BILIN BAS116 Surface mount switching diode Datasheet

Production specification
BAS116
Surface mount switching diode
FEATURES
Pb
z
Low leakage current applications.
z
Medium speed switching times.
z
Surface mount package ideally suited for automatic
Lead-free
Insertion.
APPLICATIONS
z
High speed switching application.
SOT-23
ORDERING INFORMATION
Type No.
Marking
Package Code
BAS116
JV
SOT-23
MAXIMUM RATING @ Ta=25℃ unless otherwise specified
Characteristic
Symbol
Limits
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Reverse Voltage
VRRM
VRWM
VR
85
V
RMS Reverse Voltage
VR(RMS)
60
V
Forward Continuous Current
IFM
215
mA
Repetitive Peak Forward Current
IFRM
500
mA
Non-Repetitive Peak Forward Surge Current
@t=1.0μs
@t=1.0ms
@t=1.0s
IFSM
Power Dissipation
Pd
250
mW
Thermal Resistance Junction to Ambient Air
RθJA
500
℃/W
Operating Junction Temperature Range
Tj
150
℃
Storage Temperature Range
TSTG
-65 to +150
℃
C031
Rev.A
4.0
1.0
0.5
A
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Production specification
BAS116
Surface mount switching diode
ELECTRICAL CHARACTERISTICS @ Ta=25℃
unless otherwise specified
Characteristic
Symbol
Min
Typ
MAX
UNIT
Test Condition
Reverse Breakdown Voltage
V(BR)R
85
-
-
V
IR= 100μA
V
IF=1mA
IF=10mA
IF=50mA
IF=150mA
Forward Voltage
VFM
-
-
0.9
1.0
1.1
1.25
Reverse Leakage Current
IR
-
-
5.0
80
nA
VR=75V
VR=75V,Tj=150℃
Junction Capacitance
Cj
-
2
-
pF
VR=0V,f=1.0MHz
Reverse Recovery Time
trr
-
-
3
ns
IF=IR=10mAIrr=0.1*IR
TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
C031
Rev.A
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Production specification
BAS116
Surface mount switching diode
PACKAGE OUTLINE
Plastic surface mounted package
SOT-23
SOT-23
A
E
K
B
J
D
G
Dim
Min
Max
A
2.70
3.10
B
1.10
1.50
C
1.0 Typical
D
0.4 Typical
E
0.35
0.48
G
1.80
2.00
H
0.02
0.1
J
H
K
C
0.1 Typical
2.20
2.60
All Dimensions in mm
SOLDERING FOOTPRINT
0.95
0.95
2.00
0.90
0.80
Unit : mm
PACKAGE INFORMATION
Device
Package
Shipping
BAS116
SOT-23
3000/Tape&Reel
C031
Rev.A
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3
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