ON MJD41CRLG Complementary power transistor Datasheet

MJD41C(NPN),
MJD42C(PNP)
Complementary Power
Transistors
DPAK for Surface Mount Applications
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Designed for general purpose amplifier and low speed switching
applications.
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves
•
•
•
•
•
(No Suffix)
Straight Lead Version in Plastic Sleeves (“1” Suffix)
Electrically Similar to Popular TIP41 and TIP42 Series
Epoxy Meets UL 94 V−0 @ 0.125 in
NJV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
SILICON
POWER TRANSISTORS
6 AMPERES
100 VOLTS, 20 WATTS
COMPLEMENTARY
COLLECTOR
2, 4
1
BASE
1
BASE
MAXIMUM RATINGS
Rating
3
EMITTER
Symbol
Max
Unit
VCEO
100
Vdc
Collector−Base Voltage
VCB
100
Vdc
Emitter−Base Voltage
VEB
5
Vdc
IC
6
Adc
ICM
10
Adc
1 2
Base Current
IB
2
Adc
Total Power Dissipation
@ TC = 25°C
Derate above 25°C
PD
DPAK
CASE 369C
STYLE 1
Total Power Dissipation (Note 1)
@ TA = 25°C
Derate above 25°C
PD
Operating and Storage Junction
Temperature Range
Collector−Emitter Voltage
Collector Current − Continuous
Collector Current − Peak
20
0.16
W
W/°C
W
1.75
0.014
W/°C
TJ, Tstg
−65 to +150
°C
ESD − Human Body Model
HBM
3B
V
ESD − Machine Model
MM
C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
COLLECTOR
2, 4
3
EMITTER
4
4
1
3
2
3
IPAK
CASE 369D
STYLE 1
MARKING DIAGRAMS
AYWW
J4xCG
AYWW
J4xCG
DPAK
A
Y
WW
J4xC
G
IPAK
=
=
=
=
Assembly Location
Year
Work Week
Device Code
x = 1 or 2
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
August, 2013 − Rev. 12
1
Publication Order Number:
MJD41C/D
MJD41C (NPN), MJD42C (PNP)
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Case
RqJC
6.25
°C/W
Thermal Resistance, Junction−to−Ambient (Note 2)
RqJA
71.4
°C/W
Min
Max
Unit
100
−
−
50
−
10
−
0.5
30
15
−
75
−
1.5
−
2
3
−
20
−
2. These ratings are applicable when surface mounted on the minimum pad sizes recommended.
ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted)
Characteristic
Symbol
OFF CHARACTERISTICS
VCEO(sus)
Collector−Emitter Sustaining Voltage (Note 3)
(IC = 30 mAdc, IB = 0)
Collector Cutoff Current
(VCE = 60 Vdc, IB = 0)
ICEO
Collector Cutoff Current
(VCE = 100 Vdc, VEB = 0)
ICES
Emitter Cutoff Current
(VBE = 5 Vdc, IC = 0)
IEBO
Vdc
mAdc
mAdc
mAdc
ON CHARACTERISTICS (Note 3)
hFE
DC Current Gain
(IC = 0.3 Adc, VCE = 4 Vdc)
(IC = 3 Adc, VCE = 4 Vdc)
Collector−Emitter Saturation Voltage
(IC = 6 Adc, IB = 600 mAdc)
VCE(sat)
Base−Emitter On Voltage
(IC = 6 Adc, VCE = 4 Vdc)
VBE(on)
−
Vdc
Vdc
DYNAMIC CHARACTERISTICS
Current Gain − Bandwidth Product (Note 4)
(IC = 500 mAdc, VCE = 10 Vdc, ftest = 1 MHz)
fT
Small−Signal Current Gain
(IC = 0.5 Adc, VCE = 10 Vdc, f = 1 kHz)
hfe
3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
4. fT = ⎪hfe⎪• ftest.
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2
MHz
−
MJD41C (NPN), MJD42C (PNP)
PD, POWER DISSIPATION (WATTS)
TYPICAL CHARACTERISTICS
TA
2.5
TC
25
2
20
VCC
+30 V
+11 V
1.5
0
15
TC
TA SURFACE MOUNT
10
0.5
5
0
0
25
50
tr, tf ≤ 10 ns
DUTY CYCLE = 1%
75
100
125
150
Figure 2. Switching Time Test Circuit
2
500
300
200
VCE = 2 V
TJ = 150°C
100
70
50
0.7
0.5
25°C
30
20
TJ = 25°C
VCC = 30 V
IC/IB = 10
1
t, TIME (s)
μ
hFE , DC CURRENT GAIN
-4 V
RB and RC VARIED TO OBTAIN DESIRED CURRENT LEVELS
D1 MUST BE FAST RECOVERY TYPE, e.g.:
MSB5300 USED ABOVE IB ≈ 100 mA
MSD6100 USED BELOW IB ≈ 100 mA
REVERSE ALL POLARITIES FOR PNP.
Figure 1. Power Derating
10
7
5
0.06
0.3
0.2
tr
0.1
0.07
-55°C
td @ VBE(off) ≈ 5 V
0.05
0.2
0.1
0.3 0.4
0.6
1
2
4
0.03
0.02
0.06 0.1
6
0.2
0.4
1
2
IC, COLLECTOR CURRENT (AMP)
Figure 3. DC Current Gain
Figure 4. Turn−On Time
4
6
5
TJ = 25°C
TJ = 25°C
VCC = 30 V
IC/IB = 10
IB1 = IB2
3
2
1.6
t, TIME (s)
μ
ts
1.2
VCE(sat) @ IC/IB = 10
VBE @ VCE = 4 V
0.2 0.3 0.4
0.3
0.2
0.1
0.07
0.05
0.06 0.1
VBE(sat) @ IC/IB = 10
0.1
1
0.7
0.5
tf
0.4
0
0.06
0.6
IC, COLLECTOR CURRENT (AMP)
2
0.8
D1
51
-9 V
1
SCOPE
RB
T, TEMPERATURE (°C)
V, VOLTAGE (VOLTS)
RC
25 ms
0.6
1
2
3
4
6
IC, COLLECTOR CURRENT (AMP)
0.2
0.4 0.6
1
2
IC, COLLECTOR CURRENT (AMP)
Figure 5. “On” Voltages
Figure 6. Turn−Off Time
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3
4
6
300
2
TJ = 25°C
TJ = 25°C
200
1.6
IC = 1 A
2.5 A
C, CAPACITANCE (pF)
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
MJD41C (NPN), MJD42C (PNP)
5A
1.2
0.8
Cib
100
70
Cob
50
0.4
0
10
20
30
50
100
200 300
IB, BASE CURRENT (mA)
500
1000
30
0.5
1
3
10
2
5
20
VR, REVERSE VOLTAGE (VOLTS)
r(t), EFFECTIVE TRANSIENT THERMAL
RESISTANCE (NORMALIZED)
D = 0.5
0.3
0.2
0.2
0.05
0.02
0.03
P(pk)
RqJC(t) = r(t) RqJC
RqJC = 6.25°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) - TC = P(pk) qJC(t)
0.1
0.1
0.07
0.05
50
Figure 8. Capacitance
Figure 7. Collector Saturation Region
1
0.7
0.5
30
0.01
t1
t2
DUTY CYCLE, D = t1/t2
SINGLE PULSE
0.02
0.01
0.01
0.02 0.03
0.05
0.1
0.2 0.3
0.5
1
2 3
5
t, TIME (ms)
10
20
30
50
100
200 300
500
1000
Figure 9. Thermal Response
IC, COLLECTOR CURRENT (AMP)
10
500ms
5
3
2
1ms
dc
5ms
1
0.5
0.3
WIRE BOND LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
CURVES APPLY BELOW RATED VCEO
0.1
0.05
0.03
0.01
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate IC − VCE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 10 is based on TJ(pk) = 150_C; TC is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided
TJ(pk) v 150_C. TJ(pk) may be calculated from the data in
Figure 9. At high case temperatures, thermal limitations will
reduce the power that can be handled to values less than the
limitations imposed by second breakdown.
100ms
TC = 25°C SINGLE PULSE
TJ = 150°C
1
MJD41C, 42C
2
3
5 7 10
20 30
50 70 100
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 10. Maximum Forward Bias
Safe Operating Area
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4
MJD41C (NPN), MJD42C (PNP)
ORDERING INFORMATION
Package Type
Package
Shipping†
MJD41CRLG
DPAK
(Pb−Free)
369C
1,800 / Tape & Reel
MJD41CT4G
DPAK
(Pb−Free)
369C
2,500 / Tape & Reel
NJVMJD41CT4G*
DPAK
(Pb−Free)
369C
2,500 / Tape & Reel
MJD42CG
DPAK
(Pb−Free)
369C
75 Units / Rail
MJD42C1G
IPAK
(Pb−Free)
369D
75 Units / Rail
MJD42CRLG
DPAK
(Pb−Free)
369C
1,800 / Tape & Reel
NJVMJD42CRLG*
DPAK
(Pb−Free)
369C
1,800 / Tape & Reel
MJD42CT4G
DPAK
(Pb−Free)
369C
2,500 / Tape & Reel
NJVMJD42CT4G*
DPAK
(Pb−Free)
369C
2,500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable
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5
MJD41C (NPN), MJD42C (PNP)
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
A
A
E
b3
c2
B
4
L3
Z
D
1
2
H
DETAIL A
3
L4
b2
e
c
b
0.005 (0.13)
M
C
H
L2
GAUGE
PLANE
C
L
SEATING
PLANE
A1
L1
DETAIL A
ROTATED 905 CW
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
SOLDERING FOOTPRINT*
6.20
0.244
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
MJD41C (NPN), MJD42C (PNP)
PACKAGE DIMENSIONS
IPAK
CASE 369D
ISSUE C
C
B
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
E
R
4
Z
A
S
1
2
3
−T−
SEATING
PLANE
K
J
F
H
D
G
DIM
A
B
C
D
E
F
G
H
J
K
R
S
V
Z
INCHES
MIN
MAX
0.235 0.245
0.250 0.265
0.086 0.094
0.027 0.035
0.018 0.023
0.037 0.045
0.090 BSC
0.034 0.040
0.018 0.023
0.350 0.380
0.180 0.215
0.025 0.040
0.035 0.050
0.155
−−−
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.46
0.58
0.94
1.14
2.29 BSC
0.87
1.01
0.46
0.58
8.89
9.65
4.45
5.45
0.63
1.01
0.89
1.27
3.93
−−−
3 PL
0.13 (0.005)
M
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
T
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MJD41C/D
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