Lineage Power EVW020A0A41Z 36-75vdc input; 5.0vdc output; 20a output current Datasheet

Data Sheet
June 29, 2009
EVW020A0A Series (Eighth-Brick) DC-DC Converter Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Features
RoHS Compliant
Applications
ƒ
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
ƒ
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
ƒ
Compliant to IPC-9592, Category 2, Class 2
ƒ
High efficiency 92% at 5.0V full load (Vin=48Vdc)
ƒ
ƒ
Industry standard, DOSA compliant footprint
58.4 mm x 22.8 mm x 8.1 mm
(2.30 in x 0.9 in x 0.32 in)
Wide input voltage range: 36-75 Vdc
ƒ
Tightly regulated output
ƒ
Constant switching frequency
ƒ
Distributed Power Architectures
ƒ
Positive remote On/Off logic
ƒ
Wireless Networks
ƒ
Input under/over voltage protection
ƒ
Output overcurrent and overvoltage protection
ƒ
Over-temperature protection
ƒ
Remote sense
ƒ
No reverse current during output shutdown
ƒ
Output Voltage adjust: 90% to 110% of Vo,nom
ƒ
Wide operating temperature range (-40°C to 85°C)
ƒ
UL*Recognized to UL60950-1, CAN/CSA C22.2
No.60950-1, and EN60950-1(VDE ‡ 0805-1)
Licensed
ƒ
CE mark meets 2006/95/EC directive
ƒ
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed for
Basic insulation rating per EN60950-1
ƒ
2250 Vdc Isolation tested in compliance with IEEE
802.3¤ PoE standards
ƒ
ISO 9001 and ISO 14001 certified manufacturing
facilities
ƒ
Access and Optical Network Equipment
ƒ
Enterprise Networks including Power over Ethernet
(PoE)
Options
ƒ
Negative Remote On/Off logic
ƒ
Over current/Over temperature/Over voltage
protections (Auto-restart)
ƒ
Heat plate version (-H)
ƒ
Surface Mount version (-S)
†
§
**
Description
The EVW020A0A, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 20A of
output current and provide a precisely regulated output voltage of 5.0V over a wide range of input voltages (VIN = 36 75Vdc). The modules achieve typical full load efficiency of 92%. The open frame modules construction, available in
both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions.
Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and
overtemperature protection.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
‡
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§
This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
Document No: DS08-001 ver. 1.01
PDF name: evw020_ds.pdf
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter
Device
Symbol
Min
Max
Unit
Continuous
All
VIN
-0.3
80
Vdc
Transient, operational (≤100 ms)
All
VIN,trans
-0.3
100
Vdc
All
TA
-40
85
°C
Storage Temperature
All
Tstg
-55
125
°C
I/O Isolation voltage (100% factory Hi-Pot tested)
All
⎯
⎯
2250
Vdc
Input Voltage
Operating Ambient Temperature
(see Thermal Considerations section)
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter
Operating Input Voltage
Maximum Input Current
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current
(VIN = VIN, nom, IO = 0, module enabled)
Input Stand-by Current
Device
Symbol
Min
Typ
Max
Unit
All
VIN
36
48
75
Vdc
All
IIN,max
3.0
3.5
Adc
All
IIN,No load
70
IIN,stand-by
2.5
All
(VIN = VIN, nom, module disabled)
2
It
mA
5.0
mA
0.5
As
2
Inrush Transient
All
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,
IO= IOmax ; See Test configuration section)
All
20
mAp-p
Input Ripple Rejection (120Hz)
All
65
dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.
LINEAGE POWER
2
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Electrical Specifications (continued)
Parameter
Device
Symbol
Min
Typ
Max
Unit
All
VO, set
4.90
5.0
5.10
Vdc
All
VO
4.85
⎯
5.15
% VO, set
All
All
All
⎯
⎯
⎯
⎯
⎯
⎯
±0.2
±0.2
±0.2
% VO, set
% VO, set
% VO, set
All
⎯
15
25
mVrms
All
⎯
40
75
mVpk-pk
Nominal Output Voltage Set-point
VIN=VIN, min, IO=IO, max, TA=25°C)
Output Voltage
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max)
Load (IO=IO, min to IO, max)
Temperature (Tref=TA, min to TA, max)
Output Ripple and Noise on nominal output
(VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth)
Peak-to-Peak (5Hz to 20MHz bandwidth)
External Capacitance
All
CO, max
0
⎯
10,000
μF
Output Current
Output Current Limit Inception (Hiccup Mode )
(VO= 90% of VO, set)
Output Short-Circuit Current
(VO≤250mV) ( Hiccup Mode )
Efficiency
All
Io
0
⎯
20
Adc
All
IO, lim
105
120
130
% Io
All
IO, s/c
5
Arms
VIN= VIN, nom, TA=25°C, IO=IO, max , VO= VO,set
All
η
92.0
%
VIN= VIN, nom, TA=25°C, IO=0.5xIO, max , VO= VO,set
All
η
91.0
%
All
fsw
400
kHz
All
Vpk
⎯
3
⎯
% VO, set
All
ts
⎯
200
⎯
μs
All
Vpk
⎯
5
⎯
% VO, set
All
ts
⎯
200
⎯
μs
Unit
Switching Frequency
Dynamic Load Response
(dIo/dt=0.1A/μs; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation
Settling Time (Vo<10% peak deviation)
(dIo/dt=1.0A/μs; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation
Settling Time (Vo<10% peak deviation)
Isolation Specifications
Parameter
Device
Symbol
Min
Typ
Max
Isolation Capacitance
All
Ciso
⎯
2000
⎯
pF
Isolation Resistance
All
Riso
100
⎯
⎯
MΩ
I/O Isolation Voltage (100% factory Hi-pot tested)
All
All
⎯
⎯
2250
Vdc
Device
Symbol
Min
Typ
Max
General Specifications
Parameter
Calculated Reliability based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,
airflow = 200 lfm, 90% confidence)
All
FIT
272.1
10 /Hours
All
MTBF
3,675,359
Hours
Weight (Open Frame)
All
Weight (with Heatplate)
All
LINEAGE POWER
Unit
9
21
(0.77)
33
(1.16)
g
(oz.)
g
(oz.)
3
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current
All
Ion/off
⎯
0.3
1.0
mA
Logic Low - On/Off Voltage
All
Von/off
-0.7
⎯
1.2
Vdc
Logic High Voltage – (Typ = Open Collector)
All
Von/off
⎯
5
Logic High maximum allowable leakage current
All
Ion/off
⎯
⎯
10
μA
All
Tdelay
―
―
50
msec
All
Tdelay
―
―
50
msec
All
Trise
―
5
12
msec
―
3
% VO, set
Vdc
Turn-On Delay and Rise Times
o
(IO=IO, max , VIN=VIN, nom, TA = 25 C)
Case 1: Input power is applied for at least 1 second
and then the On/Off input is set from OFF to ON (Tdelay
= from instant at which VIN=VIN, min until VO = 10% of VO,
)
Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (Tdelay from
instant at which VIN = VIN, min until Vo=10% of VO,set)
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set)
Output voltage overshoot – Startup
o
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C
All
Remote Sense Range
All
Output Voltage Adjustment Range
All
VSENSE
90
10
% VO, set
110
% VO, set
Vdc
Output Overvoltage Protection
All
VO, limit
5.75
⎯
7.0
Overtemperature Protection – Hiccup Auto Restart
All
Tref
⎯
130
⎯
O
Input Undervoltage Lockout
All
VUVLO
Vdc
C
Turn-on Threshold
⎯
33
36
Turn-off Threshold
27
28
⎯
Vdc
Hysterisis
3
5.5
⎯
Vdc
LINEAGE POWER
4
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Characteristic Curves
o
88
85
Vin=75V
82
Vin=48V
79
Vin=36V
76
73
70
0
5
10
15
20
VO (V) (200mV/div)
91
Io(A) (5A/div)
EFFICIENCY, η (%)
94
OUTPUT CURRENT OUTPUT VOLTAGE
The following figures provide typical characteristics for the EVW020A0A (5.0V, 20A) at 25 C. The figures are
identical for either positive or negative remote On/Off logic.
OUTPUT CURRENT, IO (A)
TIME, t (200µs/div)
OUTPUT VOLTAGE
VOn/Off (V) (5V/div)
VO (V) (2V/div)
Figure 4. Transient Response to 1.0A/µS Dynamic
Load Change from 50% to 75% to 50% of full load.
On/Off VOLTAGE
VO (V) (10mV/div)
OUTPUT VOLTAGE
Figure 1. Converter Efficiency versus Output Current.
TIME, t (20ms/div)
INPUT VOLTAGE
VIN (V) (20V/div)
OUTPUT VOLTAGE
VO (V) (2V/div)
Io(A) (5A/div)
VO (V) (100mV/div)
Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io = Io,max).
OUTPUT CURRENT OUTPUT VOLTAGE
TIME, t (1μs/div)
Figure 2. Typical output ripple and noise (VIN = VIN,NOM,
Io = Io,max).
TIME, t (100µs/div)
Figure 3. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load.
LINEAGE POWER
TIME, t (20ms/div)
Figure 6. Typical Start-up Using Input Voltage (VIN =
VIN,NOM, Io = Io,max).
5
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Test Configurations
Design Considerations
Input Filtering
CURRENT PROBE
TO OSCILLOSCOPE
LTEST
Vin+
12μH
BATTERY
33-100μF
CS
220μF
E.S.R.<0.1Ω
@ 20°C 100kHz
Safety Considerations
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST ) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test
Setup.
COPPER STRIP
V O (+)
RESISTIVE
LOAD
1uF
10uF
SCOPE
V O (– )
GROUND PLANE
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 8. Output Ripple and Noise Test Setup.
Rdistribution
Rcontact
Rcontact
Vin+
Rdistribution
RLOAD
VO
Rcontact
Rcontact
Vin-
Rdistribution
Vout+
VIN
Rdistribution
Vout-
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test
Setup.
VO. IO
Efficiency
η =
LINEAGE POWER
VIN. IIN
x
100 %
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7 a 33100μF electrolytic capacitor (ESR<0.7Ω at 100kHz),
mounted close to the power module helps ensure the
stability of the unit. Consult the factory for further
application guidelines.
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e. UL60950-1, CSA C22.2 No.60950-1,
and VDE0805-1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
ƒ
The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.
ƒ
One VIN pin and one VOUT pin are to be
grounded, or both the input and output pins are
to be kept floating.
ƒ
The input pins of the module are not operator
accessible.
ƒ
Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety
agencies, to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the
UL60950 A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been
evaluated to the applicable requirements of BASIC
INSULATION between secondary DC MAINS
DISTRIBUTION input (classified as TNV-2 in Europe)
and unearthed SELV outputs.
The input to these units is to be provided with a
maximum 6 A fast-acting fuse in the ungrounded lead.
6
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).
SENSE(+)
SENSE(–)
SUPPLY
Vin+
Vout+
II
VI(+)
VO(+)
VI(-)
VO(–)
CONTACT
RESISTANCE
IO
LOAD
CONTACT AND
DISTRIBUTION LOSSE
Figure 11. Circuit Configuration for remote
sense .
Ion/off
ON/OFF
TRIM
Von/off
Vin-
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (Von/off) between the ON/OFF
terminal and the VIN(-) terminal (see Figure 10). Logic
low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a
logic low is 1mA, the switch should be maintain a
logic low level whilst sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 15V, and the maximum
allowable leakage current at Von/off = 5V is 1μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between
the remote-sense pins and the output terminals must
not exceed the output voltage sense range given in
the Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
be increased, which at the same output current would
LINEAGE POWER
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, VUV/ON.
Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under certain fault conditions,
the unit is equipped with a thermal shutdown circuit.
The unit will shutdown if the thermal reference point
o
Tref (Figure 13), exceeds 130 C (typical), but the
thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating.
The module can be restarted by cycling the dc input
power for at least one second or by toggling the
remote on/off signal for at least one second. If the
auto-restart option (4) is ordered, the module will
automatically restart upon cool-down to a safe
temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the
latching protection feature. If the auto-restart option
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can
be restarted by cycling the dc input power for at least
7
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Feature Descriptions (continued)
one second or by toggling the remote on/off signal for
at least one second. If the unit is configured with the
auto-restart option (4), it will remain in the hiccup
mode as long as the overcurrent condition exists; it
operates normally, once the output current is brought
back into its specified range. The average output
current during hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin.
VIN(+)
⎤
⎡ 5.11 × Vo , set × (100 + Δ %) 511
Rtrim − up = ⎢
−
− 10 .22 ⎥ ΚΩ
1
.
225
%
%
×
Δ
Δ
⎦
⎣
Where
⎛V
− V o , set
Δ % = ⎜⎜ desired
V
o , set
⎝
⎞
⎟ × 100
⎟
⎠
For example, to trim-up the output voltage of the
module by 5% to 5.25V, Rtrim-up is calculated is as
follows:
Δ% = 5
R trim − up
⎡ 5 . 11 × 5 . 0 × (100 + 5 ) 511
⎤
=⎢
−
− 10 . 22 ⎥ ΚΩ
1 . 225 × 5
5
⎣
⎦
Rtrim −up = 325 .6 ΚΩ
VO(+)
Rtrim-up
ON/OFF
LOAD
VOTRIM
Rtrim-down
VIN(-)
determines the required external resistor value to
obtain a percentage output voltage change of Δ%:
VO(-)
Figure 12. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between
the TRIM pin and the VO(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output
voltage of the module can be increased, which at the
same output current would increase the power output
of the module. Care should be taken to ensure that
the maximum output power of the module remains at
or below the maximum rated power (Maximum rated
power = VO,set x IO,max).
⎡ 511
⎤
− 10 . 22 ⎥ ΚΩ
R trim − down = ⎢
⎣ Δ%
⎦
Where Δ % = ⎛⎜ V o , set − V desired
⎜
V o , set
⎝
⎞
⎟ × 100
⎟
⎠
For example, to trim-down the output voltage of the
module by 8% to 4.6V, Rtrim-down is calculated as
follows:
Δ% = 8
⎡ 511
⎤
Rtrim − down = ⎢
− 10 .22 ⎥ ΚΩ
⎣ 8
⎦
R trim − down = 53 . 6 ΚΩ
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases
the output voltage set point. The following equation
LINEAGE POWER
8
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
OUTPUT CURRENT, IO (A)
20
16
3.0 m/s
(600 LM)
12
2.0 m/s
(400 LM)
1.0 m/s
(200 LM)
8
0.5 m/s
(100 LM)
4
NC
0
The thermal reference point, Tref used in the
specifications for modules with heatplate is shown in
Figure 14. For reliable operation this temperature
o
should not exceed 105 C.
AIRFLOW
20
30
40
50
60
70
80
90
o
AMBIENT TEMEPERATURE, TA ( C)
Figure 15. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
20
OUTPUT CURRENT, IO (A)
The thermal reference point, Tref used in the
specifications for open frame modules is shown in
Figure 13. For reliable operation this temperature
o
should not exceed 114 C.
16
3.0 m/s
(600 LFM)
12
2.0 m/s
(400 LFM)
8
1.0 m/s
(200 LFM)
0.5 m/s
(100 LFM)
4
NC
0
20
Figure 13. Tref Temperature Measurement
Location for Open Frame Module.
30
40
50
60
70
80
90
o
AMBIENT TEMEPERATURE, TA ( C)
Figure 16. Output Current Derating for the Module
with Heatplate; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
AIRFLOW
Figure 14. Tref Temperature Measurement
Location for Module with Heatplate.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (TA)
for natural convection and up to 3m/s (600 ft./min)
forced airflow are shown in Figure 14.
LINEAGE POWER
OUTPUT CURRENT, IO (A)
20
16
3.0 m/s
(600 LFM)
12
2.0 m/s
(400 LFM)
1.0 m/s
(200 LFM)
0.5 m/s
(100 LFM)
8
4
NC
0
20
30
40
50
60
70
80
90
o
AMBIENT TEMEPERATURE, TA ( C)
Figure 17. Output Current Derating for the Module
with Heatplate and 0.25 in. heatsink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
9
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
product information such as product code, serial
number and the location of manufacture.
Thermal Considerations (continued)
OUTPUT CURRENT, IO (A)
20
16
12
2.0 m/s
(400 LFM)
1.0 m/s
(200 LFM)
0.5 m/s
(100 LFM)
8
4
NC
Figure 20. Pick and Place Location.
0
20
30
40
50
60
70
80
90
o
AMBIENT TEMEPERATURE, TA ( C)
Nozzle Recommendations
Figure 18. Output Current Derating for the Module
with Heatplate and 0.5 in. heatsink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
OUTPUT CURRENT, IO (A)
20
16
2.0 m/s
(400 LFM)
1.0 m/s
(200 LFM)
0.5 m/s
(100 LFM)
12
8
NC
4
0
20
30
40
50
60
70
80
90
o
AMBIENT TEMEPERATURE, TA ( C)
Figure 19. Output Current Derating for the Module
with Heatplate and 1.0 in. heatsink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame BoardMounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Surface Mount Information
Pick and Place
The EVW020A0A modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
LINEAGE POWER
The surface mountable modules in the EHW family
use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 48 shows the new CP
connector before and after reflow soldering onto the
end-board assembly.
EV W Bo ard
In su lato r
So lde r Ba ll
End assem bly P CB
Figure 21. Column Pin Connector Before and After
Reflow Soldering .
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag3/Cu
(SAC) solder for –Z codes. The CP connector design
is able to compensate for large amounts of coplanarity and still ensure a reliable SMT solder joint.
o
Typically, the eutectic solder melts at 183 C (Sn/Pb
solder) or 217-218 oC (SAC solder), wets the land,
and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable
10
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Surface Mount Information (continued)
Tin Lead Soldering
The EVW020A0A power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
o
o
235 C. Typically, the eutectic solder melts at 183 C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
300
235
MAX TEMP SOLDER (°C)
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
240
230
225
220
215
210
205
200
0
10
20
30
40
50
60
o
Figure 23. Time Limit Curve Above 205 C for
Tin/Lead (Sn/Pb) process
Lead Free Soldering
The –Z version of the EVW020A0A modules are leadfree (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 23.
P eak Temp 235oC
REFLOW TEMP (°C)
250
200
Co o ling
zo ne
1-4oCs -1
Heat zo ne
max 4oCs -1
MSL Rating
The EVW020A0A modules have a MSL rating of 2.
150
100
50
So ak zo ne
30-240s
Storage and Handling
Tlim above
205oC
P reheat zo ne
max 4oCs -1
0
REFLOW TIME (S)
Figure 22. Reflow Profile for Tin/Lead (Sn/Pb)
process
LINEAGE POWER
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
11
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Surface Mount Information (continued)
300
Per J-STD-020 Rev. C
Peak Temp 260°C
Reflow Temp (°C)
250
200
* Min. Time Above 235°C
15 Seconds
150
Heating Zone
1°C/Second
Cooling
Zone
*Time Above 217°C
60 Seconds
100
50
0
Reflow Time (Seconds)
Figure 24. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
LINEAGE POWER
12
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
EMC Considerations
The circuit and plots in Figure 25 shows a suggested configuration to meet the conducted emission limits of EN55022
Class B.
Level
[dBµV]
80
70
60
50
+
40
30
20
10
0
150k
+
+ MES
MES
Level
300k
500k
1M
2M
3M 4M 5M
Frequency [Hz]
CE1204081008_fin
CE1204081008_pre
7M
10M
30M
AV
AV
[dBµV]
80
70
60
50
40
30
x
20
10
0
150k
x
x MES
MES
300k
500k
1M
2M
3M 4M 5M
Frequency [Hz]
CE1204081008_fin
CE1204081008_pre
7M
10M
30M
QP
PK
Figure 25. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
LINEAGE POWER
13
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top side label includes Lineage Power name, product designation and date code.
Top
View*
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom
View
Pin
1
2
3
4
5
6
7
8
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
LINEAGE POWER
14
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Mechanical Outline for Surface Mount Module (-S Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
* Top side label includes Lineage Power name, product designation and date code.
Top
View*
Side
View
Bottom
View
Pin
1
2
3
4
5
6
7
8
LINEAGE POWER
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
15
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top
View
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
* Bottom side label includes Lineage Power name, product designation and date code.
Bottom
View*
Pin
1
2
3
4
5
6
7
8
LINEAGE POWER
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
16
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Pin
1
2
3
4
5
6
7
8
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
SMT Recommended Pad Layout (Component Side View)
Pin
Function
1
Vi(+)
2
ON/OFF
3
Vi(-)
4
Vo(-)
5
SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER
FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER
TH Recommended Pad Layout (Component Side View)
LINEAGE POWER
17
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Packaging Details
The surface mount versions of the EHW020A0A (suffix
–S) are supplied as standard in the plastic trays shown
in Figure 26.
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box for the
EHW020A0A (suffix –S) surface mount module will
contain 4 full trays plus one empty hold down tray
giving a total number of 48 power modules.
Tray Specification
Material
Max surface resistivity
Color
Capacity
Antistatic coated PVC
1012Ω/sq
Clear
12 power modules
Figure 26. Surface Mount Packaging Tray
LINEAGE POWER
18
Data Sheet
June 29, 2009
EVW020A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 20A Output Current
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes
Input Voltage
Output
Voltage
Output
Current
On/Off Logic
Connector
Type
EVW020A0A41Z
48V (36-75Vdc)
5.0V
20A
Negative
Through hole
CC109141826
EVW020A0A41-HZ
48V (36-75Vdc)
5.0V
20A
Negative
Through hole
CC109147427
EVW020A0A41-SZ
48V (36-75Vdc)
5.0V
20A
Negative
Surface mount
CC109147435
Comcodes
Ratings
Table 2. Device Coding Scheme and Options
Characteristic
Form Factor
Family Designator
Input Voltage
Output Current
Output Voltage
Pin Length
Options
Action following
Protective Shutdown
Character and Position
E
Definition
E = Eighth Brick
V
W
W = Wide Input Voltage Range, 36V -75V
020A0 = 020.0 Amps Rated Output Current
A = 5.0 Vout Nominal
Omit = No Pin Trim
6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)
8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)
Omit = Latching Mode
4 = Auto-restart following shutdown (Overcurrent/Overvoltage)
Omit = Positive Logic
1 = Negative Logic
020A0
A
6
8
4
On/Off logic
Customer Specific
Mechanical Features
RoHS
1
XY
XY = Customer Specific Modified Code, Omit for Standard Code
Omit = Standard open Frame Module
H H = Heat plate (not available with –S option)
S S = Surface mount connections
Omit = RoHS 5/6, Lead Based Solder Used
Z Z = RoHS 6/6 Compliant, Lead free
Asia-Pacific Headquarters
Tel: +65 6416 4283
World Wide Headquarters
Lineage Power Corporation
3000 Skyline Drive, Mesquite, TX 75149, USA
+1-800-526-7819
(Outside U.S.A.: +1-972-284-2626)
www.lineagepower.com
e-mail: [email protected]
Europe, Middle-East and Africa Headquarters
Tel: +49 898 780 672 80
India Headquarters
Tel: +91 80 28411633
Lineage Power reserves the right to m ake changes to the product (s) or information contained herein without notice. No liability is assumed as a result of their use or
application. No rights under any patent accompany the sale of any such product (s) or information.
© 2008 Lineage Pow er C orporation, (Mesquite, Texas) All International Rights Res erved.
Document No: DS08-001 ver. 1.01
PDF name: evw020_ds.pdf
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