Rohm BD8152FVM Boost converter with integrated fet Datasheet

Datasheet
2.1V(or 2.5V) to 5.5V, 1.5A 1ch
Boost Converter with Integrated FET
BD8152FVM
BD8158FVM
General Description
Key Specifications
 Input Voltage Range:
BD8152FVM and BD8158FVM are 1-Channel boost
converter which uses low voltage FET. The input
voltage is 2.5V to 5.5V for BD8152FVM and 2.1V to
5.5V for BD8158FVM achieving a low power
consumption. The high accuracy feedback voltage
(±1%) is established and the brightness dispersion of
TFT-LCD panel is suppressed.





BD8152FVM
2.5V to 5.5V
BD8158FVM
2.1V to 5.5V
Switching Frequency:
600 kHz/1,200 kHz
250mΩ(Typ)
Integrated FET RON
Feedback Voltage:
1.245 ± 1%
Ultra-Low Current Consumption:
0µA (Typ)
Operating Temperature Range:
BD8152FVM -40°C to +85°C
BD8158FVM -40°C to +125°C
Features




Current Mode PWM System
Built-In Under-Voltage Lockout Protection Circuit
Built-In Over-Current Protection Circuit
Built-In Thermal Shutdown Circuit
Package
W (Typ) x D (Typ) x H (Max)
Applications
 Panels for the Satellite Navigation System
 Laptop PC( 7 to17 inches)
 TFT-LCD Panels
MSOP8
2.90mm x 4.00 mm x 0.90mm
Typical Application Circuit
Vo
L
VCC,PVCC
FCLK,ENB
Cin
VCC
SW
COMP
Rc
Co
GND,PGND
Cc
Figure 1. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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BD8152FVM
BD8158FVM
Pin Configuration
(TOP VIEW)
MSOP8
COMP
1
8
SS
FB
2
7
FCLK
ENB
3
6
VCC
4
5
SW
GND
Figure 2. Pin Configuration
Pin Description
Pin No.
Pin Name
Function
1
COMP
2
FB
3
ENB
4
GND
5
SW
N-Channel power FET drain output
6
VCC
Power supply input pin
7
FCLK
Frequency switching pin
8
SS
Error amp output
Error amp inversion input pin
Control input pin
Ground pin
Soft-start current output pin
Block Diagram
SS
FCLK
VCC
SW
8
7
6
5
CURRENT
SENSE
SLOPE
OS
+
Set
SOFT
START
LOGIC
Reset
DRV
SDWN
PWM
+ OCP
UVLO/TSD
ERR
- +
VREF
1.245V
1
2
3
4
COMP
FB
ENB
GND
Figure 3. Block Diagram
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Absolute Maximum Ratings (Ta = 25°C)
Parameter
Power Supply Voltage Range
Symbol
Limit
Unit
VCC
7
V
W
°C
Pd
0.58(Note1)
Storage Temperature Range
Tstg
-55 to +150
Switch Pin Current
ISW
1.5(Note2)
A
Switch Pin Voltage
VSW
15
V
Tjmax
150
°C
Power Dissipation
Maximum Junction Temperature
(Note 1) Reduced by 4.7 W/°C over 25°C, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
(Note 2) Must not exceed Pd.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short
circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Recommended Operating Conditions (Ta = 25°C)
Parameter
Power Supply Voltage Range
Symbol
BD8152FM
BD8158FM
Switch Current
ISW
Switch Pin Voltage Range
Operating Temperature
Range
VCC
VSW
BD8152FM
BD8158FM
Topr
Min
2.5
Limit
Typ
3.3
2.1
2.5
4.0(5.5)(Note3)
V
-
-
1.4
A
Unit
Max
5.5
V
-
-
14
V
-40
-
+85
°C
-40
-
+125
°C
(Note3) Specified at 600kHz switching operation.
Electrical Characteristics
BD8152FVM (Unless otherwise specified, Ta = 25°C; VCC = 3.3V; VENB = 3.3V)
Limit
Parameter
Symbol
Min
Typ
Max
[Triangular Waveform Oscillator]
Oscillating Frequency 1
fOSC1
540
600
660
Oscillating Frequency 2
fOSC2
1.08
1.20
1.32
[Over-Current Protection Circuit]
Over-Current Limit
ISW
2
[Soft-Start Circuit]
SS Source Current
ISO
6
10
14
[Under-Voltage Lockout Protection Circuit]
OFF Threshold Voltage
VUTOFF
2.1
2.2
2.3
ON Threshold Voltage
VUTON
2.0
2.1
2.2
[Error Amp]
Input Bias Current
IB
0.1
0.5
Feedback Voltage
VFB
1.232
1.245
1.258
[Output]
ON-Resistance
RON
250
380
Max Duty Ratio
DMAX
72
80
88
[ENB]
ENB ON Voltage
VON
VCCx0.7
VCC
ENB OFF Voltage
VOFF
0
VCCx0.3
[Overall]
Standby Current
ISTB
0
10
Average Consumption Current
ICC
1.2
2.4
Unit
kHz
MHz
Conditions
VFCLK = 0V
VFCLK = VCC
A
µA
VSS = 0.5V
V
V
µA
V
mΩ
%
Buffer
(Note 4)I
SW = 1 A
RL = 100 Ω
V
V
µA
mA
VENB = 0 V
No Switching
(Note 4) Design guarantee (No total shipment inspection is made.)
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BD8152FVM
BD8158FVM
Electrical Characteristics – continued
BD8158FVM (Unless otherwise specified, Ta = 25°C; VCC = 2.5V; VENB = 2.5V)
Limit
Parameter
Symbol
Min
Typ
Max
[Triangular Waveform Oscillator]
Oscillating Frequency 1
fOSC1
480
600
720
Oscillating Frequency 2
fOSC2
0.96
1.20
1.44
[Over-Current Protection Circuit]
Over-Current Limit
ISW
2
[Soft-Start Circuit]
SS Source Current
ISO
6
10
14
[Under-Voltage Lockout Protection Circuit]
OFF Threshold Voltage
VUTOFF
1.7
1.8
1.9
ON Threshold Voltage
VUTON
1.6
1.7
1.8
[Error Amp]
Input Bias Current
IB
0.1
0.5
Feedback Voltage
VFB
1.232
1.245
1.258
[Output]
ON-Resistance
RON
250
Max Duty Ratio
DMAX
85
[ENB]
ENB ON Voltage
VON
VCCx0.7
VCC
ENB OFF Voltage
VOFF
0
VCCx0.3
[Overall]
Standby Current
ISTB
0
10
Average Consumption Current
ICC
1.2
2.4
Unit
kHz
MHz
Conditions
VFCLK = 0V
VFCLK = VCC
A
µA
VSS = 0.5 V
V
V
µA
V
mΩ
%
Buffer
(Note 5)I
SW = 1 A
RL = 100 Ω
V
V
µA
mA
VENB = 0 V
No Switching
(Note 5) Design guarantee (No total shipment inspection is made.)
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BD8158FVM
Typical Performance Curves
(Unless otherwise specified, Ta = 25°C)
Standby Current: ICC[µA]
STANDBY CURRENT:Icc [uA]
Supply Current: ICC[mA]
2.000
-40°C
25°C
125°C
1.500
1.000
125°C
0.500
0.000
-0.500
25°C
-40°C
-1.000
-1.500
-2.000
0
2
3
4
SUPPLY
VOLTAGE:Vcc
Supply Voltage:
VCC [V][V]
Supply Voltage: VCC [V]
Figure 4. Supply Current vs Supply Voltage
Figure 5. Standby Current vs Supply Voltage
1.260
0
1.255
-4
SS
Current: ISS[µA]
SS
CURRENT:ISS[uA]
Reference Voltage: VREF[V]
REFERENCE VOLTAGE:VREF[V]
1
1.250
1.245
1.240
1.235
-8
-12
-16
1.230
-40
-15
10
35
60
85
-20
110
0
AmbientTEMPERATURE:Ta
Temperature: Ta[°C][℃]
AMBIENT
1
1.5
2
Voltage: VSS[V]
SSSS
VOLTAGE:VSS[V]
Figure 7. SS Current vs SS Voltage
Figure 6. Reference Voltage vs Temperature
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BD8158FVM
Typical Performance Curves - continued
2000
BD8158FVM
1.8
VFCLK=VCC
1.6
1500
1.4
ICOMP [µA]
ICOMP[uA]
Reference Voltage: VREF[V]
REFERENCE VOLTAGE:VREF[V]
2.0
1.2
1.0
0.8
0.6
1000
VFCLK=GND
500
0.4
0.2
0
0.0
-40
0
2
-15
4
10
35
60
85
110
VCOMP [V]
VCOMP[V]
SupplyVOLTAGE:VCC[V]
Voltage: VCC[V]
SUPPLY
Figure 9. ICOMP vs VCOMP
125°C
ENB Current: IENB[µA]
fCLK Current: IfCLK[µA]
Figure 8. Reference Voltage vs Supply Voltage
25°C
-40°C
25°C
-40°C
fCLK Voltage: VFCLK[V]
ENB Voltage: VENB[V]
Figure 10. fCLK Pin Current vs fCLK Voltage
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125°C
Figure 11. ENB Pin Current vs ENB Voltage
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BD8152FVM
BD8158FVM
Typical Performance Curves - continued
100
100
95
Max
Duty
Max
Duty[%]
[%]
ICOMP [µA]
50
0
90
85
-50
80
-40
-100
1.0
1.1
1.2
1.3
VCOMP [V]
1.4
1.5
-15
10
35
60
85
110
AMBIENT
[℃]
AmbientTEMPERATURE:Ta
Temperature: Ta[°C]
Figure 13. Max Duty vs Temperature
Figure 12. ICOMP vs VCOMP
80
VCC = 2.5 VF = 1200kHz
Efficiency [%]
Efficiency [%][%]
EFFICIENCY
90
70
VCC = 2.5 VF = 600kHz
60
BD8158FVM
50
0.05
0.1
0.15
0.2
0.25
BD8152FVM
0.3
OUTPUT
Output CURRENT:Io[A]
Current: IO[A]
Output Current: IO[A]
Figure 14. Efficiency vs Output Current
(VCC=2.5V)
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Figure 15. Efficiency vs Output Current
(VCC=5V)
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BD8152FVM
BD8158FVM
Typical Performance Curves - continued
0.8
Maximum Current: IOMAX[A]
MAXIMUM CURRENT:IOMAX[A]
100
Efficiency [%]
EFFICIENCY [%]
90
80
70
60
BD8158FVM
50
2.0
2.5
3.0
3.5
BD8158FVM
0.6
0.4
f = 600 kHz
0.2
f = 1200 kHz
0
2.0
4.0
SUPPLY
VOLTAGE:Vcc[V]
Supply Voltage:
VCC[V]
2.4
2.8
3.2
3.6
Supply Voltage: VCC[V]
SUPPLY VOLTAGE:Vcc[V]
4.0
Figure 17. Maximum Current vs Supply Voltage
Figure 16. Efficiency vs Supply Voltage
9
9
8.8
8.8
Output Voltage:
VO[V]
OUTPUT
VOLTAGE:Vo[V]
Output VOLTAGE:Vo[V]
Voltage: VO[V]
OUTPUT
VCC = 2.5V
8.6
8.4
8.2
8.6
8.4
8.2
BD8158FVM
8
2.0
8
0.0
2.5
3.0
3.5
4.0
1.0
Load CURRENT:Io[A]
Current: Io[A]
LOAD
SupplyVOLTAGE:Vcc[V]
Voltage: VCC[V]
SUPPLY
Figure 19. Output Voltage vs Load Current
(Load Regulation 1)
Figure 18. Output Voltage vs Supply Voltage
( Line Regulation)
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BD8152FVM
BD8158FVM
Typical Performance Curves - continued
Output
Voltage:
VO[V]
OUTPUT
VOLTAGE:Vo[V]
9
8.8
VCC=5V
8.6
8.4
8.2
BD8152FVM
8
0.0
0.1
Load
Current:
IO[A]
LOAD CURRENT:Io[A]
1.0
Figure 20. Output Voltage vs Load Current
(Load Regulation 2)
Typical Waveforms
IO = 0mA
IO = 100mA
VO
20µs
100mV
Figure 21. Load Response Waveform
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BD8158FVM
Application Information
1. Description of Operation of Each Block
D1
RB161M-20
10uH
L1
V
OUT
VOUT
9V
VVCC
CC
C0
10uF
C1
10uF
8
6
7
SS
5
VCC
FCLK
SW
CURRENT
SENSE
C2
0.01uF
SLOPE
OSC
+
Set
SOFT
START
LOGIC
Reset
DRV
SDWN
PWM
+ OCP
UVLO/TSD
ERR
- +
VREF
1.245V
COMP
FB
C4
100pF
ENB
2
1
R3
5.1kΩ
C3
3300pF
3
GND
4
R1
110kΩ
R2
18kΩ
(1) Error Amp (ERR)
This is the circuit used to compare the reference voltage 1.245V(Typ) and the feedback voltage of output. Switching
duty is decided by the COMP pin voltage which is connected to the error amp output. During start-up, since the soft
start is operated by the SS pin voltage, the COMP pin voltage is limited to SS pin voltage.
(2) Oscillator (OSC)
This block generates the oscillating frequency. It is possible to select 600kHz/1.2MHz(Typ) via fCLK pin.
(3) SLOPE
This block generates the triangular waveform from the clock generated by OSC. Generated triangular waveform is
fed to the PWM comparator.
(4) PWM
The output COMP voltage of the error amp and the triangular waveform of the SLOPE block are compared to set the
switching duty. Since the switching duty is limited by the maximum duty ratio which is set internally, it does not
become 100%.
(5) Reference Voltage (VREF)
This block generates the internal reference voltage of 1.245V(Typ).
(6) Protection Circuit (UVLO/TSD)
UVLO (under-voltage lockout protection circuit) shuts down the circuit when the voltage is equal or lower than
2.2V(Typ) for BD8152FVM and 1.8V(Typ) for BD8158FVM. Thermal shutdown circuit shuts down IC’s operation at
175°C(Typ) and recovers at 160°C (Typ).
(7) Over-Current Protection Circuit (OCP)
Current flowing to the power FET is detected by voltage at the CURRENT SENSE and the Over-Current protection
operates at 3A(Typ). When the Over-Current protection activates, the switching is turned OFF and the SS pin
capacity is discharged.
(8) Soft-Start Circuit
Since the output voltage rises gradually while restricting the current at the time of startup, it is possible to prevent the
output voltage overshoot or the inrush current.
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BD8152FVM
BD8158FVM
2. Timing Chart
Startup sequence
VCC
ENB
SS
SW
VO
Figure 22. Startup Sequence Waveform
Over-Current protection operation
2.5V
VCC,ENB
SS
SW
VO
IO
Figure 23. Over-Current Protection Operating Waveform
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BD8152FVM
BD8158FVM
3. Selecting Application Components
(1)
Setting the Output L Constant
The coil L to use for output is decided by the rating current ILR and input current maximum value IINMAX of the coil.
VCC
∆ILL should not
IINMAX + ∆I
IL
IL
reach the rating value level
L
IL
VO
ILR
ILR
INMAX average
IIINMAX
average
current
current
CO
t
Figure 25. Output Application Circuit Diagram
Figure 24. Coil Current Waveform
Adjust coil L so that IINMAX + ∆IL does not reach the rating current value ILR. At this time, ∆IL can be obtained by the
following equation.
∆I L =
V − VCC 1
1
VCC × O
×
L
VO
f
[ A]
where:
f is the switching frequency.
Set with sufficient margin because the coil L value may have the dispersion of approx. ±30%. If the coil current
exceeds the rating current ILR of the coil, it may damage the IC internal element.
BD8152FVM and BD8158FVM use a current mode DC/DC converter control and an optimized design at the coil value.
The following coil values are recommended considering the power efficiency, response and safety. When the coil
value selected is out of this range, the stable continues operation is not guaranteed such as the switching waveform
becomes irregular. Please pay attention to it.
Switching frequency: L = 10 µH to 22 µH at 600 kHz
Switching frequency: L = 4.7 µH to 15 µH at 1,200 kHz
(2)
Setting the Output Capacitor
For the capacitor C to use for the output, select the capacitor which has the larger ripple voltage (VPP) and drop
voltage allowance value at the time of sudden load change. Output ripple voltage is decided by the following equation.
∆V PP = I LMAX × R ESR +
where:
f is the switching frequency
V
∆I 
1

× CC ×  I LMAX − L 
fC O VO
2 

[V ]
Perform setting so that the voltage is within the allowable ripple voltage range.
For the drop voltage during sudden load change (VDR), please perform a rough calculation using the following
equation.
V DR =
∆I
×10 µ sec
CO
[V ]
However, 10 µs is the rough calculation value of the DC/DC response speed. Please set the capacitance considering
the sufficient margin so that these two values are within the standard value range.
(3)
Selecting the Input Capacitor
Since the peak current flows between the input and output at the DC/DC converter, a capacitor is required at the input
side. For this reason, the low ESR capacitor is recommended as an input capacitor which has the value more than
10μF and less than 100 mΩ ESR. If a capacitor selected is out of this range, the excessive ripple voltage will occur on
the input voltage hence it may cause the malfunction of IC.
However, these conditions may vary according to the load current, input voltage, output voltage, inductance and
switching frequency. Be sure to perform the margin check using the actual product.
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(4)
BD8158FVM
Selecting the Output Rectification Diode
Schottky barrier diode is recommended as the rectification diode to be used at the DC/DC converter output stage.
Select the diode paying attention to the max inductor current and max output voltage.
Max Inductor Current
Max Output Voltage
IINMAX + ∆IL
VOMAX
<
<
Current rating of diode
Voltage rating of diode
Since each parameter has 30% to 40% of dispersion, be sure to design with sufficient margins.
(5)
Design of the Feedback Resistor Constant
Refer to the following equation to set the feedback resistor. As the setting range, 10kΩ to 330kΩ is recommended.
If the resistor is set to 10kΩ or lower, it causes the reduction of power efficiency. If it is set to 330kΩ or larger,
the offset voltage becomes larger with respect to the input bias current 0.4µA(Typ) in the internal error amp.
R + R9
VO = 8
× 1.245
R9
Step-Up
[V ]
Reference voltage 1.245 V
V
VoO
R
R88
＋
ERR
2
－
FB
R
9
R9
Figure 26. Feedback Resistor Setting
Setting the Soft-Start Time
Soft-start is required to prevent the coil current from increasing and the
overshoot of the output voltage at the time of startup. Figure 27. shows
the relation between the capacitance and soft start time. Please refer to it
to set the capacitance.
For the capacitance value, 0.001µF to 0.1µF is recommended. If the
capacitance value is set to 0.001µF or lower, overshoot may occur on the
output voltage. If the capacitance value is set to 0.1µF or larger,
excessive back current flow may occur in the internal parasitic elements
when the power is turned OFF and it may damage the IC. When the
capacitor used is 0.1µF or larger, be sure to insert a diode to VCC in
series, or a bypass diode between the SS pin and VCC.
10
DELAY
TIME[ms]
Delay
Time
[ms]
(6)
1
0.1
0.01
0.001
0.01
0.1
CAPACITANCE[uF]
SSSS
Capacitance
[µF]
Bypass diode
Figure 27. SS Pin Capacitance vs
Delay Time
Back current prevention diode
VCC
VCC
Output pin
Figure 28. Bypass Diode Example
When there is startup sequence with other power supplies, be sure to use the high accuracy product (such as X5R).
Soft start time may vary according to the input voltage, output voltage, loads, coils and output capacity. Be sure to
verify the operation using the actual product.
(7)
Setting the ENB Pin
When the ENB pin is set to High, the internal circuit becomes active and the DC/DC converter starts its operation.
When it is set to Low, the shut down function activates and all circuits will be turned OFF.
(8)
Setting the Frequency by FCLK
It is possible to change the switching frequency by setting the FCLK pin to High or Low. When it is set to Low, the IC
operates at 600kHz(Typ). When it is set to High, the IC operates at 1,200kHz(Typ).
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BD8158FVM
(9)
Setting RC, CC of the Phase Compensation Circuit
In the current mode control, since the coil current is controlled, a pole (phase lag) made by the CR filter composed of the
output capacitor and load resistor will be created in the low frequency range, and a zero (phase lead) by the output
capacitor and ESR of capacitor will be created in the high frequency range. In this case, cancel the pole of the power
amplifier. It is easy to compensate by adding the zero point with CC and RC to the output from the error amp as shown in
the illustration.
Open loop gain
1
2π × RO × CO
1
f Z ( ESR) =
2π × ESR × CO
fP =
fp(Min)
A
fp(Max)
0
Gain
【dB】
lIOUT
Min
OUTMIN
fz(ESR)
lIOUT
Max
OUTMAX
[ Hz ]
Pole at the power amplification stage
When the output current decreases, the load
resistance Ro increases and the pole frequency
decreases.
0
Phase
【deg】
[ Hz ]
-90
f P ( Min) =
1
2π × RO MAX × CO
[ Hz ] ← At light − load
Error amp phase compensation
f Z ( Max) =
A
Gain
1
2π × RO MIN × CO
[ Hz ] ← At heavy − load
【dB】
Zero at the power amplification stage
When the output capacitor is set larger, the pole
frequency is decreased but the zero frequency will not
change. (This is because the capacitor ESR becomes
1/2 when the capacitor becomes 2 times.)
0
Phase
0
【deg】-90
f P ( Amp.) =
Figure 29. Gain vs Phase
VCC,PVCC
Vcc,PVcc
Cin
CIN
RRc
C
Ro
RO
ESR
SW
COMP
[ Hz ]
VO
Vo
L
VVCC
CC
1
2π × RC × CC
CCo
O
GND,PGND
CCc
C
Figure 30. Application Circuit Diagram
It is possible to achieve the stable feedback loop by canceling the pole fp (Min), which is created by the output
capacitor and load resistor, with CR zero compensation of the error amp as shown below.
f Z ( Amp.) = f P ( Min)

→
1
2π × RC × C C
=
1
2π × RO MAX × C O
[Hz ]
For the setting range of the resistor, 1kΩ to 10kΩ is recommended. When the resistor is set to 1kΩ or lower, the effect
of phase compensation becomes low and it may cause the oscillation of output voltage. When it is set to 10kΩ or
larger, the COMP pin becomes Hi-Z and the switching noise becomes easy to occur. Therefore the stable switching
pulse cannot be generated and the irregular ripple voltage may be generated on the output voltage.
For the setting range of the capacitance, 3,300pF to 10,000pF is recommended. When the capacitance is set to
3,300pF or lower, the irregular ripple voltage may be generated on the output voltage due to the effect of switching
noise. When it is set to 10,000pF or larger, the response becomes worse and the output voltage fluctuation becomes
large. Accordingly it may require the output capacitor which is larger than the necessary value.
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BD8152FVM
BD8158FVM
4. Application Examples
Although ROHM is sure that the application examples are recommendable ones, further check the characteristics of
components that require high precision before using them.
When using the circuit and modifying the externally connected circuit constant, be sure to decide allowing sufficient
margins considering the tolerance values of external parts as well as our IC including not only the static but also the
transient characteristic. For the patent, we have not acquired the sufficient confirmation. Please acknowledge the status.
(1) When the charge pump is removed from the DC/DC converter to make it 3-Channel output mode:
It is possible to create the charge pump by using the switching operation of DC/DC converter. When the application
shown in the following diagram is used, 1-Channel DC/DC converter output, 1-Channel positive side charge pump and
1-Channel negative side charge pump can be output as a total of 3-Channels.
0.1µF
0.1µF
D
D11
RB161M-20
10µH
L11
L
VCC
Vo
9V
DAN217U
C0
C0
10µF
1µF
C
C11
10µF
8
6
7
SS
VCC
FCLK
1µF
2SD2657k
SW
0.1µF
SLOPE
V
VGH
GH
UDZ
Series
C U R R E NT
SENSE
C2
C2
0.01µF
0.01µ
F
1kΩ
5
DAN217U
OSC
1µF
100kΩ
+
Set
SOFT
START
LOGIC
Reset
1µF 1kΩ
DRV
SDWN
2SB1695k
V
GL
VGL
PWM
+ -
UDZ
Series
OCP
1µF
UVLO/TSD
ERR
- +
VREF
1.245V
COMP
FB
ENB
2
1
R33
R
5.1kΩ
C33
C
3300pF
100kΩ
3
GND
4
R
R11
R22
R
110kΩ
18kΩ
Figure 31. 3ch Application Circuit Diagram Example
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(2) When the output voltage is set to 0V:
Since the switch does not exist between the input and output in the application using the boost type DC/DC converter,
the output voltage is generated even if the IC is turned OFF. When it is intended to maintain the output voltage 0V
until IC operates, insert the switch as shown in the following circuit diagram.
D1
D1
RB161M-20
1kΩ
L1
10µH
L1 10uH
Vo
VCC
10uF
10µF
C1
10uF
8
6
7
SS
5
VCC
FCLK
Switches of PNP or
PFET
SW
CURRENT
SENSE
C2
0.01uF
SLOPE
OSC
+
Set
SOFT
START
LOGIC
Reset
DRV
SDWN
PWM
+ OCP
UVLO/TSD
ERR
- +
VREF
1.245V
COMP
FB
1
R3
R3
5.1kΩ
C3
C3
3300pF
GND
ENB
2
3
4
R
R11
R
R22
18kΩ
110kΩ
Figure 32. Switch Application Circuit Diagram Example
Figure 32. 3ch Application Circuit Diagram Example
(3) When the circuit is intended to operate at the lower voltage than the IC’s operating range:
Although the recommended operating range of IC’s power supply starts from 2.5V / 2.1V (BD8152FVM,BD8158FVM), it
is possible to maintain the operation by composing the self-energizing type boost DC/DC converter application even if the
input voltage is lower than 2.1V. This example is recommended for the application with battery input.
D1
D1
RB161M-20
10uH
L1 10µH
L1
Vo
3.3V
VCC
2.0V
10uF
10µF
C1
C
1
10uF
10µF
8
6
7
SS
5
VCC
VCC
FCLK
SW
CURRENT
SENSE
C22
C
0.01uF
0.01µF
SLOPE
OSC
+
Set
SOFT
START
LOGIC
Reset
DRV
SDWN
PWM
+ OCP
UVLO/TSD
ERR
- +
VREF
1.245V
COMP
ENB
FB
2
1
R33
R
5.1kΩ
C3
C3
3300pF
GND
3
4
R
R11
R2
R
2
110kΩ
18kΩ
Figure 33. Self-Energizing Application Circuit Diagram Example
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(4) SEPIC type application
When it is intended to compose the boost type DC/DC converter, the SEPIC type application is recommended. Since
the switching voltage is generated by the value of input voltage + output voltage, pay utmost attention to the withstand
voltage of SW pin.
LL1
1
1 10µH
10uH
4.7µF
4.7uF
DD1
1
RB161M-20
Vo
VCC
10uH
10µH
C1
C
1
10uF
10µF
8
6
7
SS
5
VCC
VCC
FCLK
10µF
10uF
SW
CURRENT
SENSE
C2
C2
0.01uF
0.01µF
SLOPE
OSC
+
Set
SOFT
START
LOGIC
Reset
DRV
SDWN
PWM
+ OCP
UVLO/TSD
ERR
- +
VREF
1.245V
COMP
FB
GND
ENB
2
1
3
4
R1
R1
R
R33
5.1kΩ
C3
C3
3300pF
110kΩ
R
R22
18kΩ
Figure 34. SEPIC Application Circuit Diagram Example
(5) When the Supply Voltage is over 4.0V (BD8158FVM only)
The Capacitor C4 is inserted to COMP pin, and it operates when the supply voltage is over 4.0V.
In this case, switching frequency is limited to 600kHz.
DD1
1
RB161M-20
LL1
1 10µH
10uH
Vo
10µF
10uF
C1
C1
10uF
8
10µF
6
7
SS
5
VCC
VCC
FCLK
SW
CURRENT
SENSE
C2
C2
0.01uF
0.01µF
SLOPE
OSC
+
Set
SOFT
START
LOGIC
Reset
DRV
SDWN
PWM
+ OCP
UVLO/TSD
ERR
- +
VREF
1.245V
COMP
FB
1
C4
C
4
100pF
R3
R
3
5.1kΩ
C3
C3
3300pF
ENB
2
GND
3
4
R1
R
1
110kΩ
R
2
R2
18kΩ
Figure 35. Circuit Diagram Example (Supply Voltage over 4.0 V)
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BD8158FVM
I/O Equivalent Circuit
1.COMP
5.SW
Vcc
2.FB
8.SS
Vcc
Vcc
Vcc
3.ENB 7.FCLK
Vcc
130kΩ
Figure 36. I/O Equivalent Circuit
Power Dissipation
Power Dissipation: Pd[mW]
800
On 70×70×1.6mm Board
588
600
400
200
BD8152FVM
0
25
50
75
85
BD8158FVM
100
125
150
Ambient Temperature [°C]
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BD8152FVM
BD8158FVM
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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BD8158FVM
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Transistor (NPN)
Resistor
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
N Region
close-by
Figure 37. Example of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
14. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD8152FVM
BD8158FVM
Ordering Information
B
D
8
1
5
Part Number
8152
8158
x
F
V
M
-
TR
Packaging and forming specification
TR: Embossed tape and reel
(MSOP8)
Package
FVM:MSOP8
Marking Diagram
MSOP8 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number Marking
Package
Orderable Part Number
D8152
MSOP8
BD8152FVM - TR
D8158
MSOP8
BD8158FVM - TR
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BD8152FVM
BD8158FVM
Physical Dimensions, Tape and Reel information
Package Name
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MSOP8
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BD8152FVM
BD8158FVM
Revision History
Date
09.Sep.2014
Revision
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD8152FVM - Web Page
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Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD8152FVM
MSOP8
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3000
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inquiry
Yes