Thinki GBU608 6.0 ampere glass passivated flat bridge rectifier Datasheet

®
GBU6005 thru GBU610
Pb Free Plating Product
Pb
GBU6005 thru GBU610
6.0 AMPERE GLASS PASSIVATED FLAT BRIDGE RECTIFIERS
GBU
Features
• Plastic material has Underwriters Laboratory
Flammability Classification 94V-0
• Ideal for printed circuit boards
• Glass passivated chip junction
• Reliable low cost construction utilizing molded
plastic technique
Unit: inch (mm)
.310(7.90)
.290(7.40)
.880(22.3)
.860(21.8)
Mechanical Data
.740(18.8)
.720(18.3)
.140(3.56)
.130(3.30)
.710(18.0)
.690(17.5)
.075(1.90)R
.085(2.16)
.065(1.65)
.080(2.03)
.060(1.52)
.160(4.1)
.140(3.5)
.040(1.02)
.030(0.76)
.030(0.75)
.017(0.45)
.100(2.54)
.085(2.16)
• Case: Molded plastic GBU
• Terminals: leads solderable per MIL-STD-202
Method 208 guaranteed
• Mounting Position: Any
.080(2.03)
.065(1.65)
.190(4.83)
.210(5.33)
.050(1.27)
.040(1.02)
Absolute Maximum Ratings and Characteristics
Rating at 25℃ ambient temperature unless otherwise specified. Single-phase, half wave, 60Hz, resistive or inductive
load. For capacitive load, derate current by 20%.
Symbols
GBU
6005
GBU
601
GBU
602
GBU
604
GBU
606
GBU
608
GBU
610
Units
Maximum recurrent peak reverse voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
V
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
V
Maximum average forward rectified current
at TC = 100℃ (Note 1), (Note 2)
IF(AV)
6
A
Peak forward surge current,8.3ms single half-sine-wave
superimposed on rated load (JEDEC Method)
IFSM
175
A
VF
1
V
Maximum reverse current at TA = 25℃
at rated DC blocking voltage TA = 125℃
IR
5
500
µA
Typical junction capacitance (Note 3)
CJ
Maximum forward voltage
at 3.0A DC and 25℃
211
94
pF
Typical thermal resistance (Note 1),(Note 2)
RθJA
7.4
℃/W
Typical thermal resistance (Note 1),(Note 2)
RθJC
2.2
℃/W
TJ ,TS
-55 to +150
℃
Operating and storage temperature range
Notes: (1). Units case mounted on 2.6x1.4x0.06” thick (6.5x3.5x0.15 cm) AI. plate heatsink..
(2). Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum
heat transfer with #6 screws.
(3). Measured at 1MHz and applied reverse voltage of 4.0 VDC.
Rev.05
© 2006 Thinki Semiconductor Co., Ltd.
Page 1/2
http://www.thinkisemi.com/
®
GBU6005 thru GBU610
Heatsink Mounting.
2.6*1.4*0.06" Thk
(6.5*3.5*0.15cm) AL. Plate
4.0
2.0
0
60Hz Resistive or Inductive Load
50
0
100
150
Fig.2 Maximum Non-Repetitive Peak
Forward Surge Current Per Leg
175
Single Sine-Wave
(JEDEC Method)
TJ=150°C
150
125
100
75
50
1.0 Cycle
25
1
10
10
TJ=25°C
Pulse Width = 300 s
1% Duty Cycle
1
0.1
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1000
Fig.5 Typical Junction Capacitance
Per Leg
TJ=25°C
f=1.0MHz
Vsig=50mVp-p
100
10
50 - 400V
600 - 1000V
0.1
1
10
Reverse Voltage (A)
Rev.05
© 2006 Thinki Semiconductor Co., Ltd.
100
Instantaneous Reverse Current ( A)
Fig.3 Typical Forward Characteristics
Per Leg
100
100
Number of Cycles at 60Hz
Case Temperature (°C)
Instantaneous Forward Voltage (V)
Junction Capacitance, pF
Peak Forward Surge Current (A)
6.0
Fig.1 Derating Curve Output
Rectified Current
Transient Thermal Impedance (°C/W)
Instantaneous Forward Current (A)
Average Forward Output Current (A)
RATINGS AND CHARACTERISTIC CURVES
Fig.4 Typical Reverse Leakage
Characteristics Per Leg
500
50 - 400V
600 - 1000V
100
TJ=125°C
10
1
0.1
0.01
TJ=25°C
0
40
20
60
80
100
Percent of Rated Peak Reverse Voltage (%)
100
Fig.6 Typical Transient
Thermal Impedance
10
1
0.1
0.01
0.1
1
10
100
t,Heating Time (sec.)
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