ISSI IS41LV85125B-60K 512k x 8 (4-mbit) dynamic ram with fast page mode Datasheet

ISSI
IS41LV85125B
512K x 8 (4-MBIT) DYNAMIC RAM
WITH FAST PAGE MODE
®
APRIL 2005
FEATURES
DESCRIPTION
•
•
•
•
Fast access and cycle time
TTL compatible inputs and outputs
Refresh Interval: 1024 cycles/16 ms
Refresh Mode: RAS-Only, CAS-before-RAS
(CBR), and Hidden
• JEDEC standard pinout
• Single power supply: 3.3V ± 10%
• Lead-free available
The ISSI IS41LV85125B is 512,288 x 8-bit high-performance
CMOS Dynamic Random Access Memories. Fast Page
Mode allows 1024 random accesses within a single row
with access cycle time as short as 12 ns per 8-bit word.
KEY TIMING PARAMETERS
PIN CONFIGURATION
28-Pin SOJ
Parameter
Max. RAS Access Time (tRAC)
Max. CAS Access Time (tCAC)
Max. Column Address Access Time (tAA)
Min. Fast Page Mode Cycle Time (tPC)
Min. Read/Write Cycle Time (tRC)
-60
60
15
30
40
110
These features make the IS41LV85125B ideally suited for
high band-width graphics, digital signal processing, highperformance computing systems, and peripheral
applications.
The IS41LV85125B is available in a 28-pin, 400-mil SOJ
package.
Unit
ns
ns
ns
ns
ns
PIN DESCRIPTIONS
VDD
1
28
GND
I/O0
2
27
I/O7
I/O1
3
26
I/O6
I/O2
4
25
I/O5
I/O3
5
24
I/O4
NC
6
23
CAS
WE
7
22
OE
RAS
8
21
NC
A0-A9
Address Inputs
I/O0-I/O7
Data Inputs/Outputs
A9
9
20
A8
WE
Write Enable
A0
10
19
A7
OE
Output Enable
A1
11
18
A6
RAS
Row Address Strobe
A2
12
17
A5
CAS
Column Address Strobe
A3
13
16
A4
VDD
Power
VDD
14
15
GND
GND
Ground
NC
No Connection
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
1
ISSI
IS41LV85125B
®
FUNCTIONAL BLOCK DIAGRAM
OE
WE
CAS
CAS
CLOCK
GENERATOR
WE
CONTROL
LOGICS
CAS
WE
OE
CONTROL
LOGIC
OE
RAS
CLOCK
GENERATOR
RAS
DATA I/O BUS
COLUMN DECODERS
SENSE AMPLIFIERS
ROW DECODER
REFRESH
COUNTER
ADDRESS
BUFFERS
A0-A9
DATA I/O BUFFERS
RAS
I/O0-I/O7
MEMORY ARRAY
512,288 x 8
TRUTH TABLE
Function
Standby
Read
Write: Word (Early Write)
Read-Write
Hidden Refresh
Read
Write(1)
RAS-Only Refresh
CBR Refresh
RAS
H
L
L
L
L→H→L
L→H→L
L
H→L
CAS
H
L
L
L
L
L
H
L
WE
X
H
L
H→L
H
L
X
X
OE
X
L
X
L→H
L
X
X
X
Address tR/tC
X
ROW/COL
ROW/COL
ROW/COL
ROW/COL
ROW/COL
ROW/NA
X
I/O
High-Z
DOUT
DIN
DOUT, DIN
DOUT
DOUT
High-Z
High-Z
Notes:
1. EARLY WRITE only.
2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
ISSI
IS41LV85125B
FUNCTIONAL DESCRIPTION
The IS41LV85125B is a CMOS DRAM optimized for highspeed bandwidth, low-power applications. During READ or
WRITE cycles, each bit is uniquely addressed through the
19 address bits. The first ten address bits (A0-A9) are
entered as row address and latter nine address bits (A0A8) are entered as column address. The row address is
latched by the Row Address Strobe (RAS). The column
address is latched by the Column Address Strobe (CAS).
RAS is used to latch the first ten bits of row address and
CAS is used to latch the latter nine bits of column address.
Memory Cycle
A memory cycle is initiated by bringing RAS LOW and it is
terminated by returning both RAS and CAS HIGH. To
ensure proper device operation and data integrity any
memory cycle, once initiated, must not be ended or
aborted before the minimum tRAS time has expired. A new
cycle must not be initiated until the minimum precharge
time tRP, tCP has elapsed.
Read Cycle
A read cycle is initiated by the falling edge of CAS or OE,
whichever occurs last, while holding WE HIGH. The
column address must be held for a minimum time specified
by tAR. Data Out becomes valid only when tRAC, tAA, tCAC
and tOEA are all satisfied. As a result, the access time is
dependent on the timing relationships between these
parameters.
®
Refresh Cycle
To retain data, 1024 refresh cycles are required in each
16 ms period. There are two ways to refresh the memory:
1. By clocking each of the 1024 row addresses (A0
through A9) with RAS at least once every 16 ms. Any
read, write, read-modify-write or RAS-only cycle refreshes the addressed row.
2. Using a CAS-before-RAS refresh cycle. CAS-beforeRAS refresh is activated by the falling edge of RAS,
while holding CAS LOW. In CAS-before-RAS refresh
cycle, an internal 10-bit counter provides the row
addresses and the external address inputs are ignored.
CAS-before-RAS is a refresh-only mode and no data
access or device selection is allowed. Thus, the output
remains in the High-Z state during the cycle.
Power-On
After application of the VDD supply, an initial pause of
200 µs is required followed by a minimum of eight
initialization cycles (any combination of cycles containing
a RAS signal).
During power-on, it is recommended that RAS track with
VDD or be held at a valid VIH to avoid current surges.
Write Cycle
A write cycle is initiated by the falling edge of CAS and
WE, whichever occurs last. The input data must be valid
at or before the falling edge of CAS or WE, whichever occurs
last.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
3
ISSI
IS41LV85125B
®
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
Parameters
VT
VDD
IOUT
PD
TA
TSTG
Voltage on Any Pin Relative to GND 3.3V
Supply Voltage
3.3V
Output Current
Power Dissipation
Operation Temperature
Com.
Storage Temperature
Rating
Unit
–0.5 t0 +4.6
–0.5 t0 +4.6
50
1
0 to +70
–55 to +125
V
V
mA
W
°C
°C
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
RECOMMENDED OPERATING CONDITIONS (Voltages are referenced to GND)
Symbol
VDD
VIH
VIL
TA
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Ambient Temperature
Voltage
Min.
Typ.
Max.
Unit
3.3V
3.3V
3.3
Com.
3.0
2.0
–0.3
0
3.3
—
—
—
3.6
VDD + 0.3
0.8
+70
V
V
V
°C
Max.
Unit
5
7
7
pF
pF
pF
CAPACITANCE(1,2)
Symbol
Parameter
CIN1
CIN2
CIO
Input Capacitance: A0-A9
Input Capacitance: RAS, UCAS, LCAS, WE, OE
Data Input/Output Capacitance: I/O0-I/O7
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: TA = 25°C, f = 1 MHz.
4
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
ISSI
IS41LV85125B
®
ELECTRICAL CHARACTERISTICS(1) (Recommended Operation Conditions unless otherwise noted.)
Symbol
Parameter
Test Condition
IIL
Input Leakage Current
IIO
Output Leakage Current
VOH
VOL
Output High Voltage Level
Output Low Voltage Level
Any input 0V ≤ VIN ≤ VDD
Other inputs not under test = 0V
Output is disabled (Hi-Z)
0V ≤ VOUT ≤ VDD
IOH = –2 mA
IOL = 2 mA
ICC1
ICC2
ICC3
Stand-by Current: TTL
Stand-by Current: CMOS
Operating Current:
Random Read/Write(2,3,4)
Average Power Supply Current
Operating Current:
Fast Page Mode(2,3,4)
Average Power Supply Current
Refresh Current:
RAS-Only(2,3)
Average Power Supply Current
Refresh Current:
CBR(2,3,5)
Average Power Supply Current
ICC4
ICC5
ICC6
Min.
Max.
Unit
–10
10
µA
–10
10
µA
2.4
—
—
0.4
V
V
-60
—
—
—
2
2
170
mA
mA
mA
RAS = VIL, CAS,
Cycling tPC = tPC (min.)
-60
—
170
mA
RAS Cycling, CAS ≥ VIH
tRC = tRC (min.)
-60
—
170
mA
RAS, CAS Cycling
tRC = tRC (min.)
-60
—
170
mA
RAS, CAS ≥ VIH
3.3V
RAS, CAS ≥ VDD – 0.2V
3.3V
RAS, CAS,
Address Cycling, tRC = tRC (min.)
Speed
Com.
Notes:
1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycles (RAS-Only or CBR) before proper device
operation is assured.The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded.
2. Dependent on cycle rates.
3. Specified values are obtained with minimum cycle time and the output open.
4. Column-address is changed once each fast page cycle.
5. Enables on-chip refresh and address counters.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
5
ISSI
IS41LV85125B
®
AC CHARACTERISTICS(1,2,3,4,5,6) (Recommended Operating Conditions unless otherwise noted.)
-60
Symbol
tRC
Parameter
Random READ or WRITE Cycle Time
Min.
110
Max.
—
Units
ns
tRAC
tCAC
tAA
tRAS
tRP
tCAS
tCP
tCSH
tRCD
tASR
tRAH
tASC
tCAH
tAR
Access Time from RAS(6, 7)
Access Time from CAS(6, 8, 15)
Access Time from Column-Address(6)
RAS Pulse Width
RAS Precharge Time
CAS Pulse Width(26)
CAS Precharge Time(9, 25)
CAS Hold Time (21)
RAS to CAS Delay Time(10, 20)
Row-Address Setup Time
Row-Address Hold Time
Column-Address Setup Time(20)
Column-Address Hold Time(20)
Column-Address Hold Time
(referenced to RAS)
RAS to Column-Address Delay Time(11)
Column-Address to RAS Lead Time
RAS to CAS Precharge Time
RAS Hold Time(27)
CAS to Output in Low-Z(15, 29)
CAS to RAS Precharge Time(21)
Output Disable Time(19, 28, 29)
Output Enable Time(15, 16)
OE HIGH Hold Time from CAS HIGH
OE HIGH Pulse Width
OE LOW to CAS HIGH Setup Time
Read Command Setup Time(17, 20)
Read Command Hold Time
(referenced to RAS)(12)
Read Command Hold Time
(referenced to CAS)(12, 17, 21)
Write Command Hold Time(17, 27)
Write Command Hold Time
(referenced to RAS)(17)
—
—
—
60
40
10
10
60
20
0
10
0
10
40
60
15
30
10K
—
10K
—
—
45
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
15
30
5
15
0
5
3
—
15
10
5
0
0
30
—
—
10K
—
—
15
15
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
0
—
ns
10
50
—
—
ns
ns
tRAD
tRAL
tRPC
tRSH
tCLZ
tCRP
tOD
tOE
tOEHC
tOEP
tOES
tRCS
tRRH
tRCH
tWCH
tWCR
(Continued)
6
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
ISSI
IS41LV85125B
®
AC CHARACTERISTICS(1,2,3,4,5,6) (Recommended Operating Conditions unless otherwise noted.)
-60
Symbol
tWP
tWPZ
tRWL
tCWL
tWCS
tDHR
tACH
tOEH
tDS
tDH
tRWC
tRWD
tCWD
tAWD
tPC
tRASP
tCPA
tPRWC
tOFF
tWHZ
tCLCH
tCSR
tCHR
tORD
tREF
tT
Parameter
Write Command Pulse Width(17)
WE Pulse Widths to Disable Outputs
Write Command to RAS Lead Time(17)
Write Command to CAS Lead Time(17, 21)
Write Command Setup Time(14, 17, 20)
Data-in Hold Time (referenced to RAS)
Column-Address Setup Time to CAS
Precharge during WRITE Cycle
OE Hold Time from WE during
READ-MODIFY-WRITE cycle(18)
Data-In Setup Time(15, 22)
Data-In Hold Time(15, 22)
READ-MODIFY-WRITE Cycle Time
RAS to WE Delay Time during
READ-MODIFY-WRITE Cycle(14)
CAS to WE Delay Time(14, 20)
Column-Address to WE Delay Time(14)
Fast Page Mode READ or WRITE
Cycle Time(24)
RAS Pulse Width
Access Time from CAS Precharge(15)
READ-WRITE Cycle Time(24)
Output Buffer Turn-Off Delay from
CAS or RAS(13,15,19, 29)
Output Disable Delay from WE
Last CAS going LOW to First CAS
returning HIGH(23)
CAS Setup Time (CBR REFRESH)(30, 20)
CAS Hold Time (CBR REFRESH)(30, 21)
OE Setup Time prior to RAS during
HIDDEN REFRESH Cycle
Refresh Period (1024 Cycles)
Transition Time (Rise or Fall)(2, 3)
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
Min.
10
10
15
15
0
40
15
Max.
—
—
—
—
—
—
—
Units
ns
ns
ns
ns
ns
ns
ns
15
—
ns
0
15
155
85
—
—
—
—
ns
ns
ns
ns
40
55
40
—
—
—
ns
ns
ns
60
—
56
3
100K
35
—
15
ns
ns
ns
ns
3
10
15
—
ns
ns
5
10
0
—
—
—
ns
ns
ns
—
3
16
50
ms
ns
7
IS41LV85125B
ISSI
®
Notes:
1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycle (RAS-Only or CBR) before proper device
operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded.
2. VIH (MIN) and VIL (MAX) are reference levels for measuring timing of input signals. Transition times, are measured between VIH
and VIL (or between VIL and VIH) and assume to be 1 ns for all inputs.
3. In addition to meeting the transition rate specification, all input signals must transit between VIH and VIL (or between VIL and VIH)
in a monotonic manner.
4. If CAS and RAS = VIH, data output is High-Z.
5. If CAS = VIL, data output may contain data from the last valid READ cycle.
6. Measured with a load equivalent to one TTL gate and 50 pF.
7. Assumes that tRCD < tRCD (MAX). If tRCD is greater than the maximum recommended value shown in this table, tRAC will increase
by the amount that tRCD exceeds the value shown.
8. Assumes that tRCD ≥ tRCD (MAX).
9. If CAS is LOW at the falling edge of RAS, data out will be maintained from the previous cycle. To initiate a new cycle and clear
the data output buffer, CAS and RAS must be pulsed for tCP.
10. Operation with the tRCD (MAX) limit ensures that tRAC (MAX) can be met. tRCD (MAX) is specified as a reference point only; if tRCD
is greater than the specified tRCD (MAX) limit, access time is controlled exclusively by tCAC.
11. Operation within the tRAD (MAX) limit ensures that tRCD (MAX) can be met. tRAD (MAX) is specified as a reference point only; if tRAD
is greater than the specified tRAD (MAX) limit, access time is controlled exclusively by tAA.
12. Either tRCH or tRRH must be satisfied for a READ cycle.
13. tOFF (MAX) defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL.
14. tWCS, tRWD, tAWD and tCWD are restrictive operating parameters in LATE WRITE and READ-MODIFY-WRITE cycle only. If tWCS ≥ tWCS
(MIN), the cycle is an EARLY WRITE cycle and the data output will remain open circuit throughout the entire cycle. If tRWD ≥ tRWD
(MIN), tAWD ≥ tAWD (MIN) and tCWD ≥ tCWD (MIN), the cycle is a READ-WRITE cycle and the data output will contain data read from
the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until CAS and RAS or OE go back
to VIH) is indeterminate. OE held HIGH and WE taken LOW after CAS goes LOW result in a LATE WRITE (OE-controlled) cycle.
15. Output parameter (I/O) is referenced to corresponding CAS input, I/O0-I/O7 by LCAS and I/O8-I/O15 by UCAS.
16. During a READ cycle, if OE is LOW then taken HIGH before CAS goes HIGH, I/O goes open. If OE is tied permanently LOW, a LATE
WRITE or READ-MODIFY-WRITE is not possible.
17. Write command is defined as WE going low.
18. LATE WRITE and READ-MODIFY-WRITE cycles must have both tOD and tOEH met (OE HIGH during WRITE cycle) in order to ensure
that the output buffers will be open during the WRITE cycle. The I/Os will provide the previously written data if CAS remains LOW
and OE is taken back to LOW after tOEH is met.
19. The I/Os are in open during READ cycles once tOD or tOFF occur.
20. The first χCAS edge to transition LOW.
21. The last χCAS edge to transition HIGH.
22. These parameters are referenced to CAS leading edge in EARLY WRITE cycles and WE leading edge in LATE WRITE or READMODIFY-WRITE cycles.
23. Last falling χCAS edge to first rising χCAS edge.
24. Last rising χCAS edge to next cycle’s last rising χCAS edge.
25. Last rising χCAS edge to first falling χCAS edge.
26. Each χCAS must meet minimum pulse width.
27. Last χCAS to go LOW.
28. I/Os controlled, regardless UCAS and LCAS.
29. The 3 ns minimum is a parameter guaranteed by design.
30. Enables on-chip refresh and address counters.
8
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
ISSI
IS41LV85125B
®
AC WAVEFORMS
FAST-PAGE-MODE READ CYCLE
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRSH
tCAS tCLCH
tRCD
tRRH
CAS
tAR
tRAD
tASR
ADDRESS
tRAH
tRAL
tCAH
tASC
Row
Column
Row
tRCS
tRCH
WE
tAA
tRAC
tCAC
tCLC
I/O
tOFF(1)
Open
Open
Valid Data
tOE
tOD
OE
tOES
Don't Care
Note:
1. tOFF is referenced from rising edge of CAS.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
9
ISSI
IS41LV85125B
®
FAST PAGE MODE READ-MODIFY-WRITE CYCLE
tRASP
tRP
RAS
tPRWC
tCAS
tCSH
tCAS
tCRP
tRCD
tRSH
tCAS
tCP
tCRP
tCP
CAS
tAR
tRAH
tRAD
tASC
tASR
ADDRESS
tCPWD
tRAL
tCAH
tCPWD
Row
tCAH
tAR
Column
tASC
Column
tCWL
tRWD
tAWD
tCWD
tRCS
tCAH
tASC
Column
tCWL
tRWL
tCWL
tAWD
tCWD
tWP
tAWD
tCWD
tWP
tWP
WE
tAA
tAA
tCAC
tCAC
tOEA
OE
tCAC
tOEA
tOEZ
tOED
tRAC
tOEA
tOEZ
tOED
OUT
IN
tOEZ
tOED
tDH
tDH
tDS tCLZ
tCLZ
I/O
tAA
tDS
OUT
IN
tDH
tCLZ
OUT
tDS
IN
Don't Care
10
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
ISSI
IS41LV85125B
®
FAST-PAGE-MODE EARLY WRITE CYCLE (OE = DON'T CARE)
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRSH
tCAS tCLCH
tRCD
CAS
tAR
tRAD
tRAH
tASR
ADDRESS
tRAL
tCAH
tACH
tASC
Row
Column
Row
tCWL
tRWL
tWCR
tWCS
tWCH
tWP
WE
tDHR
tDS
I/O
tDH
Valid Data
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
11
ISSI
IS41LV85125B
®
FAST-PAGE-MODE READ WRITE CYCLE (LATE WRITE and READ-MODIFY-WRITE Cycles)
tRWC
tRAS
tRP
RAS
tCSH
tCRP
tRSH
tCAS tCLCH
tRCD
CAS
tAR
tRAD
tASR
tRAH
tRAL
tCAH
tASC
tACH
ADDRESS
Row
Column
Row
tRWD
tCWL
tRWL
tCWD
tRCS
tAWD
tWP
WE
tAA
tRAC
tCAC
tCLZ
I/O
tDS
Open
Valid DOUT
tOE
tOD
tDH
Valid DIN
Open
tOEH
OE
Don't Care
12
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
ISSI
IS41LV85125B
®
FAST PAGE MODE EARLY WRITE CYCLE
tRASP
tRP
RAS
tCAS
tCRP
tRHCP
tRSH
tCAS
tPC
tCAS
tCSH
tRCD
tCP
tCRP
tCP
CAS
tAR
tRAL
tRAH
tRAD
tASC
tASR
ADDRESS
Row
tCAH
tCAH
tAR
Column
tASC
Column
Column
tCWL
tWCS
tWCH
tCAH
tASC
tCWL
tWP
tCWL
tWCH tWCS
tWCS
tWP
tWCH
tWP
WE
tWCR
OE
tDHR
tDS
I/O
tDH
Valid DIN
tDS
tDH
Valid DIN
tDS
tDH
Valid DIN
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
13
ISSI
IS41LV85125B
®
READ CYCLE (With WE-Controlled Disable)
RAS
tCSH
tCRP
tRCD
tCP
tCAS
CAS
tAR
tRAD
tRAH
tASR
ADDRESS
tCAH
tASC
Row
tASC
Column
Column
tRCS
tRCH
tRCS
WE
tAA
tRAC
tCAC
tCLZ
Open
I/O
tWHZ
tCLZ
Valid Data
Open
tOE
tOD
OE
Don't Care
RAS
RAS-ONLY REFRESH CYCLE (OE, WE = DON'T CARE)
tRC
tRAS
tRP
RAS
tCRP
tRPC
CAS
tASR
ADDRESS
I/O
tRAH
Row
Row
Open
Don't Care
14
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
ISSI
IS41LV85125B
®
CBR REFRESH CYCLE (Addresses; WE, OE = DON'T CARE)
tRP
tRAS
tRP
tRAS
RAS
tRPC
tCP
tCHR
tCHR
tRPC
tCSR
tCSR
CAS
Open
I/O
HIDDEN REFRESH CYCLE(1) (WE = HIGH; OE = LOW)
tRAS
tRP
tRAS
RAS
tCRP
tRCD
tASR
tRAD
tRAH tASC
tRSH
tCHR
CAS
tAR
ADDRESS
Row
tRAL
tCAH
Column
tAA
tRAC
tOFF(2)
tCAC
tCLZ
I/O
Open
Valid Data
tOE
Open
tOD
tORD
OE
Don't Care
Notes:
1. A Hidden Refresh may also be performed after a Write Cycle. In this case, WE = LOW and OE = HIGH.
2. tOFF is referenced from rising edge of RAS or CAS, whichever occurs last.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
15
ISSI
IS41LV85125B
®
ORDERING INFORMATION: IS41LV85125B
Commercial Range: 0oC to +70oC
Speed (ns)
60
16
Order Part No.
Package
IS41LV85125B-60K
IS41LV85125B-60KL
28-pin, 400-mil SOJ
28-pin, 400-mil SOJ, Lead-free
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
04/19/05
ISSI
PACKAGING INFORMATION
®
400-mil Plastic SOJ
Package Code: K
N
Notes:
1. Controlling dimension:
millimeters.
2. BSC = Basic lead spacing
between centers.
3. Dimensions D and E1 do not
include mold flash protrusions
and should be measured from
the bottom of the package.
4. Reference document: JEDEC
MS-027.
N/2+1
E1
1
E
N/2
SEATING PLANE
D
b
A
C
A2
e
Symbol
No. Leads
A
A1
A2
B
b
C
D
E
E1
E2
e
B
Millimeters
Inches
Min Max
Min
Max
(N)
28
3.25 3.75
0.128 0.148
0.64 —
0.025
—
2.08 —
0.082
—
0.38 0.51
0.015 0.020
0.66 0.81
0.026 0.032
0.18 0.33
0.007 0.013
18.29 18.54
0.720 0.730
11.05 11.30
0.435 0.445
10.03 10.29
0.395 0.405
9.40 BSC
0.370 BSC
1.27 BSC
0.050 BSC
A1
E2
Millimeters
Min Max
Inches
Min Max
Millimeters
Min Max
32
3.25 3.75
0.64 —
2.08 —
0.38 0.51
0.66 0.81
0.18 0.33
20.82 21.08
11.05 11.30
10.03 10.29
9.40 BSC
1.27 BSC
0.128 0.148
0.025
—
0.082
—
0.015 0.020
0.026 0.032
0.007 0.013
0.820 0.830
0.435 0.445
0.395 0.405
0.370 BSC
0.050 BSC
3.25 3.75
0.64 —
2.08 —
0.38 0.51
0.66 0.81
0.18 0.33
23.37 23.62
11.05 11.30
10.03 10.29
9.40 BSC
1.27 BSC
Inches
Min Max
36
0.128 0.148
0.025
—
0.082
—
0.015 0.020
0.026 0.032
0.007 0.013
0.920 0.930
0.435 0.445
0.395 0.405
0.370 BSC
0.050 BSC
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
10/29/03
ISSI
PACKAGING INFORMATION
Millimeters
Inches
Symbol Min Max
Min
Max
No. Leads (N)
40
A
3.25 3.75
0.128 0.148
A1
0.64 —
0.025
—
A2
2.08 —
0.082
—
B
0.38 0.51
0.015 0.020
b
0.66 0.81
0.026 0.032
C
0.18 0.33
0.007 0.013
D
25.91 26.16
1.020 1.030
E
11.05 11.30
0.435 0.445
E1
10.03 10.29
0.395 0.405
E2
9.40 BSC
0.370 BSC
e
1.27 BSC
0.050 BSC
Millimeters
Min Max
Inches
Min Max
Millimeters
Min
Max
42
3.25 3.75
0.64 —
2.08 —
0.38 0.51
0.66 0.81
0.18 0.33
27.18 27.43
11.05 11.30
10.03 10.29
9.40 BSC
1.27 BSC
0.128 0.148
0.025
—
0.082
—
0.015 0.020
0.026 0.032
0.007 0.013
1.070 1.080
0.435 0.445
0.395 0.405
0.370 BSC
0.050 BSC
3.25 3.75
0.64 —
2.08 —
0.38 0.51
0.66 0.81
0.18 0.33
28.45 28.70
11.05 11.30
10.03 10.29
9.40 BSC
1.27 BSC
®
Inches
Min
Max
44
0.128 0.148
0.025
—
0.082
—
0.015 0.020
0.026 0.032
0.007 0.013
1.120 1.130
0.435 0.445
0.395 0.405
0.370 BSC
0.050 BSC
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
2
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
10/29/03
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