ON MC10H106P Triple 4-3-3-onput nor gate Datasheet

MC10H106
Triple 4-3-3-Input NOR
Gate
The MC10H106 is a triple 4–3–3 input NOR gate. This 10H part is a
functional/pinout duplication of the standard MECL 10K family part,
with 100% improvement in propagation delay and no increase in
power– supply current.
• Propagation Delay, 1.0 ns Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
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MARKING
DIAGRAMS
16
CDIP–16
L SUFFIX
CASE 620A
LOGIC DIAGRAM
4
5
MC10H106L
AWLYYWW
1
16
PDIP–16
P SUFFIX
CASE 648
3
6
7
MC10H106P
AWLYYWW
1
9
10
11
1
2
12
13
14
PLCC–20
FN SUFFIX
CASE 775
15
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
A
WL
YY
WW
DIP
PIN ASSIGNMENT
10H106
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Package
Shipping
MC10H106L
CDIP–16
25 Units/Rail
CIN
MC10H106P
PDIP–16
25 Units/Rail
13
CIN
MC10H106FN
PLCC–20
46 Units/Rail
5
12
CIN
AIN
6
11
BIN
AIN
7
10
BIN
VEE
8
9
BIN
VCC1
1
16
VCC2
BOUT
2
15
COUT
AOUT
3
14
AIN
4
AIN
Device
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
 Semiconductor Components Industries, LLC, 2000
May, 2000 – Rev. 8
1
Publication Order Number:
MC10H106/D
MC10H106
MAXIMUM RATINGS
Symbol
Rating
Unit
VEE
VI
Power Supply (VCC = 0)
Characteristic
–8.0 to 0
Vdc
Input Voltage (VCC = 0)
0 to VEE
Vdc
Iout
Output Current – Continuous
– Surge
50
100
mA
TA
Tstg
Operating Temperature Range
0 to +75
°C
–55 to +150
–55 to +165
°C
°C
Storage Temperature Range – Plastic
– Ceramic
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note 1.)
0°
Symbol
IE
Characteristic
Power Supply Current
25°
75°
Min
Max
Min
Max
Min
Max
Unit
–
23
–
21
–
23
mA
µA
IinH
IinL
Input Current High
–
500
–
310
–
310
Input Current Low
0.5
–
0.5
–
0.3
–
µA
VOH
VOL
High Output Voltage
–1.02
–0.84
–0.98
–0.81
–0.92
–0.735
Vdc
Low Output Voltage
–1.95
–1.63
–1.95
–1.63
–1.95
–1.60
Vdc
VIH
VIL
High Input Voltage
–1.17
–0.84
–1.13
–0.81
–1.07
–0.735
Vdc
Low Input Voltage
–1.95
–1.48
–1.95
–1.48
–1.95
–1.45
Vdc
Propagation Delay
0.5
1.3
0.5
1.5
0.55
1.55
ns
Rise Time
0.5
1.7
0.5
1.8
0.55
1.9
ns
AC PARAMETERS
tpd
tr
tf
Fall Time
0.5
1.7
0.5
1.8
0.55
1.9
ns
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts.
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2
MC10H106
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
G1
X
V
0.010 (0.250)
S
T L–M
S
N
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
0.007 (0.180) M T L–M
H
S
N
S
Z
K1
K
C
E
F
0.007 (0.180) M T L–M
S
0.004 (0.100)
G
J
–T–
VIEW S
G1
0.010 (0.250) S T L–M
S
N
S
VIEW S
SEATING
PLANE
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
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3
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
N
S
MC10H106
B
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A–01
ISSUE O
A
A
16
9
1
8
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620–10.
E
F
M
C
L
K
T
N
16X
0.25 (0.010)
G
J
16X
T B
M
0.25 (0.010)
–A–
16
9
1
8
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
M
D
SEATING
PLANE
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
T A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
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MC10H106/D
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