EPCOS B58601D8010A019 Pressure sensor Datasheet

Pressure sensors
C28 series
Series/Type:
Ordering code:
Gauge pressure sensor die for back side pressure applications
Date:
Version:
2009-08-03
3
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Identification/Classification 1
(header 1 + top left bar):
Pressure sensors
Identification/Classification 2
(header 2 + bottom left header bar):
C28 series
Ordering code: (top right header bar)
Series/Type: (top right header bar)
Gauge pressure sensor die for back side pressure applications
Preliminary data (optional):
(if necessary)
Department:
AS SEN PD
Date:
2009-08-03
Version:
3
 EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited
Pressure sensors
C28 series
Gauge pressure sensor die for back side pressure applications
Applications
Medical devices
Automotive
Automation
Features
Piezoresistive MEMS technology
Small dimensions: 2.05 × 2.05 mm
Square diaphragm
Measured media (back side):
Non-aggressive gases and fluids.
Unsuitable for substances which react with
glass or silicon.
Whetstone bridge with mV output,
ratiometric to supply voltage
Rated pressure ranges 1.6 up to 40 bar
Options
Temperature sensing diode
Delivery mode
Tray
Dimensional drawings
2050
560
390
150 A B
800
560
Note1
X5
640
700
400
allowable edge disruptions
80 µm max.
allowable edge disruptions
50 µm max.
810
235
X8
A
B Note1
2050
95
660
X4
X9
660
B
X4
X5
X1
X2
electrical diagram:
X3
X10
280
560
840
X5
280
560
850
Si 100
all dimensions in µm
Note1: geometry of diaphragm depend
on specification
checked bond area (typ. 100µm x 100µm)
AS SEN PD
Please read Cautions and warnings and
Important notes at the end of this document.
glass
BOROFLOATTM
R1 R2
X4
R3 R4
X3 X2
p
X9
X8
X1
X1 :
X2 :
X3 :
X4 :
X5 :
X8 :
X9 :
X10:
Vout–
VDD–
VDD–
Vout+
VDD+
Diode (N)
Diode (P)
Substrate
2009-08-03
Page 2 of 8
Pressure sensors
C28 series
Gauge pressure sensor die for back side pressure applications
Technical data
Absolute maximum ratings
Parameter
Symbol
Conditions
VDD
Without damage
Min.
Typ.
Max.
Unit
10
V
Supply voltage
Maximum supply voltage
1)
Temperature ranges
Operating temperature range
Storage temperature range
2)
–40
135
°C
For t <15 min
–40
140
°C
Tst
3)
–40
150
°C
pr
Gauge pressure
4)
0 ... 1.6
0 ... 40
bar
Gauge pressure
5)
2.5
pr
pberst
Gauge pressure
6)
3
pr
Symbol
Conditions
Min.
7)
1.0
Ta
Pressure ranges
Operating pressure ranges
Over pressure
Burst pressure
pov
Electrical specifications
Parameter
Typ.
Max.
Unit
5.0
V
Supply voltage / bridge resistance
Operating supply voltage
VDD
Total bridge resistance
RS
Temperature coefficient
of total bridge resistance
αRs
@ 25 °C
8)
@ 25 °C
9)
βRs
2.7
3.2
3.7
kΩ
2.1
2.4
2.7
10 /K
4
6
8
10 /K
–30
0
30
mV
–3
–6
2
Output signal @ VDD = 5 V
Offset
V0
Sensitivity
S
Temperature coefficient
of the sensitivity
αS
Pressure hysteresis
pHys
@ 25 °C
10)
@ 25 °C
13)
@ 25 °C
15)
See next table
βS
16)
mV/bar
–3
–2.5
–2.2
–1.9
10 /K
3
5
8
10 /K
0.1
% FS
–0.1
–6
2
Optional temperature sensing diode
Forward diode voltage
VF
@ 25 °C, IF = 50 µA
17)
550
600
650
mV
Temperature coefficient
of forward diode voltage
TCVF
@ 25 °C, IF = 50 µA
18)
–2.4
–2.2
–2.0
mV/K
Long-term stability (Full scale normal output FSON = 120 mV)
Temperature hysteresis of offset
Temperature cycle drift of offset
High temperature drift of offset
Long term stability of offset
THV0
19)
–0.35
±0.2
0.35
% FSON
TCDV0
19)
–0.25
±0.1
0.25
% FSON
HTDV0
19)
–0.25
±0.1
0.25
% FSON
LTSV0
19)
–0.45
±0.3
0.45
% FSON
AS SEN PD
Please read Cautions and warnings and
Important notes at the end of this document.
2009-08-03
Page 3 of 8
Pressure sensors
C28 series
Gauge pressure sensor die for back side pressure applications
Operating pressures and ordering codes
Parameter @ 25 °C, VDD = 5 V
Operating pressure
4)
Temperature coefficient
11)
of offset voltage (unglued)
[min/typ/max]
Nonlinearity
14)
[typ/max]
Symbol
Typ.
Typ.
Typ.
Typ.
Units
pr
2.5
6.0
10
25
bar
TCV0
–
–8/±4/8
–8/±4/8
–8/±4/8
–8/±4/8
µV/VK
TCV0
+
–4/±2/4
–4/±2/4
–4/±2/4
–4/±2/4
µV/VK
L
±0.2/±0.3
±0.2/±0.3
±0.2/±0.3
±0.2/±0.3
% FS
S
36/48/60
15/20/25
9/12/15
3.6/4.8/6
mV/bar
yes
yes
yes
yes
13)
Sensitivity
[min/typ/max]
Product type
AER 2.500 C28/1 G08 D
AER 6.000 C28/1 G08 D
AER 10.00 C28/1 G08 D
AER 25.00 C28/1 G08 D
Ordering code
B58601D8010A016
B58601D8010A017
B58601D8010A018
B58601D8010A019
Temperature sensing diode present
Other operating pressures upon request.
AS SEN PD
Please read Cautions and warnings and
Important notes at the end of this document.
2009-08-03
Page 4 of 8
Pressure sensors
C28 series
Gauge pressure sensor die for back side pressure applications
Symbols and Terms
1)
2)
3)
4)
5)
6)
7)
Maximum power supply VDD
This is the maximal allowed voltage, which may be applied to the piezoresistive bridge circuit without damage.
Operating temperature range Ta
This is the operating Temperature range Ta,min to Ta,max. Because most of the sensor parameters depend on assembling
conditions like gluing, wire bonding etc, the die has to be tested over the operating temperature range by the customer
fully assembled. For design verification and process control samples, mounted in AK transducer package (AK2 series)
are tested over a reduced measuring temperature range of Tmeas,min to Tmeas,max.
Storage temperature range Tst
If the pressure sensor dies are stored in the temperature range Tst,min to Tst,max without applied voltage power supply, this
will not affect the performance of the pressure sensor dies.
Operating pressure range pr
In the operating pressure range 0 to pr,max the pressure sensor die output characteristic is as defined in this specification.
Over pressure pOV
Pressure cycles in the pressure range 0 to pov do not affect the performance of the pressure sensor dies.
Burst pressure pberst
Up to the burst pressure pberst the diaphragm of the sensor die will not be destroyed mechanically. This parameter is
tested at room temperature on samples mounted on an aluminium socket by increasing the applied pressure until the
diaphragm is destroyed.
Operating power supply VDD
The pressure sensor parameters are defined for a power supply voltage of VDD = 5 V. In the operating power supply
voltage range VDD,min to VDD,max the ratiometric parameters r(VDD) like sensitivity, offset voltage and the temperature
coefficient of the offset voltage are defined by:
r (VDD ) = r(5[ V ])
VDD
5[ V ]
8)
Total bridge resistance RS
The total bridge resistance is defined between pad X5 and X2, X3 (see the dimensional drawing in this data sheet) of the
closed piezoresistive bridge circuit. The total bridge resistance is in a good approximation the output impedance of the
piezoresistive bridge circuit. This parameter is tested completely on a wafer (wafer level test measurement).
9)
Temperature coefficients of resistance αRs and β Rs:
The temperature coefficients of resistance are tested for design verification on samples, mounted on AK transducer
package (AK2 series) over a reduced temperature range Tmeas,min = –20 °C to Tmeas,max = 80 °C with TR = 25 °C.
The temperature coefficients of first and second order are defined with the polynomial:

RS(T) = RS (T = 25°C ) 1+α Rs T−25°C +β Rs T−25°C

(
10)
11)
)
(
)
2


The coefficients αRs and βRs are calculated using the three measurement points of Rs(T) at Tmeas,min, TR and Tmeas,max.
Offset voltage V0
The offset voltage V0 is the output voltage Vout(p = 0 bar gauge) at zero gauge pressure and for a bridge voltage power
supply VDD = 5 V. This parameter is tested completely on a wafer (wafer level test measurement).
It should be noted that this parameter may be influenced by assembly.
Temperature coefficient of offset voltage TCV0
The temperature coefficients of offset voltage are defined for a bridge voltage power supply VDD = 5 V.
These parameters strongly depend on assembly conditions like gluing, wire bonding etc.
The temperature coefficients of offset voltage are tested for design verification on samples, mounted on AK transducer
package (AK2 series) over a temperature range Tmin = –40 °C to Tmax = 135 °C.
Therefore TCV0+ and TCV0- are defined for the measurement temperature range by:
TCVo + =
Vo (Tmax ) − Vo (25°C)
Tmax − 25°C
AS SEN PD
Please read Cautions and warnings and
Important notes at the end of this document.
TCVo − =
Vo (Tmin ) − Vo (25°C)
Tmin − 25°C
2009-08-03
Page 5 of 8
Pressure sensors
C28 series
12)
Gauge pressure sensor die for back side pressure applications
Full scale value FS
FS = Vout (p r max ) − Vo
13)
Sensitivity S
The sensitivity is defined for a bridge voltage power supply VDD = 5 V. It can be determined by the formula:
S=
14)
Vout (p r max ) − Vo
p r max
This parameter is tested for process control on samples, mounted on AK transducer package (AK2 series).
Nonlinearity L
This parameter may be influenced by assembly.
The nonlinearity is measured using the endpoint method. Assuming a characteristic, this can be approximated
by a polynomial of second order, where the maximum is at px = prmax/2. The nonlinearity is defined at px = prmax/2,
using the equation:
L=
Vout (p x ) − Vo
px
−
Vout (p r max ) − Vo p r max
This parameter is tested for process control on samples, mounted on AK transducer package (AK2 series).
15)
Temperature coefficient of sensitivity αS and βS:
These parameters may be influenced by assembly.
The temperature coefficients of sensitivity are tested for design verification on samples, mounted on AK transducer
package (AK2 series) over a reduced temperature range Tmeas,min = –20 °C to Tmeas,max = 80 °C with TR = 25 °C.
The temperature coefficients of first and second order are defined with the polynomial:
2

S(T) = S (T = 25 °C) 1+ αS T − 25 °C + βS T − 25 °C 


(
16)
18)
Vout,2 (p k ) − Vout,1(p k )
FS
With k = min, 1, 2, 3, max. The pressure steps are: prmin = 0, p1 = 0.25·pr,max, p2 = 0.5·pr,max, p3 = 0.75·pr, max, pr,max.
This parameter is tested for design verification on samples, mounted on AK transducer package (AK2 series).
Forward diode voltage VF
The voltage drop is measured across anode and cathode by a forward current of 47 µA.
This parameter is tested completely on a wafer (wafer level test measurement).
Temperature coefficient of forward diode voltage TCVF
The temperature sensitivity of diode voltage drop is defined by the measured values at –20 °C and 80 °C
using the equation:
TCVF =
19)
)
The coefficients αS and βS are calculated using the three measurement points of S(T) at Tmeas,min, TR and Tmeas,max.
Pressure hysteresis pHys
The pressure hysteresis is the difference between output voltages at constant pressure and constant temperature while
applying a pressure cycle with pressure steps of pr, min, p1, p2, p3, pr,max, p3, p2, p1, pr, min:
pHys =
17)
) (
VF (Tmeas,max ) − VF (Tmeas,min )
Tmeas,max − Tmeas,min
With Tmeas,min = –20 °C and Tmeas,max = 80 °C and the measurement is done with a constant current of 50 µA.
The estimated temperature coefficient is also valid at temperatures between –40 °C and 135 °C.
This parameter is tested for design verification on samples, mounted on AK transducer package (AK2 series).
Reliability data
For long-term stability of offset voltage LTSV0 please refer to the defined Aktiv Sensor’s standard AS100001 in chapter
“Reliability data” on the internet.
AS SEN PD
Please read Cautions and warnings and
Important notes at the end of this document.
2009-08-03
Page 6 of 8
Pressure sensors
C28 series
Gauge pressure sensor die for back side pressure applications
Cautions and warnings
Storage (general)
All pressure sensors should be stored in their original packaging. They should not be placed in harmful environments such
as corrosive gases nor exposed to heat or direct sunlight, which may cause deformations. Similar effects may result from
extreme storage temperatures and climatic conditions. Avoid storing the sensor dies in an environment where condensation
may form or in a location exposed to corrosive gases, which will adversely affect their performance. Plastic materials should
not be used for wrapping/packing when storing or transporting these dies, as they may become charged. Pressure sensor
dies should be used soon after opening their seal and packaging.
Operation (general)
Media compatibility with the pressure sensors must be ensured to prevent their failure. The use of other media can cause
damage and malfunction. Never use pressure sensors in atmospheres containing explosive liquids or gases.
Ensure pressure equalization to the environment, if gauge pressure sensors are used. Avoid operating the pressure sensors
in an environment where condensation may form or in a location exposed to corrosive gases. These environments adversely
affect their performance.
If the operating pressure is not within the rated pressure range, it may change the output characteristics. This may also
happen with pressure sensor dies if an incorrect mounting method is used. Be sure that the applicable pressure does not
exceed the overpressure, as it may damage the pressure sensor.
Do not exceed the maximum rated supply voltage nor the rated storage temperature range, as it may damage the pressure
sensor.
Temperature variations in both the ambient conditions and the media (liquid or gas) can affect the accuracy of the output
signal from the pressure sensors. Be sure to check the operating temperature range and thermal error specification of the
pressure sensors to determine their suitability for the application.
Connections must be wired in accordance with the terminal assignment specified in the data sheets. Care should be taken
as reversed pin connections can damage the pressure transmitters or degrade their performance. Contact between the
pressure sensor terminals and metals or other materials may cause errors in the output characteristics.
Design notes (dies)
This specification describes the mechanical, electrical and physical requirements of a piezoresistive sensor die for
measuring pressure. The specified parameters are valid for the pressure sensor die with pressure application either to the
front or back side of the diaphragm as described in the data sheet. Pressure application to the other side may result in
differing data. Most of the parameters are influenced by assembly conditions. Hence these parameters and the reliability
have to be specified for each specific application and tested over its temperature range by the customer.
Handling/Mounting (dies)
Pressure sensor dies should be handled appropriately and not be touched with bare hands. They should only be picked up
manually by the sides using tweezers. Their top surface should never be touched with tweezers. Latex gloves should not be
used for handling them, as this will inhibit the curing of the adhesive used to bond the die to the carrier. When handling, be
careful to avoid cuts caused by the sharp-edged terminals. The sensor die must not be contaminated during manufacturing
processes (gluing, soldering, silk-screen process).
The package of pressure sensor dies should not to be opened until the die is mounted and should be closed after use. The
sensor die must not be cleaned. The sensor die must not be damaged during the assembly process (especially scratches on
the diaphragm).
Soldering (transducers, transmitters)
The thermal capacity of pressure sensors is normally low, so steps should be taken to minimize the effects of external heat.
High temperatures may lead to damage or changes in characteristics.
A non-corrosive type of flux resin should normally be used and complete removal of the flux is recommended.
Avoid rapid cooling due to dipping in solvent. Note that the output signal may change if pressure is applied to the terminals
during soldering.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
AS SEN PD
Please read Cautions and warnings and
Important notes at the end of this document.
2009-08-03
Page 7 of 8
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed
questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of
the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue,
MiniCell, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT,
SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
Page 8 of 8
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