CEL NX6306GK 1310 nm ingaasp mqw dfb laser diode in can package for 155 mb/s and 622 mb/s application Datasheet

PRELIMINARY DATASHEET
NEC's 1310 nm InGaAsP MQW DFB
LASER DIODE IN CAN PACKAGE NX6306 SERIES
FOR 155 Mb/s and 622 Mb/s APPLICATIONS
DESCRIPTION
NEC's NX6306 Series is a 1 310 nm Multiple Quantum Well
NX6306S Series
(MQW) structured Distributed Feed-Back (DFB) laser diode
with InGaAs monitor PIN-PD.
This device is ideal for Gigabit Ethernet and Synchronous
Digital Hierarchy (SDH) system STM-1 (I-1, S-1.1, L-1.1),
STM-4 (I-4, S-4.1, L-4.1), ITU-T recommendations.
FEATURES
• OPTICAL OUTPUT POWER:
Po = 5.0 mW
NX6306G Series
• LOW THRESHOLD CURRENT:
lth = 10 mA @ TC = 25°C
• HIGH SPEED:
tr, tf = 0.5 ns MAX.
• 40% REDUCTION OF MOUNTING AREA:
APPLICATIONS
5-pin SOP × 2
• 156 Mb/s: STM-1 (I-1, S-1.1, L-1.1)
• SIDE MODE SUPPRESSION RATIO:
• 622 Mb/s: STM-4 (I-4, S-4.1, L-4.1)
SWSR = 45 dB @ TYP.
• InGaAs MONITOR PIN-PD
• 1.25 Gb/s: Gigabit Ethernet
• CAN PACKAGE:
φ 5.6 mm
• BASED ON TELCORDIA RELIABILITY
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
California Eastern Laboratories
1
NX6306 Series
PACKAGE DIMENSIONS (UNIT: mm)
NX6306S Series
5.6 +0.00
-0.03
4.2±0.1
3.55±0.05
BOTTOM VIEW
1.0±0.1
110º±2º
0.3 +0.1
-0.0
1
2
4
3
PIN CONNECTIONS
NX6306SK
NX6306SH
*1
0.33
0.25
1.0 MIN.
1 (CASE)
1 (CASE)
LD CHIP
LD
2
REFERENCE
PLANE
1.27±0.05
15.0±1.0 1.2±0.1 2.1±0.15
1.6±0.1
0.25±0.03
(GLASS)
0.3 +0.1
-0.0
PD
LD
2
4
4
PD
3
3
4– 0.45
2.0
P.C.D
*1 n = 1.48 Bolosilicate Glass
NX6306G Series
5.6 +0.00
-0.03
4.3±0.1
3.75±0.05
BOTTOM VIEW
1.0±0.1
1
110º±2º
0.3+0.1
-0.0
2
0.3 +0.1
-0.0
3
Focal Point
PIN CONNECTIONS
NX6306GH
8.5±1.0
15.0±1.0 1.2±0.1 3.97±0.1
4
NX6306GK
1 (CASE)
1 (CASE)
LD
2
PD
4– 0.45
2.0
P.C.D
2
3
4
LD
2
4
PD
3
NX6306 Series
ORDERING INFORMATION
NX6306S Series
PART NUMBER
NX6306SH
PACKAGE
PIN CONNECTIONS
4-pin CAN with flat glass cap
1
LD
2
PD
NX6306SK
4
3
1
LD
2
4
PD
3
NX6306G Series
PART NUMBER
NX6306GH
PACKAGE
PIN CONNECTIONS
4-pin CAN with aspherical lens cap
1
LD
2
PD
NX6306GK
4
3
1
LD
2
4
PD
3
3
NX6306 Series
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATINGS
UNIT
Optical Output Power
Po
10
mW
Forward Current of LD
IF
150
mA
Reverse Voltage of LD
VR
2.0
V
Forward Current of PD
IF
10
mA
Reverse Voltage of PD
VR
20
V
Operating Case Temperature
TC
−40 to +85
°C
Storage Temperature
Tstg
−40 to +85
°C
Assembly Temperature
Tasb
150 (15 Hr)
°C
Lead Soldering Temperature
Tsld
350 (3 sec.)
°C
Relative Humidity (noncondensing)
RH
85
%
ELECTRO-OPTICAL CHARACTERISTICS (TC = 25ºC, unless otherwise specified)
PARAMETER
SYMBOL
Operating Voltage
Vop
Threshold Current
Ith
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1.1
1.6
V
10
20
mA
TC = 85°C
30
40
100
200
Po = 5.0 mW, TC = −40 to +85°C
Threshold Output Power
Pth
TC = −40 to +85°C, IF = Ith
Differential Efficiency
ηd
(Flat glass type: NX6306S Series)
0.2
0.35
W/A
(Aspherical lens type: NX6306G Series)
0.2
0.3
W/A
−3.0
−2.5
dB
Temperature Dependence of
Differential Efficiency
Δηd
Peak Emission Wavelength
λp
Po = 5.0 mW, RMS (−20 dB),
TC = −40 to +85°C
1 280
SMSR
Po = 5.0 mW, RMS (−20 dB),
TC = −40 to +85°C
30
Side Mode Suppression Ratio
Δηd = 10 log
Vertical Beam Angle *1
ηd (@ 85ºC)
μW
ηd (@ 25ºC)
1 335
45
nm
dB
θ⊥
Po = 5.0 mW, FAHM *2
35
40
deg.
θ//
Po = 5.0 mW,
FAHM *2
30
35
deg.
Rise Time
tr
10-90%
0.5
ns
Fall Time
tf
90-10%
0.5
ns
Monitor Current
Im
VR = 5 V, Po = 5.0 mW
600
1 000
μA
Monitor Dark Current
ID
VR = 5 V
0.1
10
nA
Lateral
Beam Angle *1
200
VR = 5 V, TC = −40 to +85°C
Monitor PD Terminal Capacitance
Tracking
Error *3
Ct
VR = 5 V, f = 1 MHz
γ
Im = const. (@ Po = 5.0 mW, TC = 25°C)
TC = −40 to +85°C
*1 Applicable to only NX6306S Series
*2 FAHM: Full Angle at Half Maximum
4
500
6
−1.0
20
pF
1.0
dB
NX6306 Series
3 Tracking Error: γ
Po
� = 10 log
(mW)
TC = 25ºC
5.0
Po
5.0
[dB]
TC = -40 to +85ºC
Po
0
Im
(mA)
Im
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
01/25/2005
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
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