ON LC72717PW Mobile fm multiplex broadcast receiver ic Datasheet

LC72717PW
Mobile FM Multiplex Broadcast
(DARC) Receiver IC
Overview
The LC72717PW is a data demodulation LSI for receiving FM multiplex
broadcasts for mobile reception in the DARC format. This LSI includes an
on-chip bandpass filter for extracting the DARC signal from the FM
baseband signal. It also supports ITU-R recommended FM multiplex frame
structures (methods A, A’, B, and C) and can implement a compact,
multifunction DARC reception system.
The LC72717PW’s package, pin assignment and electrical characteristics
are same as the LC72715PW (VICS-LSI). Functionally, the LC72717PW is
a product that VICS function is removed from the LC72715PW.
The LC72717PW is also control-compatible with the LC72711LW.
Note that a contract with the NHK Engineering System, Inc. may be
required to produce DARC compatible products in case, please contact with
the NHK Engineering System, Inc.
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SPQFP64 10x10 / SQFP64
Functions
 Adjustment-free 76 kHz SCF bandpass filter
 Supports all FM multiplex frame structures
(methods A, A’, B and C) under CPU control.
 MSK delay detection system based on a 1T delay.
 Error correction function based on a 2T delay
(in the MSK detection stage)
 Digital PLL based clock regeneration function
 Shift-register 1T and 2T delay circuits
 Block and frame synchronization detection circuits
 Functions for setting the number of allowable BIC errors and the number
of synchronization protection operations.
 Error correction using (272, 190) codes
 Built-in layer 4 CRC code checking circuit
 On-chip frame memory and memory control circuit for vertical correction
 7.2 MHz crystal oscillator circuit
 Two power saving modes: STNBY and EC STOP
 Applications can use either a parallel CPU interface (DMA) or a CCB*
serial interface.
 Supply voltage: 2.7 V to 3.6 V
* Computer Control Bus (CCB) is an ON Semiconductor’s original bus format and
the bus addresses are controlled by ON Semiconductor.
ORDERING INFORMATION
See detailed ordering and shipping information on page 27 of this data sheet.
© Semiconductor Components Industries, LLC, 2017
June 2017 - Rev. 3
1
Publication Order Number :
LC72717PW/D
LC72717PW
Specifications
Absolute Maximum Ratings at Ta = 25C, VSS = 0 V
Parameter
Symbol
Maximum supply voltage
VDD
Input voltage
VIN1
VIN2
VOUT
Output voltage
Output current
IOUT1
IOUT2
Allowable output current (total)
ITTL
Allowable power dissipation
Pd max
Operating temperature
Topr
Storage temperature
Tstg
Conditions
Ratings
Unit
0.3 to +4.0
V
A0/CL, A1/CE, A2/DI, RST, STNBY
(VDD is equal to 2.7 V or more.)
0.3 to +5.6
V
A0/CL, A1/CE, A2/DI, RST, STNBY
(VDD is less than 2.7 V.)
0.3 to VDD+0.3
V
Input pin other than VIN1
0.3 to VDD+0.3
V
Output pin
0.3 to VDD+0.3
V
INT, RDY, DREQ, D0 to D15, DO
0 to 2.0
mA
Output pin other than IOUT1
Total for all the output pins
0 to 1.0
mA
Ta  85C
10
mA
200
mW
40 to +85
C
55 to +125
C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
Allowable Operating Ranges at Ta = 40C to +85C, VSS = 0 V
Parameter
Symbol
Supply voltage
VDD
Input high-level
voltage
VIH1
FOSC
A0/CL, A1/CE, A2/DI,
RST, STNBY
IOCNT1, IOCNT2,
DACK, D0, D1, D2, D3,
D4, D5, D6, D7, WR,
RD, A3, CS
SP, BUSWD, TIN,
TPC1, TPC2, TOSEL1,
TOSEL2
A0/CL, A1/CE, A2/DI,
RST, STNBY
IOCNT1, IOCNT2,
DACK, D0, D1, D2, D3,
D4, D5, D6, D7, WR,
RD, A3, CS
SP, BUSWD, TIN,
TPC1, TPC2, TOSEL1,
TOSEL2
XIN, XOUT
VXI
XIN
VMPX1
MPXIN
VIH2
VIH3
Input low-level
voltage
VIL1
VIL2
VIL3
Oscillation
frequency
XIN input
sensitivity
Input amplitude
Pin Name
VMPX2
MPXIN
Type
Conditions
Schmitt
Ratings
min
typ
max
unit
2.7
3.6
V
0.7VDD
5.5
V
0.7VDD
VDD
V
0.7VDD
VDD
V
0.0
0.3VDD
V
0.0
0.3VDD
V
0.0
0.3VDD
V
Schmitt
Schmitt
Schmitt
Oscillation
circuit
SCF
SCF
Within
250 ppm
Capacitive
coupling
100%
demodulation
composite
VDD = 3.3 V
100%
demodulation
composite
VDD = 2.7 V
7.2
MHz
400
mVrms
120
500
mVrms
120
450
mVrms
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.
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2
LC72717PW
Electrical Characteristics at Ta = 40C to +85C, VDD = 2.7 V to 3.6 V, VSS = 0 V
Parameter
Input high-level
current
Symbol
IIH1
IIH2
IIH3
Input low-level
current
IIL1
IIL2
IIL3
Output high-level
voltage
VOH1
VOH2
Output low-level
voltage
VOL1
VOL2
VOL3
Output leakage
current
Hysteresis voltage
Internal feedback
resistance
Current drain
Pin Name
Type
A0/CL, A1/CE, A2/DI, RST,
STNBY
IOCNT1, IOCNT2, DACK
D0, D1, D2, D3, D4, D5, D6,
D7, WR, RD, A3, CS
SP, BUSWD, TIN, TPC1,
TPC2, TOSEL1, TOSEL2
A0/CL, A1/CE, A2/DI, RST,
STNBY
IOCNT1, IOCNT2, DACK
D0, D1, D2, D3, D4, D5, D6,
D7, WR, RD, A3, CS
SP, BUSWD, TIN, TPC1,
TPC2, TOSEL1, TOSEL2
CLK16, DATA, FLOCK,
BLOCK, FCK, BCK, CRC4
DREQ, RDY, D0, D1, D2, D3,
D4, D5, D6, D7, D8, D9, D10,
D11, D12, D13, D14, D15, INT
CLK16, DATA, FLOCK,
BLOCK, FCK, BCK, CRC4
DREQ, RDY, D0, D1, D2, D3,
D4, D5, D6, D7, D8, D9, D10,
D11, D12, D13, D14, D15, INT
DO
Schmitt
IOFF
DO
VHYS
A0/CL, A1/CE, A2/DI, RST,
STNBY, IOCNT1, IOCNT2,
DACK, D0, D1, D2, D3, D4,
D5, D6, D7, WR, RD, A3, CS
XIN, XOUT
RF
Ratings
Conditions
min
typ
max
unit
1.0
A
1.0
A
1.0
A
Schmitt
Schmitt
1.0
A
1.0
A
1.0
A
IOH =
1 mA
VDD0.4
V
IOH =
2 mA
VDD0.4
V
Schmitt
CMOS
CMOS
CMOS
CMOS
NchOpen
Drain
IOL =
1 mA
0.4
V
IOL =
2 mA
0.4
V
IOL =
2 mA
0.4
V
VO = VDD
1.0
A
0.1VDD
V
1.0
IDD
MΩ
6
12
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
Bandpass Filter Characteristics at Ta = 25C, VDD = 2.7 V to 3.6 V, VSS = 0 V
Parameter
Symbol
Conditions
Input resistance
RMPX
Reference supply voltage output
VREF
Vref, Vdda = 3 V
BPF center frequency
FC
3 dB band width
Ratings
min
typ
max
50
unit
k
1.5
V
FLOUT
76.0
kHz
FBW
FLOUT
19.0
Group-delay in band width
DGD
FLOUT
Gain
Gain
FLOUT-MPXIN, f = 76 kHz
Attenuation characteristic
ATT1
FLOUT, f = 50 kHz
25
dB
ATT2
FLOUT, f = 100 kHz
15
dB
ATT3
FLOUT, f = 30 kHz
50
dB
ATT4
FLOUT, f = 150 kHz
50
dB
kHz
7.5
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3
20
s
dB
LC72717PW
Error correction
and
Layer 2 CRC
Frame
memory
Reference
voltage
Vssa
Vref
MPXIN
Antialiasing filter
Vdda
FLOUT
76kHz
BPF(SCF)
PN
demodulation
Parallel IF
Vref
CCB IF
Output control
and
CPU register
Timing
control
+
CIN
LPF
Internal clock
Vssd
Vddd
INT
CS
A3
A2/DI
A1/CE
A0/CL
RD
WR
DO
BUSWD
SP
RST
STNBY
Block Diagram
MSK correction
circuit
Synchronization
regeneration
Layer 4
CRC
CRC4
DREQ
DACK
Vssd
Vddd
RDY
Vssd
XIN
Clock
regeneration
1T Delay
FLOCK
BLOCK
FCK
BCK
2T Delay
Divider
CLK16
DATA
XOUT
Vddd
IOCNT1
IOCNT2
LPF
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4
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
LC72717PW
Package Dimensions
unit : mm
SPQFP64 10x10 / SQFP64
CASE 131AK
ISSUE A
0.5±0.2
12.0±0.2
12.0±0.2
64
10.0±0.1
10.0±0.1
1 2
+0.08
0.5
0.15±0.05
0.18 −0.03
0.10
1.7 MAX
(1.5)
(1.25)
0.1±0.1
0 to10°
0.10
GENERIC MARKING DIAGRAM*
SOLDERING FOOTPRINT*
11.40
XXXXXXXX
YDD
XXXXXXXX
YMDDD
(Unit: mm)
11.40
XXXXX = Specific Device Code
Y = Year
DD = Additional Traceability Data
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
0.50
0.28
1.00
*This information is generic. Please refer to
device data sheet for actual part marking.
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
LC72717PW
BUSWD
SP
RST
STNBY
CS
A3
A2/DI
A1/CE
A0/CL
RD
WR
NC
DO
Vssd
Vddd
INT
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
Pin Assignment
TIN
49
32
D15
NC
50
31
D14
Vssa
51
30
D13
Vref
52
29
D12
MPXIN
53
28
D11
Vdda
54
27
D10
FLOUT
55
26
D9
CIN
56
25
D8
NC
57
24
D7
TPC1
58
23
D6
TPC2
59
22
D5
TEST
60
21
D4
TOSEL1
61
20
D3
TOSEL2
62
19
D2
Vssd
63
18
D1
XIN
64
17
D0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
XOUT
Vddd
IOCNT1
IOCNT2
CLK16
DATA
FLOCK
BLOCK
FCK
BCK
CRC4
DREQ
DACK
Vssd
Vddd
RDY
LC72717PW
Top view
List of Pin Functions
Pin No.
Name of Pin
IO Form
State with RST=”L”
Description of Functions
1
XOUT
O
Oscillation
2
Vddd
-
-
3
IOCNT1
I
Input
4
IOCNT2
I
Input
5
CLK16
O
L
Clock regeneration monitor pin
Pin for system clock (crystal oscillator)
Digital power pin
Data bus I/O control 1 input pin (Parallel IF)
* Connect to Vssd when CCB IF (SP=H) is to be used.
Data bus I/O control 2 input pin (Parallel IF)
* Connect to Vssd when CCB IF (SP=H) is to be used.
6
DATA
O
L
Demodulation data monitor pin
7
FLOCK
O
L
Frame synchronization flag output pin (H: synchronized)
8
BLOCK
O
L
Block synchronization flag output pin (H: synchronized)
9
FCK
O
L
Frame start signal output pin
10
BCK
O
L
Block start signal output pin
11
CRC4
O
H
Layer 4 CRC check result output pin
12
DREQ
O
H
DMA REQ signal output pin (parallel IF)
13
DACK
I
Input
14
Vssd
-
-
Digital GND pin
15
Vddd
-
-
Digital power pin
16
RDY
O
H
Read data READY signal output pin (parallel IF)
DMA ACK signal input pin (parallel IF)
* Connect to Vddd when CCB IF (SP=H) is to be used.
Continued on next page.
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6
LC72717PW
Continued from preceding page.
Pin No.
Name of Pin
IO Form
Description of Functions
State with RST=”L”
17
D0
I/O
Input
Data bus 0 to 7 I/O pins (parallel IF)
18
D1
I/O
Input
Bus width switched to 8 bits or 16 bits according to the BUSWD setting
19
D2
I/O
Input
20
D3
I/O
Input
21
D4
I/O
Input
22
D5
I/O
Input
23
D6
I/O
Input
24
D7
I/O
Input
25
D8
O
Hi-Z
Data bus 8 to 15 output pins (parallel IF)
26
D9
O
Hi-Z
* Output OFF for 8 bit bus width (BUSWD=L)
27
D10
O
Hi-Z
28
D11
O
Hi-Z
29
D12
O
Hi-Z
30
D13
O
Hi-Z
31
D14
O
Hi-Z
32
D15
O
Hi-Z
33
INT
O
H
Interrupt output pin for external CPU
34
Vddd
-
-
Digital power pin
35
Vssd
-
-
Digital GND pin
36
DO
O
Hi-Z(H)
37
NC
-
-
38
WR
I
Input
39
RD
I
Input
40
A0/CL
I
Input
CL input pin (CCB IF)/ address input pin 0 (parallel IF)
41
A1/CE
I
Input
CE input pin (CCB IF)/ address input pin 1 (parallel IF)
42
A2/DI
I
Input
DI input pin (CCB IF)/ address input pin 2 (parallel IF)
43
A3
I
Input
44
CS
I
Input
45
STNBY
I
Input
Standby mode input pin (H: standby)
46
RST
I
Input
System reset input pin (L: reset)
47
SP
I
Input
CCB/parallel setting input pin (H: CCB, L: parallel)
48
BUSWD
I
Input
Data bus width setting input pin (L: 8 bits, H: 16 bits)
49
TIN
I
Input
Test input pin (This pin must be connected to Vssd.)
50
NC
-
-
NC pin (This pin must be open.)
51
Vssa
-
-
Analog GND pin
52
Vref
AO
Vdda/2
53
MPXIN
AI
Input
54
Vdda
-
-
55
FLOUT
AO
Vdda/2
56
CIN
AI
Input
57
NC
-
-
58
TPC1
I
Input
Test input pin (This pin must be connected to Vssd.)
59
TPC2
I
Input
Test input pin (This pin must be connected to Vssd.)
60
TEST
I
Input
Test mode setting pin (This pin must be connected to Vssd.)
61
TOSEL1
I
Input
Test input pin (This pin must be connected to Vssd.)
62
TOSEL2
I
Input
Test input pin (This pin must be connected to Vssd.)
63
Vssd
-
-
64
XIN
I
Oscillation
* Connect to Vssd when CCB IF (SP=H) is to be used.
D O output pin (CCB IF)
NC pin (This pin must be open.)
Write control signal input pin (parallel IF)
* Connect to Vddd when CCB IF (SP=H) is to be used.
Read control signal input pin (parallel IF)
* Connect to Vddd when CCB IF (SP=H) is to be used.
Address input pin 3 (parallel IF)
* Connect to Vssd when CCB IF (SP=H) is to be used.
Chip selector input pin (parallel IF)
* Connect to Vddd when CCB IF (SP=H) is to be used.
Reference voltage output pin (Vdda/2)
Baseband (multiplex) signal input pin
Analog power pin
Subcarrier output pin (76kHz BPF output)
Subcarrier input pin (comparator input)
NC pin (This pin must be open.)
Digital GND pin
System clock pin (crystal oscillator/external clock input)
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7
LC72717PW
Internal Equivalent Circuit of Analog Pins
Name of pin
Internal equivalent circuit
Pin number in parentheses
MPXIN(53)
+
FLOUT(55)
-
+
CIN(56)
Vref
Vdda
Vref(52)
Vssa
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8
LC72717PW
CPU Interface <CCB Mode>
CCB (Computer Control Bus), which is the ON Semiconductor original serial bus format for ON Semiconductor’s
acoustic LSIs, performs data input and output.
The CCB address is transmitted with CE= “L”, acknowledging the CCB I/O mode when CE is set to “H”.
(1) List of CCB modes
CCB address
I/O mode
Hexadecimal
B0
B1
B2
B3
A0
A1
A2
A3
FAh
0
1
0
1
1
1
1
1
Input
FBh
1
1
0
1
1
1
1
1
Output
FCh
0
0
1
1
1
1
1
1
Input
Fad
1
0
1
1
1
1
1
1
Output
Description
16-bit control data input
Output of data corresponding to the
input clock (CL) portion
Layer 4 CRC check circuit data input
(on the 8-bit units)
Output of the register only
(2) Data input (CCB address FAh)
This is to set data to the LSI internal register. DI input includes both CCB address FAh and 16-bit data (DI0 to
DI15) are input.
Assignment of each bit is as shown in the table below. Though DI12 to DI15 are invalid data, it is necessary to enter
the arbitrary data so that the total of 16 bits can be obtained. For the contents of each register and register address,
refer to the chapter of CPU registers.
(Note that writing into the layer 4 CRC check register will be described later (for the CCB address, use FCh.))
(LSB)
Input data (8-bit)
(MSB)
Register address
Invalid data
DI0
DI1
DI2
DI3
DI4
DI5
DI6
DI7
DI8
DI9
DI10
DI11
DI12 to DI15
BIT0
BIT1
BIT2
BIT3
BIT4
BIT5
BIT6
BIT7
BIT0
BIT1
BIT2
BIT3
BIT4 to BIT7
tES
tEL
CE
tCL
tCH
tEH
CL
tSU
DI
tHD
B0
B1
B2
B3
A0
A1
A3
A2
DI0
DI1
DI13
DI14
DI15
tLC
Internal data latch
(3) Output of the corrected data (CCB address FBh)
The corrected packet data is output from LSI. The CCB address, FBh, is input in DI.
The valid data to be output is maximum 288 bits. If the clock input (CL input) is interrupted halfway to set CE to the
“L” level, data output is not troubled by the next interrupt.
The maximum data to be output is 288 bits (36 bytes) and the leading two bytes, to which the status register
(STAT) contents and the block number register (BLNO) contents are added, are output.
STAT and BLNO, which are the register contents outputs, are output respectively with LSB first.
The corrected data is output sequentially beginning with the leading bit in data of one block.
The BIC code is not output.
In case of data reading for multiple times by one interrupt signal (INT), the output data is not guaranteed.
STAT (8)
BLN0 (8)
Data block (176)
D O 0 to D O 7
D O 8 to D O 15
D O 16
to
Error-corrected data
Layer 2 CRC (14)
Parity (82)
D O 191
D O 192 to D O 205
D O 206 to D O 287
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9
LC72717PW
tES
tEL
CE
tCH
tEH
tCL
CL
tHD
tSU
DI
B1
B0
B2
A1
A0
B3
A2
A3
tDDO
DO0
DO
tDDO2
DO1
DO2
DO285 DO286
DO287
(4) Layer 4 CRC check circuit (CCB address FCh)
This is a function to detect the error in the data group (Layer 4 CRC), transmitting the data group of specified
number of bytes, via the CCB interface, to LSI. The CCB address is FCh. In this case, it is not necessary to send
register address.
The length of data group to be transmitted is on the 8-bit units. Here is not any upper limit (such as N pieces in the
figure below) for the length of data to be transmitted at a time and data transmission can be divided into multiple
times.
tES
tEL
CE
tCL
tCH
tEH
CL
tHD
tSU
DI
B0
B1
B2
B3
A1
A0
A2
A3
CR0
N-3
CR1
N-1
N-2
tCRC
CRC4 pin output
Note: The number of Ns must be on the 8-bit units.
Output after
transmission
of N pieces
(5) Register output (CCB address Fad)
This is the dedicated register that can read only the status register (STAT) and block number register (BLNO) in LSI.
To DI, the CCB address (Fad) is input. Data is output in order of the status register and the block number register.
tEL
tES
CE
tCH
tEH
tCL
CL
tSU
DI
tHD
B0
B1
B2
B3
A0
A1
A2
A3
tDDO
DO
ST0
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10
tDDO2
ST1
ST2
BLN5
BLN6
BLN7
LC72717PW
Symbol
tCL
Parameter
Clock “L” level time
min
typ
max
unit
s
0.7
tCH
Clock “H” level time
0.7
s
tSU
Data setup time
0.7
s
tHD
Data hold time
0.7
s
tEL
CE wait time
0.7
s
tES
CE setup time
0.7
s
tEH
CE hold time
0.7
s
tLC
Data latch change time
0.7
tDDO*1
DO data output time
135
TDDO2
DO data output off time
135
tCRC
320
s
ns
ns
CRC4 change period
0.7
s
*1 DO data output change time from the “H” level to the “L” level. Output change time from the “L” level to the “H”
level is determined by the external pull-up resistance value and load capacitance value.
CPU Interface <Parallel Mode>
This LSI can perform control via the parallel interface, in addition to the CCB interface. To use the parallel interface, it
is necessary to set the SP pin = L. The data bus width can be selected with the BUSWD pin. (BUSWD pin - L: 8 bits,
H: 16 bits)
The DMA transmission method can also be selected according to the setting of control register.
(1) Data input (register setting)
Data is set to the register in LSI. For accessing, input the register address to A0 to A3 pins and the write data to the
D(n) pin.
Set the CS pin = L, and then the WR pin = L. Subsequently, by setting the WR pin = H and the CS pin = H after the
tWWRL period, the data can be set to the register. It is necessary to keep an interval of tCYWR or more before the
next data input.
tSAWR
tWWRL
tHAWR
A0 to A3
CS
tCYWR
WR
tWDH
tWDS
D(n)
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LC72717PW
(2) Register output
This is to read data from the register in LSI. Only the status register (STAT) and block number register (BLNO) in
LSI can be read.
For accessing, input the register address in A0 to A3, set the CS pin = L, and then the RD pin = L. This causes the
RDY pin to change from “H” to “L”. Then, data is output from the D(n) pin after the RDY pin becomes “H”. It is
necessary to keep an interval of tCYRD or more before the next data output. (n: 0-7 for BUSWD=L and 0 – 15 for
BUSWD=H.)
By setting bit 3 (RDY) = 1 of the control register 2, the RDY pin output method can be changed. In this case, the
RDY pin changes from “H” to “L” in the timing enabling output of the acquired data and the pin returns to “H” after
the end of data output (shown as Timing 2 in the figure).
tSARD
tWRDL
tHARD
A0 to A3
CS
tCYRD
RD
tDRDY
tWRDY
RDY (Timing1: default)
tDRDY2
tDRDY+tWRDY
RDY (Timing2)
tRDH
VALID
OUTPUT
D(n)
tDATON
tDDATn
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LC72717PW
(3) Corrected data output
This is to output the packet data after correction processing from LSI. The total length of output data is 176 bits (22
Bytes) only, and the Layer 2 CRC data (14 bits) and parity data (82 bits) are not output. The corrected data is output,
on either the 8-bit or 16-bit units, sequentially from the leading data among those in one packet. The BIC code is not
output.
The accessing method is the same as for the register output and the address “0” is input to A0 to A3 pins. Since this
is different from the register output in the timing conditions during access, the timing chart is shown here separately
from the register output. The RDY signal output method can also be selected similarly.
Data block (176 bits) Data after error correction
Layer 2 CRC (14 bits)
Parity (82 bits)
Structure of a Single Data Packet (Total length 272 bits: BIC not included)
tSARD
tWDRD
tHARD
A0 to A3
CS
tCYRD
RD
tDRDY
tWDRDY
RDY (Timing1: default)
tDRDY+tWRDY
tDRDY2
RDY (Timing2)
tRDH
VALID
OUTPUT
D(n)
tDATON
tDDATn
VALID
OUTPUT
* A0 to A3 should be set to 0 during
reading of corrected data.
(4) Layer 4 CRC check output
This is a function to detect error of data group (layer 4 CRC). The CRC4 pin = “H” or bit1 (CRC4) = 1 of the status
register after writing of the data group into the layer 4 CRC register means that there is no error. The accessing
method is the same as for the data input when setting up an internal register, and the address “6h” of the layer 4
CRC register is input into the register address.
Note: WR cycle wait for writing in layer 4CRC register differs from the time of the data input of other register setup.
(5) DMA transmission output
Setting bit0 (DMA) = 1 of control register 2 causes the DMA mode, allowing the corrected data to be output in the
DMA method.
For accessing, input the address “0h” to A0 to A3 pins after falling of the DREQ output pin, setting the CS pin = L,
and then the RD pin = L. After the DREQ pin = H, data is acquired from the D(n) pin. Then, the wait state occurs for
the tCYDM period or longer till the DREQ pin becomes “L”. In the DMA mode, only 8 bits can be selected for the
data bus width. (n: 0 to 7 for BUSWD=L. Do not set BUSWD=H because it may cause fault.)
The DACK pin can be used instead of the RD pin for DMA transmission. In this case, it is necessary to set bit1
(DMA_RD) = 1 of the control register 2. It is also possible to change the polarity of DREQ and DACK pins. In this
case, it is necessary to set bit4 (DREQ) = 1 and bit5 (DACK) = 1 of the control register 2.
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LC72717PW
tRDDM
tCYDM
tDREQ
DREQ
DACK (when DACK is selected)
tWRDM
RD (default)
0
A0 to A3
0
tSARD
tHARD
CS
tRDH
VALID
OUTPUT
D(n)
VALID
OUTPUT
tDDATn
*A0 to A3 should be set to 0
during DMA transmission
Symbol
tSARD
tHARD *1
Parameter
min
Address and CS to RD setup
typ
max
20
RD to address and CS hold
unit
ns
0
ns
tWRDL
RD “L” level width
340
ns
tCYRD
RD cycle wait
150
ns
tWRDY
RDY width (at register output)
tRDH
RD data hold
tSAWR
Address and CS to WR setup
tHAWR
WR to address and CS hold
tCYWR
WR cycle wait
tWWRL
WR “L” level width
60
210
ns
0
40
ns
20
WR cycle wait(When writing data in Layer 4CRC register)
ns
20
ns
150
ns
1200
ns
200
ns
tWDS
WR data setup
0
ns
tWDH
WR data hold
20
ns
tDRDY
RDY output delay
0
40
ns
tDRDY2
RDY output delay 2
0
40
ns
tWDRD
RD width at output of corrected data
BUSWD=L (8bit)
RD width at output of corrected data
BUSWD=H (16bit)
tWDRDY
RDY width at output of corrected data
BUSWD=L (8bit)
RDY width at output of corrected data
BUSWD=H (16bit)
tRDDM
DMA start time
tDREQ
DACK to DREQ delay
340
ns
620
ns
60
210
ns
300
490
ns
260
ns
40
ns
20
tDATON
DATn output start time
0
tDDATn
DATn output delay
0
tCYDM
DMA cycle wait
tWRDM
RD “L” level width at DMA transmission output
300
*1 Specified up to the earliest negating of A0 to A3 and CS
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14
ns
40
ns
420
ns
ns
LC72717PW
CPU Registers
This LSI has both write registers and read registers. Access to the registers is made via CCB IF or parallel IF. Switching
of access mode is made with the SP pin. (CCB IF: SP=H, Parallel IF: SP=L)
(1) Write registers
Setting any data to ‘0h’ or ‘7h’ or larger address of Write-registers is prohibited. Do not set any data to these addresses.
 List of write registers
ADR
R/W
Register Name
0h
-
-
Description
1h
W
BIC
2h
W
SYNCB
Block synchronization: error protection count
3h
W
SYNCF
Frame synchronization: error protection count
4h
W
CTL1
5h
W
CTL2
Control register 2
6h
W
CRC4
Layer 4 CRC register (for the parallel IF only. CCB to use the dedicated address)
7h and beyond
-
-
Reserved (setting prohibited)
Allowable number of BIC errors
Control register 1
Reserved (setting prohibited)
 1h <BIC>: Number of allowable BIC errors <Write Only>
Register to set the allowable number of BIC error bits for determination of synchronization
ADR
Register Name
Bit
Name
1h
BIC
7-4
BIC_F
Description
Forward protection value (initial value 2)
Sets the allowable number of BIC error bits (when synchronized).
3-0
BIC_B
Backward protection value (initial value 2)
Sets the number of allowable BIC error bits (when not synchronized).
Reset
0010b
0010b
When the block synchronization determination output (BLOCK) is to be used determination of whether or not there is
any FM multiplex data, it is recommended to set the allowable number of BIC errors during backward protection to
‘0001b’ or ‘0000b’.
 2h <SYNCB>: Block synchronization: error protection count <Write Only>
Register to set the number of block synchronization protections for determination of block synchronization.
ADR
Register Name
Bit
Name
Description
2h
SYNCB
7-4
SYNCB_B
Backward protection value (Register initial value 1: Number of backward protections 2)
Number of backward protections = Backward protection value +1
3-0
SYNCB_F
Forward protection value (Register initial value 7: Number of forward protections 8)
Number of forward protections = Forward protection value +1
To change the set value, it is necessary to set the value determined by deducting 1 from the desired number of
protections.
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Reset
0001b
0111b
LC72717PW
The number of forward and backward protections can be set separately. The conditions for counting the number of
protections are as follows:
 Number of backward protections (not synchronized): BLOCK=L)
When the timing of the free-run counter for LSI internal synchronization agrees with that of received BIC, the
protection counter is incremented by 1. Similarly, when the timing between the LSI internal counter and the received
BIC is lost, the protection counter is cleared to zero. The count timing is the timing of the LSI internal counter.
 Number of forward protections (synchronized: BLOCK=H)
Contrarily to the case of backward protection, the number of protections is counted up when the timing of LSI internal
free-run counter is deviated from the received BIC detection timing. The number of protections is cleared to zero
when they agree.
The figure below shows the agreement/disagreement between the LSI internal timing and received BIC timing and the
relationship between the protection counter value and BLOCK signal.
For the number of forward/backward protections of 3, the protection counter value at a timing of BLOCK signal
changeover is 2, that is, smaller by 1. The number of protections is determined in the internal circuit by comparing the
register set value for the number of forward/backward protections and the protection counter. Accordingly, the register
set value must be set to the value smaller than the desired number of protections by 1.
For example, when the number of both forward and backward protections is 3 as shown below, it is necessary to set
‘22h’. If the set value is ‘00h’, the number of protections becomes 1 by definition for forward and backward protections.
However, the operation becomes the same as for the state without the protection circuit.
When the block synchronization flag output (BLOCK) is to be used for determination whether or not there is FM
multiplex data, it is recommended to reset the value severer than the initial value.
BIC
Received data
1
2
3
Reset
BIC position
of synchronization
counter
1
0
Protection
counter
1
2
0
3
2
1
2
0
BLOCK
1
0
For the register set value of 22h:
the number of both the forward and backward protections become 3.
 3h <SYNCF>: Frame synchronization: error protection count <Write Only>
Register to set the number of frame synchronization protections for determination of frame synchronization
ADR
Register Name
Bit
Name
3h
SYNCF
7-4
SYNCF_B
Description
Reset
Backward protection value
(Register initial value 1: Number of backward protections 2)
0001b
Number of backward protections = Backward protection value +1
3-0
SYNCF_F
Forward protection value
(Register initial value 7: Number of forward protections 8)
0111b
Number of forward protections = Forward protection value +1
To change the set value, it is necessary to set the value determined by deducting 1 from the desired number of
protections. This LSI detects BIC peculiar change points exist at four points in one frame and increases/decreases the
counts of protection counter by determining agreement/disagreement with the timing counter for LSI internal frame
synchronization.
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LC72717PW
 4h <CTL1>: Control register 1 <Write Only>
Register to control the block reset ON/OFF, function activation/stop, and the data output method.
ADR
Register Name
Bit
Name
4h
CTL1
7
CRC4_RST
Description
Reset
Layer 4 CRC check circuit reset setting
1: Reset ON
0: Reset OFF
0
To cancel reset, it is necessary to set 0.
6
D O _MOVE
Sets the D O pin output method changeover
0: Hi-Z state retained in states other than data output
0
1: Changes in an interlocked manner with the INT signal *6
5
INT_MOVE
Sets changeover of corrected data output method *4
0: Outputs only data received at completion of correction & layer 2 CRC
completion as well as during synchronization
0
1: Outputs all of data
4
SYNC_RST
Synchronization regeneration circuit reset setting *1
1: Reset ON
0: Reset OFF
0
0 to be set to cancel reset
3
EC_STOP
Error correction function down setting *2
0: All functions activated
0
1: Only MSK detector circuit and synchronization regeneration circuit activated
2
VEC_HALT
Vertical error correction function down function *3
0: Executes vertical error correction and second horizontal correction.
0
1: Does not execute vertical error correction and second horizontal correction.
1
RTIB
Real-time information block setting *5
0
0: Real-time information blocks present.
1: No-real-time information block.
0
FRAME
Frame setting
0
0: Specifies method B.
1: Specifies method A.
*1 With SYNC_RST=1, the synchronization status and the synchronization protection status are cleared, resulting in the
unsynchronized state. This function enables rapid pull-in of frame synchronization when the frame synchronization
of new tuned and received data is deviated during tuning of a radio receiver. In this case, registers such as the
number of allowable BIC errors, the number of block forward/backward protections, and the number of frame
forward/backward protections are not initialized. During reset, the INT signal is not output and the DO pin becomes
the HI-Z output.
*2 With EC_STOP=1, all of operations and data output related to error correction is shut down. MSK demodulation,
synchronization circuits, serial data input, and layer 4 CRC circuit remain operative.
*3 With VEC_HALT=1 setting, all of LSI operation related to vertical correction and second horizontal correction are
shut down. Only the data after first horizontal correction is output.
*4 Since the output mode will be modified depending on the setting of the VEC_OUT flag or the result of horizontal
error correction, refer to the “List of operation modes” section for detail.
*5 In the ITU-R recommended frame structure method A, a total of 12 data blocks can be inserted in the parity data area
(the area that consists of 82 consecutive blocks of parity packets). If this IC is used ina system that has no real-time
information blocks (RTIB), this flag must be set.
Note that if this flag is changed, frame synchronization is retained in the synchronized state for the time
corresponding to the forward protection count, and then switches to the unsynchronized state. To quickly reestablish
frame synchronization, applications must reset the synchronization circuit using the SYNC_RST flag.
*6 About the relationship between INT and DO, refer to the “Output Format with DO_MOVE=1”section in the “Error
Correction” chapter.
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LC72717PW
 5h <CTL2>: Control register 2 <Write Only>
Register to control the parallel IF setting, vertically-corrected data output method, etc.
ADR
Register Name
Bit
Name
5h
CTL2
7
Reserved
Either keep an initial value or set it to 0.
Description
6
BLK_RST
Block synchronization circuit reset setting *1
1: Reset ON
0: Reset OFF
Reset
0
0
0 to be set to cancel reset
5
DACK
DACK signal polarity setting (effective for SP=L only)
0: Negative logic for DACK signal polarity
0
1: Positive logic for DACK signal polarity
4
DREQ
DREQ signal polarity setting (effective for SP=L only)
0: Negative logic for DREQ signal polarity
0
1: Positive logic for DREQ signal polarity
3
RDY
RDY signal timing setting (effective for SP=L only)
0: Outputs the RDY signal in the timing 1.
0
1: Outputs the RDY signal in the timing 2.
2
VEC_OUT
Vertically error corrected data output method changeover setting *2
0: No vertically error corrected output if vertical error correction has not been made
0
1: All data output even when vertical error correction has not been made
1
DMA_RD
DMA read control signal selection setting (effective for SP=L only)
0: RD signal used
0
1: DACK signal used
0
DMA
DMA transmission function enable setting (effective for SP=L only)
0: DMA transmission not used for reading of corrected data
0
1: DMA transmission used for reading of corrected data
*1 With BLK_RST=1, the block synchronization state and block synchronization protection counter value are cleared.
But this does not affect the functions related to frame synchronization.
*2 With VEC_OUT=1, one frame of data completely free from error. The data similar to the horizontally-corrected data
is output in the timing of output of vertically-corrected data even when vertical correction has not been made.
 6h <CRC4>: Layer 4 CRC register <Write Only>
Register for data group writing to check the layer 4 CRC.
Used on with the parallel IF. The dedicated CCB address is to be used for CCB IF.
ADR
Register Name
Bit
Name
6h
CRC4
7
CRCDAT7
Layer 4 CRC check data setting
Description
0
6
CRCDAT6
By writing value consecutively into this register, the layer 4 CRC check of data
0
5
CRCDAT5
4
CRCDAT4
3
CRCDAT3
2
CRCDAT2
0
1
CRCDAT1
0
0
CRCDAT0
0
group comprising multiple bytes can be made.
The CRC checked results can be known by checking the CRC4 flag in the status
register or CRC4 pin output.
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Reset
0
0
0
LC72717PW
(2) Read registers
 List of read registers
ADR
R/W
Register Name
0h
R
PDATO
Description
1h
R
STAT
Status register
2h
R
BLNO
Block number register
3h and beyond
-
-
Input this address into A0 to A3 after reading of error-corrected data
Reserved
Parallel mode: To read registers, send address shown in the list of read registers.
CCB mode: To read registers, send assigned CCB address (FBh or Fad). It is not necessary to send address shown in the
list of read registers.
 1h <STAT>: Status register <Read Only>
Register to confirm various states
ADR
Register Name
Bit
Name
1h
STAT
7
VH
Description
Reset
Determination on vertically error corrected data
0: Data for which only horizontal correction is performed
1: Data for which vertical and second horizontal correction after horizontal correction
0
are performed
6
BLK
Block synchronization state
0: Data that is received when block synchronization is not established
0
1: Data that is received when block synchronization is established
5
FRM
Frame synchronization state
0: Data that is received when frame synchronization is not established
0
1: Data that is received when frame synchronization is established
4
ERR
Error correction state
0: Data whose correction is completed and for which error is not detected by the layer 2
CRC check
0
1: Data whose correction is impossible or for which error is detected by the layer 2 CRC
check.
3
PRI
Determination of parity block
0: Data that is estimated to be data block by the frame synchronization circuit
0
1: Data that is estimated to be parity block by the frame synchronization circuit
2
HEAD
Frame head determination
1: Data that is estimated to be the frame head block by the frame synchronization circuit
0
0: Data other than above
1
CRC4
Layer 4 CRC check result
0: Error in layer 4 CRC check result
1
1: No error in layer 4 CRC check result
0
RTIB
Real-time information block state
1: Indicates the data is a real-time information block.(This bit is valid only in method A’.)
0: The others
The value in the “Reset” column is the readable value immediately after canceling the reset.
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0
LC72717PW
 2h <BLNO>: Block Number register <Read Only>
Register to confirm the output data block Number
ADR
Register Name
Bit
Name
2h
BLNO
7
BLN7
Description
6
BLN6
5
BLN5
4
BLN4
3
BLN3
0
2
BLN2
0
1
BLN1
0
0
BLN0
0
Indicates the block Number or parity block Number of output data
Reset
0
0
Data block Number
0 to 189
Parity block Number
0 to 81
0
0
The value in the “Reset” column is the readable value immediately after canceling the reset.
 Data renewal timing of read register
The timing for rewriting of read register (STAT, BLNO) data is the timing for changing of INT from H to L.
 Read procedure of corrected data
Normally, the status register is first read because of occurrence of interrupt to check the condition of corrected output
data that is output by the interrupt signal, determining whether or not read is necessary. For example, read is not made
till the next interrupt if the error correction result is NG and read is not necessary.
For CCB IF, data read is made at the CCB address, ‘FBh’, and determination is made by means of the status
information added by 16 bits to see if the subsequent data is to be read. When interrupting read, set the CE signal to
“L”.
It is possible to read the register in a manner a synchronous with the interrupt signal when INT_MOVE is set to “1”.
For example, to check the current receiving state, read the status register to check BLK (data received during block
synchronization) and FRM (data received during frame synchronization). In this case, read data is more close to the
current receiving state, when VH=0 (data subject to horizontal correction only) information is used.
 Layer 4 CRC check
To perform layer 4 CRC check, the data group to be checked is transmitted. After transmission, it is determined that
the data group is free from error if the CRC4 pin becomes the H-level output or the status register CRC4 (layer 4 CRC
check result) is ‘1’.
The CRC4 pin or CRC4 flag of status register is either “H” or “1” when all bits of check register in LSI are “0”. To
perform layer 4 CRC check using this function, it is necessary to initialize the CRC check register in LSI before
transmission of one group of one data group. Initialization is made by setting the CRC4_RST (layer 4 CRC check
circuit reset) of control register to ‘1’.
Subsequently, to transmit the layer 4 CRC check data, set CRC4_RST back to 0 to cancel reset.
The generating polynomial of CRC code is as follows: G(X) = X16 + X12 + X5 + 1
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LC72717PW
Error Correction
(1) Error Correction and Output Conditions of Error-corrected Data (in the default state)
The received data is subject to error detection by the layer 2 CRC and error correction by the (272,190) code for each
one block (272 bits). At the end of correction, preparation for transmission to CPU is made and the INT signal is output.
This is called “horizontal correction”.
In the default state, this INT signal is output only when the output data concerned meets all of three conditions as
follows:
Data whose error correction is completed and for which layer 2 CRC detects no error
Data received during block and frame synchronizations
Data in the data packet
*Depending on the register mode setting, horizontally-corrected data may be output regardless of conditions of  to 
above.
When horizontal correction cannot cover completely, correction by the product code is made frame by frame. For data
that cannot be horizontally corrected, the second horizontal correction is made.
This series of operations is called “vertical correction”. Conditions for the data obtained from vertically-corrected
output are as follows in the default state:
Data that cannot be corrected by horizontal correction, but that has been completely corrected by the vertical
correction
Data in the data packet
Accordingly, horizontally-corrected data is not output. Packet data that cannot be corrected horizontally or vertically
is not output. The parity packet data after vertical correction is not output either.
Vertical correction is applied to the whole packet data that have been received during frame synchronization, and is
executed when horizontal correction cannot correct all packet (block) data. Vertical correction is not made when the
error-free data is received for one frame or when the received data is not synchronous in flame synchronization during
reception. For the packet whose error has been corrected by horizontal correction and any error-free packet, vertical
correction is not made to prevent faulty correction.
In the default setting, the applicable vertically-corrected output is not output when vertical correction has not been
made.
* Depending on the register mode setting, the vertically-corrected data may be output regardless of whether or not
vertical correction is to be made.
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LC72717PW
(2) Error-corrected Data Output Timing (Basic Restrictions)
Data received by LSI is corrected error and written sequentially without any interruption into the output data buffer
memory. Since this data buffer memory has a capacity for one-block data, the corrected data before reading is overwritten by the next data if data read is delayed. In consequence, it is essential to read data according to the timing
stipulations shown below.
This LSI specifies the output timing for each of horizontally and vertically corrected data as follows:
Upon completion of preparation for the output data, LSI lowers the INT pin to “L” as a request for transmission.
Data output has the period during which only horizontal data can be read and the period during which horizontal and
vertical data are read according to the time division.
Complete data transmission within about 8ms after INT = “L”. When only the horizontally-corrected data can be
output, data transmission is possible for about 17ms. Even when CPU is in the course of reading, the output buffer is
overwritten by the next output data once the specified time period is expired.
The data amount that can be read by one horizontal and vertical transmission request (INT) is one block only.
Vertically-corrected data is output sequentially beginning with the first block after completion of vertical correction,
but the data of parity block is not output.
Output of only horizontal data
INT
18ms
1ms
Horizontal data output period
Divided output for horizontal and
vertical data
INT
9ms
1ms
Horizontal data output
period
Vertical data output
period
990s
990s
Period during which data guarantee is impossible
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LC72717PW
(3) Horizontally-corrected Data Output Timing (Relationship With The Received Data)
The timing relationship between the received data and interrupt control signal (INT) for horizontary-corrected data
output is shown. But the delay from the actual received signal caused by demodulation in the MSK demodulation block
is ignored.
Block synchronization is established by determining the BIC code. Data of the Nth packet can be output during
receiving of the next (N + 1) packet data.
(N-1) packet
(N+1) packet
N packet
BIC
Received data
BIC
18ms
300ns max
62.5s
BCK
300ns max
INT
(N-1) packet data output period
1ms
N packet data output period
990s
Period during which data cannot be guaranteed
(4) Vertically-corrected Data Output Timing
Vertical correction is made when the data of one frame is stored in the memory, frame synchronization has been
established, and when horizontal correction cannot correct all of packet data. Vertical correction start timing is the head
of a frame. During receiving of the first to 28th packets of the N-th frame, horizontal correction of each packet is made,
transferring data to the CPU interface. Using the idling time in this period, vertical correction of the previous (N-1)-th
frame data is made.
Vertically-corrected data is output for the amount equivalent to 190 blocks sequentially beginning with reception of the
29th packet (block), in such a manner that one block data is output each time one block is received. Only data of data
block in the FM multiplex broadcasting frame is output.
The final 190th block is output during reception of the 218th block.
In the vertically-corrected data output timing, the packet data corrected by vertical correction is not output (INT not
issued). However, vertical correction data output order is not shortened for the amount equivalent to the packet data that
is not output. For example, if the first to 100th data packets have been horizontally corrected, the 101st vertically
corrected packet data is output, not at the reception point of the block Number 29 th, but at the 129th packet data
reception point.
(N-1)-th frame
Reception block No.
271
N-th frame
272
1
2
3
28
29
30
31
218
2
189
219
220
BCK
62.5s
FCK
18ms
1
190
INT
1ms
18ms
18ms28=504ms
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23
9ms
9ms
Data output period after
vertical correction of
previous frame
LC72717PW
(5) List of Operation Modes
Depending on the set value of INT_MOVE (bit 5 of control register 1) and VEC_OUT (bit 2 of control register 2), the
INT signal output timing and output data are modified. In the table below,  indicates “output”,  indicates “no
output.” and - indicates “none applicable.”
Horizontal
Parameter
INT_MOVE
VEC_OUT
Default value
0
0
Mode 1
1
1
Mode 2
1
0
Mode 3
0
1
Vertically-corrected
Horizontally-corrected output
correction
output
result
OK data
NG data
Parity
OK data
OK

-


-
NG



 *1

OK

-

 *2
-
NG



 *2

OK

-

 *3
-
NG



 *4

OK

-


-
NG





NG data
*1 Only data whose horizontal correction result is NG and whose vertical correction result is OK is output.
*2 All of vertically-corrected outputs (190 blocks/frame) are output, in both cases of horizontal correction result of OK
and NG, regardless of whether the vertical correction result is OK or NG.
*3 The vertically-corrected data is not output when there is no data that is determined to be NG because all the
horizontal correction results are OK.
*4 When there is any data whose horizontal correction result becomes NG, all of vertically-corrected outputs
(190 blocks/frame) are output regardless of whether the vertical correction result is OK or NG.
(6) Output Format with DO_MOVE=1
The relationship between INT and DO is shown below. DO becomes “L” in synchronous with the falling edge of INT,
and return to “H” before 3ms or more against the next falling edge of INT. Therefore, when the data read is started
while DO is “L”, there is margin time 3ms or more against the falling edge of INT. This timing diagram is for the
case when the data read is not performed. When the data read is performed, DO returns to “H” after completion of
read.
18ms
INT
1ms
3ms or
more
DO
(Output of only horizontal data)
Horizontal data output period
990s
Period during which data cannot be guaranteed
9ms
INT
1ms
3ms or
more
DO
(Output of horizontal and
vertical data)
Horizontal data output
period
3ms or
more
Vertical data output
period
990s
990s
Period during which data cannot be guaranteed
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24
LC72717PW
Example of an application circuit diagram
This is an application circuit example when the CCB serial interface is selected, using a microcomputer operating on the
supply voltage of 3V.
The DO pin must be pulled up by a resistor to the supply voltage.
CPU Interface
5.1k
VDD
0.1F
100F
10F 0.1F
330pF
FM composite
560pF
22H
0.1F
TIN
NC
Vssa
Vref
MPXIN
Vdda
FLOUT
CIN
NC
TPC1
TPC2
TEST
TOSEL1
TOSEL2
Vssd
XIN
3.3F
LC72717PW
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
22H
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
BUSWD
SP
RST
STNBY
CS
A3
A2/DI
A1/CE
A0/CL
RD
WR
NC
DO
Vssd
Vddd
INT
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
0.1F
XOUT
Vddd
IOCNT1
IOCNT2
CLK16
DATA
FLOCK
BLOCK
FCK
BCK
CRC4
DREQ
DACK
Vssd
Vddd
RDY
GND
0.1F
Xtal
7.2MHz
22pF
22pF
<Note>
(1)This example of an application circuit is a circuit of reference, and does not
guarantee the characteristic.
(2)The capacitance value to be connected to the above crystal oscillator is the
reference value.
Before use, confirm by crystal supplier that oscillation is free from trouble
using the actual substrate.
(3)A bypass capacitor needs to be connected near the power supply terminal.
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25
LC72717PW
Cautions
Operation at Reset and Standby
(1) Reset signal
After crystal was oscillated and stabilized, reset operation is performed by setting the RST pin input level to VIL or
less for 300ns or more at the supply voltage (VDD) of 2.5V or more. (See the figure below).
Be sure to perform reset operation at power ON.
Supply Voltage
2.5V
VIH
VIL(0.3VDD)
RST
300ns(min)
(2) Pin state at reset
Refer to the list of pin functions.
(3) Reset operation range
The reset signal causes reset inside LSI, causing return to the initial state. Though the crystal oscillation circuit is not
stopped, the internal divider circuit is stopped.
(4) Data input after reset
If 300ns or more time has elapsed after completion of reset, the register write control circuit is ready for activation.
(5) Standby mode
Set the STNBY pin to the “H” level, and LSI enters the standby mode. In this mode, all of LSI operations can be
stopped. After canceling of STNBY, the time is required till the crystal oscillation circuit becomes stable.
Digital pin output states during standby is the same as for that dueing reset. On the other hand, analog output pins
(FLOUT, VREF) are L outputs (Vdda/2 is output during reset).
Similarly to the case of reset, the LSI inside is reset to return to the initial state.
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26
LC72717PW
ORDERING INFORMATION
Device
Package
Shipping (Qty / Packing)
LC72717PW-H
SQFP64(10X10)
(Pb-Free / Halogen Free)
500 / Tray Foam
LC72717PW-NH
SQFP64(10X10)
(Pb-Free / Halogen Free)
1000 / Tape & Reel
† For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel
Packaging Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF
 The DARC (Data Radio Channel) FM multiplex broadcast technology was developed
by NHK (Japan Broadcasting Corporation).
 The DARC is a registered trademark of NHK Engineering System, Inc. (NHK-ES).
 A separate contract with NHK-ES is required in advance for the manufacture and/or
sales of electronic equipment in Japan and other countries that uses the patents, which
are related to DARC technology, and which are registered in Japan and such other
countries by NHK independently or in cooperation with a third party.
 DARC and the logo shown on the right-hand side can be displayed on electronic
equipment that uses DARC technology by the conclusion of a contract with NHK-ES.
Please contact NHK Engineering System, Inc. for further details.
Contact information: NHK Engineering System, Inc.
Phone: +81- (0)3-5494-2400 (main)
URL: http://www.nes.or.jp/index.html
*Note
The number of shipments of this LSI will be reported to NHK-ES by our company.
(the number of samples is excluded)
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