TI1 MAX3223MDWREP 3-v to 5.5-v multichannel rs-232 line driver/receiver with â±15-kv esd protection Datasheet

MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SGLS368 – SEPTEMBER 2006
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
(1)
Controlled Baseline
– One Assembly
– One Test Site
– One Fabrication Site
Extended Temperature Performance of up to
–55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree (1)
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
Two Drivers and Two Receivers
Low Standby Current . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
Alternative High-Speed Pin-Compatible
Device (1 Mbit/s)
– SNx5C3223
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DB, DW, OR PW PACKAGE
(TOP VIEW)
EN
C1+
V+
C1C2+
C2VDOUT2
RIN2
ROUT2
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
FORCEOFF
VCC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
DIN2
INVALID
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
The MAX3223 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. The device operates at typical data signaling rates up to 250 kbit/s and a maximum of 30-V/µs
driver output slew rate.
ORDERING INFORMATION
PACKAGE (1)
TA
–55°C to 125°C
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SOIC – DW
Reel of 2000
MAX3223MDWREP (2)
SSOP – DB
Reel of 2000
MAX3223MDBREP
MB223M
TSSOP – PW
Reel of 2000
MAX3223MPWREP (2)
MB223M
MAX3223M
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Product Preview
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SGLS368 – SEPTEMBER 2006
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 µA.
Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled,
the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is
used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any
receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less
than 30 µs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than
30 µs. See Figure 4 for receiver input levels.
FUNCTION TABLES
ABC
EACH DRIVER (1)
INPUTS
DIN
(1)
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
OUTPUT
DOUT
DRIVER STATUS
X
X
L
X
Z
Powered off
L
H
H
X
H
H
H
H
X
L
Normal operation with
auto-powerdown disabled
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
Normal operation with
auto-powerdown enabled
Powered off by
auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER (1)
INPUTS
(1)
2
RIN
EN
VALID RIN
RS-232 LEVEL
OUTPUT
ROUT
L
L
X
H
H
L
X
L
X
H
X
Z
Open
L
No
H
H = high level, L = low level, X = irrelevant,
Z = high impedance (off),
Open = input disconnected or connected driver off
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MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SGLS368 – SEPTEMBER 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1
DIN2
13
17
12
8
DOUT1
DOUT2
20
FORCEOFF
14
FORCEON
Auto-powerdown
11
INVALID
1
EN
ROUT1
ROUT2
15
16
10
9
RIN1
RIN2
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.3
6
V
V+
Positive-output supply voltage range (2)
–0.3
7
V
0.3
–7
V
13
V
V–
Negative-output supply voltage
V+ – V–
Supply voltage difference (2)
VI
Input voltage range
VO
Output voltage range
θJA
Package thermal
range (2)
impedance (3) (4)
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
Driver (FORCEOFF, FORCEON, EN)
–0.3
6
Receiver
–25
25
Driver
Receiver (INVALID)
–13.2
13.2
–0.3
VCC + 0.3
DB package
70
DW package
58
PW package
83
–65
UNIT
V
V
°C/W
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
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MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SGLS368 – SEPTEMBER 2006
Recommended Operating Conditions (1)
See Figure 6
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control
high-level input voltage
DIN, EN, FORCEOFF, FORCEON
VIL
Driver and control
low-level input voltage
DIN, EN, FORCEOFF, FORCEON
Driver and control input voltage
DIN, EN, FORCEOFF, FORCEON
VI
TA
(1)
VCC = 3.3 V
VCC = 5 V
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
UNIT
V
2
V
2.4
0.8
V
V
0
5.5
Receiver input voltage
–25
25
V
Operating free-air temperature
–55
125
°C
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
II
Input leakage
current
EN, FORCEOFF,
FORCEON
Auto-powerdown
disabled
ICC
Supply current
Powered off
Auto-powerdown
enabled
(1)
(2)
4
TEST CONDITIONS
MIN
TYP (2) MAX
±0.01
±1
µA
0.3
2
mA
1
20
1
20
No load, FORCEOFF and
FORCEON at VCC
VCC = 3.3 V or 5 V, No load, FORCEOFF at GND
TA = 25°C
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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UNIT
µA
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MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
SGLS368 – SEPTEMBER 2006
DRIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
VOH
TEST CONDITIONS
MIN (2)
TYP (3)
5
5.4
–5
–5.4
MAX
UNIT
High-level output voltage
DOUT at RL = 3 kΩ to GND
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to VCC = 5 V
GND
VCC = 3.3 V
IIH
High-level input current
VI = VCC
±0.01
±1
µA
IIL
Low-level input current
VI at GND
±0.01
±1
µA
VCC = 3.6 V, VO = 0 V
±35
±60
VCC = 5.5 V, VO = 0 V
±35
±60
IOS
Short-circuit output current (4)
ro
Output resistance
IOZ
(1)
(2)
(3)
(4)
Output leakage current
VCC, V+, and V– = 0 V, VO = ±2 V
FORCEOFF = GND
V
V
–4.9
300
mA
Ω
10M
VCC = 3 V to 3.6 V, VO = ±12 V
±25
VCC = 4.5 V to 5.5 V, VO = ±10 V
±25
µA
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
The minimum reading of –4.9 V at VCC = 3.3 V falls outside the TIA/EIA-232 Standard.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
MAX
Maximum data rate
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF,
See Figure 2
RL = 3 kΩ to 7 kΩ,
SR(tr)
Slew rate, transition region
(see Figure 1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
(1)
(2)
(3)
250
UNIT
kbit/s
100
ns
V/µs
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SGLS368 – SEPTEMBER 2006
RECEIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
VCC = 3.3 V
1.6
2.4
VCC = 5 V
1.9
2.4
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
IOZ
Output leakage current
EN = VCC
ri
Input resistance
VI = ±3 V to ±16 V
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.4
UNIT
V
0.4
VIT+
(1)
(2)
MIN
TEST CONDITIONS
V
V
V
0.5
V
±0.05
±10
µA
5
8.3
kΩ
3
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TYP (2)
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 3
150
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 3
150
ns
ten
Output enable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
tdis
Output disable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
tsk(p)
Pulse skew (3)
See Figure 3
50
ns
(1)
(2)
(3)
6
TEST CONDITIONS
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SGLS368 – SEPTEMBER 2006
AUTO-POWERDOWN SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold for
INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT–(valid)
Receiver input threshold for
INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7
VT(invalid)
Receiver input threshold for
INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–0.2
VOH
INVALID high-level output voltage
IOH = 1 mA,
FORCEOFF = VCC
FORCEON = GND,
VOL
INVALID low-level output voltage
IOL = 1.6 mA,
FORCEOFF = VCC
FORCEON = GND,
MAX
UNIT
2.7
V
V
0.3
V
VCC – 0.6
V
0.4
V
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TYP (1)
UNIT
tvalid
Propagation delay time, low- to high-level output
1
µs
tinvalid
Propagation delay time, high- to low-level output
30
µs
ten
Supply enable time
100
µs
(1)
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SGLS368 – SEPTEMBER 2006
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50
RL
0V
CL
(see Note A)
3V
FORCEOFF
1.5 V
tTHL
tTLH
-3 V
-3 V
TEST CIRCUIT
VOH
3V
3V
Output
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W, 50% duty cycle, tr 10 ns, tf £ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 W
RL
Input
0V
tPHL
CL
(see Note A)
3V
FORCEOFF
1.5 V
1.5 V
tPLH
VOH
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 2. Driver Pulse Skew
EN
0V
3V
Input
1.5 V
1.5 V
-3 V
Output
Generator
(see Note B)
50 W
tPHL
CL
(see Note A)
0V
FORCEOFF
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 3. Receiver Propagation Delay Times
8
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MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SGLS368 – SEPTEMBER 2006
PARAMETER MEASUREMENT INFORMATION (continued)
3V
VCC
FORCEON
3 V or 0 V
GND
S1
1.5 V
0V
tPHZ
(S1 at GND)
Output
CL
(see Note A)
EN
Generator
(see Note B)
1.5 V
tPHZ
(S1 at GND)
RL
3 V or 0 V
Input
VOH
Output
50%
0.3 V
tPLZ
(S1 at VCC)
0.3 V
50 W
Output
50%
VOL
tPZL
(S1 at VCC)
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 4. Receiver Enable and Disable Times
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MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SGLS368 – SEPTEMBER 2006
PARAMETER MEASUREMENT INFORMATION (continued)
2.7 V
2.7 V
0V
Receiver
Input
0V
50 W
tinvalid
INVALID
Output
Autopowerdown
tvalid
VCC
50% VCC
INVALID
50% VCC
0V
V+
»V+
0.3 V
VCC
0V
0.3 V
»V-
Supply
Voltages
FORCEOFF
DIN
-3 V
ten
CL = 30 pF
(see Note A)
FORCEON
-2.7 V
-2.7 V
ROUT
Generator
(see Note B)
3V
DOUT
V-
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
0V
If Signal Remains Within This Region
†
for More Than 30 ms, INVALID Is Low
-0.3 V
Indeterminate
-2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdown disables drivers and reduces supply
current to 1 mA.
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
10
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MAX3223-EP
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SGLS368 – SEPTEMBER 2006
APPLICATION INFORMATION
2
20
Autopowerdown
1
EN
VCC
C1+
FORCEOFF
19
+
+
C1
-
3
C3
†
+
V+
GND
18
-
CBYPASS
= 0.1 mF
4
5
17
C1-
16
C2+
DOUT1
RIN1
+
C2
-
6
15
C2-
ROUT1
5 kW
7
C4
DOUT2
RIN2
ROUT2
-
14
V-
FORCEON
+
8
13
9
12
10
11
DIN1
DIN2
INVALID
5 kW
†
C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Non polarized ceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 mF
0.047 mF
0.1 mF
0.1 mF
0.33 mF
0.47 mF
Figure 6. Typical Operating Circuit and Capacitor Values
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MAX3223MDBREP
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/06635-01XE
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3223-EP :
• Catalog: MAX3223
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
MAX3223MDBREP
Package Package Pins
Type Drawing
SSOP
DB
20
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.2
7.5
2.5
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX3223MDBREP
SSOP
DB
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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