Foshan MBRF2060CT Schottky barrier diode in a to-220f plastic package Datasheet

MBRF2060CT
Rev.F Mar.-2016
描述
/
DATA SHEET
Descriptions
TO-220F 塑料封装 肖特基二极管。
Schottky Barrier Diode in a TO-220F Plastic Package.
特征
/ Features
损耗低,效率高。
Low power loss,high efficiency.
用途
/
Applications
用于高频、低压、大电流整流二极管,续流二极管,保护二极管。
For use in low voltage,high frequency inverters, free wheeling, and polarity protection applications.
内部等效电路
引脚排列
12
/ Equivalent Circuit
/ Pinning
3
PIN1:Anode
放大及印章代码
PIN 2:Cathode
PIN 3:Anode
/ hFE Classifications & Marking
见印章说明。See Marking Instructions
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MBRF2060CT
Rev.F Mar.-2016
极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
符号
Symbol
数值
Rating
单位
Unit
Peak Repetitive Reverse Voltage
VRRM
60
V
Average Forward Current
IF(AV)
20
A
Non Repetitive Peak Surge Current
IFSM
150
A
Power Dissipation
PD
2.0
W
Thermal Resistance, Junction to Lead
RθJL
5.0
℃/W
Thermal Resistance, Junction to Ambient
RθJA
60
℃/W
Junction Temperature Range
Tj,
150
℃
Storage Temperature Range
Tstg
-55~150
℃
电性能参数
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
Forward Voltage
Instantaneous Reverse Current
Repetitive Peak Reverse Current
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符号
Symbol
VF
IR
IRRM
测试条件
Test Conditions
IF =10A(Tc=25℃)
最小值 典型值
Min
Typ
最大值
Max
0.80
单位
Unit
V
IF =10A(Tc=125℃)
0.70
V
IF =20A(Tc=25℃)
0.95
V
IF =20A(Tc=125℃)
0.85
V
TA=25℃
100
μA
TA=125℃
30
mA
f=1.0KHZ
0.5
A
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MBRF2060CT
Rev.F Mar.-2016
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
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MBRF2060CT
Rev.F Mar.-2016
外形尺寸图
DATA SHEET
/ Package Dimensions
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MBRF2060CT
Rev.F Mar.-2016
印章说明
/
DATA SHEET
Marking Instructions
BR
MBRF2060
CT
****
说明:
BR: 


为公司代码
MBRF2060: 
为型号代码
CT:  


为内部结构
****:


为生产批号代码,随生产批号变化。
Note:
BR:
Company Code
MBRF2060:
Product Type.
CT:
Internal Structure
****:
Lot No. Code, code change with Lot No.
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MBRF2060CT
Rev.F Mar.-2016
DATA SHEET
波峰焊温度曲线图(无铅)
/
Temperature Profile for Dip Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 255±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:255±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度:270±5℃
包装规格
Package Type
封装形式
TO-220/F
套管包装
Package Type
封装形式
使用说明
Temp.:270±5℃
Time:10±1 sec
/ Packaging SPEC.
散件包装
TO-220/F
时间:10±1 sec.
/ BULK
Units 包装数量
Dimension
包装尺寸
3
(unit:mm )
Units/Bag
只/袋
Bags/Inner Box
袋/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Bag 袋
Inner Box 盒
Outer Box 箱
200
10
2,000
5
10,000
135×190
237×172×102
560×245×195
Units/Tube
只/套管
Tubes/Inner Box
套管/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Tube 套管
Inner Box 盒
Outer Box 箱
50
20
1,000
5
5,000
532×31.4×5.5
555×164×50
575×290×180
/ TUBE
Units 包装数量
Dimension
包装尺寸
3
(unit:mm )
/ Notices
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