MOTOROLA MPXY8020A Tire pressure monitoring sensor temperature compensated Datasheet

MPXY8000
Rev 1, 12/2004
Freescale Semiconductor
Technical Data
Tire Pressure Monitoring Sensor
Temperature Compensated
and Calibrated, Fully Integrated,
Digital Output
The Freescale Semiconductor MPXY8000 series sensor is an 8-pin tire
monitoring sensor which is comprised of a variable capacitance pressure
sensing element, a temperature sensing element, and an interface circuit (with
a wake-up feature) all on a single chip. It is housed in a Super-Small Outline
Package (SSOP), which includes a media protection filter. Specifically designed
for the low power consumption requirements of tire pressure monitoring
systems, it can combine with a Freescale Semiconductor remote keyless entry
(RKE) system to facilitate a low-cost, highly integrated system.
MPXY8020A
MPXY8040A
TIRE PRESSURE
MONITORING SENSOR
MPXY8020A:
OPTIMIZED FOR 250 kPa – 450 kPa
MPXY8040A:
OPTIMIZED FOR 500 kPa – 900 kPa
Detailed Description
The block diagram of the MPXY8000 series sensor is shown in Figure 1. The
pressure sensor is a capacitive transducer constructed using surface
micromachining, the temperature sensor is constructed using a diffused
resistor, and the interface circuit is integrated onto the same die as the sensors
using a standard silicon CMOS process.
The conditioning of the pressure signal begins with a capacitance to voltage
conversion (C to V) followed by a switched capacitor amplifier. This amplifier
has adjustable offset and gain trimming. The offset and gain are factory
calibrated, with calibration values stored in the EEPROM trim register. This
amplifier also has temperature compensation circuits for both sensitivity and
offset, which also are factory adjusted using the EEPROM trim register.
The pressure is monitored by a voltage comparator, which compares the
measured value against an 8-bit threshold adjusted by a serial input. By
adjusting the threshold and monitoring the state of the OUT pin the external
device can check whether a low-pressure threshold has been crossed, or
perform up to 8-bit A/D conversions.
The temperature is measured by a diffused resistor with a positive
temperature coefficient driven by a current source, thereby creating a voltage.
The room temperature value of this voltage is factory calibrated using the
EEPROM trim register. A two-channel multiplexer can route either the pressure
or temperature signal to a sampling capacitor that is monitored by a voltage
comparator with variable threshold adjust, providing a digital output for
temperature.
An internal low frequency, low power 5.4 kHz oscillator with a 14-stage
divider provides a periodic pulse to the OUT pin (divide by 16384 for 3 seconds).
This pulse can be used to wake up an external MCU to begin an interface with
the device. An additional 10-stage divider will provide a pulse every 52 minutes
which can be used to reset an external MCU.
The power consumption can be controlled by several operational modes
selected by external pins.
© Freescale Semiconductor, Inc., 2004. All rights reserved.
SUPER SMALL OUTLINE PACKAGE
CASE 1352-03
PIN ASSIGNMENT
S1/VPP 1
VDD 2
VSS 3
OUT 4
8 SO
7 CLK
6 DATA
5 RST
8-pin Super Small Outline Package (SSOP)
ORDERING INFORMATION
Shipped In Rails
Shipped in Tape &
Reel
MPXY8020A6U
MPXY8040A6U
MPXY8020A6T1
MPXY8040A6T1
VDD
Clock
Gen
PX
fHF
S1
Internal HF
OSC.
PREF
C to V
Convert
S0
Digital
Control
Power
Control
Data
CLK
AMP
P-Cell
Internal LF
OSC.
P-Off
Trim
P-Gain
Trim
P-TCO
Trim
f LF
P-TCS
Trim
14-Stage
Divider
Lock
8-Bit
Current
Source
T-Off
Trim
10-Stage
Divider
8-Bit
D/A
Register
RST
2-Chan
MUX
2-Chan
MUX
t
PTC
Res.
COMP
+
3-Chan
MUX
OUT
VSS
Sample CAP
AVSS
AVSS
AVSS
Figure 1. MPXY8000 Series Sensor Block Diagram
Operating Modes
The device has several operating modes dependent on
the applied voltages to the S1 and S0 pins as shown in
Table 1. In all the modes listed the channel multiplexers, D/A
Register, LFO, and the output pulse dividers will always be
powered up as long as there is a voltage source connected to
the VDD pin.
When only the S0 pin is at a logic one the pressure
measuring circuit in the device is powered up and the
pressure output signal is connected to the sample capacitor
through a multiplexer. When the S0 pin returns to the low
state the multiplexer will first turn off to store the signal on the
sample capacitor before powering down the measuring
circuitry.
When only the S1 pin is at a logic one the temperature
measuring circuit in the device is powered up and the
temperature output signal is connected to the sample
capacitor through a multiplexer. When the S1 pin returns to
the low state the multiplexer will first turn off to store the signal
on the sample capacitor before powering down the
measuring circuitry.
NOTE: All of the EEPROM trim bits will be powered up
regardless of whether the pressure or temperature
measuring circuitry is activated.
NOTE: If the voltage on the S1 pin exceeds 2.5 times the
voltage on the VDD pin the device will be placed into its Trim/
Test Mode.
NOTE: If the VDD supply source is switched off in order to
reduce current consumption, it is important that all input pins
be driven LOW to avoid powering up the device.
If any input pin (S1, S0, DATA, or CLK) is driven HIGH
while the VDD supply is switched off, the device may be
powered up through an ESD protection diode. In such a case,
the effective VDD voltage will be about 0.3 V less than the
voltage applied to the input pin, and the full device IDD current
will be drawn from the device driving input.
MPXY8000
2
Sensor Devices
Freescale Semiconductor
Table 1. Operating Modes
Circuitry Powered
Serial Data
Counter
Pressure
Measure
System
Temp
Measure
System
A/D Output
Comp.
LFO
Oscill.
Standby/Reset
OFF
OFF
OFF
ON
ACTIVE
1
Measure Pressure
ON
OFF
OFF
ON
RESET
1
0
Measure Temperature
OFF
ON
OFF
ON
RESET
1
1
Output Read
OFF
OFF
ON
ON
ACTIVE
S1
S0
0
0
0
Operating Mode
Pin Functions
The following paragraphs give a description of the general
function of each pin.
ground. The control IC operates from a single power supply.
Therefore, the conductors to the power supply should be
connected to the VDD and VSS pins and locally decoupled as
shown in Figure 2.
VDD and VSS Pins
Power is supplied to the control IC through VDD and VSS.
VDD is the positive supply and VSS is the digital and analog
MPXY8020A
To Other VDD Loads
VDD
VDD
0.1 µF
To Power Supply
VSS
VSS
To Other VSS Returns
Figure 2. Recommended Power Supply Connections
OUT Pin
The OUT pin normally provides a digital signal related to
the voltage applied to the voltage comparator and the
threshold level shifted into an 8-bit register from an external
device. When the device is placed in the standby mode the
2/f LFO
OUT
Operation
OUT pin is driven high and will be clocked low when an
overflow is detected from a clock divider (divide by 16384)
driven by the LFO. This allows the OUT pin to wake up an
external device such as an MCU.
Measure
Standby
2/f LFO
Measure
3 Sec
Wake Up
Figure 3. Pulse on OUT Pin During Standby Mode
RST Pin
The RST pin is normally driven high and will be clocked
low when an overflow is detected from total clock divider
(divide by 16,777,216) driven by the LFO. This allows the
RST pin to reset an external device such as an MCU. This
pulse will appear on the RST pin approximately every
52 minutes regardless of the operating mode of the device.
The pulse lasts for two cycles of the LFO oscillator as shown
in Figure 4. Since the RST pin is clocked from the same
divider string as the OUT pin, there will also be a pulse on the
OUT pin when the RST pin pulses every 52 minutes.
MPXY8000
Sensor Devices
Freescale Semiconductor
3
OUT
RST
Standby
2/f LFO
2/f LFO
≈ 3 Sec
≈ 52 Minutes
Figure 4. Pulse on RST Pin
S0 Pin
The S0 pin is used to select the mode of operation as
shown in Table 1.
The S0 pin contains an internal Schmitt trigger as part of
its input to improve noise immunity. The S0 pin has an
internal pull-down device in order to provide a low level when
the pin is left unconnected.
S1 Pin
The S1 pin is used to select the mode of operation, as
shown in Table 1.
The S1 pin contains an internal Schmitt trigger as part of
its input to improve noise immunity. This pin has an internal
pull-down device to provide a low level when the pin is left
unconnected.
The S1 pin also serves the purpose of enabling factory trim
and test of the device.
The higher VPP programming voltage for the internal
EEPROM trim register is also supplied through the S1 pin.
DATA Pin
The DATA pin is the serial data in (SDI) function for setting
the threshold of the voltage comparator.
The DATA pin contains an internal Schmitt trigger as part
of its input to improve noise immunity. This pin has an internal
pull-down device to provide a low level when the pin is left
unconnected.
CLK Pin
The CLK pin is used to provide a clock used for loading
and shifting data into the DATA pin. The data on the DATA pin
is clocked into a shift register on the rising edge of the CLK
pin signal. The data is transferred to the D/A Register on the
eighth falling edge of the CLK pin. This protocol may be
handled by the SPI or SIOP serial I/O function found on some
MCU devices.
The CLK pin contains an internal Schmitt trigger as part of
its input to improve noise immunity. The CLK pin has an
internal pull-down device to provide a low level when the pin
is left unconnected.
Output Threshold Adjust
The state of the OUT pin is driven by a voltage comparator
whose output state depends on the level of the input voltage
on the sample capacitor and the level of an adjustable 8-bit
threshold voltage. The threshold is adjusted by shifting data
bits into the D/A Register (DAR) via the DATA pin while
clocking the CLK pin. The timing of this data is shown in
Figure 4. Data is transferred into the serial shift register on
the rising edge of the CLK pin. On the falling edge of the 8th
clock the data in the serial shift register is latched into the
parallel DAR register. The DAR remains powered up
whenever VDD is present. The serial data is clocked into the
DATA pin starting with the MSB first. This sequence of
threshold select bits is shown in Table 2.
Table 2. D/A Threshold Bit Assignment
Function
LSB
Voltage Comparator Threshold Adjust (8 bits)
MSB
Bit Weight
Data Bit
1
D0
2
D1
4
D2
8
D3
16
D4
32
D5
64
D6
128
D7
MPXY8000
4
Sensor Devices
Freescale Semiconductor
An analog to digital (A/D) conversion can be accomplished
with eight (8) different threshold levels in a successive
approximation algorithm; or the OUT pin can be set to trip at
some alarm level. The voltage on the sample capacitor will
maintain long enough for a single 8-bit conversion, but may
need to be refreshed with a new measured reading if the read
interval is longer than the specified hold time, tSH.
The counter that determines the number of clock pulses
into the device is reset whenever the device is placed into the
Measure Pressure or Measure Temperature Modes. This
provides a means to reset the data transfer count in case the
1
2
3
clock stream is corrupted during a transmission. In these two
modes the DATA and CLK pins should not be clocked to
reduce noise in the captured pressure or temperature data.
Any change in the DAR contents should be done during the
Standby or Output Read Modes.
Both the serial bit counter and the state of the DAR are
undefined following power up of the device. The serial bit
counter can be reset by cycling either the SO pin or the
S1/VPP pin to a high level and then back low. The DAR can
then be reset to the lowest level by holding the DATA pin low
while bursting the CLK pin with eight (8) clock pulses.
4
5
6
7
8
CLK
Data
Serial Data ∗
MSB
BIT6
MSB
BIT5
BIT6
BIT4
BIT5
BIT3
BIT4
BIT2
BIT3
BIT1
BIT2
LSB
BIT1
LSB
DAR Load *
Data
DAR *
(*) Denotes Internal Signal
Figure 5. Serial Data Timing
Pressure Sensor Output
The pressure channel compares the output of its analog
measurement circuit to the D/A reference voltage. The device
is calibrated at two different nominal values depending on the
calibration option.
Temperature Sensor Output
The temperature channel compares the output of a
positive temperature coefficient (PTC) resistor driven by a
switched current source. The current source is only active
when the temperature channel is selected.
APPLICATIONS
Suggested application example is shown in Figure 6.
Optional
+
VDD
3.0 V
Motion
Sense
S1
S0
RF
Transmitter
Data
0.1 µF
MPXY8000
Series
Sensor
VSS
CLK
State Machine
or MCU
RST
OUT
Figure 6. Application Example
MPXY8000
Sensor Devices
Freescale Semiconductor
5
ELECTRICAL SPECIFICATIONS
Maximum ratings are the extreme limits to which the
device can be exposed without permanently damaging it. The
device contains circuitry to protect the inputs against damage
from high static voltages; however, do not apply voltages
higher than those shown in the table below. Keep VIN and
VOUT within the range VSS ≤ (VIN or VOUT) ≤ VDD.
Table 3. Maximum Ratings
Rating
Symbol
Value
Unit
VDD
–0.3 to +4.0
V
Maximum High Voltage for 5 minutes
Minimum Low Voltage for 5 minutes
VSC
VSC
VDD
VSS
V
V
Substrate Current Injection
Current from any pin to VSS –0.3 VDC)
ISUB
600
µA
Electrostatic Discharge
Human Body Model (HBM)
Charged Device Model (CDM)
Machine Model (MM)
VESD
VESD
VESD
±1000
±1000
±200
V
V
V
Storage Temperature Range
Standard Temperature Range
Tstg
–40 to +150
°C
Supply Voltage
Short Circuit Capability (all pins excluding VDD and VSS)
ELECTRO STATIC DISCHARGE (ESD)
WARNING: This device is sensitive to electrostatic
discharge.
Extra precaution must be taken by the user to protect the
chip from ESD. A charge of over 1000 volts can accumulate
on the human body or associated test equipment. A charge
of this magnitude can alter the performance or cause failure
of the chip. When handling the pressure sensor, proper ESD
precautions should be followed to avoid exposing the device
to discharges which may be detrimental to its performance.
Operating Range
The limits normally expected in the application which define range of operation.
Table 4. Operating Range
Characteristic
Supply Voltage
Operating Temperature Range
Standard Temperature Range
Supply Current Drain
Standby Mode
−40°C to +85°C
+85°C to +100°C
+100°C to +125°C
Read Mode
−40°C to +125°C
Measure Temperature Mode
−40°C to +125°C
Measure Pressure Mode
−40°C to +10°C
+10°C to +60°C
+60°C to +125°C
Symbol
Min
Typ
Max
Units
VDD
2.1
3.0
3.6
V
TA
–40
—
TH
+125
°C
ISTBY
ISTBY
ISTBY
—
—
—
0.6
0.8
1.5
0.9
1.2
2.2
µA
µA
µA
—
400
600
µA
—
400
600
µA
—
—
—
1400
1300
1200
1800
1700
1700
µA
µA
µA
TL
IREAD
ITEMP
IPRESS
IPRESS
IPRESS
MPXY8000
6
Sensor Devices
Freescale Semiconductor
Table 5. Electrical Characteristics
+2.1 V ≤ VDD ≤ +3.6 V, TL ≤ TA ≤ TH, unless otherwise specified.
Characteristic
Symbol
Min
Typ
Max
Units
Output High Voltage
DATA, OUT, RST (ILoad = 100 µA)
VOH
VDD –0.8
—
—
V
Output Low Voltage
DATA, OUT, RST (ILoad = -100 µA)
VOL
—
—
0.4
V
Input High Voltage
S0, S1, DATA, CLK
VIH
0.7 x VDD
—
—
V
Input Low Voltage
S0, S1, DATA, CLK
VIL
VSS
—
0.3 x VDD
V
VHYS
100
200
—
mV
Input Low Current (at VIL)
S0, S1, DATA, CLK
IIL
–5
–25
–100
µA
Input High Current (at VIH)
S0, S1, DATA, CLK
IIH
–5
–35
–140
µA (2)
T–40
36
52
97
155
204
241
249
42
57
102
163
214
252
255
47
62
107
171
224
255
255
counts
counts
counts
counts
counts
counts
counts
36
52
97
154
203
240
249
42
57
102
163
214
252
255
49
64
107
172
225
255
255
counts
counts
counts
counts
counts
counts
counts
—
0.80
Input Hysteresis (VIH — VIL)
S0, S1, DATA, CLK
Temperature Measurement (+2.5 V ≤ VDD ≤ 3.0 V)
D/A Conversion Code at –40°C
D/A Conversion Code at –20°C
D/A Conversion Code at 25°C
D/A Conversion Code at 70°C
D/A Conversion Code at 100°C
D/A Conversion Code at 120°C
D/A Conversion Code at 125°C
T–20
T25
T70
T100
T120
T125
Temperature Measurement (+2.1 V ≤ VDD ≤ 3.6 V)
T–40
D/A Conversion Code at –40°C
D/A Conversion Code at –20°C
D/A Conversion Code at 25°C
D/A Conversion Code at 70°C
D/A Conversion Code at 100°C
D/A Conversion Code at 120°C
D/A Conversion Code at 125°C
T–20
T25
T70
T100
T120
T125
Temperature Sensitivity at 25°C
Approximate Temperature Output Response
°C/bit
OUT = 74.7461 + 0.9752 x Ta + 0.0041 x Ta^2
counts
8
7
Temperature Error (°C)
6
5
4
3
2
1
0
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
Figure 7. Temperature Error vs Temperature at VDD = 3.0 V
MPXY8000
Sensor Devices
Freescale Semiconductor
7
Table 6. Control Timing
+2.1 V ≤ VDD ≤ +3.6 V, TL ≤ TA ≤ TH, unless otherwise specified.
Characteristic
Symbol
Min
Typ
Max
Units
HFO Measurement Clock Frequency
fHF
100
135
150
kHz
LFO Wake Up Clock Frequency
Ta = –40°C, +2.1V ≤ VDD ≤ +3.6
Ta = +25°C, +2.1V ≤ VDD ≤ +3.6
Ta = +125°C, +2.1V ≤ VDD ≤ +3.6
fLF
fLF
fLF
3300
3900
3800
5400
5400
5300
8000
7700
7000
Hz
Hz
Hz
Wake Up Pulse
Pulse Timing
Pulse Width
tWAKE
tWPW
—
—
16384
2
—
—
LFO clocks
LFO clocks
Reset Pulse
Pulse Timing
Pulse Width
tRESET
tRPW
—
—
16,777,216
2
—
—
LFO clocks
LFO clocks
Minimum Setup Time (DATA edge to CLK rise)
tSETUP
100
—
—
nSec
Minimum Hold Time (CLK rise to DATA change)
tHOLD
100
—
—
nSec
Measurement Response Time
Recommended time to hold device in measurement mode
Temperature
Pressure
tTMEAS
tPMEAS
—
—
200
500
—
—
µSec
µSec
Read Response Time (see Figure 8)
From 90% VDD on S0 to OUT less than VOL or greater than VOH
tREAD
—
50
100
µSec
tSH
20
—
—
mSec
Sample Capacitor Discharge Time
From initial full scale D/A count (255) to drop 2 counts (253)
VDD
6.32 kΩ
Test Point
50 pF
10.91 kΩ
Figure 8. Control Timing Test Load for OUT and RST Pins
MPXY8000
8
Sensor Devices
Freescale Semiconductor
SENSOR CHARACTERISTICS (MPXY8020A)
Pressure Transfer Function
kPa = 2.5 x Output ± (Pressure Error)
Output = 8-bit digital pressure measurement (between 0-255)
Pressure Error (±kPa): 50 kPa ≤ P < 250 kPa
T[°C] \ VDD[V]
2.1
2.5
2.7
3.0
3.3
3.6
–40
72.5
72.5
32.5
32.5
32.5
35.0
–20
57.5
57.5
25.0
25.0
25.0
27.5
0
57.5
57.5
25.0
25.0
25.0
27.5
25
57.5
57.5
25.0
25.0
25.0
27.5
70
57.5
57.5
27.5
25.0
25.0
27.5
100
72.5
72.5
37.5
37.5
37.5
37.5
125
95.0
92.5
57.5
47.5
47.5
47.5
Pressure Error (±kPa): 250 kPa ≤ P ≤ 450 kPa
T[°C] \ VDD[V]
2.1
2.5
2.7
3.0
3.3
3.6
–40
40.0
40.0
25.0
25.0
25.0
30.0
–20
32.5
25.0
15.0
15.0
15.0
20.0
0
30.0
25.0
10.0
10.0
10.0
15.0
25
30.0
25.0
7.5
7.5
7.5
15.0
70
35.0
25.0
10.0
7.5
7.5
15.0
100
40.0
40.0
25.0
25.0
25.0
30.0
125
62.5
60.0
35.0
35.0
35.0
35.0
Pressure Error (±kPa): 450 kPa < P ≤ 600 kPa
T[°C] \ VDD[V]
2.1
2.5
2.7
3.0
3.3
3.6
–40
70.0
70.0
37.5
37.5
37.5
40.0
–20
55.0
55.0
25.0
25.0
25.0
35.0
0
55.0
55.0
22.5
22.5
22.5
35.0
25
55.0
55.0
22.5
22.5
22.5
35.0
70
55.0
55.0
25.0
25.0
25.0
35.0
100
70.0
70.0
32.5
32.5
32.5
40.0
125
90.0
90.0
47.5
47.5
47.5
52.5
Areas marked in grey indicate the typical operating range.
MPXY8000
Sensor Devices
Freescale Semiconductor
9
SENSOR CHARACTERISTICS (MPXY8020A)
Pressure Error
30.0
25.0
Error [kPa]
20.0
15.0
10.0
5.0
0.0
50
100
150
200
250
300
350
400
450
500
550
600
Pressure [kPa]
Figure 9. Pressure Error vs Pressure at T = 25°C, 2.7 V ≤ VDD ≤ 3.3 V
35.0
30.0
25.0
Error [kPa]
20.0
15.0
10.0
5.0
0.0
2.1
2.3
2.5
2.9
2.7
3.1
3.3
3.5
VDD [V]
Figure 10. Pressure Error vs VDD at T = 25°C, 250 kPa ≤ P ≤ 450 kPa
35.0
30.0
25.0
Error [kPa]
20.0
15.0
10.0
5.0
0.0
–40.0
–20.0
0.0
20.0
40.0
60.0
80.0
100.0
120.0
Temperature [C]
Figure 11. Pressure Error vs Temperature at VDD = 3.0 V, 250 kPa ≤ P ≤ 450 kPa
MPXY8000
10
Sensor Devices
Freescale Semiconductor
SENSOR CHARACTERISTICS (MPXY8040A)
Pressure Transfer Function
kPa = 5.0 x Output ± (Pressure Error)
Output = 8-bit digital pressure measurement (between 0-255)
Pressure Error [±kPa]: 50 kPa ≤ P < 500 kPa
T[°C] \ VDD[V]
2.1
2.3
2.5
2.7
3.0
3.3
3.6
–40
80
75
70
70
70
70
75
–20
70
60
55
55
55
55
60
0
60
50
45
45
45
45
55
25
55
45
40
40
40
45
50
70
70
55
50
50
50
50
55
100
80
70
65
65
65
65
70
125
90
85
80
80
80
80
80
Pressure Error [±kPa]: 500 kPa ≤ P ≤ 900 kPa
T[°C] \ VDD[V]
2.1
2.3
2.5
2.7
3.0
3.3
3.6
–40
75
65
60
60
60
60
65
–20
50
35
25
25
25
40
50
0
40
30
20
20
20
25
35
25
40
30
20
20
20
25
35
70
40
30
20
20
20
25
35
100
60
45
35
35
35
45
60
125
90
85
80
80
80
80
80
Areas marked in grey indicate the typical operating range.
(*) Output will max out (255 counts) at 1,275 kPa or higher, but pressure sensor output is not specified above 900 kPa.
MPXY8000
Sensor Devices
Freescale Semiconductor
11
SENSOR CHARACTERISTICS (MPXY8040A)
Pressure Error
50.0
40.0
Error [kPa]
30.0
20.0
10.0
0.0
50
150
250
350
450
550
650
750
850
Pressure [kPa]
Figure 12. Pressure Error vs Pressure at T= 25°C, 2.5 V ≤ VDD ≤ 3.0 V
45.0
40.0
35.0
Error [kPa]
30.0
25.0
20.0
15.0
10.0
5.0
0.0
2.1
2.3
2.5
2.7
2.9
3.1
3.3
3.5
VDD [V]
Figure 13. Pressure Error vs VDD at T = 25°C, 500 kPa ≤ P ≤ 900kPa
80.0
70.0
60.0
Error [kPa]
50.0
40.0
30.0
20.0
10.0
0.0
–40
–20
0
20
40
60
80
100
120
Temperature [C]
Figure 14. Pressure Error vs Temperature at VDD = 3.0 V, 500 kPa ≤ P ≤ 900kPa
MPXY8000
12
Sensor Devices
Freescale Semiconductor
MECHANICAL SPECIFICATIONS
Maximum ratings are the extreme limits to which the
device can be exposed without permanently damaging it.
Keep VIN and VOUT within the range VSS ≤ (VIN or VOUT) ≤
VDD.
Table 7. Maximum Ratings
Rating
Symbol
Value
Unit
pmax
1400
kPa1
Centrifugal Force Effects (3 axis)
Pressure measurement change less than 1% FSS
gCENT
2000
g
Unpowered Shock (three sides, 0.5 mSec duration)
gshock
2000
g
Maximum Pressure
1
Note:
1. Tested for 5 minutes at 25°C.
Media Compatibility
Media compatibility is as specified in Freescale Semiconductor document “SPD TPM Media Test.”
MPXY8000
Sensor Devices
Freescale Semiconductor
13
NOTES
MPXY8000
14
Sensor Devices
Freescale Semiconductor
PACKAGE DIMENSIONS
2X
2 PLACES 4 TIPS
0.006 C A B
A
.420
.400
6X
.050
5
4
8
1
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M-1994.
3. DIMENSIONS DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.006 PER SIDE.
4. ALL VERTICAL SURFACES TO BE 5˚ MAXIMUM.
5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008
MAXIMUM.
.025
.300
.280
3
8X .019
3
B
5
.014
0.004 M C A B
.300
.280
.160
.140
.292
.272
GAGE
PLANE
.006
.000
.175
.155
8X
.011
.009
.041
.031
7˚
0˚
.014
DETAIL G
0.004
DETAIL G
C
SEATING
PLANE
CASE 1352-03
ISSUE B
MPXY8000
Sensor Devices
Freescale Semiconductor
15
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MPXY8000
Rev. 1
12/2004
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