MCP73213 Dual-Cell Li-Ion/Li-Polymer Battery Charge Management Controller with Input Overvoltage Protection Features Description • Complete Linear Charge Management Controller: - Integrated Input Overvoltage Protection - Integrated Pass Transistor - Integrated Current Sense - Integrated Reverse Discharge Protection • Constant Current/Constant Voltage Operation with Thermal Regulation • 4.15V Undervoltage Lockout (UVLO) • 13V Input Overvoltage Protection • High Accuracy Preset Voltage Regulation through Full Temperature Range (-5°C to +55°C ±0.6%) • Battery Charge Voltage Options: - 8.20V, 8.40V, 8.7V or 8.8V • Resistor Programmable Fast Charge Current: - 130 mA-1100 mA • Preconditioning of Deeply Depleted Cells: - Available Options: 10% or Disable • Integrated Precondition Timer: - 32 Minutes or Disable • Automatic End-of-Charge Control: - Selectable Minimum Current Ratio: 5%, 7.5%, 10% or 20% - Elapse Safety Timer: 4 hr, 6 hr, 8 hr or Disable • Automatic Recharge: - Available Options: 95% or Disable • Factory Preset Charge Status Output: - On/Off or Flashing • Soft Start • Temperature Range: -40°C to +85°C • Packaging: DFN-10 (3 mm x 3 mm) The MCP73213 is a highly integrated Li-Ion battery charge management controller for use in space-limited and cost-sensitive applications. The MCP73213 provides specific charge algorithms for dual-cell Li-Ion/ Li-Polymer batteries to achieve optimal capacity and safety in the shortest charging time possible. Along with its small physical size, the low number of external components makes the MCP73213 ideally suitable for portable applications. The absolute maximum voltage, up to 18V, allows the use of MCP73213 in harsh environments, such as low-cost wall wart or voltage spikes from plug/unplug. The MCP73213 employs a constant current/constant voltage charge algorithm. The various charging voltage regulations provide design engineers flexibility to use in different applications. The fast charge, constant current value is set with one external resistor from 130 mA to 1100 mA. The MCP73213 limits the charge current based on die temperature during high-power or highambient conditions. This thermal regulation optimizes the charge cycle time while maintaining device reliability. The PROG pin of the MCP73213 also serves as enable pin. When high impedance is applied, the MCP73213 will be in Standby mode. The MCP73213 is fully specified over the ambient temperature range of -40°C to +85°C. The MCP73213 is available in a 10-lead DFN package. Applications • • • • • • • Digital Camcorders Portable Media Players Ultra Mobile Personal Computers Netbook Computers Handheld Devices Walkie-Talkie Low-Cost 2-Cell Li-Ion/Li-Poly Chargers/Cradles 2009-2014 Microchip Technology Inc. Package Types (Top View) MCP73213 3x3 DFN * VDD VDD VBAT VBAT NC 1 2 3 4 5 EP 11 10 9 8 7 6 PROG VSS VSS STAT NC * Includes Exposed Thermal Pad (EP); see Table 3-1. DS20002190C-page 1 MCP73213 Typical Application 2 CIN RLED 7 VDD VDD STAT 5 NC 6 NC DS20002190C-page 2 VBAT VBAT MCP73213 1 AC-DC-Adapter PROG VSS VSS 3 + 4 COUT 2-Cell Li-Ion Battery 10 9 8 RPROG - 2009-2014 Microchip Technology Inc. 2009-2014 Microchip Technology Inc. TABLE 1: AVAILABLE FACTORY PRESET OPTIONS Charge Voltage OVP Preconditioning Charge Current Preconditioning Threshold Precondition Timer Elapse Timer End-of-Charge Control Automatic Recharge Output Status 8.2V 13V Disable/10% 66.5%/71.5% Disable/ 32 Minimum Disable/4 hr/ 6 hr/8 hr 5%/7.5%/ 10%/20% No/ Yes Type 1/ Type 2 8.4V 13V Disable/10% 66.5%/71.5% Disable/ 32 Minimum Disable/4 hr/ 6 hr/8 hr 5%/7.5%/ 10%/20% No/ Yes Type 1/ Type 2 8.7V 13V Disable/10% 66.5%/71.5% Disable/ 32 Minimum Disable/4 hr/ 6 hr/8 hr 5%/7.5%/ 10%/20% No/ Yes Type 1/ Type 2 8.8V 13V Disable/10% 66.5%/71.5% Disable/ 32 Minimum Disable/4 hr/ 6 hr/8 hr 5%/7.5%/ 10%/20% No/ Yes Type 1/ Type 2 Note 1: 2: 3: 4: 5: 6: 7: TABLE 2: IREG: Regulated fast charge current. VREG: Regulated charge voltage. IPREG/IREG: Preconditioning charge current; ratio of regulated fast charge current. ITERM/IREG: End-of-Charge control; ratio of regulated fast charge current. VRTH/VREG: Recharge threshold; ratio of regulated battery voltage. VPTH/VREG: Preconditioning threshold voltage. Type 1: On/Off; Type 2: Flashing. Please refer to Table 5-2. STANDARD SAMPLE OPTIONS Part Number VREG OVP IPREG/IREG Precharge Timer Elapse Timer ITERM/IREG VRTH/VREG VPTH/VREG Output Status MCP73213-B6S/MF 8.20V 13V 10% 32 Minimum 6 hr 10% 95% 71.5% Type 1 MCP73213-A6S/MF 8.40V 13V 10% 32 Minimum 6 hr 10% 95% 71.5% Type 1 Note 1: Customers should contact their distributor, representatives or field application engineer (FAE) for support and sample. Local sales offices are also available to help customers. A listing of sales offices and locations is included at the back of this document. Technical support is available through the web site at: http://www.microchip.com/support MCP73213 DS20002190C-page 3 MCP73213 Functional Block Diagram VOREG DIRECTION CONTROL VBAT VDD + CURRENT LIMIT - VREF G=0.001 PROG REFERENCE, BIAS, UVLO, AND SHDN VOREG + VREF (1.21V) CA - + UVLO - PRECONDITION + TERM + CHARGE + VA - 13V + CHARGE CONTROL, TIMER, AND STATUS LOGIC - STAT VDD VSS Input OverVP + Thermal Regulation DS20002190C-page 4 95% VREG + TSD - 110°C VBAT *Recharge *Only available on selected options 2009-2014 Microchip Technology Inc. MCP73213 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† VDD...................................................................... 18.0V VPROG ................................................................... 6.0V All Inputs and Outputs w.r.t. VSS .....-0.3 to (VDD+0.3)V Maximum Junction Temperature, TJ . Internally Limited Storage Temperature ......................... -65°C to +150°C ESD Protection on All Pins 4 kV HBM ESD Protection on All Pins 300V MM DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 12V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V] Parameters Sym. Min. Typ. Max. Units V Conditions Supply Input Input Voltage Range VDD 4 — 16 Operating Supply Voltage VDD 4.2 — 13 V ISS — 4 5.5 µA Shutdown (VDD ≤ VBAT - 150 mV) — 700 1500 µA Charging — 50 125 µA Standby (PROG Floating) — 50 150 µA Charge Complete; No Battery; VDD < VSTOP — 0.5 2 µA Standby (PROG Floating) — 0.5 2 µA Shutdown (VDD ≤ VBAT or VDD < VSTOP) — 10 17 µA Charge Complete; VDD is present V Supply Current Battery Discharge Current Output Reverse Leakage Current IDISCHARGE Undervoltage Lockout UVLO Start Threshold VSTART 4.10 4.15 4.25 UVLO Stop Threshold VSTOP 4.00 4.05 4.10 V UVLO Hysteresis VHYS — 100 — mV VOVP 12.8 13 13.2 V VOVPHYS — 150 — mV Overvoltage Protection OVP Start Threshold OVP Hysteresis Voltage Regulation (Constant Voltage Mode) Regulated Output Voltage Options Output Voltage Tolerance VREG 8.15 8.20 8.25 V TA= -5°C to +55°C 8.35 8.40 8.45 V VDD = [VREG(Typical)+1V] IOUT = 50 mA 8.65 8.70 8.75 V 8.75 8.80 8.85 V VRTOL -0.6 — 0.6 % Line Regulation VBAT/ VBAT)/VDD| — 0.05 0.20 %/V Load Regulation VBAT/VBAT| — 0.05 0.20 % Note 1: VDD = [VREG(Typical)+1V] to 12V IOUT = 50 mA IOUT = 50 mA - 150 mA VDD = [VREG(Typical)+1V] Not production tested. Ensured by design. 2009-2014 Microchip Technology Inc. DS20002190C-page 5 MCP73213 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 12V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions Supply Ripple Attenuation PSRR — -46 — dB IOUT = 20 mA, 10 Hz to 1 kHz — -30 — dB IOUT = 20 mA, 10 Hz to 10 kHz Battery Short Protection BSP Start Threshold VSHORT — 3.4 — V BSP Hysteresis VBSPHYS — 150 — mV ISHORT — 25 — mA BSP Regulation Current Current Regulation (Fast Charge, Constant-Current Mode) Fast Charge Current Regulation IREG 130 — 1100 mA TA = -5°C to +55°C 117 130 143 mA PROG = 10 k 900 1000 1100 mA PROG = 1.1 k Preconditioning Current Regulation (Trickle Charge Constant-Current Mode) Precondition Current Ratio IPREG/IREG — — 100 — % No Preconditioning Precondition Voltage Threshold Ratio VPTH/VREG 64 66.5 69 % VBAT Low-to-High VBAT Low-to-High Precondition Hysteresis 10 — % 69 71.5 74 % VPHYS — 100 — mV ITERM/IREG 3.7 5 6.3 % 5.6 7.5 9.4 — 7.5 10 12.5 — 15 20 25 — 93 95.0 97 % — 0 — % RDSON — 350 — m PROG = 1 kto 10 k TA=-5°C to +55°C VBAT High-to-Low (Note 1) Charge Termination Charge Termination Current Ratio PROG = 1 kto 10 k TA=-5°C to +55°C Automatic Recharge Recharge Voltage Threshold Ratio VRTH/VREG VBAT High-to-Low No Automatic Recharge Pass Transistor ON-Resistance ON-Resistance VDD = 4.5V, TJ = 105°C (Note 1) Status Indicator - STAT Sink Current ISINK — 20 35 mA Low Output Voltage VOL — 0.2 0.5 V ISINK = 4 mA Input Leakage Current ILK — 0.001 1 µA High Impedance, VDD on pin Charge Impedance Range RPROG 1 — 22 k Shutdown Impedance RPROG — 200 — k Automatic Power-Down Entry Threshold VPDENTRY VBAT + 10 mV VBAT + 50 mV — V VDD Falling Automatic Power-Down Exit Threshold VPDEXIT — V VDD Rising PROG Input Impedance for Shutdown Automatic Power-Down Note 1: VBAT + 150 VBAT + 250 mV mV Not production tested. Ensured by design. DS20002190C-page 6 2009-2014 Microchip Technology Inc. MCP73213 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 12V, TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V] Parameters Sym. Min. Typ. Max. Units Die Temperature TSD — 150 — C Die Temperature Hysteresis TSDHYS — 10 — C Conditions Thermal Shutdown Note 1: Not production tested. Ensured by design. AC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typical)+0.3V] to 12V, TA=-40°C to +85°C. Typical values are at +25°C, VDD= [VREG(Typical)+1.0V] Parameters Sym. Min. Typ. Max. Units tEL- — 0 — Hours APSED 3.6 4.0 4.4 Hours 5.4 6.0 6.6 Hours 7.2 8.0 8.8 Hours — 0 — Hours 0.4 0.5 0.6 Hours Conditions Elapsed Timer Elapsed Timer Period Timer Disabled Preconditioning Timer Preconditioning Timer Period tPRECHG Disabled Timer Status Indicator Status Output Turn-Off tOFF — — 500 µs ISINK = 1 mA to 0 mA (Note 1) Status Output Turn-On tON — — 500 — ISINK = 0 mA to 1 mA (Note 1) Note 1: Not production tested. Ensured by design. TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typical) + 0.3V] to 6V. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Specified Temperature Range TA -40 — +85 °C Operating Temperature Range TJ -40 — +125 °C Storage Temperature Range TA -65 — +150 °C JA — 62 — °C/W JC — 20.5 — °C/W Thermal Package Resistances Thermal Resistance, DFN-10LD (3x3) 2009-2014 Microchip Technology Inc. 4-Layer JC51-7 Standard Board, Natural Convection DS20002190C-page 7 MCP73213 NOTES: DS20002190C-page 8 2009-2014 Microchip Technology Inc. MCP73213 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Battery Regulation Voltage (V) Battery Regulation Voltage (V) Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 50 mA and TA= +25°C, Constant Voltage mode. 8.24 8.23 8.22 8.21 8.20 8.19 VBAT = 8.2V ILOAD = 150 mA TA = +25°C 8.18 8.17 8.16 8.4 9.0 9.6 10.2 10.8 11.4 12.0 8.24 8.23 8.22 8.21 8.20 8.19 VBAT = 8.2V VDD = 9.2V ILOAD = 150 mA 8.18 8.17 8.16 -5.0 5.0 Supply Voltage (V) 25.0 35.0 45.0 55.0 FIGURE 2-4: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA). 8.24 1200 8.23 Charge Current (mA) Battery Regulation Voltage (V) FIGURE 2-1: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). 8.22 8.21 8.20 8.19 VBAT = 8.2V ILOAD = 50 mA TA = +25°C 8.18 8.17 VBAT = 8.2V VDD = 9.2V TA = +25°C 1000 800 600 400 200 8.16 0 8.4 9.0 9.6 10.2 10.8 11.4 12.0 1 3 Supply Voltage (V) Charge Current (mA) 8.23 8.22 8.21 8.20 8.19 V BAT = 8.2V V DD = 9.2V ILOAD = 50 mA 8.17 8.16 -5 5 15 25 35 45 55 Ambient Temperature (°C) FIGURE 2-3: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA). 2009-2014 Microchip Technology Inc. 7 9 11 13 15 17 19 FIGURE 2-5: Charge Current (IOUT) vs. Programming Resistor (RPROG). 8.24 8.18 5 Programming Resistor (kΩ) FIGURE 2-2: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). Battery Regulation Voltage (V) 15.0 Ambient Temperature (°C) 900 880 860 840 820 800 780 760 740 720 700 R PROG = 1.3 kΩ TA = +25°C 8.4 9.0 9.6 10.2 10.8 11.4 12.0 Supply Voltage (V) FIGURE 2-6: Charge Current (IOUT) vs. Supply Voltage (VDD). DS20002190C-page 9 MCP73213 TYPICAL PERFORMANCE CURVES (CONTINUED) 600 160 154 148 142 136 130 124 118 112 106 100 Charge Current (mA) Charge Current (mA) Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode. RPROG = 10 kΩ TA = +25°C 8.4 9.0 VBAT = 8.2V RPROG = 2 kΩ 590 V DD = 12V 580 V DD = 11V 570 560 V DD = 9.2V V DD = 8.5V 9.6 10.2 10.8 11.4 550 12.0 -5 0 5 Supply Voltage (V) Ambient Temperature (°C) RPROG = 5 kΩ TA = +25°C 8.4 9.0 FIGURE 2-10: Charge Current (IOUT) vs. Ambient Temperature (TA). BSP Regulation Current (mA) Charge Current (mA) FIGURE 2-7: Charge Current (IOUT) vs. Supply Voltage (VDD). 300 290 280 270 260 250 240 230 220 210 200 9.6 10.2 10.8 11.4 12.0 VDD = 12V VDD = 11V VDD = 9.2V VDD = 8.5V 5 10 15 20 25 30 35 40 45 50 55 Ambient Temperature (°C) FIGURE 2-9: Charge Current (IOUT) vs. Ambient Temperature (TA). DS20002190C-page 10 22 18 14 VDD = 9.2V 10 5 15 25 35 45 55 65 75 85 FIGURE 2-11: Battery Short Protection Regulation Current (ISHORT) vs. Ambient Temperature (TA). Discharge Current (uA) Charge Current (mA) VBAT = 8.2V RPROG = 20 kΩ 0 26 Ambient Temperature (C) FIGURE 2-8: Charge Current (IOUT) vs. Supply Voltage (VDD). -5 30 -45 -35 -25 -15 -5 Supply Voltage (V) 90 87 84 81 78 75 72 69 66 63 60 10 15 20 25 30 35 40 45 50 55 9.0 8.0 7.0 6.0 5.0 End of Charge 4.0 3.0 2.0 VDD < VBAT 1.0 0.0 VDD < VSTOP -1.0 -5.0 5.0 15.0 25.0 35.0 45.0 55.0 Ambient Temperature (°C) FIGURE 2-12: Output Leakage Current (IDISCHARGE) vs. Ambient Temperature (TA). 2009-2014 Microchip Technology Inc. MCP73213 TYPICAL PERFORMANCE CURVES (CONTINUED) Battery Voltage Accuracy (%) Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode. 0.5 0.3 Output Current 0.1 -0.1 Battery Voltage Input Voltage VBAT = 8.2V ILOAD = 150 mA TA = +25°C -0.3 -0.5 8.4 9.0 9.6 10.2 10.8 11.4 12.0 Supply Voltage (V) FIGURE 2-13: Battery Voltage Accuracy (VRTOL) vs. Supply Voltage (VDD). FIGURE 2-16: Protection. Input Overvoltage Source Voltage (V) Output Ripple (V) Output Ripple (V) Output Current (mA) 10 9 8 7 6 5 4 3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Thermal Foldback VDD = 9V RPROG = 1.5 kΩ 875 mAh Li-Ion Battery 2 1 0 0 10 20 FIGURE 2-15: 30 40 50 60 Time (Minutes) 70 80 Supply Current (A) Battery Voltage (V) FIGURE 2-14: Load Transient Response (ILOAD = 50 mA/Div, Output: 100 mV/Div, Time: 100 µs/Div). Source Voltage (V) Output Ripple (V) 90 Complete Charge Cycle. 2009-2014 Microchip Technology Inc. FIGURE 2-17: Line Transient Response (ILOAD = 10 mA) (100 µs/Div). FIGURE 2-18: Line Transient Response (ILOAD = 100 mA) (100 µs/Div). DS20002190C-page 11 MCP73213 NOTES: DS20002190C-page 12 2009-2014 Microchip Technology Inc. MCP73213 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: MCP73213 DFN-10 3.1 PIN FUNCTION TABLE Symbol I/O Description 1, 2 VDD I 3, 4 VBAT I/O Battery Management Input Supply Pin Battery Charge Control Output Pin 5, 6 NC — No Connection Pin 7 STAT O Battery Charge Status Output Pin 8, 9 VSS — Battery Management 0V Reference Pin 10 PROG I/O Battery Charge Current Regulation Program and Charge Control Enable Pin 11 EP — Exposed Pad Pin Battery Management Input Supply (VDD) A supply voltage of [VREG (Typical) + 0.3V] to 13.0V is recommended. Bypass to VSS with a minimum of 1 µF. The VDD pin is rated 18V absolute maximum to prevent a sudden rise in input voltage from spikes or low-cost AC-DC wall adapters from causing an over-voltage condition and damaging the device. 3.2 Battery Charge Control Output (VBAT) Connect to the positive terminal of the battery. Bypass to VSS with a minimum of 1 µF to ensure loop stability when the battery is disconnected. 3.3 No Connection (NC) No connection. 3.4 Status Output (STAT) STAT is an open-drain logic output for connection to an LED for charge status indication in stand-alone applications. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. Refer to Table 5-2 for a summary of the status output during a charge cycle. 2009-2014 Microchip Technology Inc. 3.5 Battery Management 0V Reference (VSS) Connect to the negative terminal of the battery and input supply. 3.6 Current Regulation Set (PROG) The fast charge current is set by placing a resistor from PROG to VSS during constant current (CC) mode. PROG pin also serves as charge control enable. When a typical 200 k impedance is applied to the PROG pin, the MCP73213 will go into standby mode until the high impedance is removed. Refer to Section 5.5 “Constant-Current Mode - Fast Charge” for details. 3.7 Exposed Pad (EP) Connect the Exposed Thermal Pad (EP) to the exposed copper area on the Printed Circuit Board (PCB) for thermal enhancement. Additional vias in the copper area under the MCP73213 device can improve heat dissipation performance and simplify the assembly process. DS20002190C-page 13 MCP73213 NOTES: DS20002190C-page 14 2009-2014 Microchip Technology Inc. MCP73213 4.0 DEVICE OVERVIEW The MCP73213 are simple, but fully integrated linear charge management controllers. Figure 4-1 depicts the operational flow algorithm. SHUTDOWN MODE VDD < VUVLO VDD < VPD or PROG > 200 k STAT = High Z VBAT < VPTH VDD < VOVP PRECONDITIONING MODE Charge Current = IPREG STAT = LOW Timer Reset Timer Enable Timer Expired TIMER FAULT No Charge Current STAT = Flashing (Type 2) STAT = High Z (Type 1) Timer Suspended VDD > VOVP VDD > VOVP VBAT > VPTH VBAT > VPTH FAST CHARGE MODE Charge Current = IREG STAT = LOW Timer Reset Timer Enabled OVERVOLTAGE PROTECTION No Charge Current STAT = High Z Timer Suspended VDD < VOVP VDD > VOVP VDD < VOVP VBAT = VREG Timer Expired VBAT < VRTH TIMER FAULT No Charge Current STAT = Flashing (Type 2) STAT = High Z (Type 1) Timer Suspended CONSTANT VOLTAGE MODE Charge Voltage = VREG STAT = LOW VBAT < ITERM Die Temperature < TSDHYS Charge Mode Resume CHARGE COMPLETE MODE No Charge Current STAT = High Z Timer Reset Die Temperature > TSD VBAT < VSHORT TEMPERATURE FAULT No Charge Current STAT = Flashing (Type 2) STAT = High Z (Type 1) Timer Suspended FIGURE 4-1: VBAT > VSHORT Charge Mode Resume BATTERY SHORT PROTECTION Charge Current = ISHORT STAT = Flashing (Type 2) STAT = High Z (Type 1) Timer Suspended The MCP73213 Flow Chart. 2009-2014 Microchip Technology Inc. DS20002190C-page 15 MCP73213 NOTES: DS20002190C-page 16 2009-2014 Microchip Technology Inc. MCP73213 5.0 DETAILED DESCRIPTION 5.3.2 5.1 Undervoltage Lockout (UVLO) The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP73213 provides constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack. An internal undervoltage lockout (UVLO) circuit monitors the input voltage and keeps the charger in shutdown mode until the input supply rises above the UVLO threshold. In the event a battery is present when the input power is applied, the input supply must rise approximately 150 mV above the battery voltage before the MCP73213 device becomes operational. The UVLO circuit places the device in shutdown mode if the input supply falls to approximately 150 mV above the battery voltage.The UVLO circuit is always active. Any time the input supply is below the UVLO threshold or approximately 150 mV of the voltage at the VBAT pin, the MCP73213 device is placed in a shutdown mode. 5.2 Overvoltage Protection (OVP) An internal overvoltage protection (OVP) circuit monitors the input voltage and keeps the charger in shutdown mode when the input supply rises above the typical 13V OVP threshold. The OVP hysteresis is approximately 150 mV for the MCP73213 device. The MCP73213 device is operational between UVLO and OVP thresholds. The OVP circuit is also recognized as overvoltage lockout (OVLO). 5.3 Charge Qualification When the input power is applied, the input supply must rise 150 mV above the battery voltage before the MCP73213 becomes operational. The automatic power-down circuit places the device in a shutdown mode if the input supply falls to within +50 mV of the battery voltage. The automatic circuit is always active. At any time the input supply is within +50 mV of the voltage at the VBAT pin, the MCP73213 is placed in a shutdown mode. For a charge cycle to begin, the automatic power-down conditions must be met and the charge enable input must be above the input high threshold. 5.3.1 BATTERY MANAGEMENT INPUT SUPPLY (VDD) The VDD input is the input supply to the MCP73213. The MCP73213 automatically enters a power-down mode if the voltage on the VDD input falls to within +50 mV of the battery voltage. This feature prevents draining the battery pack when the VDD supply is not present. 2009-2014 Microchip Technology Inc. 5.3.3 BATTERY CHARGE CONTROL OUTPUT (VBAT) BATTERY DETECTION The MCP73213 detects the battery presence with charging of the output capacitor. The charge flow will initiate when the voltage on VBAT is pulled below the VRECHARGE threshold. Refer to Section 1.0 “Electrical Characteristics” for VRECHARGE values. The value will be the same for nonrechargeable devices. When VBAT > VREG + Hysteresis, the charge will be suspended (or not started, depending on the condition) to prevent overcharging. 5.4 Preconditioning If the voltage at the VBAT pin is less than the preconditioning threshold, the MCP73213 device enters a preconditioning mode. The preconditioning threshold is factory set. Refer to Section 1.0 “Electrical Characteristics” for preconditioning threshold options. In this mode, the MCP73213 device supplies 10% of the fast charge current (established with the value of the resistor connected to the PROG pin) to the battery. When the voltage at the VBAT pin rises above the preconditioning threshold, the MCP73213 device enters the Constant Current (Fast Charge) mode. Note: 5.4.1 The MCP73213 device also offers options with no preconditioning. TIMER EXPIRED DURING PRECONDITIONING MODE If the internal timer expires before the voltage threshold is reached for Fast Charge mode, a timer fault is indicated and the charge cycle terminates. The MCP73213 device remains in this condition until the battery is removed or input power is cycled. If the battery is removed, the MCP73213 device enters the Standby mode, where it remains until a battery is reinserted. Note: The typical preconditioning timer for MCP73213 is 32 minutes. The MCP73213 also offers options with no preconditioning timer. DS20002190C-page 17 MCP73213 5.5 Constant-Current Mode - Fast Charge During Constant-Current mode, the programmed charge current is supplied to the battery or load. The charge current is established using a single resistor from PROG to VSS. The program resistor and the charge current are calculated using the following equation: EQUATION 5-1: IREG = 1104 R PROG – 0.93 Where: RPROG = kilohm (k) IREG = milliampere (mA) I REG log ---------- 1104- – 0.93 If the internal timer expires before the recharge voltage threshold is reached, a timer fault is indicated and the charge cycle terminates. The MCP73213 device remains in this condition until the battery is removed. If the battery is removed or input power is cycled, the MCP73213 device enters the Standby mode where it remains until a battery is reinserted. 5.7 RPROG = kilohm (k) IREG = milliampere (mA) Table 5-1 provides commonly seen E96 (1%) and E24 (5%) resistors for various charge current to reduce design time. RESISTOR LOOKUP TABLE Charge Recommended Recommended Current (mA) E96 Resistor () E24 Resistor () 130 10k 10k 150 8.45k 8.20k 200 6.20k 6.20k 250 4.99k 5.10k 300 4.02k 3.90k 350 3.40k 3.30k 400 3.00k 3.00k 450 2.61k 2.70k 500 2.32k 2.37k 550 2.10k 2.20k 600 1.91k 2.00k 650 1.78k 1.80k 700 1.62k 1.60k 750 1.50k 1.50k 800 1.40k 1.50k 850 1.33k 1.30k 900 1.24k 1.20k 950 1.18k 1.20k 1000 1.10k 1.10k 1100 1.00k 1.00k DS20002190C-page 18 TIMER EXPIRED DURING CONSTANT-CURRENT - FAST CHARGE MODE Constant-Voltage Mode When the voltage at the VBAT pin reaches the regulation voltage, VREG, constant voltage regulation begins. The regulation voltage is factory set to 8.2V, 8.4V, 8.7V or 8.8V with a tolerance of ± 0.5%. Where: TABLE 5-1: 5.5.1 5.6 EQUATION 5-2: R PROG = 10 Constant-Current mode is maintained until the voltage at the VBAT pin reaches the regulation voltage, VREG. When Constant Current mode is invoked, the internal timer is reset. Charge Termination The charge cycle is terminated when, during ConstantVoltage mode, the average charge current diminishes below a threshold established with the value of 5%, 7.5%, 10% or 20% of fast charge current or the internal timer expires. A 1 ms filter time on the termination comparator ensures that transient load conditions do not result in premature charge cycle termination. The timer period is factory set and can be disabled. Refer to Section 1.0 “Electrical Characteristics” for timer period options. 5.8 Automatic Recharge The MCP73213 device continuously monitors the voltage at the VBAT pin in the charge complete mode. If the voltage drops below the recharge threshold, another charge cycle begins and current is once again supplied to the battery or load. The recharge threshold is factory set. Refer to Section 1.0 “Electrical Characteristics” for recharge threshold options. Note: The MCP73213 also offers options with no automatic recharge. For the MCP73213 device with no recharge option, the MCP73213 will go into Standby mode when the termination condition is met. The charge will not restart until the following conditions have been met: • Battery is removed from the system and inserted again • VDD is removed and plugged in again • RPROG is disconnected (or high-impedance) and reconnected 2009-2014 Microchip Technology Inc. MCP73213 5.9 Thermal Regulation The MCP73213 shall limit the charge current based on the die temperature. The thermal regulation optimizes the charge cycle time while maintaining device reliability. Figure 5-1 depicts the thermal regulation for the MCP73213 device. Refer to Section 1.0 “Electrical Characteristics” for thermal package resistances and Section 6.1.1.2 “Thermal Considerations” for calculating power dissipation. TABLE 5-2: STATUS OUTPUTS CHARGE CYCLE STATE Shutdown High Z Standby High Z Preconditioning L Constant Current Fast Charge L Constant Voltage . Charge Complete - Standby Fast Charge Current (mA) 150 1.6 second 50% D.C. Flashing (Type 2) High Z (Type 1) Timer Fault 1.6 second 50% D.C. Flashing (Type 2) High Z (Type 1) Preconditioning Timer Fault 1.6 second 50% D.C. Flashing (Type 2) High Z (Type 1) 60 VDD = 9.1V RPROG = 10 kΩ 30 0 25 40 FIGURE 5-1: 5.10 55 70 85 100 115 130 145 160 Junction Temperature (°C) Thermal Regulation. Thermal Shutdown The MCP73213 suspends charge if the die temperature exceeds +150°C. Charging will resume when the die temperature has cooled by approximately 10°C. The thermal shutdown is a secondary safety feature in the event that there is a failure within the thermal regulation circuitry. 5.11 Status Indicator L High Z Temperature Fault 120 90 STAT 5.12 Battery Short Protection Once a single-cell Li-Ion battery is detected, an internal battery short protection (BSP) circuit starts monitoring the battery voltage. When VBAT falls below a typical 1.7V battery short protection threshold voltage, the charging behavior is postponed. A typical 25 mA detection current is supplied for recovering from the battery short condition. Preconditioning mode resumes when VBAT raises above the battery short protection threshold. The battery voltage must rise approximately 150 mV above the battery short protection voltage before the MCP73213 device becomes operational. The charge status outputs are open-drain outputs with two different states: Low (L), and High-Impedance (High Z). The charge status outputs can be used to illuminate LEDs. Optionally, the charge status outputs can be used as an interface to a host microcontroller. Table 5-2 summarizes the state of the status outputs during a charge cycle. 2009-2014 Microchip Technology Inc. DS20002190C-page 19 MCP73213 NOTES: DS20002190C-page 20 2009-2014 Microchip Technology Inc. MCP73213 6.0 APPLICATIONS The MCP73213 is designed to operate in conjunction with a host microcontroller or in stand-alone applications. The MCP73213 provides the preferred charge algorithm for dual Lithium-Ion or Lithium-Polymer cells: Constant Current followed by Constant Voltage. Figure 6-1 depicts a typical stand-alone application circuit, while Figure 6-2 depicts the accompanying charge profile. 2 CIN RLED 7 VDD VDD STAT 5 NC 6 NC 10 9 8 7 6 5 4 3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 VDD = 9V RPROG = 1.5 kΩ 875 mAh Li-Ion Battery 0 10 PROG VSS VSS + 4 COUT 2-Cell Li-Ion Battery 10 9 8 RPROG - Typical Application Circuit. Thermal Foldback 2 1 0 VBAT 3 20 30 40 50 60 Time (Minutes) 70 80 Supply Current (A) Battery Voltage (V) FIGURE 6-1: VBAT MCP73213 1 AC-DC-Adapter 90 FIGURE 6-2: Typical Charge Profile (875 mAh Li-Ion Battery). 2009-2014 Microchip Technology Inc. DS20002190C-page 21 MCP73213 6.1 Application Circuit Design Due to the low efficiency of linear charging, the most important factors are thermal design and cost, which are a direct function of the input voltage, output current and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is when the device has transitioned from the Preconditioning mode to the Constant Current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost and thermal requirements of the charger. 6.1.1 COMPONENT SELECTION Selection of the external components in Figure 6-1 is crucial to the integrity and reliability of the charging system. The following discussion is intended as a guide for the component selection process. 6.1.1.1 Charge Current The preferred fast charge current for Li-Ion/Li-Poly cells is below the 1C rate, with an absolute maximum current at the 2C rate. The recommended fast charge current should be obtained from the battery manufacturer. For example, a 500 mAh battery pack with 0.7C preferred fast charge current has a charge current of 350 mA. Charging at this rate provides the shortest charge cycle times without degradation to the battery pack performance or life. Note: 6.1.1.2 Please consult with your battery supplier or refer to the battery data sheet for the preferred charge rate. Thermal Considerations The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum and the device has transitioned from Preconditioning mode to Constant-Current mode. In this case, the power dissipation is: EQUATION 6-1: PowerDissipation = V DDMAX – V PTHMIN IREGMAX Where: VDDMAX = the maximum input voltage IREGMAX = the maximum fast charge current VPTHMIN = the minimum transition threshold voltage DS20002190C-page 22 Power dissipation with a 9V, ±10% input voltage source, 400 mA ±10% and preconditioning threshold voltage at 6V is: EQUATION 6-2: Power dissipation = 9.9V – 6.0V 440 mA = 1.58W This power dissipation with the battery charger in the DFN-10 package will result approximately 98C above room temperature. 6.1.1.3 External Capacitors The MCP73213 is stable with or without a battery load. In order to maintain good AC stability in Constant-Voltage mode, a minimum capacitance of 1 µF is recommended to bypass the VBAT pin to VSS. This capacitance provides compensation when there is no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant Voltage mode. Therefore, bypass capacitance may be necessary to compensate for the inductive nature of the battery pack. For typical applications, it is recommended to apply a minimum of 16V rated 1 µF to the output capacitor and a minimum of 25V rated 1 µF to the input capacitor. TABLE 6-1: MLCC CAPACITOR EXAMPLE MLCC Capacitors Temperature Range Tolerance X7R -55C to +125C ±15% X5R -55C to +85C ±15% Virtually any good quality output filter capacitor can be used independent of the capacitor’s minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 1 µF ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability. 6.1.1.4 Reverse-Blocking Protection The MCP73213 provides protection from a faulted or shorted input. Without the protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor. 2009-2014 Microchip Technology Inc. MCP73213 6.2 PCB Layout Issues For optimum voltage regulation, place the battery pack as close as possible to the device’s VBAT and VSS pins to minimize voltage drops along the high-currentcarrying PCB traces. If the PCB layout is used as a heatsink, adding multiple vias in the heatsink pad can help conduct more heat to the backplane of the PCB, thus reducing the junction temperature. Figures 6-4 and 6-5 depict a typical layout with PCB heatsinking. FIGURE 6-5: Typical Layout (Bottom). 102-00261 MCP73213EV FIGURE 6-3: Typical Layout (Top). FIGURE 6-4: Typical Layout (Top Metal). 2009-2014 Microchip Technology Inc. DS20002190C-page 23 MCP73213 NOTES: DS20002190C-page 24 2009-2014 Microchip Technology Inc. MCP73213 7.0 PACKAGING INFORMATION 7.1 Package Marking Information Example: 10-Lead DFN (3x3) Standard * XXXX Part Number YYWW MCP73213-A6SI/MF MCP73213T-A6SI/MF MCP73213-B6SI/MF MCP73213T-B6SI/MF NNN Legend: XX...X Y YY WW NNN e3 * Note: Code Z3HI Z3HI Y3HI Y3HI Z3HI 1443 256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2009-2014 Microchip Technology Inc. DS20002190C-page 25 MCP73213 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002190C-page 26 2009-2014 Microchip Technology Inc. MCP73213 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2014 Microchip Technology Inc. DS20002190C-page 27 MCP73213 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002190C-page 28 2009-2014 Microchip Technology Inc. MCP73213 APPENDIX A: REVISION HISTORY Revision C (December 2014) The following is the list of modifications: 1. 2. 3. 4. 5. 6. 7. 8. Added Note 7 in Table 1 regarding the Type 1 and Type 2 descriptions. Updated the Functional Block Diagram. Updated the thermal resistances in the Temperature Specifications. Changed captions for the Figures 2-7, 2-8, 2-15, 2-16. Updated Figure 4-1. Updated Section 6.1.1.2, Thermal Considerations. Updated Section 7.1, Package Marking Information. Minor typographical corrections. Revision B (December 2009) The following is the list of modifications: 1. Updated the Battery Short Protection values in the DC Characteristics table. Revision A (July 2009) • Original Release of this Document. 2009-2014 Microchip Technology Inc. DS20002190C-page 29 MCP73213 NOTES: DS20002190C-page 30 2009-2014 Microchip Technology Inc. MCP73213 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) X /XX XXX Device Tape and Reel Option Temperature Range Package Pattern Device: Examples: a) MCP73213-xxx: Dual Cell Li-Ion/Li-Polymer Battery Device MCP73213T-xxx: Dual Cell Li-Ion/Li-Polymer Battery Device, Tape and Reel Tape and Reel T Option: = Tape and Reel(1) Temperature Range: I = -40C to +85C (Industrial) Package: MF = 10-Lead Plastic Dual Flat, No Lead - 3x3 mm Body (DFN) b) c) d) MCP73213-A6SI/MF: Dual Cell Li-Ion/ Li-Polymer Battery Device MCP73213-B6SI/MF: Dual Cell Li-Ion/ Li-Polymer Battery Device MCP73213T-A6SI/MF: Tape and Reel, Dual Cell Li-Ion/ Li-Polymer Battery Device MCP73213T-B6SI/MF: Tape and Reel, Dual Cell Li-Ion/ Li-Polymer Battery Device Note 1: 2009-2014 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20002190C-page 31 MCP73213 NOTES: DS20002190C-page 32 2009-2014 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2009-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63276-867-4 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2009-2014 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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