Sony CXG1016N High-frequency spdt antenna switch Datasheet

CXG1016N
High-Frequency SPDT Antenna Switch
For the availability of this product, please contact the sales office.
Description
The CXG1016N is a high power antenna switch
MMIC. This IC is designed using the Sony’s GaAs
J-FET process and operates at a single positive
power supply
Features
• Single positive power supply operation
• Low insertion loss 0.45 dB (Typ.) at 1.5 GHz
• Isolation
20 dB (Typ.) at 1.5 GHz
• High power switching
P1 dB (Typ.)
33 dBm
at 1.5 GHz
VCTL (H)=3.0 V
37 dBm
at 1.5 GHz
VCTL (H)=4.0 V
Applications
Antenna switch for digital cellular telephones
8 pin SSOP (Plastic)
Absolute Maximum Ratings (Ta=25 °C)
• Control voltage
Vctl
7
• Operating temperature Topr
–35 to +85
• Storage temperature
Tstg –65 to +150
Operating Condition
• Control voltage
0/4
V
°C
°C
V
Structure
GaAs J-FET MMIC
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
—1—
E96525-TE
CXG1016N
Electrical Characteristics
VCTL (L)=0 V, VCTL (H)=4 V, PIN=32 dBm, REF=75 kΩ
Item
Insertion Loss
Isolation
Insertion Loss
Isolation
Insertion Loss
Isolation
VSWR
Switching Time
Symbol
IL1
ISO1
IL1.5
ISO1.5
IL2
ISO2
VSWR
TSW
(Ta=25 °C)
Test Condition
Min.
f=1.0 GHz
20
f=1.5 GHz
17
14
f=2.0 GHz
Typ.
0.4
23
0.45
20
0.5
17
Max.
0.7
0.75
0.8
1.5
100
ns
VCTL (L)=0 V, f=2 GHz
Item
1 dB Compression Point
1 dB Compression Point
(Ta=25 °C)
Symbol
P1 dB (3)
P1 dB (4)
Min.
31
35
Test Condition
VCTL (H)=3 V
VCTL (H)=4 V
Typ.
33
37
Max.
VCTL (L)=0 V, RRF=75 kΩ
Item
Control Current
Control Current
Control Current
Unit
dB
dB
dB
dB
dB
dB
Unit
dBm
dBm
(Ta=25 °C)
Symbol
ICTL (1)
ICTL (2)
ICTL (3)
Test Condition
VCTL (H)=3 V
VCTL (H)=4 V
VCTL (H)=5 V
Block Diagram
Min.
Typ.
120
170
250
Max.
170
220
300
Package Outline/Pin Configuration
Port3
Port1
Port2
CTLB
1
8 Port3
Port1
2
7 GND
GND
3
6 GND
CTLA
4
5 Port2
8pin SSOP (PLASTIC)
VCTLA
VCTLB
High
Low
Low
High
Port1-Port2 ON
Port1-Port3 OFF
Port1-Port2 OFF
Port1-Port3 ON
—2—
Unit
µA
µA
µA
CXG1016N
Recommended Circuit
100pF
CTLB
1
Port3
8
100pF
75kΩ
Port1
2
7
100pF
CXG1016N
3
6
100pF
CTLA
4
5
100pF
75kΩ
Example of Representative Characteristics (Ta=25 °C)
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Insertion Loss and Isolation vs. Input Power
0
0
Insertion Loss
VCTL (H)=5V
VCTL (H)=4V
VCTL (H)=3V
-2
VCTL (H)=3V
VCTL (H)=4V
VCTL (H)=5V
-20
Isolation
-30
@1.5GHZ
24
28
32
36
40
44
Input Power [dBm]
Insertion Loss and Isolation vs. Frequency
0
0
-10
-2
-20
Isolation
-3
-30
-4
-40
-50
1
2
Frequency [GHz]
—3—
3
-50
Isolation [dB]
Insertion Loss
-1
Isolation [dB]
-10
-6
Insertion Loss [dB]
Insertion Loss [dB]
-4
Port2
CXG1016N
Unit : mm
8PIN SSOP (PLASTIC)
+ 0.2
1.25 – 0.1
∗3.0 ± 0.1
0.1
8
5
A
6.4 ± 0.2
∗4.4 ± 0.1
4
1
0.65
+ 0.08
0.24 – 0.07
0.25
0.13 M
(0.5)
+ 0.08
0.24 – 0.07
(0.22)
0.6 ± 0.15
0.1 ± 0.05
B
0° to 10°
(0.15)
+ 0.025
0.17 – 0.015
Package Outline
DETAIL A
DETAIL B
NOTE: Dimension “∗” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SSOP-8P-L01
LEAD TREATMENT
SOLDER / PALLADIUM
PLATING
EIAJ CODE
SSOP008-P-0044
LEAD MATERIAL
COPPER ALLOY
PACKAGE WEIGHT
0.04g
JEDEC CODE
—4—
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