ON MC14585BDG 4−bit magnitude comparator Datasheet

MC14585B
4−Bit Magnitude Comparator
The MC14585B 4−Bit Magnitude Comparator is constructed with
complementary MOS (CMOS) enhancement mode devices. The circuit
has eight comparing inputs (A3, B3, A2, B2, A1, B1, A0, B0), three
cascading inputs (A < B, A = B, and A > B), and three outputs (A < B,
A = B, and A > B). This device compares two 4−bit words (A and B)
and determines whether they are “less than”, “equal to”, or “greater
than” by a high level on the appropriate output. For words greater than
4−bits, units can be cascaded by connecting outputs (A > B), (A < B),
and (A = B) to the corresponding inputs of the next significant
comparator. Inputs (A < B), (A = B), and (A > B) on the least significant
(first) comparator are connected to a low, a high, and a low, respectively.
Applications include logic in CPU’s, correction and/or detection of
instrumentation conditions, comparator in testers, converters, and
controls.
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MARKING
DIAGRAMS
PDIP−16
P SUFFIX
CASE 648
16
•
•
Diode Protection on All Inputs
Expandable
Applicable to Binary or 8421−BCD Code
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load over the Rated Temperature Range
Can be Cascaded − See Figure 3
Pb−Free Packages are Available*
MAXIMUM RATINGS (Voltages Referenced to VSS)
Parameter
DC Supply Voltage Range
Symbol
Value
Unit
VDD
−0.5 to +18.0
V
Vin, Vout
−0.5 to VDD
+ 0.5
V
Input or Output Current (DC or Transient)
per Pin
Iin, Iout
±10
mA
Power Dissipation per Package (Note 1)
PD
500
mW
Ambient Temperature Range
TA
−55 to +125
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Lead Temperature (8−Second Soldering)
TL
260
°C
Input or Output Voltage Range
(DC or Transient)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 6
SOIC−16
D SUFFIX
CASE 751B
1
SOEIAJ−16
F SUFFIX
CASE 966
1
16
14585BG
AWLYWW
1
16
MC14585B
ALYWG
1
1
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Package
Shipping†
MC14585BCP
PDIP−16
25 Units / Rail
MC14585BCPG
PDIP−16
(Pb−Free)
25 Units / Rail
MC14585BD
SOIC−16
48 Units / Rail
MC14585BDG
SOIC−16
(Pb−Free)
48 Units / Rail
MC14585BDR2
SOIC−16
2500/Tape & Reel
MC14585BDR2G
SOIC−16
(Pb−Free)
2500/Tape & Reel
MC14585BFEL
SOEIAJ−16 2000/Tape & Reel
MC14585BFELG
SOEIAJ−16 2000/Tape & Reel
(Pb−Free)
Device
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
1
1
Features
•
•
•
•
•
MC14585BCP
AWLYYWWG
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MC14585B/D
MC14585B
PIN ASSIGNMENT
BLOCK DIAGRAM
B2
1
16
VDD
A2
2
15
A3
(A = B)out
3
14
B3
(A u B)in
4
13
(A u B)out
(A t B)in
5
12
(A t B)out
(A = B)in
6
11
B0
A1
7
10
A0
VSS
8
9
B1
(A>B) in
(A=B) in
(A<B) in
A0
B0
A1
B1
A2
B2
A3
B3
4
6
5
10
11
7
9
2
1
15
14
(A>B) out
13
(A=B) out
3
(A<B) out
12
VDD = PIN 16
VSS = PIN 8
TRUTH TABLE (x = Don’t Care)
Inputs
Comparing
Cascading
Outputs
A3, B3
A2, B2
A1, B1
A0, B0
A<B
A=B
A>B
A<B
A=B
A>B
A3 > B3
A3 = B3
A3 = B3
A3 = B3
x
A2 > B2
A2 = B2
A2 = B2
x
x
A1 > B1
A1 = B1
x
x
x
A0 > B0
x
x
x
x
x
x
x
x
x
x
x
x
0
0
0
0
0
0
0
0
1
1
1
1
A3 = B3
A3 = B3
A3 = B3
A3 = B3
A2 = B2
A2 = B2
A2 = B2
A2 = B2
A1 = B1
A1 = B1
A1 = B1
A1 = B1
A0 = B0
A0 = B0
A0 = B0
A0 = B0
0
0
1
1
0
1
0
1
x
x
x
x
0
0
1
1
0
1
0
1
1
0
0
0
A3 = B3
A3 = B3
A3 = B3
A2 = B2
A2 = B2
A2 < B2
A1 = B1
A1 < B1
x
A0 < B0
x
x
x
x
x
x
x
x
x
x
x
1
1
1
0
0
0
0
0
0
A3 < B3
x
x
x
x
x
x
1
0
0
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2
MC14585B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
– 55_C
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ
(Note 2)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
−
−
−
−
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
−
−
−
−
– 1.7
– 0.36
– 0.9
– 2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
± 0.1
−
± 0.00001
± 0.1
−
± 1.0
mAdc
Input Capacitance (Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current (Per Package)
IDD
5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
Total Supply Current (Notes 3, 4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT
5.0
10
15
Vin = 0 or VDD
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Vdc
Vdc
IOH
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
mAdc
IT = (0.6 mA/kHz) f + IDD
IT = (1.2 mA/kHz) f + IDD
IT = (1.8 mA/kHz) f + IDD
mAdc
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in mA (per package), CL in pF,
V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Turn−On, Turn−Off Delay Time
tPLH, tPHL = (1.7 ns/pF) CL + 345 ns
tPLH, tPHL = (0.66 ns/pF) CL + 147 ns
tPLH, tPHL = (0.5 ns/pF) CL + 105 ns
tPLH,
tPHL
VDD
Min
Typ
(Note 6)
Max
5.0
10
15
−
−
−
100
50
40
200
100
80
5.0
10
15
−
−
−
430
180
130
860
360
260
ns
ns
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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3
Unit
MC14585B
20 ns
20 ns
VDD
A3
VSS
1
2f
VDD
VSS
20 ns
VOH
VOL
50%
B0
VOH
10%
tPLH
VOL
50%
(A<B) out
VOL
10%
tTHL
Inputs (A>B) and (A=B) high, and inputs B3, A3, B2,
A2, B1, A1, A0, and (A<B) low.
Figure 1. Dynamic Power Dissipation
Signal Waveforms
Figure 2. Dynamic Signal Waveforms
WORD
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
B = B11
WORD
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
A=
(A>B)
(A=B)
(A<B)
B3 A3 B2 A2 B1 A1 B0 A0
OUTPUT
MC14585B
MC14585B
MC14585B
WORD B = B11, B10, ..., B0.
WORD A = A11, A10, ..., A0.
(A>B)
(A=B)
VOL
tTLH
Inputs (A>B) and (A=B) high, and inputs B2, A2, B1,
A1, B0, A0 and (A<B) low.
f in respect to a system clock.
(A<B)
VOH
90%
VOH
(A<B) out
VSS
tPHL
OUTPUTS
Figure 3. Cascading Comparators
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4
VSS VDD VSS
(A>B)
(A=B) out
VDD
90%
(A=B)
(A>B) out
20 ns
(A<B)
B3
INPUTS
MC14585B
LOGIC DIAGRAM
A3
B3
A2
B2
A1
B1
A0
B0
15
14
2
1
12
7
(A<B) out
9
10
11
5
(A<B) in
3
6
(A=B) in
13
4
(A>B) in
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5
(A=B) out
(A>B) out
MC14585B
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
DIM
A
B
C
D
F
G
H
J
K
L
M
S
S
SEATING
PLANE
−T−
K
H
G
D
M
J
16 PL
0.25 (0.010)
T A
M
M
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC−16
CASE 751B−05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
−A−
16
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
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6
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14585B
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
16
LE
9
Q1
M_
E HE
1
8
L
DETAIL P
Z
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−−
0.031
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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