HP HSME-C110 Alingap green chipled Datasheet

AgilentHSME-C110/C120/C150/
C170/C177/C190/C191/C197/C265
AlInGaP Green ChipLED
Data Sheet
Features
• Small size
• Industry standard footprint
• Operating temperature range of
–30˚C to +85˚C
• Compatible with IR soldering
• Available in 8 mm tape on
7" diameter reel
• Reel sealed in zip-locked
moisture barrier bags
Description
This chip-type LED utilizes Aluminum Indium Gallium Phosphide
(AlInGaP) material technology. The
AlInGaP material has a very high
luminous efficiency, capable of
producing high light output.
These chipLEDs come in top
mounting, top emitting packages
(HSMx-C150/170/177/190/191/197),
top mounting, side emitting packages (HSMx-C110/120) or reverse
mounting, top emitting package
(HSMx-C265).
All packages are binned by both
color and intensity.
In order to facilitate pick and
place operation, these chipLEDs
are shipped in Tape & Reel, with
4000 units per reel for HSMxC120/170/ 177/190/191/197 and
3000 units per reel for HSMxC110/C150/265.
Applications
• Membrane switch indicator
• LCD backlighting
• Pushbutton backlighting
• Front panel indicator
• Symbol backlighting
• Keypad backlighting
These packages are compatible
with reflow soldering process.
Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of
the product(s) at anytime.
Package Dimensions
CATHODE
LINE
LED DIE
CATHODE
MARK
LED DIE
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
3.2 (0.126 )
2.00 (0.079 )
POLARITY
CLEAR
EPOXY
0.62 (0.024)
1.40
(0.055)
DIFFUSED
EPOXY
POLARITY
1.5 (0.059)
0.30 (0.012)
PC BOARD
PC BOARD
1.6 (0.063 )
0.80 (0.031)
0.30 (0.012)
0.5 (0.020)
CATHODE LINE
3.2 (0.126 )
0.8 (0.031)
CATHODE LINE
0.40 ± 0.15
(0.016 ± 0.006)
0.40 ± 0.15
(0.016 ± 0.006)
1.0 (0.039)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C110
HSMx-C170
CATHODE
MARK
LED DIE
CATHODE
MARK
LED DIE
0.8 (0.031)
0.8 (0.031)
0.4 (0.016)
1.6
(0.063 )
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
1.0
(0.039)
POLARITY
POLARITY
0.3 (0.012)
0.3 (0.012)
DIFFUSED EPOXY
DIFFUSED EPOXY
PC BOARD
0.8 (0.031)
0.3 (0.012)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
PC BOARD
0.6 (0.023)
0.3 (0.012)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C190
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
HSMx-C191
CATHODE
MARK
LED DIE
3.40 (0.134)
CATHODE
MARK (ETCHED)
LED DIE
1.6 (0.063)
1.25 (0.049)
0.8 (0.031)
3.2 (0.126 )
DIFFUSED
EPOXY
POLARITY
2.0 (0.079)
0.6 (0.024)
1.1 (0.043)
PC BOARD
POLARITY
1.20
(0.047)
UNDIFFUSED
EPOXY
2– 1.10 (0.043)
1.10 (0.043)
PC BOARD
0.5 (0.020)
CATHODE LINE
0.30 (0.012)
0.5 ± 0.2
(0.020 ± 0.008)
0.5 ± 0.2
(0.020 ± 0.008)
CATHODE LINE
2– 0.50 ± 0.15
(0.020 ± 0.006)
SOLDERING
TERMINAL
HSMx-C265
HSMx-C150
CATHODE MARK
CATHODE MARK
LED DIE
LED DIE
0.6
(0.024)
0.80 (0.031)
1.6
(0.063)
0.40
(0.016)
1.60
(0.063)
POLARITY
CLEAR
EPOXY
DIFFUSED
EPOXY
0.3
(0.012)
POLARITY
1.2
(0.047)
0.40 (0.016)
PC BOARD
1.0 (0.039)
0.5 (0.020)
PC BOARD
0.16 (0.006)
0.30 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
3 – 0.3 (0.012)
CATHODE LINE
0.70
(0.028) MIN.
SOLDERING
TERMINAL
HSMx-C197
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3
SOLDERING
TERMINAL
HSMx-C120
Package Dimensions, continued
CATHODE MARK
LED DIE
1.25
(0.049)
0.62
(0.025)
2.00
(0.079)
POLARITY
DIFFUSED EPOXY
0.40 (0.016)
PC BOARD
0.16
(0.006)
0.40 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
1.10 (0.043)
SOLDERING
TERMINAL
HSMx-C177
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
4
Device Selection Guide
Package Dimension (mm)[1,2]
AlInGaP Green
Package Description
1.6 (L) x 0.8 (W) x 0.6 (H)
HSME-C191
Untinted, Diffused
1.6 (L) x 0.8 (W) x 0.4 (H)
HSME-C197
Untinted, Diffused
1.6 (L) x 0.8 (W) x 0.8 (H)
HSME-C190
Untinted, Diffused
2.0 (L) x 1.25 (W) x 0.8 (H)
HSME-C170
Untinted, Diffused
2.0 (L) x 1.25 (W) x 0.4 (H)
HSME-C177
Untinted, Diffused
1.6 (L) x 0.6 (W) x 1.0 (H)
HSME-C120
Untinted, Non-diffused
3.2 (L) x 1.0 (W) x 1.5 (H)
HSME-C110
Untinted, Non-diffused
3.2 (L) x 1.6 (W) x 1.1 (H)
HSME-C150
Untinted, Diffused
3.4 (L) x 1.25 (W) x 1.1 (H)
HSME-C265
Untinted, Non-diffused
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Absolute Maximum Ratings at TA = 25°C
HSME-C110/120/170/177/
190/191/197/150/265
Units
20
mA
Power Dissipation
52
mW
Reverse Voltage (IR = 100 µA)
5
V
LED Junction Temperature
95
°C
Operating Temperature Range
–30 to +85
°C
Storage Temperature Range
–40 to +85
°C
Soldering Temperature
See reflow soldering profile (Figures 6 & 7)
Parameter
DC Forward
Current[1,2]
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive current above 5 mA is recommended for best long term performance.
Electrical Characteristics at TA = 25°C
5
Part Number
Forward Voltage
VF (Volts)
@ IF = 20 mA
Typ.
Max.
Reverse Breakdown
VR (Volts)
@ IR = 100 µA
Min.
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
Thermal
Resistance
RθJ–PIN (°C/W)
Typ.
HSME-C110/120
2.1
2.6
5
18
550
HSME-C150/170/177/190/191/197
2.1
2.6
5
15
450
HSME-C265
2.1
2.6
5
16
450
Optical Characteristics at TA = 25°C
Part Number
Luminous Intensity
IV (mcd) @ 20 mA[1]
Min.
Typ.
Peak Wavelength
λpeak (nm)
Typ.
Color, Dominant
Wavelength
λd[2] (nm)
Typ.
Viewing Angle
2 θ1/2 Degrees[3]
Typ.
Luminous Efficacy
ηV(lm/w)
Typ.
HSME-C110
18
52
570
572
130
570
HSME-C120
18
52
570
572
155
570
HSME-150/170/
190/191
18
50
570
572
170
570
HSME-C177/197
18
50
570
572
130
570
HSME-C265
18
50
570
572
170
570
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp
package.
2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Green Color Bin Limits[1]
Light Intensity (IV) Bin Limits[1]
Intensity (mcd)
Dom. Wavelength (nm)
Bin ID
Min.
Max.
Bin ID
Min.
Max.
A
561.5
564.5
A
0.11
0.18
B
564.5
567.5
B
0.18
0.29
C
567.5
570.5
C
0.29
0.45
D
570.5
573.5
D
0.45
0.72
E
573.5
576.5
E
0.72
1.10
F
1.10
1.80
G
1.80
2.80
H
2.80
4.50
J
4.50
7.20
K
7.20
11.20
L
11.20
18.00
M
18.00
28.50
N
28.50
45.00
P
45.00
71.50
Q
71.50
112.50
R
112.50
180.00
S
180.00
285.00
T
285.00
450.00
U
450.00
715.00
Tolerance: ± 0.5 nm
Tolerance: ± 15%
Note:
1. Bin categories are established for classification of products. Products may not be available in
all categories. Please contact your Agilent representative for information on currently
available bins.
6
100
80
70
60
50
40
30
20
10
0
400
450
500
550
600
650
10
1
0.1
1.5 1.6
700
1.7
1.8
1.9
Figure 1. Relative intensity vs. wavelength.
1.0
0.8
0.6
0.4
0.2
0
2.2
0
5
10
15
20
25
IF – FORWARD CURRENT – mA
Figure 3. Luminous intensity vs. forward
current.
100
25
RELATIVE INTENSITY – %
90
20
15
10
5
80
70
60
50
40
30
20
10
0
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0 10 20 30 40 50 60 70 80 90 100
0
10 20 30 40 50 60 70 80 90
ANGLE
TA – AMBIENT TEMPERATURE – °C
Figure 5a. Relative intensity vs. angle for HSMx-C170, HSMx-C190, HSMx-C191, and HSMx-C150.
100
90
RELATIVE INTENSITY – %
2.1
Figure 2. Forward current vs. forward voltage.
Figure 4. Maximum forward current vs.
ambient temperature.
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5b. Relative intensity vs. angle for HSMx-C177 and HSMx-C197.
7
2.0
VF – FORWARD VOLTAGE – V
WAVELENGTH - nm
IF MAX. – MAXIMUM FORWARD CURRENT – mA
1.2
LUMINOUS INTENSITY
(NORMALIZED @ 20 mA)
90
IF – FORWARD CURRENT – mA
RELATIVE INTENSITY – %
100
30
RELATIVE INTENSITY – %
100
80
60
40
20
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
20
40
60
80
100
ANGLE
RELATIVE INTENSITY – %
100
80
60
40
20
0
-100
-80
-60
-40
-20
0
ANGLE
Figure 5c. Relative intensity vs. angle for HSMx-C110.
100
RELATIVE INTENSITY – %
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
100
RELATIVE INTENSITY
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5d. Relative intensity vs. angle for HSMx-C120.
8
100
80
70
60
10 SEC. MAX.
50
TEMPERATURE
RELATIVE INTENSITY – %
90
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
230°C MAX.
4°C/SEC. MAX.
140-160°C
–3°C/SEC.
4°C/SEC.
MAX.
10 20 30 40 50 60 70 80 90
OVER 2 MIN.
TIME
ANGLE
Figure 5e. Relative intensity vs. angle for HSMx-C265.
Figure 6. Recommended reflow soldering profile.
10 to 20 SEC.
255 °C (+5/-0)
TEMPERATURE
217 °C
3 °C/SEC. MAX.
6 °C/SEC. MAX.
100 - 150 °C
2.2 (0.087) DIA. PCB HOLE
60 to 150 SEC.
MAX. 120 SEC.
1.25 (0.049)
TIME
1.4
(0.055)
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 7. Recommended Pb-free reflow soldering profile.
2.3
(0.091)
1.4
(0.055)
Figure 8. Recommended soldering pattern for HSMx-C265.
5.0 (0.200)
0.4 (0.016)
0.9 (0.035)
0.4 (0.016)
0.9 (0.035)
1.0 (0.039)
0.7 (0.028)
0.2 (0.008)
0.15 (0.006)
CENTERING
BOARD
0.8
(0.031)
1.2
(0.047)
0.8
(0.031)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
CENTERING
BOARD
Figure 10. Recommended soldering pattern for HSMx-C110.
Figure 9. Recommended soldering pattern for HSMx-C120.
0.8 (0.031)
1.5 (0.059)
1.2 (0.047)
1.2
(0.047)
1.2
(0.047)
0.9
(0.035)
Figure 11. Recommended soldering pattern
for HSMx-C170 and HSMx-C177.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
9
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 12. Recommended soldering pattern
for HSMx-C190, HSMx-C191 and HSMx-C197.
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 13. Recommended soldering pattern
for HSMx-C150.
USER FEED DIRECTION
CATHODE SIDE
xxx
xxxxx
xxxxx
xxxxx
xxxxx
xx
PRINTED LABEL
Figure 14. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
Figure 15. Reel dimensions.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
CARRIER TAPE
USER FEED
DIRECTION
2.00 ± 0.05
(0.079 ± 0.002)
DIM. A
DIM. B
DIM. C
± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004)
PART NUMBER
HSMx-C110/C120
POSITION IN
CARRIER TAPE
DIM. A
(SEE TABLE 1)
DIM. B
(SEE TABLE 1)
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
4.00 (0.157)
HSMx-C191 SERIES
HSMx-C190 SERIES
HSMx-C170 SERIES
HSMx-C110 SERIES
HSMx-C150 SERIES
1.86 (0.073)
1.80 (0.071)
2.30 (0.091)
3.35 (0.132)
3.50 (0.138)
0.89 (0.035)
0.95 (0.037)
1.45 (0.057)
1.85 (0.073)
1.88 (0.074)
0.87 (0.034)
0.87 (0.034)
0.95 (0.037)
1.20 (0.047)
1.27 (0.050)
HSMx-C120 SERIES
HSMx-C197 SERIES
HSMx-C177 SERIES
1.90 (0.075)
1.75 (0.069)
2.30 (0.091)
1.15 (0.045)
0.95 (0.037)
1.40 (0.055)
0.80 (0.031)
0.60 (0.024)
0.60 (0.024)
HSMx-C110
HSMx-C120
R 1.0 ± 0.05
R 0.5 ± 0.05
(0.039 ± 0.002) (0.020 ± 0.002)
4.00 (0.157)
CATHODE
1.50 (0.059)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
PART NUMBER
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057)
Figure 16. Tape dimensions.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
11
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
1.30 (0.051)
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 17. Tape leader and trailer dimensions.
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For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-7659EN
April 28, 2004
5989-0520EN
Convective IR Reflow Soldering
For more information on soldering, refer to Application Note
1060, Surface Mounting SMT
LED Indicator Components.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Storage Condition: 5 to 30˚ C @ 60%
RH max.
Baking is required under the condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 ± 5°C for 20 hours.
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