FINTEK F75384S ±1oc accuracy temperature sensor ic datasheet Datasheet

F75383M/F75383S/F75384M/F75384S
±1oC Accuracy Temperature Sensor IC Datasheet
Release Date: July, 2007
Revision: V0.32P
F75383/F75384
F75383/F75384 Datasheet Revision History
Version
Date
Page
Revision History
0.21P
Mar.,2004
Original version (Confidential)
0.22P
Mar.,2004
Revised version ID/vendor ID, AC/DC spec.
0.23P
Mar.,2004
Add 8-SOP(F75383) package supporting
0.24P
Mar.,2004
1-2
Add additional description of 8-SOP(F75383S)/8-MSOP(F75383M)
0.25P
Apr.,2004
8,13
Add PCB Layout guide and update DC specification
0.26P
Jul.,2004
0.27P
Sep.,2004
Add F75384 description
6
Revise(1)High Byte of 1°C value (0000 0001)
12
(2) Read address (high byte) of VT2 low limit (08h (00h) )
0.28P
Jan.,2005
15
Revise serial bus timing
0.29P
Aug.,2005
4
Modify alert response address
0.30P
Dec.,2005
0.31P
Dec.,2006
0.32P
July,2007
Revise typo and updated patent no.
1
Add Patent Note
-
Revise typo ( VDD Æ VCC)
-
Company readdress
Please note that all data and specifications are subject to change without notice. All the trade marks of products and
companies mentioned in this data sheet belong to their respective owners.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Fintek for any damages resulting from
such improper use or sales.
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Table of Contents
General Description................................................................................................................. 1
Features .................................................................................................................................. 1
Key Specifications ................................................................................................................... 2
Pin Configuration..................................................................................................................... 2
Pin Descriptions ...................................................................................................................... 2
Functional Description............................................................................................................. 3
6.1 General Description.......................................................................................................... 3
6.2 The warning message ...................................................................................................... 3
6.3 Access Interface............................................................................................................... 3
6.4 Typical Operating Characteristics ...................................................................................... 5
6.5 Temperature Monitoring ..................................................................................................... 6
6.5 Alert#................................................................................................................................ 6
6.6 THERM# ............................................................................................................................ 7
6.7 ADC Conversion Sequence ............................................................................................... 7
6.8 Thermal Mass and Self Heating......................................................................................... 7
6.9 ADC Noise Filtering ........................................................................................................... 7
6.10 PCB Layout Guide........................................................................................................... 8
7. Registers Description .............................................................................................................. 9
1.
2.
3.
4.
5.
6.
7.1 Configuration Register  Index 03h(Read), 09h(Write)................................................... 9
7.2 Status Register  Index 02h .............................................................................................. 9
7.3 Conversion Rate Register  Index 04h(Read), 0Ah(Write).............................................. 10
7.4 One-Shot Register  Index 0Fh...................................................................................... 10
7.5 Alert Queue & Timeout Register  Index 22h .................................................................. 10
7.6 Status-with-ARA Control Register  Index 24h ............................................................. 11
7.7 Chip ID I Register  Index 5Ah........................................................................................ 11
7.8 Chip ID II Register  Index 5Bh....................................................................................... 11
7.9 Vendor ID I (Manufacturer ID) Register  Index 5Dh....................................................... 11
7.10 Vendor ID I (Manufacturer ID) Register  Index 5Eh ..................................................... 11
7.11 Vendor ID II (Manufacturer ID) Register  Index FEh .................................................... 11
7.12 Value RAM  Index 10h- 2Fh ........................................................................................ 11
8. Electrical characteristic.......................................................................................................... 12
8.1 Absolute Maximum Ratings .............................................................................................. 12
8.2 DC Characteristics ............................................................................................................ 12
8.3 AC Characteristics ............................................................................................................ 14
9. Package Dimensions............................................................................................................. 15
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10 Application Circuit .................................................................................................................. 17
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1.
General Description
The F75383/F75384 is a temperature sensor IC with alert signal which is specific designed for notebook,
graphic cards etc. An 11-bit analog-to-digital converter (ADC) was built inside F75383/F75384. The
F75383/F75384 can monitor two set of temperature which is very important for the system to work stably and
properly. This chip provides 1 remote temperature sensor and 1 local temperature sensor. The remote
temperature sensor can be performed by CPU thermal diode or transistor 2N3906. The users can set up the
upper and lower limits (alarm thresholds) of all monitored parameters and this chip can also issue warning
messages for system protection when there is something wrong with monitored items.
Through the BIOS or application software, the users can read all the monitored parameters of system all the
time. And a pop-up warning can be also activated when the monitored item was out of the proper/pre-setting
range. The application software could be Fintek's application utility, or other management application software.
The F75383/F75384 is in the package of 8-pin MSOP/SOP and powered by 3.3V.
2.
Features
‹
Provide 1 on-chip local and 1 remote temperature sensing
‹
±1 oC accuarcy on remote channel and ±3 oC accuarcy on local channel
„
±1 oC (+60 oC to +100 oC, remote)
„
±3 oC (+60 oC to +100 oC, local)
‹
ALERT# output for SMBus alert
‹
THERM# output for over temperature alert or for system shut down
‹
Programmable THERM# limits and THERM# hysteresis
‹
Programmable alert queue
‹
Programmable limited and setting points(alert threshold) for all monitored items
‹
2 wire SMBus interface
‹
3VCC operation and in 8-SOP/8-MSOP green class package
‹
8-MSOP Package – F75383M/F75384M ; 8-SOP Package – F75383S/F75384S
‹
The difference between F75383 and F75384 is SMBus address ID and they have the following
SMBus slave address:
A6
A5
A4
A3
A2
A1
A0
F75383
1
0
0
1
1
0
0
F75384
1
0
0
1
1
0
1
Noted: Patented TW 235231 TWI263778
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3.
4.
5.
Key Specifications
‹
Supply Voltage
3.0~3.6V
‹
Supply Current
180 uA (typ)
Pin Configuration
VCC
1
D+
2
D-
3
THERM#
4
F75383
F75384
SCL
7
SDA
6
ALERT#
5
GND
Pin Descriptions
I/O12t
- TTL level bi-directional pin with 12 mA source-sink capability
I/O12ts
- TTL level and schmitt trigger
O12
- Output pin with 12 mA source-sink capability
O24V4
- Output pin with 24 mA source-sink capability, output 4V
AOUT
- Output pin(Analog)
OD12
- Open-drain output pin with 12 mA sink capability
INt
- TTL level input pin
INts
- TTL level input pin and schmitt trigger
AIN
8
- Input pin(Analog)
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PIN NO
PIN NAME
TYPE
PWR
DESCRIPTION
PWR
3VCC
Power Pin
1
VCC
2
D+
AIN
3VCC
Positive connection to remote temperature sensor (ex: thermal diode anode)
3
D-
AIN
3VCC
Negative connection to remote temperature sensor(ex: thermal diode
cathode)
4
THERM#
OD12
3VCC
Active LOW output. This pin will be logic low when the temperature exceeds
its limit.
5
GND
PWR
3VCC
Ground
6
ALERT#
OD12
3VCC
Active LOW output. Used as SMBus alert or Interrupt
7
SDA
INts/OD12
3VCC
Serial bus data
8
SCL
INt s
3VCC
Serial bus clock
6. Functional Description
6.1
General Description
The F75383/F75384 is a simple temperature sensor with warning signal output. It includes a local and a remote temperature sensor.
Both measured temperature are compared with its high, low and THERM limits which are stored in the registers. When one or more
out-of-limit events occur, the flags in Status Register will be set and that may cause ALERT output to low. Also, measured
temperature exceeding THERM limit may cause THERM output to low.
6.2
The warning message
Pin4 and pin6 act as warning message when the temperature exceeds it threshold point.
6.3
Access Interface
The F75383/F75384 can be connected to a compatible 2-wire serial system management bus as a slave device under the control of
the master device, using two device terminals SCL and SDA. The F75383/F75384 supports SMBus protocol of, “Write Byte”, “Read
Byte”, both with or without Packet Error checking(PEC) which is calculated using CRC-8. For detail information about PEC, please
check SMBus 1.1 specification. F75383/F75384 supports 25ms timeout for no activity on the SMBus. This timeout function is
programmed at 22h bit7 and default is disabled. F75383/F75384 also supports Alert Response Address(ARA) protocol.
The operation of the protocol is described with details in the following sections.
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(a) SMBus write to internal address register followed by the data byte
0
7
8
0
7
8
SCL
SDA
1
0
0
Start By
Master
1
1
0
0
R/W
D7
D6
Ack
by
383
Frame 1
Serial Bus Address Byte
D5
D4
D3
D2
D1
D0
Ack
by
383
Frame 2
Internal Index Register Byte
0
7
8
SCL (Continued)
SDA (Continued)
D7
D6
D5
D4
D3
D2
D1
D0
Stop
by
Master
Frame 3
Data Byte
Figure 1. Serial Bus Write to Internal Address Register followed by the Data Byte
(b) Serial bus write to internal address register only
0
7
8
0
7
8
SCL
SDA
1
0
Start By
Master
0
1
1
0
0
R/W
D7
D6
Ack
by
383
Frame 1
Serial Bus Address Byte
D5
D4
D3
D2
D1
D0
Ack
by
383
Frame 2
Internal Index Register Byte
Stop by
Master
0
Figure 2. Serial Bus Write to Internal Address Register Only
(c) Serial bus read from a register with the internal address register prefer to desired location
0
7
8
0
7
8
SCL
1
SDA
0
Start By
Master
0
1
1
0
0
R/W
D7
D6
Ack
by
383
Frame 1
Serial Bus Address Byte
D5
D4
D3
D2
D1
D0
Ack
by
Master
Frame 2
Internal Index Register Byte
Stop by
Master
0
Figure 3. Serial Bus Read from Internal Address Register
(d) Alert Response Address
0
7
8
0
7
8
SCL
R/W
0
SDA
Start By
Master
0
0
1
1
0
0
0
Ack
by
383
Frame 1
Alert Response Address
1
0
0
1
Frame 2
Device Address
1
0
0
Ack
by
Master
Stop by
Master
0
Figure 4. Alert Response Address
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6.4 Typical Operating Characteristics
Temperature Error vs.D+/D- Capacitance
Local Temperature Error vs. Die Temperature
Local Temperature error(℃)
Temperature error(℃) vs. D+/D- capacitance
0.8
1
0
0.6
Temperature error(℃)
Temperature error(℃
-1
-2
-3
-4
-5
-6
-7
-8
0.4
0.2
0
-0.2
-0.4
-9
-0.6
-10
0
10
20
30
40
50
60
70
80
90
100 110 120
0
Capacitance(nf)
10
20
30
40
50
60
70
80
90
100
Temperature(℃)
Remote Diode Error vs. Remote Temperature Error
0.6
Te m pe ra ture Erroe
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
0
20
40
60
Te m pe ra ture
80
100
120
Operating Supply Current vs. Conversion Rate
Operating current (uA)
Operating current (uA)
250
200
150
100
50
0
0.0625 0.125
0.25
0.5
1
2
4
8
16
32
64
Conversion rate(Hz)
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6.5 Temperature Monitoring
The F75383/F75384 monitors a local and a remote temperature sensor. Both can be measured from 0°C to 140.875°C.
The temperature format is as the following table:
Temperature ( High Byte )
Digital Output
Temperature ( Low Byte )
Digital Output
0°C
0000 0000
0°C
000 0 0000
1°C
0000 0001
0.125°C
001 0 0000
25°C
0001 1001
0.250°C
010 0 0000
50°C
0011 0010
0.375°C
011 0 0000
75°C
0100 1011
0.500°C
100 0 0000
90°C
0101 1010
0.625°C
101 0 0000
100°C
0110 0100
0.750°C
110 0 0000
140°C
1000 1100
0.875°C
111 0 0000
Remote-sensor transistor manufacturers
6.5
Manufacturer
Model Number
Panasonic
2SB0709 2N3906
Philips
PMBT3906
Alert#
Five events can trigger ALERT# to low:
(1). VT1(Local) temperature exceeds High Limit
(2). VT1(Local) temperature goes below Low Limit
(3). VT2(Remote) temperature exceeds High Limit
(4). VT2(Remote) temperature goes below Low Limit
(5). VT2(Remote) temperature is Open-circuit.
These five events are wired-NOR together. This means that when one of out-of-limit event occurs, the ALERT# output goes low if the
MASK control is disabled. ALERT# signal can be used as an IRQ-like interrupt or as an SMBALERT. When ALERT# acts as an
IRQ-like interrupt, the ALERT# will be de-asserted until the following 2 conditions are matched:
(1). The abnormal condition is gone
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(2). Reading the Status register to clear the status
When ALERT# acts as a SMBALERT, the ALERT# will be de-asserted until the following 3 conditions are matched:
(1). The abnormal condition is gone
(2). Reading the Status register to clear the status
(3). The ALERT# has been serviced by the SMBus master reading the device address.
For more information about SMBALERT, please see SMBus 1.1 specification.
6.6 THERM#
Either VT1(Local) or VT2(Remote) temperature exceeds the corresponding THERM limit, the THERM# output will assert low. The
asserted output will be de-asserted until the temperature goes below (THERM Limit – Hysteresis). The hysteresis default value is
10°C and it can be programmed. Both VT1 and VT2 have their own THERM limits and Hysteresis values.
6.7 ADC Conversion Sequence
If a START command is written, both channels are converted and the results of both measurements are available after the end of
conversion. A BUSY status bit in the status byte shows that the device is actually performing a new conversion; however, even if the
ADC is busy, the results of the previous conversion are always available.
6.8 Thermal Mass and Self Heating
Thermal mass effect can seriously degrade the F75383’s effective accuracy. The thermal time constant of the SOP package is about
140 in still air. For the F75383/S junction temperature to settle to within +1°C after a sudden +100°C change requires about five time
constants or 12 minutes. The use of smaller packages for remote sensors such as SOT23, improves the situation. Take care to
account for thermal gradients between the heat source and the sensor package do not interfere with measurement accuracy.
Sel-heating does not significantly affect measurement accuracy. Remote sensor self-heating due to the diode current source is
negligible. For the local diode, the worst case error occurs when auto-converting at the fastest rate and simultaneously sinking
maximum current at the ALERT# output. For instance, at an 64Hz rate and ALERT# sink around 0.7mA when pull up resistor 4.7K
ohm to 3.3VCC, the typical power dissipation is VCC x 220 uA plus 0.4V x 0.7mA. Package θJA is about 120 °C/W, so with VCC =
3.3V and no copper PC board heat-sinking, the resulting temperature rise is:
dT =
1.01mW x 120 °C/W = 0.12 °C
Even with these contrived circumstances, it is difficult to introduce significant self-heating errors.
6.9 ADC Noise Filtering
The ADC is integrating type with inherently good noise rejection. Micro-power operation places constraints on high-frequency noise
rejection; therefore, careful PCB board layout and suitable external filtering are required for high-accuracy remote measurement in
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electronically noisy environment. High frequency EMI is best filtered at D+ and D- with an external 2200pF capacitor. Too high
capacitance may introduce errors due to the rise time of the switched current source. Nearly all noise sources tested cause the ADC
measurement to be higher than the actual temperature, depending on the frequency and amplitude.
6.10 PCB Layout Guide
PCB can be electrically noisy environments, and the F75383/F75384 is measuring very small voltage from the remote sensor, so
care must be taken to minimize noise which is occurred at the sensor inputs. The following guideline should be taken to reduce the
measurement error of the temperature sensors:
1.
Place the F75383/F75384 as close as practical to the remote sensing diode. In noisy environments, such as a computer
main-board, the distance can be 4 to 8 inches. (typ). This length can be increased if the worst noise sources are avoided. Noise
sources generally include clock generators, CRTs, memory buses and PCI/ISA bus etc.
2.
Route the D+ and D- tracks close together, in parallel, with grounded guard tracks on each side. Provide a ground plane under
the tracks if possible. Do not route D+ & D- lines next to the deflection coil of the CRT. And also don’t route the trace across fast
digital signals which can easily induce bigger error.
GND
10MILS
DXP
10MILS
DXN
10MILS
MINIMUM
10MILS
GND
3.
Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track minimum width and spacing is recommended.
4.
Try to minimize the number of copper/solder joints, which can cause thermocouple effects. Where copper/solder joints are used,
make sure that they are in both the D+ and D- path and at the same temperature. Thermocouple effects should not be a major
problem as 1℃ corresponds to about 200µV. It means that a copper-solder thermocouple exhibits 3µV/℃, and takes about
200µV of the voltage error at D+ & D- to cause a 1℃ measurement error. Adding a few thermocouples causes a negligible
error.
5.
Place a 0.1µF bypass capacitor close to the VCC pin. In very noisy environments, place an external 2200pF input filter
capacitors across D+, D- close to the F75383/F75384.
6.
If the distance to the remote sensor is more than 8 inches, the use of twisted pair cable is recommended. It will work up to
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around 6 to 12 feet.
7.
Because the measurement technique uses switched current sources, excessive cable and/or filter capacitance will affect the
measurement accuracy. When using long cables, the filter capacitor may be reduced or removed. Cable resistance can also
induce errors. 1 Ω series resistance introduces about 0.5℃ error.
7.
Registers Description
7.1 Configuration Register  Index 03h(Read),
09h(Write)
Power on default <7:0> = 00h
Bit
Name
Attribute
Description
7
ALERT_MASK
R/W
Set to 1, mask ALERT# signal output.
6
RUN_STOP
R/W
Set to 0, monitor.
5-0
Reserved
Set to 1, stop to monitor(software power down).
7.2 Status Register  Index 02h
Power on default <7:0> = 00h
Bit
Name
Attribute
Description
7
ADC_BUSY
RO
Set to 1, ADC is converting.
6
VT1HIGH
RO
Set to 1, VT1 temperature exceeds high limit.
Set to 0, VT1 temperature does not exceed high limit.
5
VT1LOW
RO
Set to 1, VT1 temperature goes below low limit.
Set to 0, VT1 temperature does not goes below low limit.
4
VT2HIGH
RO
Set to 1, VT2 temperature exceeds high limit.
Set to 0, VT2 temperature does not exceed high limit.
3
VT2LOW
RO
Set to 1, VT2 temperature goes below low limit.
Set to 0, VT2 temperature does not goes below low limit.
2
OPEN
RO
Set to 1, VT2 is open-circuit.
1
VT2THERM
RO
Set to 1, VT2 temperature exceeds its THERM limit.
0
VT1THERM
RO
Set to 1, VT1 temperature exceeds its THERM limit.
VT1(Local) ; VT2(Remote)
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7.3 Conversion Rate Register  Index 04h(Read), 0Ah(Write)
Power on default <7:0> = 08h
Bit
Name
Attribute
7-0
CONV_RATE
R/W
Description
Set conversion times per second.
Value
Conversion/Sec
Value
Conversion/Sec
00h
0.0625
06h
4
01h
0.125
07h
8
02h
0.25
08h
16
03h
0.5
09h
32
04h
1
0Ah
64
05h
2
0Bh ~ FFh
Reserved
7.4 One-Shot Register  Index 0Fh
Power on default <7:0> = xxh
Bit
Name
7-0
ONE-SHOT
Attribute
Description
WO
When F75383/F75384 is at standby mode, writing any value to this register
will initiate a single conversion and comparison cycle. After the single cycle,
F75383/F75384 will returns to standby mode.
7.5 Alert Queue & Timeout Register  Index 22h
Power on default <7:0> = 01h
Bit
Name
Attribute
7
EN_I2CTMOUT
R/W
Description
Set to 1, enable serial interface timeout function. (Timeout time = 25ms)
Set to 0, disable.
6-4
Reserved
3-1
ALERT_QUEUE
R/W
This number determines how many abnormal measurements must occur before
ALERT signal is generated.
000 : Once
001 : Twice
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011 : 3 times
111 : 4 times
0
Reserved
RO
Always read 1.
7.6 Status-with-ARA Control Register  Index 24h
Power on default <7:0> = 01h
Bit
Name
7-6
Reserved
0
EN_ARA_STS
Attribute
R/W
Description
Set to 1, ALERT de-asserted condition is related with ARA.
Set to 0, ALERT de-asserted condition is not related with ARA(Alert Response
Address).
7.7 Chip ID I Register  Index 5Ah
Power on default: 03h.
7.8 Chip ID II Register  Index 5Bh
Power on default: 03h.
7.9 Vendor ID I (Manufacturer ID) Register  Index 5Dh
Power on default: 19h.
7.10 Vendor ID I (Manufacturer ID) Register  Index 5Eh
Power on default: 34h.
7.11 Vendor ID II (Manufacturer ID) Register  Index FEh
Power on default: 23h. (programmable)
7.12 Value RAM  Index 10h- 2Fh
VT1 : Local Temperature
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VT2 : Remote Temperature
The value in quota is its power-on default value.
Description
Attribute
Read Address
Read Address
Write Address
Write Address
(High Byte)
(Low Byte)
(High Byte)
(Low Byte)
VT1 reading
RO
00h
1Ah
VT2 reading
RO
01h
10h
VT1 High Limit
R/W
05h (55h)
1Bh (00h)
0Bh
1Bh
VT1 Low Limit
R/W
06h (00h)
1Ch (00h)
0Ch
1Ch
VT2 High Limit
R/W
07h (55h)
13h (00h)
0Dh
13h
VT2 Low Limit
R/W
08h (00h)
14h (00h)
0Eh
14h
VT1 THERM limit
R/W
20h (55h)
20h
VT1 THERM Hysteresis
R/W
21h (0Ah)
21h
VT2 THERM limit
R/W
19h (55h)
19h
VT2 THERM Hysteresis
R/W
23h (0Ah)
23h
8. Electrical characteristic
8.1 Absolute Maximum Ratings
PARAMETER
RATING
UNIT
-0.5 to 5.5
V
-0.5 to VCC+0.5
V
Operating Temperature
0 to +140
°C
Storage Temperature
-55 to 150
°C
Power Supply Voltage
Input Voltage
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of
the device
8.2 DC Characteristics
(TA = 0° C to 70° C, VCC = 3.3V ± 10%, VSS = 0V )
Parameter
Temperature Error, Remote Diode
Conditions
o
TYP
±1
0 C <TD < 140 C
±1
60 C < TD < 100 C, VCC = 3.0V to 3.6V
o
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MIN
o
o
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MAX
Unit
o
C
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Temperature Error, Local Diode
o
o
0 C < TA < 100 C, VCC = 3.0V to 3.6V
Supply Voltage range
Average operating supply current
3.0
16 Conversions / Sec Rate
0.0625 Conversions / Sec Rate
±1
±3
3.3
3.6
Under-voltage lockout threshold
90
uA
5
uA
Diode source current
o
C
2.55
Power on reset threshold
V
uA
0.125
VCC input, Disables ADC , Rising Edge
C
180
Standby supply current
Resolution
o
2.2
V
2.4
V
High Level
95
uA
Low Level
10
uA
(TA = 0° C to 70° C, VCC = 3.3V ± 10%, VSS = 0V)
PARAMETER
SYM.
MIN.
TYP.
MAX.
UNIT
0.8
V
CONDITIONS
I/O12t - TTL level bi-directional pin with source-sink capability of 12 mA
Input Low Voltage
VIL
Input High Voltage
VIH
2.0
Output Low Current
IOL
10
Output High Current
IOH
Input High Leakage
Input Low Leakage
V
12
mA
VOL = 0.4V
-10
mA
VOH = 2.4V
ILIH
+1
µA
VIN = VCC
ILIL
-1
µA
VIN = 0V
-12
I/O12ts - TTL level bi-directional pin with source-sink capability of 12 mA and schmitt-trigger level input
Input Low Threshold Voltage
Vt-
0.5
0.8
Input High Threshold Voltage
Vt+
1.6
2.0
Output Low Current
IOL
10
12
Output High Current
IOH
V
VCC = 3.3 V
V
VCC = 3.3 V
mA
VOL = 0.4 V
-10
mA
VOH = 2.4V
Input High Leakage
ILIH
+1
µA
VIN = VCC
Input Low Leakage
ILIL
-1
µA
VIN = 0V
MAX.
UNIT
CONDITIONS
mA
VOL = 0.4V
mA
VOH = 2.4V
mA
VOL = 0.4V
-12
1.1
2.4
8.2 DC Characteristics, continued
PARAMETER
SYM.
MIN.
TYP.
OUT12t - TTL level output pin with source-sink capability of 12 mA
Output Low Current
IOL
Output High Current
IOH
12
16
-14
-12
OD8 - Open-drain output pin with sink capability of 8 mA
Output Low Current
F75383/F75384
IOL
6
8
-13-
July, 2007
V0.32P
F75383/F75384
OD16 - Open-drain output pin with sink capability of 16 mA
Output Low Current
IOL
12
16
mA
VOL = 0.4V
I/OOD16ts - TTL level bi-directional pin, can select to OD or OUT by register, with 16 mA source-sink capability
Input Low Threshold Voltage
Vt-
0.5
0.8
1.1
V
VCC = 3.3 V
Input High Threshold Voltage
Vt+
1.6
2.0
2.4
V
VCC = 3.3 V
Output Low Current
IOL
6
8
mA
VOL = 0.4 V
Output High Current
IOH
-12
mA
VOH = 2.4V
Input High Leakage
ILIH
+1
µA
VIN = VCC
Input Low Leakage
ILIL
-1
µA
VIN = 0V
Input Low Voltage
VIL
0.8
V
Input High Voltage
VIH
Input High Leakage
ILIH
+1
µA
VIN = VCC
Input Low Leakage
ILIL
-1
µA
VIN = 0 V
-16
INt - TTL level input pin
INts
-
2.0
V
TTL level Schmitt-triggered input pin
Input Low Threshold Voltage
Vt-
0.5
0.8
1.1
V
VCC = 3.3V
Input High Threshold Voltage
Vt+
1.6
2.0
2.4
V
VCC = 3.3V
Input High Leakage
ILIH
+1
µA
VIN = VCC
Input Low Leakage
ILIL
-1
µA
VIN = 0 V
8.3 AC Characteristics
t
SCL
t
t
R
R
SCL
t HD;SDA
t
SU;DAT
t
SU;STO
SDA IN
VALID DATA
t
HD;DAT
SDA OUT
Serial Bus Timing Diagram
F75383/F75384
-14-
July, 2007
V0.32P
F75383/F75384
Serial Bus Timing
PARAMETER
SYMBOL
MIN.
MAX.
UNIT
t-SCL
0.5
10000
uS
Start condition hold time
tHD;SDA
0.5
uS
Stop condition setup-up time
tSU;STO
0.5
uS
DATA to SCL setup time
tSU;DAT
50
nS
DATA to SCL hold time
tHD;DAT
50
nS
SCL and SDA rise time
tR
0.4
uS
SCL and SDA fall time
tF
0.4
uS
SCL clock period
9. Package Dimensions
(F75383/F75384 8-MSOP Package )
F75383/F75384
-15-
July, 2007
V0.32P
F75383/F75384
8
5
c
E
HE
L
4
1
O
0.25
D
A
Y
e
SEATING PLANE
GAUGE PLANE
A1
b
Control demensions are in milmeters .
SYMBOL
A
A1
b
c
E
D
e
HE
Y
L
θ
DIMENSION IN MM
MAX.
MIN.
1.35
1.75
0.10
0.25
0.33
0.51
0.19
0.25
3.80
4.00
4.80
5.00
1.27 BSC
6.20
5.80
0.10
0.40
1.27
0
10
DIMENSION IN INCH
MIN.
MAX.
0.053
0.069
0.010
0.004
0.020
0.013
0.010
0.008
0.157
0.150
0.188
0.196
0.050 BSC
0.228
0.016
0
0.244
0.004
0.050
10
(F75383/F75384 8-SOP Package )
Feature Integration Technology Inc.
Headquarters
Taipei Office
3F-7, No 36, Tai Yuan St.,
Bldg. K4, 7F, No.700, Chung Cheng Rd.,
Chupei City, Hsinchu, Taiwan 302, R.O.C.
Chungho City, Taipei, Taiwan 235, R.O.C.
TEL : 886-3-5600168
TEL : 866-2-8227-8027
FAX : 886-3-5600166
FAX : 866-2-8227-8037
www: http://www.fintek.com.tw
Please note that all datasheet and specifications are subject to change without notice. All
the trade marks of products and companies mentioned in this datasheet belong to their
respective owner
F75383/F75384
-16-
July, 2007
V0.32P
10 Application Circuit
Example 1:
TEMPERATURE MONITOR (CPU THERMAL DIODE)
D+
THERDA
C1
2200pF
THERDC
VCC3V
DC2
0.1u
R1
4.7K
R2
R3
R4
4.7K
4.7K
4.7K
Example 2:
U1
TEMPERATURE MONITOR (2N3906)
D+
D-
D+
Q1
2N3906
C3
2200pF
1
2
3
4
VCC
D+
DTHERM#
SCL
SDA
ALERT#
GND
8
7
6
5
SCLK
SDATA
F75383M
D-
Title
Size
A
Date:
-17-
Feature Integration Technology Inc.
Document Number
F75383M Application Circuit
Tuesday , January 27, 2004
Rev
0.1
Sheet
1
of
1
July, 2007
V0.32P
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