Samsung K6T4008C1B-DL55 512kx8 bit low power cmos static ram Datasheet

CMOS SRAM
K6T4008C1B Family
Document Title
512Kx8 bit Low Power CMOS Static RAM
Revision History
Revision No.
History
Draft Date
Remark
0.0
Initial Draft
December 7, 1996
Advance
0.1
Revise
- Changed Operating current by reticle revision
ICC at write : 35mA → 45mA
ICC1 at read/write : 15/35mA → 10/45mA
March 6, 1997
Preliminary
1.0
Finalize
- Changed Operating current
ICC1 at write : 45mA → 40mA
ICC2; 90mA → 80mA
- Change test load at 55ns : 100pF → 50pF
October 9, 1997
Final
2.0
Revise
- Change datasheet format
February 17, 1998
Final
3.0
Revise
- Industrial product speed bin change:70/100ns → 55/70ns
September 8, 1998
Final
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.
1
Revision 3.0
September 1998
CMOS SRAM
K6T4008C1B Family
512Kx8 bit Low Power CMOS Static RAM
FEATURES
GENERAL DESCRIPTION
• Process Technology: TFT
• Organization: 512Kx8
• Power Supply Voltage: 4.5~5.5V
• Low Data Retention Voltage: 2V(Min)
• Three state output and TTL Compatible
• Package Type: 32-DIP-600, 32-SOP-525
32-TSOP2-400F/R
The K6T4008C1B families are fabricated by SAMSUNG′s
advanced CMOS process technology. The families support
various operating temperature ranges and various package
types for user flexibility of system design. The family also
support low data retention voltage for battery back-up operation with low data retention current.
PRODUCT FAMILY
Power Dissipation
Product Family Operating Temperature Vcc Range
K6T4008C1B-L
Standby
(ISB1, Max)
Operating
(ICC2, Max)
100µA
20µA
Commercial (0~70°C)
K6T4008C1B-B
K6T4008C1B-P
Speed
4.5~5.5V
551)/70ns
PKG Type
32-DIP-600, 32-SOP-525
32-TSOP2-400F/R
80mA
100µA
50µA
Inderstrial (-40~85°C)
K6T4008C1B-F
32-SOP-525
32-TSOP2-400F/R
1. The parameter is measured with 50pF test load.
PIN DESCRIPTION
FUNCTIONAL BLOCK DIAGRAM
Clk gen.
A18
1
32
VCC
VCC
32
1
A18
A16
2
31
A15
A15
31
2
A16
A14
3
30
A17
A17
30
3
A14
A18
A12
4
29
WE
WE
29
4
A12
A16
A7
5
28
A13
A13
28
5
A7
A14
A6
6
27
A8
A8
27
6
A6
26
A9
A9
26
7
A5
25
A11
A11
25
8
A4
A5
24
OE
OE
24
9
A3
A4
23
10
A2
32-DIP
32-SOP
32-TSOP2
(Forward)
A12
A7
A5
7
A4
8
A3
9
A2
10
23
A10
A10
A1
11
22
CS
CS
22
11
A1
32-TSOP2
(Reverse)
A6
A0
A0
12
21
I/O8
I/O8
21
12
A0
13
20
I/O7
I/O7
20
13
I/O1
I/O1
I/O2
14
19
I/O6
I/O6
19
14
I/O2
I/O8
I/O3
15
18
I/O5
I/O5
18
15
I/O3
VSS
16
17
I/O4
I/O4
17
16
VSS
Write Enable Input
CS
Chip Select Input
OE
Output Enable Input
I/O1~I/O8
Data
cont
I/O Circuit
Column select
Data
cont
Function
WE
A0~A18
Memory array
1024 rows
512×8 columns
A1
I/O1
Pin Name
Row
select
Precharge circuit.
A9 A8 A13A17 A15 A10 A11 A3 A2
CS
WE
Address Inputs
Control
logic
OE
Data Inputs/Outputs
Vcc
Power
Vss
Ground
SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice.
2
Revision 3.0
September 1998
CMOS SRAM
K6T4008C1B Family
PRODUCT LIST
Commercial Temperature Products(0~70°C)
Part Name
Industrial Temperature Products(-40~85°C)
Function
Part Name
Function
32-SOP, 55ns, L-pwr
32-SOP, 55ns, LL-pwr
32-SOP, 70ns, L-pwr
32-SOP, 70ns, LL-pwr
32-TSOP2-F, 55ns, LL-pwr
32-TSOP2-F, 70ns, LL-pwr
32-TSOP2-R, 55ns, LL-pwr
32-TSOP2-R, 70ns, LL-pwr
K6T4008C1B-GP55
K6T4008C1B-GF55
K6T4008C1B-GP70
K6T4008C1B-GF70
K6T4008C1B-VF55
K6T4008C1B-VF70
K6T4008C1B-MF55
K6T4008C1B-MF70
32-DIP, 55ns, L-pwr
32-DIP, 55ns, LL-pwr
32-DIP, 70ns, L-pwr
32-DIP, 70ns, LL-pwr
32-SOP, 55ns, L-pwr
32-SOP, 55ns, LL-pwr
32-SOP, 70ns, L-pwr
32-SOP, 70ns, LL-pwr
32-TSOP2-F, 55ns, LL-pwr
32-TSOP2-F, 70ns, LL-pwr
32-TSOP2-R, 55ns, LL-pwr
32-TSOP2-R, 70ns, LL-pwr
K6T4008C1B-DL55
K6T4008C1B-DB55
K6T4008C1B-DL70
K6T4008C1B-DB70
K6T4008C1B-GL55
K6T4008C1B-GB55
K6T4008C1B-GL70
K6T4008C1B-GB70
K6T4008C1B-VB55
K6T4008C1B-VB70
K6T4008C1B-MB55
K6T4008C1B-MB70
FUNCTIONAL DESCRIPTION
CS
OE
WE
I/O Pin
Mode
Power
H
X1)
X1)
High-Z
Deselected
Standby
L
H
H
High-Z
Output disbaled
Active
L
L
H
Dout
Read
Active
L
X1)
L
Din
Write
Active
1. X means don′t care.( Must be in low or high state.)
ABSOLUTE MAXIMUM RATINGS1)
Item
Voltage on any pin relative to Vss
Voltage on Vcc supply relative to Vss
Power Dissipation
Storage temperature
Operating Temperature
Soldering temperature and time
Symbol
Ratings
Unit
Remark
VIN,VOUT
-0.5 to 7.0
V
-
VCC
-0.5 to 7.0
V
-
PD
1.0
W
-
TSTG
-65 to 150
°C
-
0 to 70
°C
K6T4008C1B-L/-B
-40 to 85
°C
K6T4008C1B-P/-F
260°C, 10sec(Lead Only)
-
-
TA
TSOLDER
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be
restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
3
Revision 3.0
September 1998
CMOS SRAM
K6T4008C1B Family
RECOMMENDED DC OPERATING CONDITIONS 1)
Item
Symbol
Min
Typ
Max
Unit
Supply voltage
Vcc
4.5
5.0
5.5
V
Ground
Vss
0
0
0
V
Input high voltage
VIH
2.2
-
Vcc+0.5 2)
V
Input low voltage
VIL
-0.53)
-
0.8
V
Note:
1. Commercial Product: TA=0 to 70°C, otherwise specified
Industrial Product: TA=-40 to 85°C, otherwise specified
2. Overshoot: VCC+3.0V in case of pulse width ≤ 30ns
3. Undershoot: -3.0V in case of pulse width ≤ 30ns
4. Overshoot and undershoot are sampled, not 100% tested.
CAPACITANCE1) (f=1MHz, TA=25°C)
Symbol
Test Condition
Min
Max
Unit
Input capacitance
Item
CIN
VIN=0V
-
8
pF
Input/Output capacitance
CIO
VIO=0V
-
10
pF
1. Capacitance is sampled, not 100% tested
DC AND OPERATING CHARACTERISTICS
Item
Symbol
Test Conditions
Min
Typ
Max
Unit
Input leakage current
ILI
VIN=Vss to Vcc
-1
-
1
µA
Output leakage current
ILO
CS=VIH or OE=VIH or WE=VIL, VIO=Vss to Vcc
-1
-
1
µA
Operating power supply
ICC
IIO=0mA, CS=VIL, VIN=VIL or VIH, Read
-
7.5
15
mA
ICC1
Cycle time=1µs, 100% duty, I IO=0mA
CS≤0.2V, VIN≥0.2V or VIN ≥ Vcc-0.2V
Average operating current
Read
-
4
10
Write
-
27
40
mA
ICC2
Cycle time=Min, 100% duty, IIO=0mA, CS=VIL, VIN=VIH or VIL
-
65
80
mA
Output low voltage
VOL
IOL=2.1mA
-
-
0.4
V
Output high voltage
VOH
IOH=-1.0mA
2.4
-
-
V
Standby Current(TTL)
ISB
CS=VIH, Other inputs = V IL or VIH
-
-
3
mA
Standby Current(CMOS)
ISB1
CS≥Vcc-0.2V, Other inputs=0~Vcc
4
K6T4008C1B-L
-
2
100
µA
K6T4008C1B-B
-
1
20
µA
K6T4008C1B-P
-
2
100
µA
K6T4008C1B-F
-
1
50
µA
Revision 3.0
September 1998
CMOS SRAM
K6T4008C1B Family
AC OPERATING CONDITIONS
TEST CONDITIONS (Test Load and Test Input/Output Reference)
Input pulse level: 0.8 to 2.4V
Input rising and falling time: 5ns
Input and output reference voltage: 1.5V
Output load (See right): CL=100pF+1TTL
CL=50pF+1TTL
CL1)
1. Including scope and jig capacitance
AC CHARACTERISTICS (Vcc=4.5~5.5V, Commercial product: TA=0 to 70°C, Industrial product: TA=-40 to 85°C)
Speed Bins
Parameter List
Symbol
Write
Units
70ns
Max
Min
Max
tRC
55
-
70
-
ns
Address access time
tAA
-
55
-
70
ns
Chip select to output
tCO
-
55
-
70
ns
Output enable to valid output
tOE
-
25
-
35
ns
Chip select to low-Z output
tLZ
10
-
10
-
ns
Output enable to low-Z output
tOLZ
5
-
5
-
ns
Chip disable to high-Z output
tHZ
0
20
0
25
ns
Read cycle time
Read
55*ns
Min
Output disable to high-Z output
tOHZ
0
20
0
25
ns
Output hold from address change
tOH
10
-
10
-
ns
Write cycle time
tWC
55
-
70
-
ns
Chip select to end of write
tCW
45
-
60
-
ns
Address set-up time
tAS
0
-
0
-
ns
Address valid to end of write
tAW
45
-
60
-
ns
Write pulse width
tWP
40
-
50
-
ns
Write recovery time
tWR
0
-
0
-
ns
Write to output high-Z
tWHZ
0
20
0
25
ns
Data to write time overlap
tDW
25
-
30
-
ns
Data hold from write time
tDH
0
-
0
-
ns
End write to output low-Z
tOW
5
-
5
-
ns
DATA RETENTION CHARACTERISTICS
Item
Vcc for data retention
Data retention current
Symbol
VDR
IDR
Test Condition
CS≥Vcc-0.2V
Vcc=3.0V, CS≥Vcc-0.2V
tSDR
Recovery time
tRDR
See data retention waveform
5
Typ
Max
Unit
V
2.0
-
5.5
K6T4008C1B-L
-
-
50
K6T4008C1B-B
-
-
15
K6T4008C1B-P
-
-
50
K6T4008C1B-F
Data retention set-up time
Min
-
-
20
0
-
-
5
-
-
µA
ms
Revision 3.0
September 1998
CMOS SRAM
K6T4008C1B Family
TIMING DIAGRAMS
TIMING WAVEFORM OF READ CYCLE(1) (Address Controlled, CS=OE=VIL , WE=VIH)
tRC
Address
tAA
tOH
Data Out
Data Valid
Previous Data Valid
TIMING WAVEFORM OF READ CYCLE(2) (WE=VIH)
tRC
Address
tOH
tAA
tCO1
CS
tHZ
tOE
OE
Data out
High-Z
tOLZ
tLZ
tOHZ
Data Valid
NOTES (READ CYCLE)
1. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage
levels.
2. At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from device to device
interconnection.
6
Revision 3.0
September 1998
CMOS SRAM
K6T4008C1B Family
TIMING WAVEFORM OF WRITE CYCLE(1) (WE Controlled)
tWC
Address
tCW(2)
tWR(4)
CS
tAW
tWP(1)
WE
tAS(3)
tDW
tDH
Data Valid
Data in
tWHZ
Data out
tOW
Data Undefined
TIMING WAVEFORM OF WRITE CYCLE(2) (CS
Controlled)
tWC
Address
tCW(2)
tAS(3)
tWR(4)
CS
tAW
tWP(1)
WE
tDW
Data in
Data out
tDH
Data Valid
High-Z
High-Z
NOTES (WRITE CYCLE)
1. A write occurs during the overlap of a low CS and a low WE. A write begins at the latest transition among CS going Low and WE
going low : A write end at the earliest transition among CS going high and WE going high, tWP is measured from the begining of write
to the end of write.
2. tCW is measured from the CS going low to the end of write.
3. tAS is measured from the address valid to the beginning of write.
4. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CS or WE going high.
DATA RETENTION WAVE FORM
CS controlled
VCC
tSDR
Data Retention Mode
tRDR
4.5V
2.2V
VDR
CS≥VCC - 0.2V
CS
GND
7
Revision 3.0
September 1998
CMOS SRAM
K6T4008C1B Family
PACKAGE DIMENSIONS
Units: millimeter(Inch)
32 PIN DUAL INLINE PACKAGE (600mil)
+0.10
-0.05
+0.004
0.010-0.002
0.25
#17
#1
#16
15.24
0.600
#32
13.60±0.20
0.535±0.008
0~15°
3.81±0.20
0.150±0.008
42.31 MAX
1.666
5.08
0.200 MAX
41.91±0.20
1.650±0.008
(
3.30±0.30
0.130±0.012
0.46±0.10
0.018±0.004
1.52±0.10
0.060±0.004
1.91
)
0.075
0.38
0.015 MIN
2.54
0.100
32 PIN PLASTIC SMALL OUTLINE PACKAGE (525mil)
0~8°
#17
14.12±0.30
0.556±0.012
#1
11.43±0.20
0.450±0.008
#16
2.74±0.20
0.108±0.008
3.00
0.118 MAX
20.87MAX
0.822
20.47±0.20
0.806±0.008
0.20 +0.10
-0.05
0.008+0.004
-0.002
13.34
0.525
#32
0.80±0.20
0.031±0.008
0.10 MAX
0.004 MAX
( 0.71 )
0.028
+0.100
-0.050
+0.004
0.016 -0.002
0.41
1.27
0.050
0.05
0.002 MIN
8
Revision 3.0
September 1998
CMOS SRAM
K6T4008C1B Family
PACKAGE DIMENSIONS
Units: millimeter(Inch)
32 PIN THIN SMALL OUTLINE PACKAGE TYPE II (400F)
0.25
( 0.010 )
#32
0~8°
#17
11.76±0.20
0.463±0.008
#1
10.16
0.400
0.45 ~0.75
0.018 ~ 0.030
#16
21.35 MAX
0.841
( 0.50 )
0.020
0.15 +0.10
-0.05
0.006 +0.004
-0.002
1.00±0.10
0.039±0.004
1.20
0.047MAX
20.95±0.10
0.825±0.004
0.10 MAX
0.004 MAX
( 0.95 )
0.037
0.40±0.10
0.016±0.004
0.05 MIN
0.002
1.27
0.050
32 PIN THIN SMALL OUTLINE PACKAGE TYPE II (400R)
0~8°
(
#1
0.25
)
0.010
#16
11.76±0.20
0.463±0.008
#32
10.16
0.400
0.45 ~0.75
0.018 ~ 0.030
#17
1.00 ±0.10
0.039±0.004
21.35
0.841 MAX
+0.10
-0.05
+0.004
0.006 -0.002
0.15
( 0.50 )
0.020
1.20
0.047 MAX
20.95±0.10
0.825±0.004
0.10 MAX
0.004 MAX
( 0.95 )
0.037
0.40±0.10
0.016±0.004
1.27
0.050
0.05 MIN
0.002
9
Revision 3.0
September 1998
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