Eudyna FTM1141GF Driver integrated 10gb/s mi-dfb ld module Datasheet

Driver Integrated 10Gb/s
MI-DFB LD Module
FTM1141GF
FEATURES
• Driver integrated 10Gb/s MI-DFB module for 800ps/nm
optical transmission
• MI-DFB-LD (Modulator Integrated DFB Laser Diode) is included
• Modulator driver IC is included
• Built-in optical isolator, PIN-Photo diode for monitor, thermistor
and thermo-electric cooler
• 800ps/nm (40km)
DESCRIPTION
The FTM1141GF was developed to reduce the size and technical
complexity of 10Gb/s optical board designs. This product, which includes
a driver and modulator integrated laser in one package, eliminates the
customer concerns regarding how to handle the RF interfacing between
these two components on his board. By co-packaging these components
a solution has also been achieved that offers greatly reduced board space.
This reduction in space is critical for next generation transponder applications.
The FTM1141GF has been designed with a differential co-planar electrical interface
which allows for easy interfacing to RF lines on PC boards. The package and pinout are part of a
multi-source agreement. This product is designed for 40km SONET/SDM applications and single
channel drop links in DWDM systems.
ABSOLUTE MAXIMUM RATINGS (Top=25°C, Unless otherwise specified)
Parameter
Storage Temperature
Operating Case Temperature
Symbol
Condition
Tstg
Top(Tc)
CW
CW
CW
Rating
Min.
-40
0
Max.
85
75
Unit
-6.5
5
150
2
0.3
mW
mA
V
V
°C
°C
Optical Output Power
Laser Forward Current
Laser Reverse Voltage
Power Supply Voltage
Pf
If
VR
VSS
Modulator (Mod) modulation
Control Voltage
Vm
-6.5
VSS+1.2
(max0.3)
V
Mod Bias Control Voltage
Vb
-6.5
VSS+2.4
(max0.3)
V
Cross Point Control Voltage
Vx1,(Vx2)
VSS-4.8
(min-6.5)
VSS+2.4
(max0.3)
V
Data Input Voltage
Din, DinB
-
1.6
Vpp
-
50
V
-
200
V
ESD Tolerance
Vesd
Differential
(AC-coupled)
Note (1-1)
ESD Tolerance
Vesd
Note (1-2)
Photodiode Forward Current
IDF
-
1
mA
Photodiode Reverse Voltage
VDR
10
2.5
1.5
-
V
Cooling
Heating
Cooling
Heating
-2.5
-0.9
ATC operation
0
+75
°C
260°C MAX
-
10
sec
TEC Voltage
Vc
TEC Current
Ic
Thermistor Temperature
Lead Soldering Time
Edition 1.1
July 2004
Tth
1
V
A
Driver Integrated 10Gb/s
MI-DFB LD Module
FTM1141GF
OPTICAL SPECIFICATIONS (TLD=25°C, Tc=0 to 75°C and BOL, unless otherwise specified)
LASER DIODE AND MODULATOR CHARACTERSITICS
Symbol
Condition
Min.
Limit
Typ.
Max.
Unit
Threshold Current
Ith
CW
-
-
25
mA
Operating Current
Iop
Pf=Pop
40
70
100
mA
Optical Output Power
Pop
Note (2a)
-1
-
+2
dBm
Forward Voltage
VF
CW
-
-
2.2
V
Extinction Ratio
Rext
Pf=Pop, Note (2a)
8.2
-
-
dB
Peak Wavelength
Wp
Pf=Pop, Note (2a)
1530
-
1565
nm
Side Mode Suppresion
Ratio
SSR
Pf=Pop, CW
35
-
-
dB
Optical Rise Time
tr
Note (3), 20% to 80%
-
-
30
psec
Optical Fall Time
tf
Note (3), 20% to 80%
-
-
30
psec
Optical Isolation
Is
25
-
-
dB
Tracking Error
TE
Note (2a)
-0.5
-
+0.5
dB
Input Return Loss
S11
130MHz to 10GHz, Tc=25°C
6
10
-
dB
Dispersion Penalty
dP
Note (2)
-
-
2.0
dB
Msk
Note (2a), 500 counts
Parameter
Eye Pattern Mask
Error
Free
MONITOR DIODE CHARACTERISTICS
Min.
100
Limit
Typ.
-
Max.
1500
Unit
VDR=5V
VDR=5V, f=1MHz
-
2
100
nA
-
5
15
pF
Symbol
Condition
Ic
Note (4)
Limit
Typ.
-
Max.
1.4
Unit
TEC Current
Min.
-
TEC Voltage
Vc
Note (4)
-
-
2.5
V
TEC Power Consumption
Pc
Note (4)
-
-
3.5
W
Thermistor Resistance
Rth
TLD=25°C
-
10
-
kΩ
Thermistor B Constant
B
3270
3450
4000
K
Parameter
Symbol
Condition
Im
IF=Iop, VDR=5V
Monitor Dark Current
Id
Monitor Diode Capacitance
Ct
Monitor Current
µA
TEC & THERMISTOR CHARACTERISTICS
Parameter
2
A
Driver Integrated 10Gb/s
MI-DFB LD Module
FTM1141GF
DRIVER IC CHARACTERISTICS
Parameter
Symbol
Condition
Min.
Limit
Typ.
Max.
Unit
Driver IC Supply Voltage
VSS
-5.5
-5.2
-5.0
V
Driver IC Supply Current
ISS
-
-
285
mA
Modulator (Mod) Modulation
Control Voltage
Vm
VSS
-
VSS
+1.0
V
Mod Bias Control Voltage
Vb
VSS
-
VSS
+2.2
V
Cross Point (XP) Control
Voltage
Vx1, (Vx2)
Xp=50%
VSS
+0.8
-
VSS
+2.2
V
Data Input Voltage
Din, DinB
Differential (AC Coupled)
0.5
-
1.0
Vpp
Note (1-1): Pin No. 3,4,5,6,7,9,11
Note (1-2): Pin No. 1,2,8,10,12-19
Note (2): Eudyna Test System
(a) Drive Condition
Bit Rate:
Word Pattern:
Mark Density:
Laser Bias Current:
Laser Temperature(TLD):
Eye Pattern Mask:
(b) Fiber Dispersion
800ps/nm
(c) Dispersion Penalty
Bit Error Rate=10-12
9.95328 Gb/s
PRBS=231-1
50%
Iop
25°C
ITU-T Eye mask for STM-64
Note (3): Eudyna Test System
Vb, Vm, Vx1(Vx2) is set to make Pop and Rext within the specification
Note (4): Eudyna Test System
Operating Case Temperature: Tc=+75°C
Laser Temperature:
25°C
Optical Output Power:
Pf=Pop, Note (2a)
Typical Output Waveform
Back to Back (with Filter)
9.95328Gb/s, NRZ, PRBS=231-1, TLD=TC=25°C
3
Driver Integrated 10Gb/s
MI-DFB LD Module
FTM1141GF
Typical Application for Driver IC
Modulation Voltage Control
Supply Voltage
Cross Point Control
Bias Voltage Control
Chip
Capacitor
0.1µF
Chip
Capacitor
0.1µF
Ther r TEC
Vx1
Vx2
VSS
Vm
Vb
LD
NC
GND
DinB
Blocking
Capacitor
Ex. 0.1µF
GND
Din
GND
GND
PD
PD
NC
TEC
For stable operation:
8-1. To prevent a dependence of “Cross point” on the supply voltage VSS,
(1) Use an external voltage source of -3.8V for “Vx2”, or
(2) Control the voltage of “Vx1”, so that the voltage difference “Vx1-Vx2” remain constant.
8-2. To prevent a dependence of “Modulation control voltage” on the supply voltage VSS,
control the voltage of “Vm”, so that the difference “Vm-VSS” remain constant.
8-3. To prevent a dependence of “Bias control voltage” on the supply voltage VSS,
control the voltage of “Vb”, so that the difference “Vb-VSS” remain constant.
4
Driver Integrated 10Gb/s
MI-DFB LD Module
FTM1141GF
“GF” PACKAGE
UNIT: mm
4.86±0.20
14-0.2
13
19
0.5
Ø0.9±0.1
5.3
18.0
12.0
8
22.0
35±1
1.25
1
Ø5.20±0.25
7
12
4-Ø2.6±0.2
9.6
7.7
Detail B
13.6
Detail A
17.6
L
25.0±0.5
Pin Description
4.95
3.56
NOTE: Pigtail length (L)
shall be specified in the
detail (individual) specification.
1.25
CONNECTOR
4-P1.0
4.46±0.20
5-0.15±0.08
4.56
(3)
5.8
12-P1.0
5-0.3
4.00±0.25
14-0.3
6.00±0.25
DETAIL-A
DETAIL-B
For further information please contact:
Eudyna Devices USA Inc.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111
1. Thermoelectric cooler(Anode, +)
2. Thermistor
3. VB: Modulator bias control voltage
4. Vm: Modulator modulation voltage control voltage
5. Vss: Driver IC supply voltage
6. Vx2: Cross point control voltage
7. Vx1: Cross point control voltage
8. Case Ground
9. DinB: Inverted data input voltage
10. Case Ground
11. Din: Data Input voltage
12. Case Ground
13. Monitor photo diode(Cathode)
14. Monitor photo diode(Anode)
15. Case Ground
16. LD Bias(Anode)
17. NC
18. NC
19. Thermoelectric cooler(Cathode, -)
CAUTION
Eudyna Devices Inc. products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
www.us.eudyna.com
• Do not put this product into the mouth.
Eudyna Devices Europe Ltd.
• Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
Eudyna Devices Asia Pte Ltd.
Hong Kong Branch
Rm. 1101, Ocean Centre, 5 Canton Rd.
Tsim Sha Tsui, Kowloon, Hong Kong
TEL: +852-2377-0227
FAX: +852-2377-3921
• Observe government laws and company regulations when discarding this
product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.
Eudyna Devices Inc. reserves the right to change products and specifications
without notice. The information does not convey any license under rights of
Eudyna Devices Inc. or others.
© 2004 Eudyna Devices USA Inc.
Printed in U.S.A.
Eudyna Devices Inc.
Sales Division
1, Kanai-cho, Sakae-ku
Yokohama, 244-0845, Japan
TEL: +81-45-853-8156
FAX: +81-45-853-8170
5
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