ON CM1401-32CP 4-channel esd/emi filter array plus 4-channel esd array for usb Datasheet

4-Channel ESD/EMI Filter Array Plus
4-Channel ESD Array for USB
CM1401-32CP
Features
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Functionally and pin-compatible with
CSPEMI307A device
OptiGuard coated for improved reliability at
assembly
Four channels of combined EMI/RFI filtering +
ESD protection
Four additional channels of ESD-only protection
40dB absolute attenuation (typical) at 1GHz
35dB attenuation (typical) at 1GHz relative to
pass band
±15kV ESD protection on all channels
(IEC 61000-4-2 Level 4, contact discharge)
±30kV ESD protection on all channels (HBM)
15-bump, 2.960mm X 1.330mm footprint
Chip Scale Package (CSP) features extremely
low
lead inductance for optimum filter and ESD
performance
RoHS-compliant (lead-free) finishing
Applications
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EMI filtering and ESD protection for both data
and I/O ports
Outer four channels provide ESD protection for
USB lines and other I/O port applications
Wireless handsets
Handheld PCs / PDAs
MP3 players
Notebooks
Desktop PCs
©2010 SCILLC. All rights reserved.
June 2010 Rev. 0
Product Description
The CM1401-32CP is a multichannel array with four
low-pass filter + ESD channels and four ESD-only
channels. The CM1401-32CP reduces EMI/RFI emissions on a data port and protects against ESD on a
USB port. Each EMI/RFI channel integrates a high
quality pi-style filter (C-R-C) that provides greater
than 30dB attenuation in the 800-2700 MHz range
relative to the pass band attenuation. These pi-style
filters are bidirectional, controlling EMI both to and
from a data port connector.
The CM1401-32CP provides a high-level of ESD protection on all eight channels for sensitive electronic
components that may be subjected to electrostatic
discharge (ESD). The input pins safely dissipate ESD
strikes of ±15kV, exceeding the maximum
requirement of the IEC 61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than ±30kV.
The CM1401-32CP is particularly well suited for
portable electronics (e.g., cellular telephones, PDAs,
notebook computers) because of its small package
footprint and low weight.
The CM1401-32CP incorporates OptiGuard™ coating
for improved reliability at assembly and comes in a
space-saving, low-profile Chip Scale Package with
RoHS-compliant lead-free finishing.
Publication Order Number:
CM1401-32CP/D
CM1401-32CP
Rev. P2 | Page 2 of 12 | www.onsemi.com
CM1401-32CP
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
A1
ESD_1
ESD Channel 1
A2
FILTER+ESD_1
Filter + ESD Channel 1
A3
FILTER+ESD_2
Filter + ESD Channel 2
A4
FILTER+ESD_3
Filter + ESD Channel 3
A5
FILT
ER+ESD_4
Filter + ESD Channel 4
A6
ESD_2
ESD Channel 2
B1-B3
GND
Device Ground
C1
ESD_3
ESD Channel 3
C2
FILTER+ESD_1
Filter + ESD Channel 1
C3
FILTER+ESD_2
Filter + ESD Channel 2
C4
FILTER+ESD_3
Filter + ESD Channel 3
C5
FILTER+ESD_4
Filter + ESD Channel 4
C6
ESD_4
ESD Channel 4
Ordering Information
PART NUMBERING INFORMATION
Pins
Package
Variation
Ordering Part Number1
Part Marking
15
CSP
SAC387
CM1401-32CP
N012A
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Rev. P2 | Page 3 of 12 | www.onsemi.com
CM1401-32CP
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
600
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Rev. P2 | Page 4 of 12 | www.onsemi.com
CM1401-32CP
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL
PARAMETER
R
Resistance
C
Capacitance
CONDITIONS
At 2.5V DC
TCR
Temperature Coefficient of Resistance
TCC
Temperature Coefficient of Capacitance
VDIODE
MIN
TYP
MAX
UNITS
80
100
120
Ω
24
30
36
pF
1200
ppm/°C
At 2.5V DC
-300
ppm/°C
Diode Voltage (reverse bias)
IDIODE=10μA
6.0
V
ILEAK
Diode Leakage Current (reverse bias)
VDIODE=3.3V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Note 3
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2 and 3
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
R=100Ω, C=30pF
VESD
VCL
f
C
5.6
-1.5
6.8
-0.8
100
nA
9.0
-0.4
V
V
±30
kV
±15
kV
+10
-5
V
V
58
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin
A2, then clamping voltage is measured at Pin C2.
Rev. P2 | Page 5 of 12 | www.onsemi.com
CM1401-32CP
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B2)
Rev. P2 | Page 6 of 12 | www.onsemi.com
CM1401-32CP
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
Rev. P2 | Page 7 of 12 | www.onsemi.com
CM1401-32CP
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Comparison of Filter Response Curves for CM1400-32CP with DC Bias
Rev. P2 | Page 8 of 12 | www.onsemi.com
CM1401-32CP
Performance Information (cont’d)
Figure 6. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
Figure 7. Resistance vs. Temperature
(normalized to resistance at 25°C)
Rev. P2 | Page 9 of 12 | www.onsemi.com
CM1401-32CP
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous (183°C)
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
Figure 2. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. P2 | Page 10 of 12 | www.onsemi.com
60 seconds
260°C
CM1401-32CP
Mechanical Details
CSP Mechanical Specifications
The CM1401-32CP is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
2.915 2.960 3.005 0.1148 0.1165 0.1183
A2
1.285 1.330 1.375 0.0506 0.0524 0.0541
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071 0.0091 0.0110
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1401-32CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. P2 | Page 11 of 12 | www.onsemi.com
CM1401-32CP
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1401-32CP
2.96 X 1.33 X 0.644
3.10 X 1.45 X 0.74
8mm
178mm (7")
3500
4mm
4mm
Figure 12. Tape and Reel Mechanical Data
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
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Rev. P2 | Page 12 of 12 | www.onsemi.com
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