AOSMD AOTF14N50 500v, 14a n-channel mosfet Datasheet

AOT14N50 / AOTF14N50
500V, 14A N-Channel MOSFET
General Description
Features
The AOT14N50 & AOTF14N50 have been fabricated
using an advanced high voltage MOSFET process
that is designed to deliver high levels of performance
and robustness in popular AC-DC applications.
By providing low RDS(on), Ciss and Crss along with
guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power
supply designs.
Top View
TO-220
VDS (V) = 600V@150°C
ID=14A
RDS(ON)<0.38Ω
(V GS = 10V)
100% UIS Tested!
100% R g Tested!
D
TO-220F
G
G
D
G
S
D
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
AOT14N50
Symbol
AOTF14N50
VDS
Drain-Source Voltage
500
VGS
Gate-Source Voltage
±30
TC=25°C
Continuous Drain
Current
TC=100°C
ID
14*
9.6*
14
9.6
Units
V
V
A
C
IDM
Avalanche Current C, G
IAR
6
A
Repetitive avalanche energy C, G
EAR
540
mJ
Single pulsed avalanche energy
Peak diode recovery dv/dt
TC=25°C
B
Power Dissipation
Derate above 25oC
EAS
dv/dt
1080
5
mJ
V/ns
W
Junction and Storage Temperature Range
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
Thermal Characteristics
Parameter
TJ, TSTG
Pulsed Drain Current
G
PD
Alpha & Omega Semiconductor, Ltd.
223
50
1.8
0.4
TL
Symbol
RθJA
Maximum Junction-to-Ambient
A
RθCS
Maximum Case-to-Sink
RθJC
Maximum Junction-to-Case
* Drain current limited by maximum junction temperature.
A,D
56
-50 to 150
W/ oC
°C
300
°C
AOT14N50
65
AOTF14N50
65
Units
0.5
-2.5
°C/W
°C/W
0.56
°C/W
www.aosmd.com
AOT14N50 / AOTF14N50
Electrical Characteristics (T J=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
Conditions
Min
ID=250µA, VGS=0V, TJ=25°C
500
BVDSS
Drain-Source Breakdown Voltage
BVDSS
Breakdown Voltage Temperature
/∆TJ
Coefficient
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS=±30V
Typ
Max
Units
V
ID=250µA, VGS=0V, TJ=150°C
600
V
ID=250µA, VGS=0V
0.5
V/ oC
VDS=500V, VGS=0V
1
VDS=400V, TJ=125°C
10
µA
±100
nA
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250µA
4.2
4.5
V
RDS(ON)
gFS
Static Drain-Source On-Resistance
VGS=10V, ID=7A
0.29
0.38
Forward Transconductance
VDS=40V, ID=7A
20
Ω
S
VSD
IS
Diode Forward Voltage
IS=1A, VGS=0V
Maximum Body-Diode Continuous Current
ISM
Maximum Body-Diode Pulsed Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
VGS=0V, VDS=25V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
VGS=10V, VDS=400V, ID=14A
3.3
0.71
1
V
14
A
56
A
1531
1914
2297
pF
153
191
229
pF
11
16
20
pF
1.75
3.5
5.3
Ω
42.8
51
nC
9.3
11
nC
nC
Qgd
Gate Drain Charge
20.3
24
tD(on)
Turn-On DelayTime
44
53
ns
tr
Turn-On Rise Time
84
101
ns
tD(off)
Turn-Off DelayTime
92
110
ns
tf
Turn-Off Fall Time
50
60
ns
289
347
4.93
6
ns
µC
VGS=10V, VDS=250V, ID=14A,
RG=25Ω
IF=14A,dI/dt=100A/µs,VDS=100V
trr
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=14A,dI/dt=100A/µs,VDS=100V
Qrr
A: The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial T J
=25°C.
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. L=60mH, IAS=6A, VDD=50V, RG=25Ω, Starting TJ=25°C
Rev 2.
Dec-08
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AOT14N50 / AOTF14N50
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
100
10V
6.5V
25
20
10
ID(A)
ID (A)
-55°C
VDS=40V
6V
15
VGS=5.5V
10
125°C
1
25°C
5
0.1
0
0
5
10
15
20
25
30
2
0.50
3
0.45
2.5
0.40
0.35
0.30
4
6
8
10
VGS(Volts)
Figure 2: Transfer Characteristics
Normalized On-Resistance
RDS(ON) (mΩ)
VDS (Volts)
Fig 1: On-Region Characteristics
VGS=10V
0.25
200
16
VGS=10V
ID=7A
2
1.5
1
0.5
0.20
0
5
10
15
20
25
0
-100
30
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
-50
0
1.2
100
150
200
1.0E+02
1.0E+01
125°C
1.1
1.0E+00
IS (A)
BVDSS (Normalized)
50
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
1
1.0E-01
25°C
1.0E-02
0.9
1.0E-03
0.8
-100
1.0E-04
-50
0
50
100
150
200
TJ (oC)
Figure 5: Break Down vs. Junction Temperature
Alpha & Omega Semiconductor, Ltd.
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
www.aosmd.com
AOT14N50 / AOTF14N50
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
10000
VDS=400V
ID=14A
Ciss
Capacitance (pF)
VGS (Volts)
12
9
6
1000
Coss
100
Crss
3
0
10
5
10 15 20 25 30 35 40 45 50 55 60
Qg (nC)
Figure 7: Gate-Charge Characteristics
100
10µs
RDS(ON)
limited
ID (Amps)
10
0.1
1
10ms
0.1s
DC
0.1
10
VDS (Volts)
Figure 8: Capacitance Characteristics
100
200
16
10µs
RDS(ON)
limited
10
100µs
1ms
1
100
100µs
ID (Amps)
0
1
DC
0.1
TJ(Max)=150°C
TC=25°C
1ms
10ms
0.1s
1s
10s
TJ(Max)=150°C
TC=25°C
0.01
0.01
1
10
100
1000
VDS (Volts)
1
10
100
1000
VDS (Volts)
Figure 9: Maximum Forward Biased Safe Operating
Area for AOT14N50 (Note F)
Figure 10: Maximum Forward Biased Safe
Operating Area for AOTF14N50 (Note F)
16
Current rating ID(A)
14
12
10
8
6
4
2
0
0
25
50
75
100
125
150
TCASE (°C)
Figure 11: Current De-rating (Note B)
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AOT14N50 / AOTF14N50
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
ZθJC Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJC.RθJC
RθJC=0.45°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
PD
0.01
Ton
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
Pulse Width (s)
Figure 12: Normalized Maximum Transient Thermal Impedance for AOT14N50 (Note F)
ZθJC Normalized Transient
Thermal Resistance
10
1
200
16
D=Ton/T
TJ,PK=TA+PDM.ZθJC.RθJC
RθJC=2.5°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
PD
0.01
Ton
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
Pulse Width (s)
Figure 13: Normalized Maximum Transient Thermal Impedance for AOTF14N50 (Note F)
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AOT14N50 / AOTF14N50
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+
VDC
-
VDC
DUT
Qgs
Vds
Qgd
-
Vgs
Ig
Charge
Res istive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
Rg
+
VDC
90%
Vdd
-
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
t off
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LI
Vds
2
AR
BVDSS
Vds
Id
+
Vgs
Vgs
VDC
Rg
-
Vdd
I AR
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Qrr = - Idt
Vds +
DUT
Vds -
Isd
Vgs
L
Vgs
Ig
Alpha & Omega Semiconductor, Ltd.
Isd
+
VDC
-
IF
trr
dI/dt
IRM
Vdd
Vdd
Vds
www.aosmd.com
Similar pages