ADPOW ARF1510 Rf power mosfet Datasheet

D1
ARF1510
D3
G1
S1D2
G3
G1
S3D4
ARF1510
S1D2
G2
RF POWER MOSFET
D3
D1
G3
S3D4
G4
S2
G2
G4
S2
S4
S4
FULL-BRIDGE
400V
750W
40MHz
The ARF1510 is four RF power transistor arranged in an H-Bridge configuration. It is intended for off-line 300V operation
in high power scientific, medical and, industrial RF power generator and amplifier applications up to 40 MHz.
• Specified 300 Volt, 27.12 MHz Characteristics:
•
Output Power = 750 Watts.
•
Gain = 17dB (Class D)
•
Efficiency > 80%
MAXIMUM RATINGS
Symbol
VDSS
ID
• High Performance Power RF Package.
• Very High Breakdown for Improved Ruggedness.
• Low Thermal Resistance.
• Nitride Passivated Die for Improved Reliability.
All Ratings Per Die: TC = 25°C unless otherwise specified.
Parameter
Drain-Source Voltage
ARF 1510
UNIT
1000
Volts
Continuous Drain Current @ TC = 25°C
6.5
Amps
VGS
Gate-Source Voltage
±30
Volts
PD
Total Device Dissipation @ TC = 25°C
1500
Watts
TJ,TSTG
TL
-55 to 200
Operating and Storage Junction Temperature Range
°C
300
Lead Temperature: 0.063" from Case for 10 Sec.
STATIC ELECTRICAL CHARACTERISTICS
Characteristic / Test Conditions
MIN
BVDSS
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250 µA)
1000
VDS(ON)
On State Drain Voltage
Symbol
IDSS
1
(ID(ON) = 3.25A, VGS = 10V)
TYP
MAX
6.8
7.5
Zero Gate Voltage Drain Current (VDS = 1000V, VGS = 0V)
25
Zero Gate Voltage Drain Current (VDS = 800V, VGS = 0V, TC = 125°C)
250
IGSS
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)
g fs
Forward Transconductance (VDS = 25V, ID = 3.25A)
V isolation
RMS Voltage (60Hz Sinewave from terminals to mounting surface for 1 minute)
VGS(TH)
Gate Threshold Voltage (VDS = VGS, ID = 50mA)
±100
3
4
UNIT
Volts
µA
nA
mhos
2500
Volts
3
5
Volts
MAX
UNIT
Characteristic (per package unless otherwise noted)
RθJC
Junction to Case
RθCS
Case to Sink (Use High Efficiency Thermal Joint Compound and Planar Heat Sink Surface.)
MIN
TYP
0.12
0.08
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
°C/W
050-4926 Rev B
Symbol
1-2005
THERMAL CHARACTERISTICS
ARF1510
DYNAMIC CHARACTERISTICS
Symbol
Test Conditions
Characteristic
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(on)
Turn-on Delay Time
tr
Turn-off Delay Time
tf
TYP
MAX
1200
1800
VDS = 200V
100
130
f = 1 MHz
20
26
VGS = 15V
8
VDD = 500V
5
ID = 6.5A @ 25°C
18
RG = 1.6 Ω
10
VGS = 0V
Rise Time
td(off)
MIN
Fall Time
UNIT
pF
ns
FUNCTIONAL CHARACTERISTICS
Symbol
Characteristic
GPS
Common Source Amplifier Power Gain
η
MIN
TYP
f = 40.7 MHz
13
15
dB
75
%
VGS = 0V
Drain Efficiency
ψ
Test Conditions
VDD = 400V
Pout = 750W
Electrical Ruggedness VSWR 6:1
MAX
UNIT
No Degradation in Output Power
1 Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%.
APT Reserves the right to change, without notice, the specifications and information contained herein.
D3
D1
D1
.100
D3
HAZARDOUS MATERIAL
WARNING
.175
G3
G1
1.065"
27.05 mm
S1D2
ARF1510
S3D4
.100
.075
.100
G1
G3
S1D2
.175
G2
G4
S2
S4
.300
1.065"
27.05 mm
.300
.100
.075
.100
S3D4
G2
G4
S2
S4
The ceramic portion of the device
between leads and mounting surface
is beryllium oxide, BeO. Beryllium
oxide dust is toxic when inhaled.
Care must be taken during handling
and mounting to avoid damage to
this area. These devices must never
be thrown away with general industrial or domestic waste.
.254
.045 .005
050-4926 Rev B
1-2005
Thermal Considerations and Package Mounting:
Clamp
ARF 1510
Heat Sink
The rated 1500W power dissipation is only available when the package mounting
surface is at 25°C and the junction temperature is 200°C. The thermal resistance
between junctions and case mounting surface is 0.12°C/W. When installed, and
additional thermal impedance of 0.08°C/W between the package base and the mounting
surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint
compound must be used to reduce the effects of small surface irregularities. The heat
sink should incorporate a copper heat spreader to obtain best results.
The package is designed to be clamped to a heatsink. A clamped joint maintains
the required mounting pressure while allowing for thermal expansion of both the device
and the heat sink. A simple clamp and two 6-32 (M3.5) screw can provide the minimum
125lb required mounting force. T = 12 in-lb.
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