IRF JANTX2N6798 Power mosfet n-channel(bvdss=200v, rds(on)=0.40ohm, id=5.5a) Datasheet

PD -90431C
IRFF230
JANTX2N6798
JANTXV2N6798
REF:MIL-PRF-19500/557
200V, N-CHANNEL
REPETITIVE AVALANCHE AND dv/dt RATED

HEXFET TRANSISTORS
THRU-HOLE (TO-205AF)
Product Summary
Part Number
IRFF230
BVDSS
200V
RDS(on)
0.40Ω
ID
5.5A

The HEXFET technology is the key to International
Rectifier’s advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
“State of the Art” design achieves: very low on-state resistance combined with high transconductance.
The HEXFET transistors also feature all of the well
established advantages of MOSFETs such as voltage control, very fast switching, ease of parelleling
and temperature stability of the electrical parameters.
They are well suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers and high energy pulse circuits.
TO-39
Features:
n
n
n
n
n
Repetitive Avalanche Ratings
Dynamic dv/dt Rating
Hermetically Sealed
Simple Drive Requirements
Ease of Paralleling
Absolute Maximum Ratings
Parameter
ID @ VGS = 10V, TC = 25°C
ID @ VGS = 10V, TC = 100°C
I DM
PD @ TC = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ
T STG
Continuous Drain Current
Continuous Drain Current
Pulsed Drain Current ➀
Max. Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy ➁
Avalanche Current ➀
Repetitive Avalanche Energy ➀
Peak Diode Recovery dv/dt ➂
Operating Junction
Storage Temperature Range
Lead Temperature
Weight
Units
5.5
3.5
22
25
0.20
±20
54
—
—
4.5
-55 to 150
A
W
W/°C
V
mJ
A
mJ
V/ns
o
300 (0.063 in. (1.6mm) from case for 10s)
0.98(typical)
C
g
For footnotes refer to the last page
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1
01/22/01
IRFF230
Electrical Characteristics
RDS(on)
VGS(th)
gfs
IDSS
Parameter
Min
Drain-to-Source Breakdown Voltage
200
—
—
V
VGS = 0V, ID = 1.0mA
—
0.25
—
V/°C
Reference to 25°C, ID = 1.0mA
—
—
2.0
2.5
—
—
—
—
—
—
—
—
0.40
0.46
4.0
—
25
250
Ω
Temperature Coefficient of Breakdown
Voltage
Static Drain-to-Source On-State
Resistance
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
Typ Max Units
Test Conditions
VGS = 10V, ID = 3.5A ➃
VGS =10V, ID =5.5A ➃
VDS = VGS, ID = 250µA
VDS > 15V, IDS = 3.5A ➃
VDS= 160V, VGS=0V
VDS = 160V
VGS = 0V, TJ = 125°C
VGS = 20V
VGS = -20V
VGS =10V, ID =5.5A
VDS= 100V
V
S( )
Ω
BVDSS
∆BVDSS/∆T J
@ Tj = 25°C (Unless Otherwise Specified)
µA
I GSS
I GSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
LS + LD
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
—
—
7.4
2.5
6.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
7.0
100
-100
42.1
5.3
28
30
50
50
40
—
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
—
—
—
600
250
80
—
—
nA
nC
VDD = 100V, ID = 5.5A,
RG = 7.5Ω
ns
nH
Measured from drain lead (6mm/0.25in. from
package) to source lead (6mm/0.25in. from
package)
VGS = 0V, VDS = 25V
f = 1.0MHz
pF
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
IS
ISM
VSD
t rr
QRR
Continuous Source Current (Body Diode)
Pulse Source Current (Body Diode) ➀
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
ton
Forward Turn-On Time
—
—
—
—
—
—
—
—
—
—
5.5
22
1.4
500
6.0
Test Conditions
A
V
nS
µC
Tj = 25°C, IS =5.5A, VGS = 0V ➃
Tj = 25°C, IF =5.5A, di/dt ≤ 100A/µs
VDD ≤ 50V ➃
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJC
R thJA
Junction-to-Case
Junction-to-Ambient
Min Typ Max Units
—
—
—
—
5.0
175
°C/W
Test Conditions
Typical socket mount.
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
2
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IRFF230
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
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Fig 2. Typical Output Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
3
IRFF230
13 a& b
4
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
Fig 8. Maximum Safe Operating Area
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IRFF230
RD
V DS
VGS
D.U.T.
RG
+
-V DD
10V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
VDS
90%
Fig 9. Maximum Drain Current Vs.
Case Temperature
10%
VGS
td(on)
tr
t d(off)
tf
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRFF230
1 5V
L
VD S
D .U .T
RG
IA S
10V
20V
D R IV E R
+
- VD D
A
0 .0 1 Ω
tp
Fig 12a. Unclamped Inductive Test Circuit
V (B R )D S S
tp
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
IAS
Current Regulator
Same Type as D.U.T.
Fig 12b. Unclamped Inductive Waveforms
50KΩ
QG
12V
.2µF
.3µF
10 V
QGS
QGD
+
V
- DS
VGS
VG
3mA
Charge
Fig 13a. Basic Gate Charge Waveform
6
D.U.T.
IG
ID
Current Sampling Resistors
Fig 13b. Gate Charge Test Circuit
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IRFF230
Foot Notes:
➀ Repetitive Rating; Pulse width limited by
maximum junction temperature.
➁ VDD =50V, starting TJ = 25°C,
Peak IL =5.5A,
➂ ISD ≤ 5.5A, di/dt ≤ 120A/µs,
VDD≤ 200V, TJ ≤ 150°C
Suggested RG =7.5 Ω
➃ Pulse width ≤ 300 µs; Duty Cycle ≤ 2%
Case Outline and Dimensions —TO-205AF
LEGEND
1- SOURCE
2- GATE
3- DRAIN
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
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Data and specifications subject to change without notice. 1/01
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