LCB120 Single-Pole, Normally Closed OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 250 170 20 Units VP mArms / mADC Description The LCB120 is a single-pole, normally closed (1-Form-B) relay that uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • Surface Mount Tape & Reel Version Available • Arc-Free With No Snubbing Circuits • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 6-Pin Package • Machine Insertable, Wave Solderable The LCB120 has low on-resistance, and is well suited for most applications requiring a normally closed relay. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 006 Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Ordering Information Part # LCB120 LCB120S LCB120STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) * For other packaging options consult factory. Pin Configuration AC/DC Configuration + Control – Control Do Not Use 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control – Control Do Not Use 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% toff Pb DS-LCB120-R09 ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION LCB120 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation voltage, Input to Output Operational Temperature Storage Temperature 1 1 Ratings 250 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Derate linearly 1.33 mW / ºC Derate linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current, Continuous AC/DC Configuration DC Configuration Peak Load Current On-Resistance AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units - IL - - 170 300 ±400 mArms / mADC mADC mAP t=10ms IL 11 5 - 20 6 1 ILEAK - A VL=50V, f=1MHz, IF=50mA ton toff COUT - 0.65 1.30 50 5 5 - ms ms pF IL=170mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 1.2 - 5 1.4 10 mA mA V A - CI/O - 3 - pF IL=170mA IL=300mA IF=5mA, VL=250VP RON IF=5mA, VL=10V www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LCB120 PERFORMANCE DATA* (@25ºC Unless Otherwise Noted) Device Count (N) Device Count (N) 30 25 20 15 10 5 35 35 30 30 Device Count (N) 35 25 20 15 10 1.17 1.19 1.21 1.23 20 15 10 0 0 1.25 25 5 5 0 0.30 0.42 LED Forward Voltage Drop (V) 0.54 0.66 0.78 0.625 0.875 0.90 35 25 30 10 20 15 10 5 5 0 0 0.63 0.81 0.99 1.17 1.35 Device Count (N) 35 25 Device Count (N) 30 15 1.375 1.625 1.875 Typical On-Resistance Distribution (N=50, IL=170mADC) Typical IF for Switch Dropout (N=50, IL=170mADC) 20 1.125 Turn-Off Time (ms) Turn-On Time (ms) Typical IF for Switch Operation (N=50, IL=170mADC) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=170mADC) Typical Turn-On Time (N=50, IF=5mA, IL=170mADC) Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 20 15 10 5 0 0.45 1.53 0.63 0.81 0.99 1.17 1.35 10.4 10.8 LED Current (mA) LED Current (mA) 11.2 11.6 12.0 12.4 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, IF=5mA) 35 Device Count (N) 30 25 20 15 10 5 0 291.25 293.75 296.25 298.75 301.25 303.75 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=170mADC) 0.634 1.6 1.4 I F =50mA I F =30mA I F =20mA I F =10mA I F =5mA 1.2 1.0 0.630 0.628 0.626 0.624 -40 -20 0 20 40 60 Temperature (ºC) 80 100 120 1.0 0.8 0.6 0.4 0.2 0.622 0.8 Typical Turn-Off Time vs. LED Forward Current (IL=170mADC) 1.2 0.632 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LCB120 PERFORMANCE DATA* (@25ºC Unless Otherwise Noted) Typical On-Resistance vs. Temperature (IL=170mADC) 0.12 40 30 20 10 I F =5mA 0.08 0.06 0.04 0.02 0 -20 0 20 40 60 80 100 -40 -20 0 Temperature (ºC) Typical IF for Switch Operation vs. Temperature (IL=170mADC) 3.0 80 1.5 1.0 0.5 -40 -20 0 20 40 60 80 2.0 1.5 1.0 -20 0 20 40 60 80 20 40 60 80 100 100 120 Maximum Load Current vs. Temperature (IF=0mA) 200 150 100 50 -40 100 -20 0 20 40 60 80 Temperature (ºC) Temperature (ºC) Temperature (ºC) Typical Load Current vs. Load Voltage Typical Blocking Voltage vs. Temperature (IF=5mA) Typical Leakage vs. Temperature Measured Across Pins 4&6 (IF=5mA) 310 0.030 100 50 0 -50 -100 -150 0.025 305 Leakage (PA) Blocking Voltage (VP) 150 Load Current (mA) 0 0 -40 200 -200 -2.0 I F =20mA -20 250 0 100 0.5 Temperature (ºC) 0.5 0 I F =10mA 1.0 -40 Load Current (mA) 2.0 1.5 100 2.5 LED Current (mA) LED Current (mA) 20 40 60 Temperature (ºC) Typical IF for Switch Dropout vs. Temperature (IL=170mADC) 3.0 2.5 2.0 0 0 -40 Typical Turn-Off Time vs. Temperature (IL=170mADC) 2.5 0.10 Turn-Off Time (ms) 50 Turn-On Time (ms) On-Resistance (:) 60 Typical Turn-On Time vs. Temperature (IF=5mA, IL=170mADC) 300 295 0 0.5 1.0 1.5 0.010 0.005 -40 2.0 0.015 290 285 -1.5 -1.0 -0.5 0.020 -20 0 20 40 60 80 100 Temperature (ºC) Load Voltage (V) 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LCB120 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LCB120 / LCB120S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LCB120 / LCB120S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R09 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LCB120 Mechanical Dimensions LCB120 8.382 ± 0.381 (0.330 ± 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 ± 0.127 (0.100 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) Pin 1 7.620 ± 0.254 (0.300 ± 0.010) 1.651 ± 0.254 (0.065 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.254 ± 0.0127 (0.010 ± 0.0005) 6.350 ± 0.127 (0.250 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 ± 0.076 (0.018 ± 0.003) LCB120S 8.382 ± 0.381 (0.330 ± 0.015) 9.524 ± 0.508 (0.375 ± 0.020) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) PCB Land Pattern 2.54 ± 0.127 (0.100 ± 0.005) 2.54 (0.10) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 1.651 ± 0.254 (0.065 ± 0.010) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) 4.445 ± 0.254 (0.175 ± 0.010) Dimensions mm (inches) 1.651 ± 0.254 (0.065 ± 0.010) 6 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LCB120 LCB120STR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) P = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment A0 = 10.10 (0.398) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-LCB120-R09 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012