NTNS3C94NZ Product Preview Small Signal MOSFET 12 V, 384 mA, Single N−Channel, 0.62 x 0.62 x 0.4 mm XLLGA3 Package Features • • • • • www.onsemi.com Single N−Channel MOSFET Ultra Small and Thin Package (0.62 x 0.62 x 0.4 mm) Low RDS(on) Solution in 0.62 x 0.62 mm Package 1.5 V Gate Voltage Rating These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MOSFET RDS(on) MAX V(BR)DSS 0.48 W @ 4.5 V 0.53 W @ 3.7 V 0.60 W @ 3.3 V 12 V 384 mA 0.80 W @ 2.5 V Applications • • • • ID MAX 1.90 W @ 1.8 V Small Signal Load Switch Analog Switch High Speed Interfacing Optimized for Power Management in Ultra Portable Products N−Channel MOSFET D (3) MAXIMUM RATINGS (TJ = 25°C unless otherwise stated) Symbol Value Units Drain-to-Source Voltage VDSS 12 V Gate-to-Source Voltage VGS ±10 V ID 384 mA Parameter Continuous Drain Current (Note 1) Power Dissipation (Note 1) Steady State TA = 25°C TA = 85°C 277 t≤5s TA = 25°C 413 Steady State TA = 25°C t≤5s Pulsed Drain Current PD G (1) S (2) MARKING DIAGRAM mW 120 1 3 TA = 25°C tp = 10 ms 140 IDM TBD mA TJ, TSTG -55 to 150 °C Source Current (Body Diode) (Note 2) IS 384 mA Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) TL 260 °C Operating Junction and Storage Temperature XLLGA3 CASE 713AB 2 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE RATINGS Parameter Symbol Max Units Junction-to-Ambient – Steady State (Note 1) RθJA 1040 °C/W Junction-to-Ambient – t ≤ 5 s (Note 1) RθJA 900 XM 1 X = Specific Device Code M = Date Code ORDERING INFORMATION Device Package Shipping† NTNS3C94NZT5G XLLGA3 (Pb−Free) 8000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1. Surface Mounted on FR4 Board using the minimum recommended pad size, (or 2 mm2), 1 oz Cu. 2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%. This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. © Semiconductor Components Industries, LLC, 2015 May, 2015 − Rev. P1 1 Publication Order Number: NTNS3C94NZ/D NTNS3C94NZ ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Symbol Test Condition Min Drain-to-Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 mA 12 Drain-to-Source Breakdown Voltage Temperature Coefficient V(BR)DSS/TJ ID = 250 mA, ref to 25°C Parameter Typ Max Units OFF CHARACTERISTICS Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = 9.6 V Gate-to-Source Leakage Current IGSS VDS = 0 V, VGS = ±10 V VGS(TH) VGS = VDS, ID = 250 mA V 3.7 TJ = 25°C mV/°C 1.0 mA ±10 mA ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Negative Gate Threshold Temperature Coefficient Drain-to-Source On Resistance VGS(TH)/TJ 0.4 1.0 0.8 RDS(on) VGS = 4.5 V, ID = 100 mA 0.32 0.48 VGS = 3.7 V, ID = 75 mA 0.36 0.53 VGS = 3.3 V, ID = 75 mA 0.40 0.60 VGS = 2.5 V, ID = 50 mA 0.54 0.80 VGS = 1.8 V, ID = 20 mA 1.0 1.9 VGS = 1.5 V, ID = 10 mA 1.8 Forward Transconductance gFS VDS = 5 V, ID = 100 mA TBD Source−Drain Diode Voltage VSD VGS = 0 V, IS = 100 mA 0.75 VGS = 0 V, f = 1 MHz, VDS =9. 6 V 6.3 V mV/°C W S 1.0 V CHARGES & CAPACITANCES Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS 4.7 Total Gate Charge QG(TOT) 0.9 Threshold Gate Charge QG(TH) Gate−to−Source Charge QGS Gate−to−Drain Charge QGD 32 VGS = 4.5 V, VDS = 9.6 V, ID = 100 mA pF nC 0.1 0.2 0.2 SWITCHING CHARACTERISTICS, VGS = 4.5 V (Note 3) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time td(ON) 8.0 tr 7.5 td(OFF) VGS = 4.5 V, VDD = 9.6 V, ID = 100 mA, RG = 2 W tf ns 147 78 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2 NTNS3C94NZ PACKAGE DIMENSIONS XLLGA3, 0.62x0.62, 0.35P CASE 713AB ISSUE O A B D ÉÉ ÉÉ PIN ONE REFERENCE E 0.10 C 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. DIM A A1 b D D2 D3 E E2 e K L L2 TOP VIEW 0.10 C A 0.10 C 3X A1 C SIDE VIEW SEATING PLANE RECOMMENDED SOLDER FOOTPRINT* D3 e/2 e MILLIMETERS MIN MAX 0.340 0.440 0.000 0.030 0.100 0.200 0.620 BSC 0.175 BSC 0.205 BSC 0.620 BSC 0.400 0.600 0.350 BSC 0.200 REF 0.090 0.210 0.110 0.310 D2 2 E2 2X PACKAGE OUTLINE 0.280 3 0.600 1 3 1 0.10 M b C A B 0.05 M C L2 2X K 2X 0.10 M C A B 0.05 M C 2X 0.200 2 0.350 PITCH L BOTTOM VIEW 0.350 0.760 DIMENSIONS: MILLIMETERS *Additional information concerning board mounting for this package may be found in Document AND9099/D, “Board Level Application Note for XLLGA 3-Lead 0.62x0.62 Package”. For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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