TI1 OPA2677 175ma,12v adsl cpe line driver Datasheet

± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
D Remote Terminal ADSL Line Driver
D
D
D
D
D High Speed
− Ideal for Both Full Rate ADSL and G.Lite
− Compatible With 1:1 Transformer Ratio
Low 2.7 pA/√Hz Noninverting Current Noise
− Reduces Noise Feedback Through
Hybrid Into Downstream Channel
Wide Supply Voltage Range ± 5 V to ± 15 V
− Ideal for ± 12-V Operation
Wide Output Swing
− 42 Vpp Differential Output Voltage,
RL = 200 Ω, ± 12-V Supply
High Output Current
− 175 mA (typ)
D
D
D
D
D
THS6052
SOIC (D) AND
SOIC PowerPAD (DDA) PACKAGE
(TOP VIEW)
D1 OUT
D1 IN−
D1 IN+
VCC−
1
8
2
7
3
6
4
5
− 110 MHz (−3 dB, G=8, ± 12 V)
− 1500 V/µs Slew Rate (G = 8, ± 12 V)
Low Distortion, Single-Ended, G = 8
− −83 dBc (250 kHz, 2 Vpp, 100-Ω load)
Low Power Shutdown (THS6053)
− 300-µA Total Standby Current
Thermal Shutdown and Short Circuit
Protection
Standard SOIC, SOIC PowerPAD, and
TSSOP PowerPAD Package
Evaluation Module Available
THS6053
SOIC (D) AND
TSSOP PowerPAD (PWP) PACKAGE
(TOP VIEW)
D1 OUT
D1 IN−
D1 IN+
VCC−
N/C
GND
N/C
VCC+
D2 OUT
D2 IN−
D2 IN+
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC+
D2 OUT
D2 IN−
D2 IN+
N/C
SHUTDOWN
N/C
description
The THS6052/3 is a high-speed line driver ideal for driving signals from the remote terminal to the central office
in asymmetrical digital subscriber line (ADSL) applications. It can operate from ±12-V supply voltages while
drawing only 5.2 mA of supply current per channel. It offers low –83 dBc total harmonic distortion driving a 100-Ω
load (2 Vpp). The THS6052/3 offers a high 42-Vpp differential output swing across a 200-Ω load from a ±12-V
supply. The THS6053 features a low-power shutdown mode, consuming only 300 µA quiescent current per
channel. The THS6052/3 is packaged in a standard SOIC, SOIC PowerPAD, and TSSOP PowerPAD
packages.
+12 V
THS6052
Driver 1
+
_
VI+
1:1
750 Ω
210 Ω
VI−
+
_
RELATED PRODUCTS
50 Ω
THS6052
Driver 2
50 Ω
DEVICE
15.4 dBm
Delivered
to Telephone
Line
DESCRIPTION
THS6042/3 350-mA, ±12 ADSL CPE line driver
100 Ω
THS6092/3 275-mA, +12 V ADSL CPE line driver
OPA2677
380-mA, +12 V ADSL CPE line driver
THS6062
Low noise ADSL receiver
0.68 µF
−12 V
750 Ω
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
Copyright  2001, Texas Instruments Incorporated
! "#$ ! %#&'" ($)
(#"! " !%$""! %$ *$ $ ! $+! !# $!
!(( ,-) (#" %"$!!. ($! $"$!!'- "'#($
$!. '' % $$!)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
AVAILABLE OPTION
PACKAGED DEVICE
EVALUATION
MODULES
TA
SOIC-8
(D)
SOIC-8 PowerPAD
(DDA)
SOIC-14
(D)
TSSOP-14
(PWP)
0°C to 70°C
THS6052CD
THS6052CDDA
THS6053CD
THS6053CPWP
THS6052EVM
THS6053EVM
−40°C to 85°C
THS6052ID
THS6052IDDA
THS6053ID
THS6053IPWP
—
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VCC+ to VCC− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± VCC
Output current (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 mA
Differential input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 4 V
Maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Total power dissipation at (or below) 25°C free-air temperature . . . . . . . . . . . See Dissipation Ratings Table
Operating free-air temperature, TA: Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature, Tstg : Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6052 and THS6053 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI technical brief SLMA002 for more information about utilizing the
PowerPAD thermally enhanced package.
DISSIPATION RATING TABLE
TA = 25°C
TJ = 150°C
POWER RATING
PACKAGE
θJA
θJC
D-8
38.3°C/W‡
9.2°C/W‡
1.32 W
D-14
95°C/W‡
45.8°C/W‡
66.6°C/W‡
26.9°C/W‡
1.88 W
PWP
37.5°C/W
1.4°C/W
DDA
2.73 W
3.3 W
‡ This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test
PCB, the ΘJA is168°C/W for the D−8 package and 122.3°C/W for the D−14 package.
recommended operating conditions
MIN
Supply voltage, VCC+ to VCC−
2
MAX
±5
±15
Single supply
10
30
0
70
−40
85
C-suffix
Operating free-air temperature, TA
NOM
Dual supply
I-suffix
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
V
°C
± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
electrical characteristics over recommended operating free-air temperature range, TA = 25°C,
VCC = ±12 V, RFEEDBACK = 750 Ω, RL = 100 Ω (unless otherwise noted)
dynamic performance
PARAMETER
TEST CONDITIONS
G= 1, RF = 1 kΩ
RL = 50 Ω
BW
G= 2, RF = 680 Ω
G= 8, RF = 330 Ω
Small-signal bandwidth (− 3 dB)
G= 1, RF = 1 kΩ
RL = 100 Ω
G= 2, RF = 680 Ω
G= 8, RF = 330 Ω
MIN
TYP
VCC = ± 5 V
110
VCC = ±12 V
120
90
VCC = ± 5 V
150
VCC = ±12 V
170
110
650
VCC = ±15 V
VCC = ±12 V
VCC = ±15 V
VCC = ±12 V
950
1500
VCC = ±15 V
NOTE 2: Slew rate is defined from the 25% to the 75% output levels.
VCC = ±15 V
1700
Slew rate (see Note 2), G=8
VO = 16 VPP
MHz
135
VCC = ±5 V, ±12 V
VCC = ± 5 V
VCC = ±12 V
SR
UNIT
100
VCC = ±5 V, ±12 V
VCC = ± 5 V
VCC = ±12 V
VO = 4 VPP
MAX
850
V/µs
noise/distortion performance
PARAMETER
THD
TEST CONDITIONS
Total harmonic distortion (single-ended
configuration)
Vn
Input voltage noise
In
Input current noise
XT
Gain = 8,
RL = 100 Ω,
VCC = ±12
12 V, f = 250 kHz
VO(pp) = 16 V
−78
RL = 50 Ω,
f = 250 kHz
VO(pp) = 2 V
−74
VO(pp) = 6 V
−72
Gain = 8,
VCC = ±5
5 V,
f = 250 kHz,
G = 2,
VCC = ±5 V,
VCC = ±12 V,
VCC = ±15 V
VCC = ±12 V,
RL= 100 Ω
f = 250 kHz,
G = 2,
VCC = ±5 V,
RL= 50 Ω
f = 10 kHz,
−Input
Crosstalk
TYP
−83
VCC = ±5 V, f = 10 kHz ,
±12 V
+Input
MIN
VO(pp) = 2 V
POST OFFICE BOX 655303
2.1
MAX
UNIT
dBc
nV/√Hz
2.7
pA/√Hz
10.7
VO = 2 Vp-p
−79
VO = 2 Vp-p
−71
dBc
• DALLAS, TEXAS 75265
3
± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
electrical characteristics over recommended operating free-air temperature range, TA = 25°C,
VCC = ±12 V, RFEEDBACK = 750 Ω, RL = 100 Ω (unless otherwise noted) (continued)
dc performance
PARAMETER
TEST CONDITIONS
Input offset voltage
VOS
VCC = ±12 V,
VCC = ±6 V
Differential offset voltage
Offset drift
− Input bias current
IIB
VCC = ±12 V,
VCC = ±6
6V
+ Input bias current
MAX
TA = 25°C
TA = full range
5
10
TA = 25°C
TA = full range
3
UNIT
15
6
mV
8
TA = full range
TA = 25°C
30
5
TA = full range
TA = 25°C
2
µV/°C
10
12
5
6
5
TA = full range
RL = 1 kΩ,
VCC = ±12 V,
VCC = ±6 V
Open loop transimpedance
TYP
TA = full range
TA = 25°C
Differential input bias current
ZOL
MIN
A
µA
10
12
1
MΩ
input characteristics
PARAMETER
TEST CONDITIONS
VICR
Input common-mode voltage range
VCC = ±12 V
VCC = ± 6 V
CMRR
Common-mode rejection ratio
VCC = ±12 V,
VCC = ±6 V
RI
Input resistance
CI
Input capacitance
TA = 25°C
TA = full range
MIN
TYP
±9.7
±10.1
± 3.8
±4.2
59
66
MAX
UNIT
V
dB
57
+ Input
1.5
MΩ
− Input
15
Ω
2
pF
output characteristics
PARAMETER
TEST CONDITIONS
RL = 50 Ω,
VO
Output voltage swing
Single ended
RL = 100 Ω
RL = 25 Ω,
IO
Output current
ISC
Short-circuit current
RL = 0 Ω,
Output resistance
Open loop
4
RL = 10 Ω,
POST OFFICE BOX 655303
VCC = ± 6 V
VCC = ±12 V
MIN
TYP
±4.2
±4.6
±10.1
±10.5
VCC = ±6 V
VCC = ±12 V
±4.4
±4.8
150
175
VCC = ±6 V
VCC = ±12 V
150
175
• DALLAS, TEXAS 75265
MAX
UNIT
V
mA
250
mA
14
Ω
± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
electrical characteristics over recommended operating free-air temperature range, TA = 25°C,
VCC = ±12 V, RFEEDBACK = 750 Ω, RL = 100 Ω (unless otherwise noted) (continued)
power supply
PARAMETER
TEST CONDITIONS
Dual supply
VCC
ICC
PSRR
Operating range
Single supply
MIN
TYP
MAX
± 4.5
± 16.5
9
33
VCC = ±12 V
TA = 25°C
TA = full range
5.2
7
VCC = ±6 V
TA = 25°C
TA = full range
4.5
6.5
VCC = ±12 V
TA = 25°C
TA = full range
−64
−62
−61
−
VCC = ±6 V
TA = 25°C
TA = full range
−60
−70
Quiescent current (each driver)
Power supply rejection ratio
UNIT
V
8
mA
7.5
dB
−58
shutdown characteristics (THS6053 only)
PARAMETER
TEST CONDITIONS
VIL(SHDN)
Shutdown pin voltage for power up
VCC = ±6 V, ±12 V GND = 0 V,
(GND Pin as Reference)
VIH(SHDN)
Shutdown pin voltage for power down
VCC = ±6 V, ±12 V, GND = 0 V,
(GND Pin as Reference)
ICC(SHDN)
tDIS
Total quiescent current when in shutdown state
tEN
IIL(SHDN)
Enable time (see Note 3)
IIH(SHDN)
Shutdown pin input bias current for power down
Disable time (see Note 3)
Shutdown pin input bias current for power up
MIN
TYP
0.8
2
UNIT
V
V
VGND = 0 V, VCC = ±6 V, ±12 V
VCC = ±12 V
0.3
VCC = ±12 V
VCC = ±6 V, ±12 V
0.4
VCC = ±6 V, ±12 V,
V(SHND) = 3.3 V
MAX
0.7
mA
µs
0.1
µs
40
100
µA
50
100
µA
NOTE 3: Disable/enable time is defined as the time from when the shutdown signal is applied to the SHDN pin to when the supply current has
reached half of its final value.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
APPLICATION INFORMATION
+12 V
THS6052
Driver 1
VI+
0.1 µF
+
6.8 µF
50 Ω
+
_
1:1
750 Ω
100 Ω
Telephone Line
1 µF
210 Ω
499 Ω
+12 V
0.68 µF
1 kΩ
THS6052
Driver 2
VI−
0.1 µF
50 Ω
+
_
499 Ω
−
+
THS6062
Receiver 1
750 Ω
0.1 µF
VO+
499 Ω
6.8 µF
+
−12 V
1 kΩ
499 Ω
−
+
VO−
THS6062
Receiver 2
−12 V
0.01 µF
Figure 1. THS6052 ADSL Application With 1:1 Transformer Ratio
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
THS6052CD
THS6052CDDA
THS6052ID
ACTIVE
Package Type Package Pins Package
Drawing
Qty
SOIC
ACTIVE SO PowerPAD
ACTIVE
SOIC
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
6052C
DDA
8
75
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
6052C
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
6052I
DDA
8
75
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
6052I
6052I
THS6052IDDA
ACTIVE SO PowerPAD
THS6052IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
THS6053CPWPR
ACTIVE
HTSSOP
PWP
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
HS6053C
THS6053ID
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
THS6053I
THS6053IPWP
ACTIVE
HTSSOP
PWP
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
HS6053I
THS6053IPWPR
ACTIVE
HTSSOP
PWP
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
HS6053I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2015
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
THS6053CPWPR
HTSSOP
PWP
14
2000
330.0
12.4
THS6053IPWPR
HTSSOP
PWP
14
2000
330.0
12.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.9
5.6
1.6
8.0
12.0
Q1
6.9
5.6
1.6
8.0
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
THS6053CPWPR
HTSSOP
PWP
14
2000
367.0
367.0
38.0
THS6053IPWPR
HTSSOP
PWP
14
2000
367.0
367.0
38.0
Pack Materials-Page 2
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