispClock5500 family are identical, the differences between devices being
restricted to the number of inputs and outputs, as shown in the following table.
Table 1. ispClock5500 Family Members
Device
Ref. Input Pairs
Clock Outputs
ispClock5510
1
10
ispClock5520
2
20
Figure 1. ispClock5510 Functional Block Diagram
PS0
PS1
LOCK
RESET
PLL_BYPASS
SGATE
Profile Select
Control
0
1
OEX
OEY
OUTPUT ENABLE CONTROLS
2
3
LOCK
DETECT
OUTPUT ROUTING
MATRIX
INPUT
DIVIDER
M
PHASE
DETECT
REFVTT
LOOP
FILTER
VCO
BANK_0A
BANK_0B
BANK_2A
V2
BANK_2B
0
(2-64)
BANK_3A
FEEDBACK
DIVIDER
V4
(2-64)
FEEDBACK
SKEW ADJUST
JTAG INTERFACE
TDI
TMS
TCK
TDO
2
BANK_1B
1
(2-64)
(1-32)
BANK_1A
(2-64)
V3
N
OUTPUT
DRIVERS
V0
V1
(1-32)
SKEW
CONTROL
OUTPUT
DIVIDERS
(2-64)
REFA+
REFA-
GOE
BANK_3B
BANK_4A
BANK_4B
Lattice Semiconductor
ispClock5500 Family Data Sheet
Figure 2. ispClock5520 Functional Block Diagram
PS0
PS1
LOCK
RESET
PLL_BYPASS
SGATE
1
2
OEX
OEY
OUTPUT ROUTING
MATRIX
Profile Select
Control
0
GOE
SKEW
CONTROL
OUTPUT
DRIVERS
BANK_0A
OUTPUT ENABLE CONTROLS
BANK_0B
3
BANK_1A
LOCK
DETECT
BANK_1B
BANK_2A
BANK_2B
OUTPUT
DIVIDERS
BANK_3A
BANK_3B
V0
(2-64)
REFSEL
BANK_4A
REFA+
REFA-
INPUT
DIVIDER
0
M
1
(1-32)
REFVTT
V1
BANK_4B
(2-64)
1
PHASE
DETECT
REFB+
REFB-
LOOP
FILTER
VCO
0
V2
(2-64)
V3
(2-64)
SKEW
CONTROL
OUTPUT
DRIVERS
BANK_5A
BANK_5B
FEEDBACK
DIVIDER
N
(1-32)
V4
(2-64)
BANK_6A
BANK_6B
BANK_7A
BANK_7B
BANK_8A
BANK_8B
BANK_9A
FEEDBACK
SKEW ADJUST
JTAG INTERFACE
TDI
TMS
TCK
TDO
3
BANK_9B
Lattice Semiconductor
ispClock5500 Family Data Sheet
Absolute Maximum Ratings
ispClock5500V
Core Supply Voltage VCCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 5.5V
PLL Supply Voltage VCCA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 5.5V
JTAG Supply Voltage VCCJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 5.5V
Output Driver Supply Voltage VCCO . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 4.5V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 4.5V
Output Voltage1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 4.5V
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C
Junction Temperature with power supplied . . . . . . . . . . . . . . . . . . . -40 to 130°C
1. When applied to an output when in high-Z condition
Recommended Operating Conditions
ispClock5500V
Symbol
Min.
Max.
Units
Core Supply Voltage
Parameter
3.0
3.6
V
VCCJ
JTAG I/O Supply Voltage
1.62
3.6
V
VCCA
Analog Supply Voltage
3.0
3.6
V
VCCASLEW
VCCA Turn-on Ramp Rate
—
0.033
V/µs
0
100
-40
115
0
701
-40
851
VCCD
Conditions
TJOP
Operating Junction Temperature
TA
Ambient Operating Temperature
Commercial
Industrial
Commercial
Industrial
°C
°C
1. Device power dissipation may also limit maximum ambient operating temperature.
Recommended Operating Conditions – VCCO vs. Logic Standard
VCCO (V)
Logic Standard
VREF (V)
VTT (V)
Min.
Typ.
Max.
Min.
Typ.
Max.
Min.
Typ.
Max.
LVTTL
3.0
3.3
3.6
—
—
—
—
—
—
LVCMOS 1.8V
1.71
1.8
1.89
—
—
—
—
—
—
LVCMOS 2.5V
2.375
2.5
2.625
—
—
—
—
—
—
LVCMOS 3.3V
3.0
3.3
3.6
—
—
—
—
—
—
—
VREF + 0.04
VREF + 0.05
SSTL2 Class 1
2.375
2.5
2.625
1.15
1.25
1.35
VREF - 0.04
SSTL3 Class 1
3.0
3.3
3.6
1.30
1.50
1.70
VREF - 0.05
VREF
HSTL Class 1
1.425
1.5
1.575
0.68
0.75
0.90
—
0.5 x VCCO
—
LVPECL (Differential)
3.0V
3.3V
3.6V
—
—
—
—
—
—
VCCO = 2.5V
2.375
2.5V
2.625
—
—
—
—
—
—
VCCO = 3.3V
3.0
3.3
3.6
—
—
—
—
—
—
Units
LVDS
Note: ‘—’ denotes VREF or VTT not applicable to this logic standard
E2CMOS Memory Write/Erase Characteristics
Parameter
Conditions
Erase/Reprogram Cycles
4
Min.
Typ.
Max.
1000
—
—
Lattice Semiconductor
ispClock5500 Family Data Sheet
Performance Characteristics – Power Supply
Symbol
Parameter
Conditions
Typ.
Max.
Units
ispClock5510, fVCO = 640MHz
100
110
mA
ispClock5520, fVCO = 640MHz
130
150
mA
Analog Supply Current
fVCO = 640MHz
5.5
7
mA
ICCO
Output Driver Supply Current
(per Bank)
VCCO = 1.8V1, LVCMOS
VCCO = 2.5V1, LVCMOS
VCCO = 3.3V1, LVCMOS
VCCO = 3.3V2, LVDS
13
18
24
7.5
15
24
35
8
mA
ICCJ
JTAG I/O Supply Current (static)
VCCJ = 1.8V
VCCJ = 2.5V
VCCJ = 3.3V
200
300
300
300
400
400
µA
ICCD
Core Supply Current
ICCA
1. Supply current consumed by each bank, both outputs active, 18pF load, 320MHz output frequency.
2. Supply current consumed by each bank, 100Ω/5pF differential load, 320MHz output frequency.
DC Electrical Characteristics – Single-ended Logic
VIL (V)
VIH (V)
Logic Standard
Min.
Max.
Min.
Max.
IOL (mA)
IOH (mA)
LVTTL/LVCMOS 3.3V
-0.3
0.8
2
3.6
0.4
VCCO - 0.4
41
-41
LVCMOS 1.8V
-0.3
0.35VCCO
0.65VCCO
3.6
0.4
VCCO - 0.4
41
-41
1
-41
LVCMOS 2.5V
-0.3
SSTL2 Class 1
-0.3
SSTL3 Class 1
-0.3
HSTL Class 1
-0.3
0.7
1.7
VREF - 0.18 VREF + 0.18
VREF - 0.2
VREF - 0.1
VREF + 0.2
VOL Max. (V) VOH Min. (V)
3.6
0.4
VCCO - 0.4
4
3.6
0.542
3.6
VREF + 0.1
3.6
VCCO - 0.812
7.6
-7.6
0.9
2
VCCO - 1.32
8
-8
0.4
3
3
8
-8
VCCO - 0.4
1. Specified for 50Ω internal series output termination.
2. Specified for 40Ω internal series output termination.
3. Specified for ≈20Ω internal series output termination.
DC Electrical Characteristics – LVDS
Symbol
Min.
Typ.
Max.
Units
Common Mode Input Voltage
0.05
—
2.35
V
VTHD
Differential Input Threshold
±100
—
—
mV
VIN
Input Voltage
0
—
2.4
V
VOH
Output High Voltage
RT = 100Ω
—
1.375
1.60
V
VOL
Output Low Voltage
RT = 100Ω
0.9
1.03
—
V
RT = 100Ω
250
400
480
mV
—
—
50
mV
1.125
1.20
1.375
V
VICM
Parameter
Conditions
VOD
Output Voltage Differential
∆VOD
Change in VOD between H and L
VOS
Output Voltage Offset
∆VOS
Change in VOS Between H and L
—
—
50
mV
ISA
Output Short Circuit Current
VOD = 0V, Outputs Shorted to GND
—
—
24
mA
ISAB
Output Short Circuit Current
VOD = 0V, Outputs Shorted to Each Other
—
—
12
mA
Common Mode Output Voltage
5
Lattice Semiconductor
ispClock5500 Family Data Sheet
DC Electrical Characteristics – Differential LVPECL
Symbol
Parameter
VIH
Input Voltage High
VIL
Input Voltage Low
VOH
Output High Voltage1
VOL
Output Low Voltage1
Test Conditions
VCCO = 3.0 to 3.6V
VCCO = 3.3V
VCCO = 3.0 to 3.6V
VCCO = 3.3V
VCCO = 3.0 to 3.6V
VCCO = 3.3V
VCCO = 3.0 to 3.6V
VCCO = 3.3V
Min.
Typ.
Max.
VCCO - 1.17
—
VCCO - 0.88
Units
2.14
—
2.42
VCCO - 1.81
—
VCCO - 1.48
1.49
—
1.83
VCCO - 1.07
—
VCCO - 0.88
2.23
—
2.42
VCCO - 1.81
—
VCCO - 1.62
1.49
—
1.68
V
V
V
V
1. 100Ω differential termination.
DC Electrical Characteristics – Input/Output Loading
Symbol
Parameter
Conditions
Typ.
Max.
Units
—
—
±10
µA
Input Leakage
IPU
Input Pull-up Current
Note 2
—
80
120
µA
IPD
Input Pull-down Current
Note 3
—
120
150
µA
IOLK
Tristate Leakage Output
Note 4
—
—
±10
µA
1.
2.
3.
4.
Note 1
Min.
ILK
Applies to clock reference inputs when termination ‘open’.
Applies to TDI, TMS inputs.
Applies to REFSEL, PS0, PS1, GOE, SGATE and PLL_BYPASS.
Applies to all logic types when in tristated mode.
6
Lattice Semiconductor
ispClock5500 Family Data Sheet
Switching Characteristics – Timing Adders for I/O Modes
Adder Type
Base Parameter(s)
Description
Min.
Typ.
Max.
Units
tIOI Input Adders2
LVTTL_in
Using LVTTL Standard
—
0
—
ns
LVCMOS18_in
Using LVCMOS 1.8V Standard
—
0
—
ns
LVCMOS25_in
Using LVCMOS 2.5V Standard
—
0
—
ns
LVCMOS33_in
Using LVCMOS 3.3V Standard
—
0
—
ns
SSTL2_in
Using SSTL2 Standard
—
0.4
—
ns
SSTL3_in
Using SSTL3 Standard
—
0.4
—
ns
HSTL_in
Using HSTL Standard
—
0.4
—
ns
LVDS_in
Using LVDS Standard
—
1.8
—
ns
LVPECL_in
Using LVPECL Standard
—
1.8
—
ns
tIOO Output Adders1, 3
LVTTL_out
Output Configured as LVTTL Buffer
—
0.1
—
ns
LVCMOS18_out
Output Configured as LVCMOS 1.8V Buffer
—
0.1
—
ns
LVCMOS25_out
Output Configured as LVCMOS 2.5V Buffer
—
0.1
—
ns
LVCMOS33_out
Output Configured as LVCMOS 3.3V Buffer
—
0.1
—
ns
SSTL2_out
Output Configured as SSTL2 Buffer
—
0.1
—
ns
SSTL3_out
Output Configured as SSTL3 Buffer
—
0.1
—
ns
HSTL_out
Output Configured as HSTL Buffer
—
0.1
—
ns
LVDS_out
Output Configured as LVDS Buffer
—
0.1
—
ns
LVPECL_out
Output Configured as LVPECL Buffer
—
0
—
ns
tIOS Output Slew Rate Adders1
Slew_1
Output Slew_1 (Fastest)
—
0
—
ps
Slew_2
Output Slew_2
—
330
—
ps
Slew_3
Output Slew_3
—
660
—
ps
Slew_4
Output Slew_4 (Slowest)
—
1320
—
ps
1. Measured under standard output load conditions – see Figures 3-5.
2. All input adders referenced to LVTTL.
3. All output adders referenced to LVPECL.
Output Rise and Fall Times – Typical Values1, 2
Slew 1 (Fastest)
Output Type
Slew 2
Slew 3
Slew 4 (Slowest)
tR
tF
tR
tF
tR
tF
tR
tF
Units
LVTTL
0.65
0.45
0.85
0.60
1.20
0.90
1.75
1.30
ns
LVCMOS 1.8V
0.90
0.40
1.05
0.50
1.40
0.80
2.00
1.20
ns
LVCMOS 2.5V
0.70
0.40
0.90
0.55
1.20
0.85
1.80
1.20
ns
LVCMOS 3.3V
0.65
0.45
0.85
0.60
1.20
0.90
1.75
1.30
ns
SSTL2
0.55
0.35
0.85
0.45
1.45
0.65
2.30
1.20
ns
SSTL3
0.50
0.40
0.80
0.50
1.45
0.75
2.30
1.35
ns
HSTL
0.65
0.35
0.85
0.45
1.30
0.65
1.90
1.25
ns
0.60
0.60
—
—
—
—
—
—
ns
0.65
0.60
—
—
—
—
—
—
ns
LVDS
3
LVPECL3
1. See Figures 3-5 for test conditions.
2. Measured between 20% and 80% points.
3. Only the ‘fastest’ slew rate is available in LVDS and LVPECL modes.
7
Lattice Semiconductor
ispClock5500 Family Data Sheet
Output Test Loads
Figures 3-5 show the equivalent termination loads used to measure rise/fall times, output timing adders and other
selected parameters as noted in the various tables of this data sheet.
Figure 3. CMOS Termination Load
Equivalent
Termination Load
50Ω
Test
Point
Z=50Ω
1kΩ
5pF
Figure 4. HSTL/SSTL Termination Load
Equivalent
Termination Load
≈20Ω (HSTL)
40Ω (SSTL)
Test
Point
Z=50Ω
5pF
50Ω
VT=1.65 V (SSTL3)
1.25 V (SSTL2)
0.75 V (HSTL)
Figure 5. LVDS/LVPECL Termination Load
Equivalent
Termination Load
+Test
Point
Z=50Ω
-Test
Point
Z=50Ω
5pF
5pF
50Ω
50Ω
0.1µF
8
Lattice Semiconductor
ispClock5500 Family Data Sheet
Programmable Input and Output Termination Characteristics
Symbol
RIN
CIN
Parameter
Input Resistance
Min.
Typ.
Max.
Rin=40Ω setting
Conditions
38
—
42
Rin=45Ω setting
42
—
46
Rin=50Ω setting
48
—
53
Rin=55Ω setting
51
—
57
Rin=60Ω setting
55
—
62
Rin=65Ω setting
60
—
68
Rin=70Ω setting
62
—
73
—
7
—
—
27
—
Input Capacitance
Rout≈20Ω setting, VCCO=1.5V
ROUT
Output Resistance
Rout≈20Ω setting, VCCO=1.8V
—
22
—
Rout≈20Ω setting, VCCO=2.5V
—
20
—
Rout≈20Ω setting, VCCO=3.3V
—
18
—
Rout=40Ω setting
35
—
47
Rout=45Ω setting
40
—
55
Rout=50Ω setting
45
—
61
Rout=55Ω setting
49
—
67
Rout=60Ω setting
53
—
72
Rout=65Ω setting
58
—
78
Rout=70Ω setting
63
—
83
9
Units
Ω
pF
Ω
Lattice Semiconductor
ispClock5500 Family Data Sheet
Performance Characteristics – PLL
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
10
—
320
MHz
1.25
—
—
ns
—
—
5
ns
fREF
Reference input frequency
range
tCLOCKHI,
tCLOCKLO
Reference input clock HIGH and
LOW times
tRINP,
tFINP
Input rise and fall times
MDIV
M-divider range
1
—
32
NDIV
N-Divider range
1
—
32
fPFD
Phase detector input frequency
range2
10
—
320
MHz
fVCO
VCO operating frequency
320
—
640
MHz
VDIV
Output Divider range
Even integer values only
2
—
64
Fine Skew Mode,
fVCO = 640MHz
10
—
320
MHz
Coarse Skew Mode,
fVCO = 640MHz
5
—
160
MHz
70
ps (p-p)
fOUT
Output frequency range
Measured between 20% and 80%
levels
1
tJIT (cc)
Output adjacent-cycle jitter
1000 cycle sample3
—
55
tJIT (per)
Output period jitter
Note 3
—
11
14
ps (RMS)
Output type LVDS, VCCO = 3.3V5
—
—
260
ps
—
—
300
ps
—
5
—
ns
From Power-up event
—
150
500
µs
From Reset event
—
15
50
µs
fIN = fOUT = 100MHz
VCCA = VCCD = VCCO modulated
with 100kHz sinusoidal stimulus
—
0.05
—
DCERR
Output duty cycle error (see
Table 3 for nominal values)4
tCO_BYPASS
Reference clock to output delay, Inputs and Outputs configured to
PLL bypass mode
LVCMOS 3.3V standard
tL
PLL Lock time
PSR
Power supply rejection, period
jitter vs. power supply noise
5
Output type LVCMOS 3.3V
fOUT < 100 MHz
1.
2.
3.
4.
ps(RMS)
mV(p-p)
In PLL Bypass mode (PLL_BYPASS = HIGH), output will support frequencies down to 0Hz (divider chain is a fully static design).
Dividers should be set so that they provide the phase detector with signals of 10MHz or greater for loop stability.
fIN = fOUT = 100 MHz, M = N = 1, V = 6, output type LVTTL, fastest slew rate, 50Ω output impedance.
Variation in duty cycle expressed in ps. To obtain duty cycle percentage error (%ERR) for a given output frequency (fOUT), %ERR = 100 x
fOUT x DCERR.
5. See Figures 3-5 for output loads.
10
Lattice Semiconductor
ispClock5500 Family Data Sheet
Timing Specifications
Skew Matching
Symbol
tSKEW
Parameter
Conditions
Between any two identically configured and loaded
outputs regardless of bank and output frequency
Output-output Skew
Min.
Typ.
Max.
Units
—
—
50
ps
Programmable Skew Control
Symbol
Parameter
tSKRANGE
Skew Control Range1
SKSTEPS
Skew Steps per range
Min.
Typ.
Max.
Fine Skew Mode, fVCO = 320 MHz
Conditions
—
5.86
—
Fine Skew Mode, fVCO = 640 MHz
—
2.93
—
Coarse Skew Mode, fVCO = 320 MHz
—
11.72
—
Coarse Skew Mode, fVCO = 640 MHz
tSKSTEP
tSKERR
Skew Step Size2
Skew Time Accuracy3
—
5.86
—
—
16
—
Fine Skew Mode, fVCO = 320 MHz
—
390
—
Fine Skew Mode, fVCO = 640 MHz
—
195
—
Coarse Skew Mode, fVCO = 320 MHz
—
780
—
Coarse Skew Mode, fVCO = 640 MHz
—
390
—
Fine skew mode
—
30
—
Coarse skew mode
—
50
—
Units
ns
ps
ps
1. Skew control range is a function of VCO frequency (fVCO). In fine skew mode TSKRANGE = 15/(8 x fVCO).
In coarse skew mode TSKRANGE = 15/(4 x fVCO).
2. Skew step size is a function of VCO frequency (fVCO). In fine skew mode TSKSTEP = 1/(8 x fVCO).
In coarse skew mode TSKSTEP = 1/(4 x fVCO).
3. Only applicable to outputs with non-zero skew settings.
Control Functions
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
tDIS/OE
Delay Time, OEX or OEY to Output Disabled/
Enabled
—
10
20
ns
tDIS/GOE
Delay Time, GOE to Output Disabled/Enabled
—
10
20
ns
tSUSGATE
Setup Time, SGATE to Output Clock Start/
Stop
3
—
—
cycles1
tPLL_RSTW
PLL Reset Pulse Width
15
—
—
µs
tHPS_RST
Hold time for RESET past change in PS[0..1]
20
—
—
ns
1. Output clock cycles for the particular output being controlled.
Figure 6. RESET and Profile Select Timing
PS[0..1]
tHPS_RST
RESET
tPLL_RSTW
11
Lattice Semiconductor
ispClock5500 Family Data Sheet
Timing Specifications (Cont.)
Boundary Scan Logic
Min.
Max.
Units
tBTCP
Symbol
TCK (BSCAN Test) Clock Cycle
Parameter
40
—
ns
tBTCH
TCK (BSCAN Test) Pulse Width High
20
—
ns
tBTCL
TCK (BSCAN Test) Pulse Width Low
20
—
ns
tBTSU
TCK (BSCAN Test) Setup Time
8
—
ns
tBTH
TCK (BSCAN Test) Hold Time
10
—
ns
tBRF
TCK (BSCAN Test) Rise and Fall Rate
50
—
mV/ns
tBTCO
TAP Controller Falling Edge of Clock to Valid Output
—
10
ns
tBTOZ
TAP Controller Falling Edge of Clock to Data Output Disable
—
10
ns
tBTVO
TAP Controller Falling Edge of Clock to Data Output Enable
—
10
ns
tBVTCPSU
BSCAN Test Capture Register Setup Time
8
—
ns
tBTCPH
BSCAN Test Capture Register Hold Time
10
—
ns
tBTUCO
BSCAN Test Update Register, Falling Edge of Clock to Valid Output
—
25
ns
tBTUOZ
BSCAN Test Update Register, Falling Edge of Clock to Output Disable
—
25
ns
tBTUOV
BSCAN Test Update Register, Falling Edge of Clock to Output Enable
—
25
ns
JTAG Interface and Programming Mode
Min.
Typ.
Max.
Units
fMAX
Symbol
Maximum TCK Clock Frequency
Parameter
Condition
—
—
25
MHz
tCKH
TCK Clock Pulse Width, High
20
—
—
ns
tCKL
TCK Clock Pulse Width, Low
20
—
—
ns
tISPEN
Program Enable Delay Time
15
—
—
µs
tISPDIS
Program Disable Delay Time
30
—
—
µs
tHVDIS
High Voltage Discharge Time, Program
30
—
—
µs
tHVDIS
High Voltage Discharge Time, Erase
200
—
—
µs
tCEN
Falling Edge of TCK to TDO Active
—
—
15
ns
tCDIS
Falling Edge of TCK to TDO Disable
—
—
15
ns
tSU1
Setup Time
8
—
—
ns
tH
Hold Time
10
—
—
ns
tCO
Falling Edge of TCK to Valid Output
—
—
15
ns
tPWV
Verify Pulse Width
30
—
—
µs
tPWP
Programming Pulse Width
10
—
—
ms
tBEW
Bulk Erase Pulse Width
200
—
—
ms
12
Lattice Semiconductor
ispClock5500 Family Data Sheet
Timing Diagrams
Figure 7. Erase (User Erase or Erase All) Timing Diagram
Clock to Shift-IR state and shift in the Discharge
Instruction, then clock to the Run-Test/Idle state
VIH
TMS
VIL
tSU1
tH
tSU1
tCKH
VIH
tSU1
tH
tGKL
tH
tBEW
tCKH
TCK
VIL
State
Update-IR
Run-Test/Idle (Erase)
Select-DR Scan
The clock (TCK) must be
able to run free with TMS = VIL
tSU1
tSU1
tH
tCKH
tSU1
tH
tGKL
tH
tCKH
tCKH
tSU2
Specified by the Data Sheet
Run-Test/Idle (Discharge)
The clock (TCK) must be
able to run free with TMS = VIL
Figure 8. Programming Timing Diagram
TMS
VIL
tSU1
tH
tSU1
tCKH
VIH
tH
tSU1
tCKL
tH
tPWP
tCKH
TCK
VIL
State
Update-IR
Run-Test/Idle (Program)
Select-DR Scan
The clock (TCK) must be
able to run free with TMS = VIL
Clock to Shift-IR state and shift in the next
Instruction, which will stop the discharge process
VIH
tSU1
tH
tCKH
tSU1
tH
tCKL
tCKH
Update-IR
VIH
TMS
VIL
tSU1
tH
tCKH
tSU1
tH
tSU1
tCKL
tH
tPWV
tCKH
VIH
TCK
VIL
State
Update-IR
Run-Test/Idle (Program)
Select-DR Scan
The clock (TCK) must be
able to run free with TMS=VIL
Clock to Shift-IR state and shift in the next Instruction
Figure 9. Verify Timing Diagram
tSU1
tH
tCKH
tSU1
tH
tCKL
tCKH
Update-IR
Figure 10. Discharge Timing Diagram
tHVDIS (Actual)
TMS
VIL
tSU1
tH
tCKH
tSU1
tCKL
tH
tSU1
tPWP or tBEW
tH
tCKH
VIH
TCK
VIL
State
Update-IR
Run-Test/Idle (Erase or Program)
Select-DR Scan
13
Clock to Shift-IR state and shift in the Verify
Instruction, then clock to the Run-Test/Idle state
VIH
tSU1
tH
tCKH
tSU1
tCKL
tH
tSU1
tPWV
tCKH
Actual
tPWV
Specified by the Data Sheet
Run-Test/Idle (Verify)
tH
tCKH
Lattice Semiconductor
ispClock5500 Family Data Sheet
Typical Performance Characteristics
ICCD vs. fVCO
(Normalized to 640MHz)
ICCO vs. Output Frequency
(LVCMOS 3.3V, Normalized to 320MHz)
1.2
Normalized ICCO Current
Normalized ICCD Current
1.2
1
0.8
0.6
0.4
0.2
0
300
1
0.8
0.6
0.4
0.2
0
400
500
600
700
0
fVCO (MHz)
50
100
150
200
250
300
350
Output Frequency (MHz)
Typical Skew Error vs. Setting
(Skew Mode = FINE, fVCO = 600MHz)
100
Error vs. Ideal (ps)
75
50
25
0
-25
-50
-75
-100
0
3
6
9
12
15
Skew Setting #
Detailed Description
PLL Subsystem
The ispClock5500 provides an integrated phase-locked-loop (PLL) which may be used to generate output clock
signals at lower, higher, or the same frequency as a user-supplied input reference signal. The core functions of the
PLL are an edge-sensitive phase detector, a programmable loop filter, and a high-speed voltage-controlled oscillator (VCO). Additionally, a set of programmable input, output and feedback dividers (M, N, V[1..5]) is provided to
support the synthesis of different output frequencies.
Phase/Frequency Detector
The ispClock5500 provides an edge-sensitive phase/frequency detector (PFD), which means that the device will
function properly over a wide range of input clock reference duty cycles. It is only necessary that the input reference clock meet specified minimum HIGH and LOW times (tCLOCKHI, tCLOCKLO) for it to properly recognized by the
PFD. The PFD’s output is of a classical charge-pump type, outputting charge packets which are then integrated by
the PLL‘s loop filter.
A lock-detection feature is also associated with the PFD. When the ispClock5500 is in a LOCKED state, the LOCK
output pin goes LOW. The lock detector has two operating modes; phase lock mode and frequency lock mode. In
phase-lock mode, the LOCK signal is asserted if the phases of the reference and feedback signals match, whereas
in frequency-lock mode the LOCK signal is asserted when the frequencies of the feedback and reference signals
14
Lattice Semiconductor
ispClock5500 Family Data Sheet
match. The option of which mode to use is programmable and may be set using PAC-Designer software (available
from Lattice’s web site at www.latticesemi.com).
In phase-lock mode the lock detector asserts the LOCK signal as soon as a lock condition is determined. In frequency-lock mode, however, the PLL must be in a locked condition for a set number of phase detector cycles
before the LOCK signal will be asserted. The number of cycles required before asserting the LOCK signal in frequency-lock mode can be set from 16 through 256, in increments of 16.
When the lock condition is lost the LOCK signal will be de-asserted immediately both in phase and frequency-lock
modes.
Loop Filter
A simplified schematic for the ispClock5500 loop filter is shown in Figure 11. The filter’s capacitors are fixed, and
the response is controlled by setting the value of the phase-detector’s output current source’s and the value of the
variable resistor. The phase detector output current has 14 possible settings, ranging from 3µA to 55µA, while the
resistor may be set to any one of six values ranging from 2.3K to 9.3K. This provides a total of 84 unique I-R combinations which may be selected.
Figure 11. ispClock5500 Loop Filter (Simplified)
Phase Detector
From
M-divider
I
To VCO
I
From
N-divider
C1
R
C2
Because the selection of an optimal PLL loop filter can be a daunting task, PAC-Designer software offers a set of
default filter settings which will provide acceptable performance for most applications. The primary criterion for
selecting one of these settings is the total division factor used in the feedback path, or the ratio between the VCO
output frequency and the frequency output by the N feedback divider (N x Vfeedback). Table 2 lists these default settings and conditions under which they should be used.
Table 2. PAC-Designer Recommended Loop Filter Settings
N x VFBK
I (µA)
R (kΩ)
2 to 8
5
2.3
10
7
2.3
12 to 14
9
2.3
16
11
2.3
18 to 20
13
2.3
22
15
2.3
24 to 26
17
2.3
28
19
2.3
30
21
2.3
32 to 64
22
2.3
15
Lattice Semiconductor
ispClock5500 Family Data Sheet
The choice of loop filter parameters can have significant effects on settling time, output jitter, and whether the PLL
will be fundamentally stable and be able to lock to an incoming signal. The values recommended in Table 2 were
chosen to provide maximum loop stability while still providing exceptional jitter performance. Please note that when
the skew mode is set to ‘coarse’, the effective value of NxV must be doubled. Refer to the section titled ‘Coarse
Skew Mode’ on page 26 for more details.
VCO
The ispClock5500 provides an internal VCO which provides an output frequency ranging from 320MHz to 640MHz.
The VCO is implemented using differential circuit design techniques which minimize the influence of power supply
noise on measured output jitter. The VCO is also used to generate skews as a function of the total VCO period.
Using the VCO as the basis for controlling output skew allows for highly precise and consistent skew generation,
both from device-to-device, as well as channel-to-channel within the same device.
M, N, and V Dividers
The ispClock5500 incorporates a set of programmable dividers which provide the ability to synthesize output frequencies differing from that of the reference clock input.
The input, or M, divider prescales the input reference frequency, and can be programmed with integer values over
the range of 1 to 32. To achieve low levels of output jitter, it is best to use the smallest M divider value possible.
The feedback, or N, divider prescales the feedback frequency and like the M divider, can also be programmed with
integer values ranging from 1 to 32.
Each one of the five output, or V, dividers can be independently programmed to provide even division ratios ranging
from 2 to 64.
When the PLL is selected (PLL_BYPASS=LOW) and locked, the output frequency of each V divider (fk) may be calculated as:
fk = fref
N x Vfbk
M x Vk
(1)
where
fk is the frequency of V divider k
fref is the input reference frequency
M and N are the input and feedback divider settings
Vfbk is the setting of the V divider used to close the PLL feedback path
Vk is the setting of the V divider used to provide output k
Note that because the feedback may be taken from any V divider, Vk and Vfbk may refer to the same divider.
Because the VCO has an operating frequency range spanning 320 MHz to 640 MHz, and the V dividers provide
division ratios from 2 to 64, the ispClock5500 can generate output signals ranging from 5MHz to 320 MHz. For performance and stability reasons, however, there are several constraints which should be followed when selecting
divider values:
• Use the smallest feasible value for the M divider
• The output frequency from the M (and N) divider should be greater or equal to 10 MHz.
• The product of the N divider and the V divider used to close the PLL’s feedback loop should be less than or
equal to 64 (N x Vfbk ≤ 64)
Output Duty Cycle
The ispClock5500’s output duty cycle varies as a function of the V divider used to generate that output. Table 3
shows the nominal output duty cycle as a function of the V divider setting. Note that if the output is inverted, the
duty cycle will be equal to 100%-DC%, where DC% is the duty cycle indicated in the table. For example, with a Vdivider of 6, the non-inverted duty cycle from Table 3 will be 67%. For an inverted output, the duty cycle will be
100%-67% or 33%.
16
Lattice Semiconductor
ispClock5500 Family Data Sheet
Table 3. Nominal Output Duty Cycle vs. V Divider Setting
V
DC%
V
DC%
V
DC%
V
DC%
2
50
18
44
34
47
50
48
4
50
20
50
36
50
52
50
6
67
22
45
38
47
54
48
8
50
24
50
40
50
56
50
10
40
26
46
42
48
58
48
12
50
28
50
44
50
60
50
14
43
30
47
46
48
62
48
16
50
32
50
48
50
64
50
PLL_BYPASS Mode
The PLL_BYPASS mode is provided so that input reference signals can be coupled through to the outputs without
using the PLL functions. When PLL_BYPASS mode is enabled (PLL_BYPASS=HIGH), the output of the M divider
is routed directly to the inputs of the V dividers. In PLL_BYPASS mode, the nominal values of the V dividers are
halved, so that they provide division ratios ranging from 1 to 32. The divide-by-1 setting, however, is invalid and will
produce undefined results. The output frequency for a given V divider (fk) will be determined by
fref
(2)
M x Vk
Please note that PLL_BYPASS mode is provided primarily for testing purposes. When PLL_BYPASS mode is
enabled, features such as lock detect and skew generation are unavailable.
fk =
Reference Inputs
The ispClock5500 provides sets of configurable, internally-terminated inputs for clock reference signals. In normal
operation, the clock reference input (REFA) is connected to the system clock from which the output signals are to
be derived.
The ispClock5510 provides one input signal pair for reference input, while the ispClock5520 provides two input
pairs for reference signals. To select between reference inputs, the ispClock5520 provides a CMOS-compatible digital input called REFSEL. Table 4 shows the behavior of this control input:
Table 4. REFSEL Operation for ispClock5520
REFSEL
Selected Input Pair
0
REFA+/-
1
REFB+/-
Clock reference inputs may be configured to interface to signals from the following logic families with little or no
external support circuitry:
•
•
•
•
•
•
•
LVTTL (3.3V)
LVCMOS (1.8V, 2.5V, 3.3V)
SSTL2
SSTL3
HSTL
LVDS
LVPECL (differential, 3.3V)
Each input also features internal programmable termination resistors, as shown in Figure 12.
17
Lattice Semiconductor
ispClock5500 Family Data Sheet
Figure 12. ispClock5500 Clock Reference Input Structure (REFA+/- Pair Shown)
ispClock5500
Single-ended
Receiver
REFA+
To Internal
Logic
REFA-
Differential
Receiver
RT
RT
REFVTT
The following usage guidelines are suggested for interfacing to supported logic families.
LVTTL (3.3V), LVCMOS (1.8V, 2.5V, 3.3V)
The receiver should be set to LVCMOS or LVTTL mode, and the input signal should be connected to the ‘+’ terminal of the input pair (e.g. REFA+). The ‘-’ input terminal should be left floating. CMOS transmission lines are generally source terminated, so all termination resistors should be set to the OPEN state. Figure 13 shows the proper
configuration. Please note that because switching thresholds are different for LVCMOS running at 1.8V, there is a
separate configuration setting for this particular standard.
Figure 13. LVCMOS/LVTTL Input Receiver Configuration
ispClock5500
Single-ended
Receiver
Signal In
REFA+
No Connect
REFART
OPEN
No Connect
REFVTT
HSTL, SSTL2, SSTL3
The receiver should be set to HSTL/SSTL mode, and the input signal should be fed into the ‘+’ terminal of the input
pair. The ‘-’ input terminal should be tied to the appropriate Vref value, and the REFVTT terminal should be tied to a
VTT termination supply. The positive input’s terminating resistor should be engaged and set to 50Ω. Figure 14
shows an appropriate configuration. Refer to the “Recommended Operating Conditions - Supported Logic Standards” table in this data sheet for suitable values of VREF and VTT.
18
Lattice Semiconductor
ispClock5500 Family Data Sheet
One important point to note is that the termination supplies must have low impedance and be able to both source
and sink current without experiencing fluctuations. These requirements generally preclude the use of a resistive
divider network, which has an impedance comparable to the resistors used, or of commodity-type linear voltage
regulators, which can only source current. The best way to develop the necessary termination voltages is with a
regulator specifically designed for this purpose. Because SSTL and HSTL logic is commonly used for high-performance memory busses, a suitable termination voltage supply is often already available in the system.
Figure 14. SSTL2, SSTL3, HSTL Receiver Configuration
ispClock5500
Signal In
Differential
Receiver
REFA+
VREF IN
REFA50
VTT
CLOSED
OPEN
REFVTT
Differential HSTL and SSTL
HSTL and SSTL are sometimes used in a differential form, especially for distributing clocks in high-speed memory
systems. Figure 15 shows how ispClock5500 reference input should be configured for accepting these standards.
The major difference between the differential and single-ended forms of these logic standards is that in the differential cases, the REFA- input is used as a signal input, not a reference level, and that both terminating resistors are
engaged and set to 50Ω.
Figure 15. Differential HSTL/SSTL Receiver Configuration
ispClock5500
+Signal In
Differential
Receiver
REFA+
-Signal In
REFA50
50
VTT
CLOSED
CLOSED
REFVTT
19
Lattice Semiconductor
ispClock5500 Family Data Sheet
LVDS/Differential LVPECL
The receiver should be set to LVDS or LVPECL mode as required and both termination resistors should be
engaged and set to 50Ω. The REFVTT pin, however, should be left unconnected. This creates a floating 100Ω differential termination resistance across the input terminals. The LVDS termination configuration is shown in
Figure 16.
Figure 16. LVDS Input Receiver Configuration
ispClock5500
Differential
Receiver
+Signal In
REFA+
LVDS
Driver
-Signal In
REFA50
50
CLOSED
CLOSED
No Connect
REFVTT
Note that while a floating 100Ω resistor forms a complete termination for an LVDS signal line, additional circuitry
may be required to satisfactorily terminate a differential LVPECL signal. This is because a true bipolar LVPECL output driver typically requires an external DC ‘pull-down’ path to a VTERM termination voltage (typically VCC-2V) to
properly bias its open emitter output stage. When interfacing to an LVPECL input signal, the ispClock5500’s internal termination resistors should not be used for this pull-down function, as they may be damaged from excessive
current. The pull-down should be implemented with external resistors placed close to the LVPECL driver
(Figure 17)
Figure 17. LVPECL Input Receiver Configuration
ispClock5500
Differential
Receiver
+Signal In
REFA+
LVPECL
Driver
-Signal In
REFARPD
RPD
50
50
CLOSED
VTERM
No Connect
REFVTT
20
CLOSED
Lattice Semiconductor
ispClock5500 Family Data Sheet
Please note that while the above discussions specify using 50Ω termination impedances, the actual impedance
required to properly terminate the transmission line and maintain good signal integrity may vary from this ideal. The
actual impedance required will be a function of the driver used to generate the signal and the transmission medium
used (PCB traces, connectors and cabling). The ispClock5500’s ability to adjust input impedance over a range of
40Ω to 70Ω allows the user to adapt his circuit to non-ideal behaviors from the rest of the system without having to
swap out components.
Output Drivers
The ispClock5500 provide banks of configurable, internally-terminated high-speed dual-output line drivers. The
ispClock5510 provides five driver banks, while the ispClock5520 provides ten. Each of these driver banks may be
configured to provide either a single differential output signal, or a pair of single-ended output signals. Programmable internal source-series termination allows the ispClock5500 to be matched to transmission lines with impedances ranging from 40 to 70 Ohms. The outputs may be independently enabled or disabled, either from E2CMOS
configuration or by external control lines. Additionally, each can be independently programmed to provide a fixed
amount of signal delay or skew, allowing the user to compensate for the effects of unequal PCB trace lengths or
loading effects. Figure 18 shows a block diagram of a typical ispClock5500 output driver bank and associated skew
control.
Because of the high edge rates which can be generated by the ispClock5500’s clock output drivers, the VCCO
power supply pin for each output bank should be individually bypassed. Low ESR capacitors with values ranging
from 0.01 to 0.1 µF may be used for this purpose. Each bypass capacitor should be placed as close to its respective output bank power pins (VCCO and GNDO) pins as is possible to minimize interconnect length and associated
parasitic inductances.
In the case where an output bank is unused, the associated VCCO pin may be either left floating or tied to ground
to reduce quiescent power consumption. We recommend, however, that all unused VCCO pins be tied to ground
where possible. All GNDD pins must be tied to ground, regardless of whether or not the associated bank is used.
Figure 18. ispClock5500 Output Driver and Skew Control
Skew
Adjust
OE
Control
Single-ended
‘A’ output Driver
From V-Dividers
BANKxA
OE
Control
Differential
(PECL/LVDS)
Driver
OE
Control
Skew
Adjust
BANKxB
Single-ended
‘B’ output Driver
21
Lattice Semiconductor
ispClock5500 Family Data Sheet
Each of the ispClock5500’s output driver banks can be configured to support the following logic outputs:
•
•
•
•
•
•
•
LVTTL
LVCMOS (1.8V, 2.5V, 3.3V)
SSTL2
SSTL3
HSTL
LVDS
Differential LVPECL (3.3V)
To provide LVTTL, LVCMOS, SSTL2, SSTL3, and HSTL outputs, the CMOS output drivers in each bank are
enabled. These circuits provide logic outputs which swing from ground to the VCCO supply rail. The choice of
VCCO to be supplied to a given bank is determined by the logic standard to which that bank is configured. Because
each pair of outputs has its own VCCO supply pin, each bank can be independently configured to support a different logic standard. Note that the two outputs associated with a bank must necessarily be configured to the same
logic standard. The source impedance of each of the two outputs in each bank may be independently set over a
range of 40Ω to 70Ω in 5Ω steps. A low impedance option (≈20Ω) is also provided for cases where low source termination is desired on a given output, such as when using HSTL output mode.
Control of output slew rate is also provided in LVTTL, LVCMOS, SSTL2, SSTL3, and HSTL output modes. Four
output slew-rate settings are provided, as specified in the “Output Rise Times” and “Output Fall Times” tables in this
data sheet.
To provide LVDS and differential LVPECL outputs, a separate driver is used which provides the correct LVDS or
LVPECL logic levels when operating from a 3.3V VCCO. Because both LVDS and differential LVPECL transmission
lines are normally terminated with a single 100Ω resistor between the ‘+’ and ‘-’ signal lines at the far end, the
ispClock5500’s internal termination resistors are not available in these modes. Also note that output slew-rate control is not available in LVDS or LVPECL mode, and that these drivers always operate at a fixed slew-rate.
Polarity control (true/inverted) is available for all output drivers. In the case of single-ended output standards, the
polarity of each of the two output signals from each bank may be controlled independently. In the case of differential output standards, the polarity of the differential pair may be selected.
Suggested Usage
Figure 19 shows a typical configuration for the ispClock5500’s output driver when configured to drive an LVTTL or
LVCMOS load. The ispClock5500’s output impedance should be set to match the characteristic impedance of the
transmission line being driven. The far end of the transmission line should be left open, with no termination resistors.
Figure 19. Configuration for LVTTL/LVCMOS Output Modes
ispClock5500
LVCMOS/LVTTL
Mode
Zo
Ro = Zo
LVCMOS/LVTTL
Receiver
Figure 20 shows a typical configuration for the ispClock5500’s output driver when configured to drive SSTL2,
SSTL3, or HSTL loads. The ispClock5500’s output impedance should be set to 40Ω for driving SSTL2 or SSTL3
22
Lattice Semiconductor
ispClock5500 Family Data Sheet
loads and to the ≈20Ω setting for driving HSTL. The far end of the transmission line must be terminated to an
appropriate VTT voltage through a 50Ω resistor.
Figure 20. Configuration for SSTL2, SSTL3, and HSTL Output Modes
VTT
ispClock5500
RT=50
SSTL/HSTL
Mode
SSTL/HSTL
Receiver
Zo=50
Ro : 40Ω (SSTL)
≈20Ω (HSTL)
VREF
When driving differential SSTL or HSTL loads, the above configuration should be duplicated on the ‘-’ output line of
the differential pair.
Figure 21 shows a typical configuration for the ispClock5500’s output driver when configured to drive LVDS or differential LVPECL loads. The ispClock5500’s output impedance is disengaged when the driver is set to LVDS or
LVPECL mode. The far end of the transmission line must be terminated with a 100Ω resistor across the two signal
lines.
Figure 21. Configuration for LVDS and LVPECL Output Modes
LVDS/LVPECL
mode
LVDS/PECL
Receiver
Zo=50
RT=100
Zo=50
ispClock5500
Note that when in LVPECL output mode, the ispClock5500’s output driver provides an internal pull-down, unlike a
typical bipolar LVPECL driver. For this reason no external pull-down resistors are necessary and the driver may be
terminated with a single 100Ω resistor across the signal lines. For proper operation, pull-down resistors should
NOT be used with the ispClock5500’s LVPECL output mode.
Thermal Management
In applications where a majority of the ispClock5510 or ispClock5520’s outputs are active and operating at or near
maximum output frequency (320 MHz), package thermal limitations may need to be considered to ensure a successful design. Thermal characteristics of the packages employed by Lattice Semiconductor may be found in the
document Thermal Management which may be obtained at www.latticesemi.com.
The maximum current consumption of the digital and analog core circuitry is approximately 157mA worst case
(ICCD + ICCA), and each of the output banks may draw up to 35mA worst case (LVCMOS 3.3V, CL=18pF, fOUT=320
MHz, both outputs in each bank enabled). This results in a total device dissipation:
PDMAX = 3.3V x (10 x 35mA + 157mA) = 1.67W
23
(3)
Lattice Semiconductor
ispClock5500 Family Data Sheet
With a maximum recommended operating junction temperature (TJOP) of 115°C for an industrial grade device, the
maximum allowable ambient temperature (TAMAX) can be estimated as
TAMAX = TJOP - PDMAX x ΘJA = 115°C - 1.67W x 35°C/W = 56°C
(4)
where ΘJA = 35 °C/W in still air for the ispClock5520’s TQFP100 package.
The above analysis represents the worst-case scenario. Significant improvement in maximum ambient operating
temperature can be realized with additional cooling. Providing a 200 LFM (Linear Feet per Minute) airflow reduces
ΘJA to 29°C/W, which results in a maximum ambient operating temperature of 66°C.
In practice, however, the absolute worst-case situation will be relatively rare, as not all outputs may be running at
maximum output frequency in a given application. Additionally, if the internal VCO is operating at less than its maximum frequency (640MHz), it requires less current on the VCCD pin. In these situations, one can estimate the
effective ICCO for each bank and the effective ICCD for the digital core functions based on output frequency and
VCO frequency. Normalized curves relating current to operating frequency for these parameters may be found in
the Typical Performance Characteristics section.
While it is possible to perform detailed calculations to estimate the maximum ambient operating temperature from
operating conditions, some simpler rule-of-thumb guidance can also be obtained through the derating curves
shown in Figure 22. The curves in Figure 22a show the maximum ambient operating temperature permitted when
operating a given number of output banks at the maximum output frequency (320MHz). Note that it is assumed that
both outputs in each bank are active.
Figure 22. Maximum Ambient Temperature vs. Number of Active Output Banks
Temperature Derating Curves
(Outputs LVCMOS 3.3V, fOUT=320 MHz)
Temperature Derating Curves
(Outputs LVCMOS 3.3V, fOUT=100 MHz)
90
Maximum Ambient Temp. ˚C
Maximum Ambient Temp. °C
90
80
70
60
50
40
70
60
50
40
0
Maximum Ambient Temp. °C
80
2
4
6
8
10
0
2
4
# Active Output Banks
# Active Output Banks
(a)
(b)
Temperature Derating Curves
(Outputs LVDS, fOUT=320 MHz)
90
5520 Commercial
5520 Industrial
80
5510 Commericial
5510 Industrial
70
60
50
40
0
2
6
4
6
8
10
# Active Output Banks
(c)
24
8
10
Lattice Semiconductor
ispClock5500 Family Data Sheet
Figure 22b shows another derating curve, derived under the assumption that the output frequency is 100MHz. For
many applications, 100MHz outputs will be a more realistic scenario. Comparing the maximum temperature limits
of Figure 22b with Figure 22a, one can see that significantly higher operating temperatures are possible in LVCMOS 3.3V output mode with more outputs at 100MHz than at 320MHz.
The examples above described examples using LVCMOS 3.3V logic, which represents the maximum power dissipation case at higher frequencies. For optimal operation at very high frequencies (> 150 MHz) LVDS will often be
the best choice from a signal integrity standpoint. For LVDS-configured outputs, the maximum ICCO current consumption per bank is low enough that both the ispClock5510 and ispClock5520 can operate all outputs at maximum frequency over their complete rated temperature range, as shown in Figure 22c.
Note that because of variations in circuit board mounting, construction, and layout, as well as convective and forced
airflow present in a given design, actual die operating temperature is subject to considerable variation from that
which may be theoretically predicted from package characteristics and device power dissipation.
Output Enable Controls
The ispClock5500 family provides the user with several options for enabling and disabling output pins, as well as
suspending the output clock. In addition to providing the user with the ability to reduce the device’s power consumption by turning off unused drivers, these features can also be used for functional testing purposes. The following inputs pins are used for output enable functions:
• GOE – global output enable
• OEX, OEY – secondary output enable controls
• SGATE – synchronous output control
Additionally, internal E2CMOS configuration bits are provided for the purpose of modifying the effects of these
external control pins.
When GOE is HIGH, all output drivers are forced into a high-Z state, regardless of any internal configuration. When
GOE is LOW, the output drivers may also be enabled or disabled on an individual basis, and optionally controlled
by the OEX and OEY pins. Internal E2CMOS configuration is used to establish whether the output driver is always
enabled (when GOE pin is LOW), never enabled (permanently off), or selectively enabled by the state of either
OEX or OEY. Bringing GOE high will also disable the internal feedback driver and will result in a loss of lock.
Synchronous output gating is provided by ispClock5500 devices through the use of the SGATE pin. The SGATE pin
does not disable the output driver, but merely forces the output to either a high or low state, depending on the output driver’s polarity setting. If the output driver polarity is true, the output will be forced LOW when SGATE is
brought LOW, while if it is inverted, the output will be forced HIGH. A primary feature of the SGATE function is that
the clock output is enabled and disabled synchronous to the selected internal clock source. This prevents the generation of partial, ‘runt’, output clock pulses, which would otherwise occur with simple combinatorial gating
schemes. The SGATE is available to all clock outputs and is selectable on a pin-by-pin basis.
Table 5 shows the behavior of the outputs for various combinations of the output enables, SGATE input, and
E2CMOS configuration.
Table 5. Clock Output Enable Functions
GOE
OEX
OEY
E2 Configuration
Output
X
X
X
Always OFF
High-Z
0
X
X
Always ON
Clock Out
0
0
X
Enable on OEX
Clock Out
0
1
X
Enable on OEX
High-Z
0
X
0
Enable on OEY
Clock Out
0
X
1
Enable on OEY
High-Z
1
X
X
n/a
High-Z
25
Lattice Semiconductor
ispClock5500 Family Data Sheet
Table 6. SGATE Function
SGATE Bank Controlled by SGATE?
Output Polarity
Output
X
NO
True
Clock
X
NO
Inverted
Inverted Clock
0
YES
True
LOW
0
YES
Inverted
HIGH
1
YES
True
Clock
1
YES
Inverted
Inverted Clock
Skew Control Units
Each of the ispClock5500’s clock outputs is supported by a skew control unit which allows the user to insert an individually programmable delay into each output signal. This feature is useful when it is necessary to de-skew clock
signals to compensate for physical length variations among different PCB clock paths.
Unlike the skew adjustment features provided in many competing products, the ispClock5500’s skew adjustment
feature provides exact and repeatable delays which exhibit extremely low channel-to-channel and device-to-device
variation. This is achieved by deriving all skew timing from the VCO, which results in the skew increment being a linear function of the VCO period. For this reason, skews are defined in terms of ‘time units’ (TUs), which may be programmed by the user over a range of 0 to 15. The ispClock5500 family also supports both ‘fine’ and ‘coarse’ skew
modes. In fine skew mode, the unit skew ranges from 195ps to 390 ps, while in the coarse skew mode unit skew
varies from 390ps to 780ps. The value of one TU may be calculated from the VCO frequency (fvco) by using the following expressions:
For fine skew mode,
TU =
For coarse skew mode,
1
8fvco
TU =
1
4fvco
(5)
When an output driver is programmed to support a differential output mode, a single skew setting is applied to both
the BANKxA+ and BANKxB- signals. When the output driver is configured to support a single-ended output standard, each of the two single-ended outputs may be assigned independent skews.
By using the internal feedback path, and programming a skew into the feedback skew control, it is possible to
implement negative timing skews, in which the clock edge of interest appears at the ispClock5500’s output before
the corresponding edge is presented at the reference input. When the feedback skew unit is used in this way, the
resulting negative skew is added to whatever skew is specified for each output. For example, if the feedback skew
is set to 6TU, BANK1’s skew is 8TU and BANK2’s skew is 3TU, then BANK1’s effective output skew will be 2TU
(8TU-6TU), while BANK2’s effective skew will be -3TU (3TU-6TU). This negative skew will manifest itself as
BANK2’s outputs appearing to lead the input reference clock, appearing as a negative propagation delay.
Please note that the skew control units are only usable when the PLL is selected. In PLL bypass mode
(PLL_BYPASS=1), output skew settings will be ineffective and all outputs will exhibit skew consistent with the
device’s propagation delay and the individual delays inherent in the output drivers consistent with the logic standard selected.
Coarse Skew Mode
The ispClock5500 family provides the user with the option of obtaining longer skew delays at the cost of reduced
time resolution through the use of coarse skew mode. Coarse skew mode provides TU values ranging from 390ps
(fVCO = 640MHz) to 780ps (fVCO = 320MHz), which is twice as long as those provided in fine skew mode. When
coarse skew mode is selected, an additional divide-by-2 stage is effectively inserted between the VCO and the Vdivider bank, as shown in Figure 23. When assigning divider settings in coarse skew mode, one must account for
this additional divide-by-two so that the VCO still operates within its specified range (320-640MHz).
26
Lattice Semiconductor
ispClock5500 Family Data Sheet
Figure 23. Additional Factor-of-2 Division in Coarse Mode
Fine
Mode
VCO
V-dividers
Fout
Coarse
Mode
÷2
When one moves from fine skew mode to coarse skew mode with a given divider configuration, the VCO frequency
will attempt to double to compensate for the additional divide-by-2 stage. Because the fVCO range is not increased,
however, one must modify the V-divider settings to bring fVCO back into its specified operating range (320MHz to
640MHz). This can be accomplished by dividing all V-divider settings by two. All output frequencies will remain
unchanged from what they were in fine mode. One drawback of moving from fine skew mode into coarse skew
mode is that it may not be possible to maintain consistent output frequencies, as only those V-divider settings which
are multiples of four (in fine mode) may be divided by two. For example, a V-divider setting of 24 will divide down to
12, which is also a legal V-divider setting, whereas an initial setting of 26 would divide down to 13, which is not a
valid setting.
When one moves from coarse skew mode to fine skew mode, the extra divide-by-two factor is removed from
between the VCO and the V-divider bank, halving the VCO’s effective operating frequency. To compensate for this
change, all of the V-dividers must be doubled to move the VCO back into its specified operating range and maintain
consistent output frequencies. The only situation in which this may be a problem is when a V-divider initially in
coarse mode has a value greater than 32, as the corresponding fine skew mode setting would be greater than 64,
which is not supported.
Skew Matching and Accuracy
Understanding the various factors which relate to output skew is essential for realizing optimal skew performance in
the ispClock5500 family of devices.
In the case where two outputs are identically configured, and driving identical loads, the maximum skew is defined
by tSKEW, which is specified as a maximum of 50ps. In Figure 24 the Bank1A and BANK2A outputs show the skew
error between two matched outputs.
Figure 24. Skew Matching Error Sources
2ns +/- (tSKEW) +/- (tSKERR )
+/- t SKEW
BANK1A
(skew setting = 0)
BANK2A
(skew setting=0)
BANK3A
(skew setting = 2ns)
27
Lattice Semiconductor
ispClock5500 Family Data Sheet
One can also program a user-defined skew between two outputs using the skew control units. Because the programmable skew is derived from the VCO frequency, as described in the previous section, the absolute skew is
very accurate. The typical error for any non-zero skew setting is given by the tSKERR specification. For example, if
one is in fine skew mode with a VCO frequency of 500MHz, and selects a skew of 8TU, the realized skew will be
2ns, which will typically be accurate to within +/-30 ps. An example of error vs. skew setting can be found in the
chart ‘Typical Skew Error vs. Setting’ in the typical performance characteristics section. Note that this parameter
adds to output-to-output skew error only if the two outputs have different skew settings. The Bank1A and Bank3A
outputs in Figure 24 show how the various sources of skew error stack up in this case. Note that if two or more outputs are programmed to the same skew setting, then the contribution of the tSKERR skew error term does not apply.
When outputs are configured or loaded differently, this also has an effect on skew matching. If an output is set to
support a different logic type, this can be accounted for by using the tIOO output adders specified in the Table
‘Switching Characteristics’. That table specifies the additional skew added to an output using LVPECL as a baseline. For instance, if one output is specified as LVTTL (tIOO = 0.1ns), and another output is specified as LVPECL
(tIOO = 0ns), then one could expect 0.1ns of additional skew between the two outputs. This timing relationship is
shown in Figure 25a.
Figure 25. Output Timing Adders for Logic Type (a) and Output Slew Rate (b)
660ps
0.1ns
LVPECL Output
(TIOS = 0)
LVCMOS Output
(Slew rate=1)
LVTTL Output
(TIOS = 0.1ns)
LVCMOS Output
(Slew rate=3)
(a)
(b)
Similarly, when one changes the slew rate of an output, the output slew rate adders (tIOS) can be used to predict
the resulting skew. In this case, the fastest slew setting (1) is used as the baseline against which other slews are
measured. For example, in the case of outputs configured to the same logic type (e.g. LVCMOS 1.8V), if one output
is set to the fastest slew rate (1, tIOS = 0ps), and another set to slew rate 3 (tIOS = 660ps), then one could expect
660ps of skew between the two outputs, as shown in Figure 25b.
Other Features
Profile Select
The ispClock5500 stores all internal configuration data in on-board E2CMOS memory. Up to four independent configuration profiles may be stored in each device. The choice of which configuration profile is to be active is specified
thought the profile select inputs PS0 and PS1, as shown in Table 7.
Table 7. Profile Select Function
PS1
PS0
Active Profile
0
0
Profile 0
0
1
Profile 1
1
0
Profile 2
1
1
Profile 3
Each profile controls the following internal configuration items:
• M divider setting
• N divider setting
• V divider settings
28
Lattice Semiconductor
ispClock5500 Family Data Sheet
• PLL Loop filter settings
• Output Skew settings
Input/Output logic configuration (logic family, I/O impedance, slew rate) is independent of the profile selected.
When a profile is changed by changing the values of the PS0 and PS1 inputs, it is necessary to assert a RESET
signal to the ispClock5500 to restart the PLL and resynchronize all the internal dividers.
RESET and Power-up Functions
To ensure proper PLL startup and synchronization of outputs, the ispClock5500 provides both internally generated
and user-controllable external reset signals. An internal reset is generated whenever the device is powered up. An
external reset may be applied by asserting a logic HIGH at the RESET pin. Please note that the RESET pin does
not have an internal pull-up or pull-down resistor associated with it and should be tied LOW if not used. Asserting
RESET resets all internal dividers, and will cause the PLL to lose lock. On losing lock, the VCO frequency will begin
dropping. The length of time required to regain lock is related to the length of time for which RESET was asserted.
Output phase relationships among the outputs may not be valid until the ispClock5500 asserts its LOCK output.
When the ispClock5500 begins operating from initial power-on, the VCO starts running at a very low frequency
(<100 MHz) which gradually increases as it approaches a locked condition. To prevent invalid outputs from being
applied to the rest of the system, it is recommended that either the SGATE, OEX, or OEY pins be used to control
the outputs based on the status of the LOCK pin. Holding the SGATE pin LOW during power-up will result in the
BANK outputs being asserted HIGH or LOW (depending on inversion status) until SGATE is brought HIGH. Asserting OEX or OEY high will result in the BANK outputs being held in a high-impedance state until the OEX or OEY
pin is pulled LOW. One should not use the GOE pin to control the outputs in anticipation of LOCK status, as holding
GOE HIGH also disables internal feedback and will prevent the device from ever achieving lock.
Software-Based Design Environment
Designers can configure the ispClock5500 using Lattice’s PAC-Designer software, an easy to use, Microsoft Windows
compatible program. Circuit designs are entered graphically and then verified, all within the PAC-Designer environment. Full device programming is supported using PC parallel port I/O operations and a download cable connected to
the serial programming interface pins of the ispClock5500. A library of configurations is included with basic solutions
and examples of advanced circuit techniques are available on the Lattice web site at www.latticesemi.com. In addition, comprehensive on-line and printed documentation is provided that covers all aspects of PAC-Designer operation.
The PAC-Designer schematic window, shown in Figure 26 provides access to all configurable ispClock5500 elements
via its graphical user interface. All analog input and output pins are represented. Static or non-configurable pins such
as power, ground and the serial digital interface are omitted for clarity. Any element in the schematic window can be
accessed via mouse operations as well as menu commands. When completed, configurations can be saved and
downloaded to devices.
Figure 26. PAC-Designer Design Entry Screen (ispClock 5520)
29
Lattice Semiconductor
ispClock5500 Family Data Sheet
In-System Programming
The ispClock5500 is an In-System Programmable (ISP™) device. This is accomplished by integrating all E2CMOS
configuration control logic on-chip. Programming is performed through a 4-wire, IEEE 1149.1 compliant serial JTAG
interface at normal logic levels. Once a device is programmed, all configuration information is stored on-chip, in
non-volatile E2CMOS memory cells. The specifics of the IEEE 1149.1 serial interface and all ispClock5500 instructions are described in the JTAG interface section of this data sheet.
User Electronic Signature
A user electronic signature (UES) feature is included in the E2CMOS memory of the ispClock5500. This consists of
32 bits that can be configured by the user to store unique data such as ID codes, revision numbers or inventory
control data. The specifics this feature are discussed in the IEEE 1149.1 serial interface section of this data sheet.
Electronic Security
An electronic security “fuse” (ESF) bit is provided in every ispClock5500 device to prevent unauthorized readout of
the E2CMOS configuration bit patterns. Once programmed, this cell prevents further access to the functional user
bits in the device. This cell can only be erased by reprogramming the device, so the original configuration can not
be examined once programmed. Usage of this feature is optional. The specifics of this feature are discussed in the
IEEE 1149.1 serial interface section of this data sheet.
Production Programming Support
Once a final configuration is determined, an ASCII format JEDEC file can be created using the PAC-Designer software. Devices can then be ordered through the usual supply channels with the user’s specific configuration already
preloaded into the devices. By virtue of its standard interface, compatibility is maintained with existing production
programming equipment, giving customers a wide degree of freedom and flexibility in production planning.
Evaluation Fixture
Included in the basic ispClock5500 Design Kit is an engineering prototype board that can be connected to the parallel port of a PC using a Lattice ispDOWNLOAD® cable. It demonstrates proper layout techniques for the
ispClock5500 and can be used in real time to check circuit operation as part of the design process. Input and output connections (SMA connectors for all RF signals) are provided to aid in the evaluation of the ispClock5500 for a
given application. (Figure 27).
Part Number
Description
PAC-SYSTEMCLK5520
Complete system kit, evaluation board, ispDOWNLOAD cable and software.
PACCLK5520-EV
Evaluation board only, with components, fully assembled.
Figure 27. Download from a PC
PAC-Designer
Software
Other
System
Circuitry
ispDownload
Cable (6')
4
30
ispClock5500
Device
Lattice Semiconductor
ispClock5500 Family Data Sheet
IEEE Standard 1149.1 Interface (JTAG)
Serial Port Programming Interface Communication with the ispClock5500 is facilitated via an IEEE 1149.1 test
access port (TAP). It is used by the ispClock5500 both as a serial programming interface, and for boundary scan
test purposes. A brief description of the ispClock5500 JTAG interface follows. For complete details of the reference
specification, refer to the publication, Standard Test Access Port and Boundary-Scan Architecture, IEEE Std.
1149.1-1990 (which now includes IEEE Std. 1149.1a-1993).
Overview
An IEEE 1149.1 test access port (TAP) provides the control interface for serially accessing the digital I/O of the
ispClock5500. The TAP controller is a state machine driven with mode and clock inputs. Given in the correct
sequence, instructions are shifted into an instruction register which then determines subsequent data input, data
output, and related operations. Device programming is performed by addressing the configuration register, shifting
data in, and then executing a program configuration instruction, after which the data is transferred to internal
E2CMOS cells. It is these non-volatile cells that store the configuration or the ispClock5500. A set of instructions
are defined that access all data registers and perform other internal control operations. For compatibility between
compliant devices, two data registers are mandated by the IEEE 1149.1 specification. Others are functionally specified, but inclusion is strictly optional. Finally, there are provisions for optional data registers defined by the manufacturer. The two required registers are the bypass and boundary-scan registers. Figure 28 shows how the
instruction and various data registers are organized in an ispClock5500.
Figure 28. ispClock5500 TAP Registers
DATA REGISTER (90 BITS)
E2CMOS
NON-VOLATILE
MEMORY
ADDRESS REGISTER (10 BITS)
MULTIPLEXER
UES REGISTER (32 BITS)
IDCODE REGISTER (32 BITS)
B-SCAN REGISTER (56 BITS)
BYPASS REGISTER (1 BIT)
INSTRUCTION REGISTER (8 BITS)
TEST ACCESS PORT (TAP)
LOGIC
TDI
TCK
TMS
OUTPUT
LATCH
TDO
TAP Controller Specifics
The TAP is controlled by the Test Clock (TCK) and Test Mode Select (TMS) inputs. These inputs determine whether
an Instruction Register or Data Register operation is performed. Driven by the TCK input, the TAP consists of a
small 16-state controller design. In a given state, the controller responds according to the level on the TMS input as
shown in Figure 29. Test Data In (TDI) and TMS are latched on the rising edge of TCK, with Test Data Out (TDO)
becoming valid on the falling edge of TCK. There are six steady states within the controller: Test-Logic-Reset, Run31
Lattice Semiconductor
ispClock5500 Family Data Sheet
Test/Idle, Shift-Data-Register, Pause-Data-Register, Shift-Instruction-Register and Pause-Instruction-Register. But
there is only one steady state for the condition when TMS is set high: the Test-Logic-Reset state. This allows a
reset of the test logic within five TCKs or less by keeping the TMS input high. Test-Logic-Reset is the power-on
default state.
Figure 29. TAP States
1
Test-Logic-Rst
0
0
Run-Test/Idle
1
Select-DR-Scan
1
1
0
Capture-DR
Select-IR-Scan
1
0
Capture-IR
0
0
0
Shift-DR
1
1
1
Exit1-IR
0
0
Pause-DR
1
1
Exit2-IR
1
Update-DR
0
0
Pause-IR
0
0
Exit2-DR
1
0
Shift-IR
1
Exit1-DR
0
1
1
Update-IR
1
0
Note: The value shown adjacent to each state transition in this figure
represents the signal present at TMS at the time of a rising edge at TCK.
When the correct logic sequence is applied to the TMS and TCK inputs, the TAP will exit the Test-Logic-Reset state
and move to the desired state. The next state after Test-Logic-Reset is Run-Test/Idle. Until a data or instruction shift
is performed, no action will occur in Run-Test/Idle (steady state = idle). After Run-Test/Idle, either a data or instruction shift is performed. The states of the Data and Instruction Register blocks are identical to each other differing
only in their entry points. When either block is entered, the first action is a capture operation. For the Data Registers, the Capture-DR state is very simple: it captures (parallel loads) data onto the selected serial data path (previously chosen with the appropriate instruction). For the Instruction Register, the Capture-IR state will always load
the IDCODE instruction. It will always enable the ID Register for readout if no other instruction is loaded prior to a
Shift-DR operation. This, in conjunction with mandated bit codes, allows a “blind” interrogation of any device in a
compliant IEEE 1149.1 serial chain. From the Capture state, the TAP transitions to either the Shift or Exit1 state.
Normally the Shift state follows the Capture state so that test data or status information can be shifted out or new
data shifted in. Following the Shift state, the TAP either returns to the Run-Test/Idle state via the Exit1 and Update
states or enters the Pause state via Exit1. The Pause state is used to temporarily suspend the shifting of data
through either the Data or Instruction Register while an external operation is performed. From the Pause state,
shifting can resume by reentering the Shift state via the Exit2 state or be terminated by entering the Run-Test/Idle
state via the Exit2 and Update states. If the proper instruction is shifted in during a Shift-IR operation, the next entry
into Run-Test/Idle initiates the test mode (steady state = test). This is when the device is actually programmed,
erased or verified. All other instructions are executed in the Update state.
Test Instructions
Like data registers, the IEEE 1149.1 standard also mandates the inclusion of certain instructions. It outlines the
function of three required and six optional instructions. Any additional instructions are left exclusively for the manu-
32
Lattice Semiconductor
ispClock5500 Family Data Sheet
facturer to determine. The instruction word length is not mandated other than to be a minimum of two bits, with only
the BYPASS and EXTEST instruction code patterns being specifically called out (all ones and all zeroes respectively). The ispClock5000 contains the required minimum instruction set as well as one from the optional instruction
set. In addition, there are several proprietary instructions that allow the device to be configured and verified. For
ispClock5000, the instruction word length is eight bits. All ispClock5000 instructions available to users are shown in
Table 8.
The following table lists the instructions supported by the ispClock5500 JTAG Test Access Port (TAP) controller:
Table 8. ispClock5500 TAP Instruction Table
Instruction
Code
Description
EXTEST
0000 0000
External Test.
ADDRESS_SHIFT
0000 0001
Address register (10 bits)
DATA_SHIFT
0000 0010
Address column data register (89 bits)
BULK_ERASE
0000 0011
Bulk Erase
PROGRAM
0000 0111
Program column data register to E2
PROGRAM_SECURITY
0000 1001
Program Electronic Security Fuse
VERIFY
0000 1010
Verify column
DISCHARGE
0001 0100
Fast VPP Discharge
PROGRAM_ENABLE
0001 0101
Enable Program Mode
IDCODE
0001 0110
Address Manufacturer ID code register (32 bits)
USERCODE
0001 0111
Read UES data from E2 and addresses UES register (32 bits)
PROGRAM_USERCODE
0001 1010
Program UES register into E2
PROGRAM_DISABLE
0001 1110
Disable Program Mode
HIGHZ
0001 1000
Force all outputs to High-Z state
SAMPLE/PRELOAD
0001 1100
Capture current state of pins to boundary scan register
CLAMP
0010 0000
Drive I/Os with boundary scan register
USER_LOGIC_RESET
0010 0010
Resets User Logic
INTEST
0010 1100
Performs in-circuit functional testing of device.
ERASE DONE
0010 0100
Erases the ‘Done’ bit only
PROG_INCR
0010 0111
Program column data register to E2 and auto-increment address register
VERIFY_INCR
0010 1010
Load column data register from E2 and auto-increment address register
PROGRAM_DONE
0010 1111
Programs the ‘Done’ Bit
NOOP
0011 0000
Functions Similarly to CLAMP instruction
BYPASS
1xxx xxxx
Bypass - Connect TDO to TDI
BYPASS is one of the three required instructions. It selects the Bypass Register to be connected between TDI and
TDO and allows serial data to be transferred through the device without affecting the operation of the
ispClock5500. The IEEE 1149.1 standard defines the bit code of this instruction to be all ones (111111).
The required SAMPLE/PRELOAD instruction dictates the Boundary-Scan Register be connected between TDI
and TDO. The bit code for this instruction is defined by Lattice as shown in Table 8.
The EXTEST (external test) instruction is required and will place the device into an external boundary test mode
while also enabling the boundary scan register to be connected between TDI and TDO. The bit code of this instruction is defined by the 1149.1 standard to be all zeros (000000).
The optional IDCODE (identification code) instruction is incorporated in the ispClock5500 and leaves it in its functional mode when executed. It selects the Device Identification Register to be connected between TDI and TDO.
The Identification Register is a 32-bit shift register containing information regarding the IC manufacturer, device
33
Lattice Semiconductor
ispClock5500 Family Data Sheet
type and version code (Figure 30). Access to the Identification Register is immediately available, via a TAP data
scan operation, after power-up of the device, or by issuing a Test-Logic-Reset instruction. The bit code for this
instruction is defined by Lattice as shown in Table 8.
Figure 30. ispClock5500 Family ID Codes
MSB
LSB
XXXX / 0000 0001 0101 0010 / 0000 0100 001 / 1
Version
(4 bits)
E2 Configured
Part Number
(16 bits)
0152h = ispClock5510
(3.3V version)
Constant ‘1’
(1 bit)
per 1149.1-1990
JEDEC Manufacturer
Identity Code for
Lattice Semiconductor
(11 bits)
MSB
LSB
XXXX / 0000 0001 0101 0000 / 0000 0100 001 / 1
Version
(4 bits)
E Configured
2
Part Number
(16 bits)
0150h = ispClock5520
(3.3V version)
JEDEC Manufacturer
Identity Code for
Lattice Semiconductor
(11 bits)
Constant ‘1’
(1 bit)
per 1149.1-1990
In addition to the four instructions described above, there are 20 unique instructions specified by Lattice for the
ispClock5520. These instructions are primarily used to interface to the various user registers and the E2CMOS nonvolatile memory. Additional instructions are used to control or monitor other features of the device, including boundary scan operations. A brief description of each unique instruction is provided in detail below, and the bit codes are
found in Table 8.
PROGRAM_ENABLE – This instruction enables the ispClock5500’s programming mode.
PROGRAM_DISABLE – This instruction disables the ispClock5500’s programming mode.
BULK_ERASE – This instruction will erase all E2CMOS bits in the device, including those the UES data and electronic security fuse (ESF). A bulk erase instruction must be issued before reprogramming a device. The device
must already be in programming mode for this instruction to execute.
ADDRESS_SHIFT – This instruction shifts address data into the address register (10 bits) in preparation for either
a PROGRAM or VERIFY instruction.
DATA_SHIFT – This instruction shifts data into or out of the data register (90 bits), and is used with both the PROGRAM and VERIFY instructions.
PROGRAM – This instruction programs the contents of the data register to the E2CMOS memory column pointed
to by the address register. The device must already be in programming mode for this instruction to execute.
PROG_INCR – This instruction first programs the contents of the data register into E2CMOS memory column
pointed to by the address register and then auto-increments the value of the address register. The device must
already be in programming mode for this instruction to execute.
PROGRAM_SECURITY – This instruction programs the electronic security fuse (ESF). This prevents data other
than the ID code and UES strings from being read fro the device. The electronic security fuse may only be reset by
issuing a BULK_ERASE command. The device must already be in programming mode for this instruction to execute.
34
Lattice Semiconductor
ispClock5500 Family Data Sheet
VERIFY – This instruction loads data from the E2CMOS array into the column register. The data may then be
shifted out. The device must already be in programming mode for this instruction to execute.
VERIFY_INCR – This instruction copies the E2CMOS column pointed to by the address register into the data column register and then auto-increments the value of the address register. The device must already be in programming mode for this instruction to execute.
DISCHARGE – This instruction is used to discharge the internal programming supply voltage after an erase or programming cycle and prepares ispClock5500 for a read cycle.
PROGRAM_USERCODE – This instruction writes the contents of the UES register (32 bits) into E2CMOS memory.
The device must already be in programming mode for this instruction to execute.
USERCODE – This instruction both reads the UES string (32 bits) from E2CMOS memory into the UES register
and addresses the UES register so that this data may be shifted in and out.
HIGHZ – This instruction forces all outputs into a High-Z state.
CLAMP – This instruction drives I/O pins with the contents of the boundary scan register.
USER_LOGIC_RESET – This instruction resets all user-accessible logic, similar to asserting a HIGH on the
RESET pin.
INTEST – This instruction performs in-circuit functional testing of the device.
ERASE_DONE – This instruction erases the ‘DONE’ bit only. This instruction is used to disable normal operation of
the device while in programming mode until a valid configuration pattern has been programmed.
PROGRAM_DONE – This instruction programs the ‘DONE’ bit only. This instruction is used to enable normal
device operation after programming is complete.
NOOP – This instruction behaves similarly to the CLAMP instruction.
35
Lattice Semiconductor
ispClock5500 Family Data Sheet
Pin Descriptions
Pin Number
Pin Name
Description
Pin Type
ispClock5510
48 TQFP
ispClock5520
100 TQFP
VCCO_0
Output Driver ‘0’ VCC
Power
1
3
VCCO_1
Output Driver ‘1’ VCC
Power
5
7
VCCO_2
Output Driver ‘2’ VCC
Power
9
11
VCCO_3
Output Driver ‘3’ VCC
Power
25
15
VCCO_4
Output Driver ‘4’ VCC
Power
29
19
VCCO_5
Output Driver ‘5’ VCC
Power
—
51
VCCO_6
Output Driver ‘6’ VCC
Power
—
55
VCCO_7
Output Driver ‘7’ VCC
Power
—
59
VCCO_8
Output Driver ‘8’ VCC
Power
—
63
VCCO_9
Output Driver ‘9’ VCC
Power
—
67
GNDO_0
Output Driver ‘0’ Ground
GND
4
6
GNDO_1
Output Driver ‘1’ Ground
GND
8
10
GNDO_2
Output Driver ‘2’ Ground
GND
12
14
GNDO_3
Output Driver ‘3’ Ground
GND
28
18
GNDO_4
Output Driver ‘4’ Ground
GND
32
22
GNDO_5
Output Driver ‘5’ Ground
GND
—
54
GNDO_6
Output Driver ‘6’ Ground
GND
—
58
GNDO_7
Output Driver ‘7’ Ground
GND
—
62
GNDO_8
Output Driver ‘8’ Ground
GND
—
66
GNDO_9
Output Driver ‘9’ Ground
GND
—
70
BANK_0A
Clock Output driver 0, ‘A’ output
Output
3
5
BANK_0B
Clock Output driver 0, ‘B’ output
Output
2
4
BANK_1A
Clock Output driver 1, ‘A’ output
Output
7
9
BANK_1B
Clock Output driver 1, ‘B’ output
Output
6
8
BANK_2A
Clock Output driver 2, ‘A’ output
Output
11
13
BANK_2B
Clock Output driver 2, ‘B’ output
Output
10
12
BANK_3A
Clock Output driver 3, ‘A’ output
Output
27
17
BANK_3B
Clock Output driver 3, ‘B’ output
Output
26
16
BANK_4A
Clock Output driver 4, ‘A’ output
Output
31
21
BANK_4B
Clock Output driver 4, ‘B’ output
Output
30
20
BANK_5A
Clock Output driver 5, ‘A’ output
Output
—
53
BANK_5B
Clock Output driver 5, ‘B’ output
Output
—
52
BANK_6A
Clock Output driver 6, ‘A’ output
Output
—
57
BANK_6B
Clock Output driver 6, ‘B’ output
Output
—
56
BANK_7A
Clock Output driver 7, ‘A’ output
Output
—
61
BANK_7B
Clock Output driver 7, ‘B’ output
Output
—
60
BANK_8A
Clock Output driver 8, ‘A’ output
Output
—
65
BANK_8B
Clock Output driver 8, ‘B’ output
Output
—
64
BANK_9A
Clock Output driver 9, ‘A’ output
Output
—
69
BANK_9B
Clock Output driver 9, ‘B’ output
Output
—
68
VCCA
Analog VCC for PLL circuitry
Power
13
30
GNDA
Analog Ground for PLL circuitry
GND
14
31
36
Lattice Semiconductor
ispClock5500 Family Data Sheet
Pin Descriptions (Continued)
Pin Number
Pin Name
VCCD
Description
Pin Type
ispClock5510
48 TQFP
Power
24, 33
47, 71
Digital Core VCC
ispClock5520
100 TQFP
GNDD
Digital GND
GND
15, 16, 17, 23, 48
32, 33, 34, 35, 36, 37,
46, 93
VCCJ
JTAG interface VCC
Power
36
74
REFA+
Clock Reference A positive input
Input
18
38
REFA-
Clock Reference A negative input
Input
19
39
REFB+
Clock Reference B positive input
Input
—
42
REFB-
Clock Reference B negative input
Input
—
41
REFSEL
Clock Reference Select input (LVCMOS)
Input1
—
43
REFVTT
Termination voltage for reference inputs
Power
20
40
TDO
JTAG TDO Output line
Output
35
73
2
TDI
JTAG TDI Input line
Input
39
84
TCK
JTAG Clock Input
Input
38
83
2
TMS
JTAG Mode Select
Input
37
82
LOCK
PLL Lock indicator, LOW indicates PLL lock
Output
34
72
SGATE
Synchronous output gate
Input1
40
85
GOE
Global Output Enable
Input1
42
87
OEX
Output Enable 1
Input
21
44
OEY
Output Enable 2
Input
22
45
PS0
Profile Select 0
Input1
44
89
PS1
Profile Select 1
Input1
43
88
PLL_BYPASS PLL Bypass
Input
1
47
92
RESET
Reset PLL
Input
41
86
TEST1
Test Input 1 - connect to GNDD
Input
46
91
TEST2
Test Input 2 - connect to GNDD
Input
45
90
n/c
No internal connection
n/a
—
1, 2, 23, 24, 25, 26, 27,
28, 29, 48, 49, 50, 75,
76, 77, 78, 79, 94, 97,
98, 99, 100
Reserved
Factory use only - Do not connect
n/a
—
80, 81, 95, 96
1. Internal pull-down resistor.
2. Internal pull-up resistor.
Detailed Pin Descriptions
VCCO_[0..9], GNDO_[0..9] – These pins provide power and ground for each of the output banks. In the case when
an output bank is unused, its corresponding VCCO pin may be left unconnected or preferably should be tied to
ground. ALL GNDO pins should be tied to ground regardless of whether the associated bank is used or not. When
a bank is used, it should be individually bypassed with a capacitor in the range of 0.01 to 0.1uF as close to its
VCCO and GNDO pins as is practical.
BANK_[0..9]A, BANK_[0..9]B – These pins provide clock output signals. The choice of output divider (V0-V4) and
output driver type (CMOS, LVDS, SSTL, etc.) may be selected on a bank-by-bank basis. When the outputs are configured as pairs of single-ended outputs, output impedance and slew rate may be selected on an output-by-output
basis.
37
Lattice Semiconductor
ispClock5500 Family Data Sheet
VCCA, GNDA – These pins provide analog supply and ground for the ispClock5500 family’s internal analog circuitry, and should be bypassed with a 0.1uF capacitor as close to the pins as is practical. To improve noise immunity, it is suggested that the supply to the VCCA pin be isolated from other circuitry with a ferrite bead.
VCCD, GNDD – These pins provide digital supply and ground for the ispClock5500 family’s internal digital circuitry,
and should be bypassed with a 0.1uF capacitor as close to the pins as is practical. to improve noise immunity it is
suggested that the supply to the VCCD pins be isolated with ferrite beads.
VCCJ – This pin provides power and a reference voltage for use by the JTAG interface circuitry. It may be set to
allow the ispClock5500 family devices to function in JTAG chains operating at voltages differing from VCCD.
REFA+, REFA-, REFB+, REFB- – These input pins provide the inputs for clock signals, and can accommodate
either single ended or differential signal protocols by using either just the ‘+’ pins, or both the ‘+’ and ‘-‘ pins. Two
sets of inputs are provided to accommodate the use of different signal sources and redundant clock sources.
REFSEL – This input pin is used to select which clock input pair (REFA+/- or REB+/-) is selected for use as the reference input. When REFSEL=0, REFA+/- is used, and when REFSEL=1, REFB+/- is used.
REFVTT – This pin is used to provide a termination voltage for the reference inputs when they are configured for
SSTL or HSTL logic, and should be connected to a suitable voltage supply in those cases.
TDO, TDI, TCK, TMS – These pins comprise the ispClock5500 device’s JTAG interface. The signal levels for these
pins are determined by the selection of the VCCJ voltage.
LOCK – This output pin indicates that the device’s PLL is in a locked condition when it goes low.
SGATE – This input pin provides a synchronous gating function for the outputs, which may be enabled on a bankby-bank basis. When the synchronous gating function is enabled for a given bank, that bank’s outputs will output a
clock signal when the SGATE pin is HIGH, and will drive a constant HIGH or LOW when the SGATE pin is LOW.
Synchronous gating ensures that when the state of SGATE is changed, no partial clock pulses will appear at the
outputs.
OEX, OEY – These pins are used to enable the outputs or put them into a high-impedance condition. Each output
may be set so that it is always on, always off, enabled by OEX or enabled by OEY.
GOE – Global output enable. This pin drives all outputs to a high-impedance state when it is pulled HIGH. GOE
also controls the internal feedback buffer, so that bringing GOE high will cause the PLL to lose lock.
PS0, PS1 – These input pins are used to select one of four user-defined configuration profiles for the device.
PLL_BYPASS – When this pin is pulled LOW, the V-dividers are driven from the output of the device’s VCO, and
the device behaves as a phase-locked loop. When this pin is pulled HIGH, the V-dividers are driven directly from
the output of the M-divider, and the PLL functions are effectively bypassed.
RESET – When this pin is pulled HIGH, all on-board counters are reset, and lock is lost.
TEST1,TEST2 – These pins are used for factory test functions, and should always be tied to ground.
n/c – These pins have no internal connection. We recommend that they be left unconnected.
RESERVED – These pins are reserved for factory use and should be left unconnected.
38
Lattice Semiconductor
ispClock5500 Family Data Sheet
Package Diagrams
48-Pin TQFP (Dimensions in Millimeters)
PIN 1 INDICATOR
0.20 H A-B D
0.20 C A-B D
D1
D
N
3. A
1
E1
E
B
e
D
8. 4X
3.
3.
SEE DETAIL "A"
H
b
0.08
C
A
SEATING PLANE
GAUGE PLANE
0.25
A2
B
M C A -B D
0.08 C
LEAD FINISH
A1
B
0.20 MIN.
0-7∞
b
L
1.00 REF.
c
c1
b
DETAIL "A"
1
BASE METAL
SECTION B - B
SYMBOL
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
6.
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
8.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
39
MAX.
-
-
1.60
0.05
-
0.15
A2
1.35
1.40
1.45
D
9.00 BSC
D1
7.00 BSC
E
9.00 BSC
E1
7.00 BSC
L
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
NOM.
A1
A
NOTES:
MIN.
0.45
0.60
N
48
e
0.50 BSC
0.22
0.75
b
0.17
b1
0.17
0.20
0.27
0.23
c
0.09
0.15
0.20
c1
0.09
0.13
0.16
Lattice Semiconductor
ispClock5500 Family Data Sheet
100-Pin TQFP (Dimensions in Millimeters)
0.20 C A-B
PIN 1 INDICATOR
D 100X
D
3
A
E
E1
B
3
e
D
8
D1
3
TOP VIEW
4X
0.20 H A-B
D
BOTTOM VIEW
SIDE VIEW
SEE DETAIL 'A'
b
0.20 M C A-B
SEATING PLANE
C
D
GAUGE PLANE
H
A
A2
0.25
B
LEAD FINISH
b
0.10 C
c1
c
b
0.20 MIN.
A1
B
0-7∞
L
1.00 REF.
DETAIL 'A'
1
BASE METAL
SECTION B-B
SYMBOL
NOTES:
MIN.
NOM.
MAX.
A
-
-
1.60
A1
0.05
-
0.15
1.35
1.40
1.45
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
A2
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
D
3.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
D1
14.00 BSC
4.
DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DIMENSIONS.
E
16.00 BSC
16.00 BSC
14.00 BSC
E1
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
OF THE PACKAGE BY 0.15 MM.
L
N
100
6.
SECTION B-B:
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
e
0.50 BSC
b
0.17
0.22
0.27
7.
A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
b1
0.17
0.20
0.23
c
0.09
0.15
0.20
8.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
c1
0.09
0.13
0.16
40
0.45
0.60
0.75
Lattice Semiconductor
ispClock5500 Family Data Sheet
Part Number Description
ispPAC-CLK55XX X - 01 XXXX X
Device Family
Grade
I = Industrial Temp. Range
C = Commercial Temp. Range
Device Number
CLK5510
CLK5520
Package
T48 = 48-pin TQFP
T100 = 100-pin TQFP
TN48 = Lead-Free 48-pin TQFP
TN100 = Lead-Free100-pin TQFP
Performance Grade
01 = Standard
Operating Voltage
V = 3.3V
Ordering Information
Conventional Packaging
Commercial
Clock Outputs
Supply Voltage
Package
Pins
ispPAC-CLK5510V-01T48C
Part Number
10
3.3V
TQFP
48
ispPAC-CLK5520V-01T100C
20
3.3V
TQFP
100
Industrial
Clock Outputs
Supply Voltage
Package
Pins
ispPAC-CLK5510V-01T48I
Part Number
10
3.3V
TQFP
48
ispPAC-CLK5520V-01T100I
20
3.3V
TQFP
100
Lead-Free Packaging
Commercial
Clock Outputs
Supply Voltage
Package
Pins
ispPAC-CLK5510V-01TN48C
Part Number
10
3.3V
Lead-Free TQFP
48
ispPAC-CLK5520V-01TN100C
20
3.3V
Lead-Free TQFP
100
Package
Pins
Industrial
Part Number
Clock Outputs
Supply Voltage
ispPAC-CLK5510V-01TN48I
10
3.3V
Lead-Free TQFP
48
ispPAC-CLK5520V-01TN100I
20
3.3V
Lead-Free TQFP
100
41
Lattice Semiconductor
ispClock5500 Family Data Sheet
Package Options
GNDD
PLL_BYPASS
TEST1
TEST2
PS0
PS1
GOE
RESET
SGATE
TDI
TCK
TMS
48
47
46
45
44
43
42
41
40
39
38
37
ispClock5510: 48-pin TQFP
VCCO_0
BANK_0B
BANK_0A
1
2
3
36
35
34
VCCJ
TDO
LOCK
GNDO_0
VCCO_1
BANK_1B
4
5
6
33
32
31
VCCD
GNDO_4
BANK_4A
BANK_1A
GNDO_1
VCCO_2
7
8
9
30
29
28
BANK_4B
VCCO_4
GNDO_3
BANK_2B
BANK_2A
GNDO_2
10
11
12
27
26
25
BANK_3A
BANK_3B
VCCO_3
13
14
15
16
17
18
19
20
21
22
23
24
VCCA
GNDA
GNDD
GNDD
GNDD
REFA+
REFA-
REFVTT
OEX
OEY
GNDD
VCCD
ispPACCLK5510V-01T48C
42
Lattice Semiconductor
ispClock5500 Family Data Sheet
n/c
n/c
n/c
n/c
Reserved
Reserved
n/c
GNDD
PLL_BYPASS
TEST1
TEST2
PS0
PS1
GOE
RESET
SGATE
TDI
TCK
TMS
Reserved
Reserved
n/c
n/c
n/c
n/c
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
n/c
VCCJ
3
4
5
73
72
71
TDO
LOCK
VCCD
GNDO_0
VCCO_1
BANK_1B
6
7
8
70
69
68
GNDO_9
BANK_9A
BANK_9B
BANK_1A
GNDO_1
VCCO_2
BANK_2B
BANK_2A
GNDO_2
9
10
11
12
13
14
67
66
65
64
63
62
VCCO_9
GNDO_8
BANK_8A
BANK_8B
VCCO_8
GNDO_7
VCCO_3
BANK_3B
BANK_3A
15
16
17
61
60
59
BANK_7A
BANK_7B
VCCO_7
GNDO_3
VCCO_4
BANK_4B
18
19
20
58
57
56
GNDO_6
BANK_6A
BANK_6B
BANK_4A
GNDO_4
n/c
n/c
21
22
23
24
55
54
53
52
VCCO_6
GNDO_5
BANK_5A
BANK_5B
n/c
25
51
VCCO_5
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
VCCA
GNDA
GNDD
GNDD
GNDD
GNDD
GNDD
GNDD
REFA+
REFA-
REFVTT
REFBREFB+
RFSEL
OEX
OEY
GNDD
VCCD
n/c
n/c
n/c
ispPAC-CLK5520V-01T100C
26
VCCO_0
BANK_0B
BANK_0A
99
98
97
75
74
n/c
n/c
n/c
1
2
n/c
n/c
n/c
100
ispClock5520: 100-pin TQFP
43