TI JM3851000404BCA Dual j.k positve.edge.triggered flip.flops with preset and clear Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
23-Mar-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
Samples
(Requires Login)
JM38510/30109B2A
ACTIVE
LCCC
FK
20
1
TBD
JM38510/30109BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
JM38510/30109BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
JM38510/30109BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
JM38510/30109BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
JM38510/30109SEA
ACTIVE
CDIP
J
16
25
TBD
A42
N / A for Pkg Type
JM38510/30109SEA
ACTIVE
CDIP
J
16
25
TBD
A42
N / A for Pkg Type
JM38510/30109SFA
ACTIVE
CFP
W
16
25
TBD
A42
N / A for Pkg Type
JM38510/30109SFA
ACTIVE
CFP
W
16
25
TBD
A42
N / A for Pkg Type
M38510/30109B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
M38510/30109B2A
ACTIVE
LCCC
FK
20
1
TBD
M38510/30109BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
M38510/30109BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
M38510/30109BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
M38510/30109BFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
M38510/30109SEA
ACTIVE
CDIP
J
16
25
TBD
A42
N / A for Pkg Type
M38510/30109SEA
ACTIVE
CDIP
J
16
25
TBD
A42
N / A for Pkg Type
M38510/30109SFA
ACTIVE
CFP
W
16
25
TBD
A42
N / A for Pkg Type
M38510/30109SFA
ACTIVE
CFP
W
16
25
TBD
A42
N / A for Pkg Type
SN54LS109AJ
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
SN54LS109AJ
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
SN74109N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74109N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74LS109AD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109AD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ADE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ADE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
(3)
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
23-Mar-2012
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ADR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ADR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ADRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ADRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ADRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ADRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109AN
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS109AN
ACTIVE
PDIP
N
16
OBSOLETE
PDIP
N
16
TBD
TBD
Call TI
Call TI
Call TI
Call TI
SN74LS109AN3
OBSOLETE
PDIP
N
16
SN74LS109ANE4
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS109ANE4
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS109ANSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ANSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ANSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ANSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ANSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS109ANSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SNJ54LS109AFK
ACTIVE
LCCC
FK
20
1
TBD
Addendum-Page 2
Samples
(Requires Login)
SN74LS109ADG4
SN74LS109AN3
(3)
POST-PLATE N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
23-Mar-2012
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SNJ54LS109AFK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS109AJ
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
SNJ54LS109AJ
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
SNJ54LS109AW
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
SNJ54LS109AW
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS109A, SN54LS109A-SP, SN74LS109A :
• Catalog: SN74LS109A, SN54LS109A
• Military: SN54LS109A
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
23-Mar-2012
• Space: SN54LS109A-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS109ADR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74LS109ANSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LS109ADR
SN74LS109ANSR
SOIC
D
16
2500
333.2
345.9
28.6
SO
NS
16
2000
367.0
367.0
38.0
Pack Materials-Page 2
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