MOTOROLA MPXT5006D Integrated pressure sensor Datasheet

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SEMICONDUCTOR TECHNICAL DATA
#!# !""$! "!
#
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INTEGRATED
PRESSURE SENSOR
0 to 6 kPa (0 to 0.87 psi)
0.2 to 4.7 V OUTPUT
!#
The MPXT5006D series piezoresistive transducer is a state–of–the–art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This sensor combines a
highly sensitive implanted strain gauge with advanced micromachining techniques,
thin–film metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
Features
• Temperature Compensated over 10° to 60°C
• Ideally Suited for Microprocessor or Microcontroller–Based Systems
• Available in Gauge Configurations
TOP PISTON FIT — SNAP PORT
CASE 473B–01, STYLE 1
VS
3
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
X–ducer
SENSING
ELEMENT
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
1
Vout
2
TOP PISTON FIT PACKAGE
CASE 473A–01, STYLE 3
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
PIN NUMBER
MAXIMUM RATINGS(1)
Parametrics
Symbol
Value
Unit
Overpressure(2) (P1 > P2)
Pmax
10
kPa
Burst Pressure(2) (P1 > P2)
Pburst
60
kPa
Tstg
– 30 to +100
°C
TA
+10 to +60
°C
Storage Temperature
Operating Temperature
1
Vout
3
VS
2
Gnd
4
N/C
NOTE: Pin 4 is an internal device
connection. Do not connect to
external circuitry or ground. Pin 1 is
noted by the notch in the Lead.
1. TC = 25°C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Senseon and X–ducer are trademarks of Motorola, Inc.
Sensor
Motorola
Motorola, Inc.
1997 Device Data
1
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Pressure Range
Min
Typ
Max
Unit
POP
0
—
6.0
kPa
Supply Voltage(1)
VS
4.75
5.0
5.25
Vdc
Supply Current
IS
—
—
10
mAdc
Full Scale Span(2)
(RL = 51kΩ)
VFSS
4.5
4.6
4.7
V
Offset(3)(5)
(RL = 51kΩ)
Voff
0.100
0.225
0.430
V
V/P
—
766
—
mV/kPa
—
—
—
± 3.0
%VFSS
Sensitivity
Accuracy(4)(5)
(10 to 60°C)
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• Offset Stability:
Output deviation, after 1000 temperature cycles, 30 to 100°C, and 1.5 million pressure cycles, with
minimum rated pressure applied.
• TcSpan:
Output deviation over the temperature range of 10 to 60°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C,
relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXT5006D, external mechanical stresses and mounting position can affect
the zero pressure output reading. To obtain the 3% FSS accuracy, the device output must be “autozeroed’’ after installation. Autozeroing
is defined as storing the zero pressure output reading and subtracting this from the device’s output during normal operations.
*
Nominal Transfer Value:
Vout = VS*[(0.1533*P) + 0.045] ± 3% VFSS
VS = 5.0 V ± 0.25 Vdc
(See Note 5 in Operating Characteristics)
Figure 2. Transfer Function
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
2
Motorola Sensor Device Data
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by integrating the shear–stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a
single monolithic chip.
Figure 3 illustrates the differential or gauge configuration in
the basic chip carrier (Case 473). A fluorosilicone gel isolates
the die surface and wire bonds from harsh environments,
while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPXT5006D series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long–term reliability. Internal reliability and qualification
test for dry air, and other media, are available from the factory.
Contact the factory for information regarding media tolerance
in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the output of the MPXT5006D to the A/D microprocessor.
Proper decoupling of the power supply is recommended.
Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves
are shown for operation over 10°C to 60°C. (Device output
may be nonlinear outside of the rated pressure range.)
PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
STAINLESS STEEL
METAL COVER
which protects the die from the environment. The Motorola
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
FLUOROSILICONE
DIE COAT
P1
WIRE BONDS
CONSTRAINED
VENTED DIE
EPOXY CASE
MPXT5006D
OUTPUT
(PIN 1)
A/D
50 pF
51 k
P2
µ PROCESSOR
RTV DIE BOND
EXTERNAL LEAD
CONNECTIONS
Figure 4. Typical Decoupling Filter for Sensor to
Microprocessor Interface
Figure 3. Cross–Sectional Diagram (Not to Scale)
OUTPUT (V)
5.0
TRANSFER FUNCTION:
4.5 Vout = VS*[(0.1533*P) + 0.045] ± 3% VFSS
4.0 VS = 5.0 Vdc
TEMP = 10 to 60°C
3.5
3.0
TYPICAL
2.5
2.0
MAX
1.5
MIN
1.0
0.5
0
0
3
DIFFERENTIAL PRESSURE (kPa)
6
Figure 5. Output versus Pressure Differential
(See Note 5 in Operating Characteristics)
Motorola Sensor Device Data
3
PACKAGE DIMENSIONS
C
G
D
S
U
H
J
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –H– IS CENTER OF TINE TO CENTER
OF LEAD. DIMENSION –J– IS LEAD THICKNESS.
N
4 3 2 1
DIM
A
B
C
D
G
H
J
K
M
N
P
R
S
U
V
W
X
Y
B
P
X
W
Y
M
R
V
A
STYLE 1:
PIN 1.
2.
3.
4.
CASE 473B–01
ISSUE O
–A–
G
–B–
4
S
5
DETAIL X
DETAIL X
P
R
U
C
–T–
L
M
SEATING
PLANE
F 8 PL
0.25 (0.010) M T B
J
MILLIMETERS
MIN
MAX
26.29
27.05
20.65
21.16
15.06
15.82
0.66
0.86
2.29
2.79
0.68
1.50
0.20
0.30
3.30
3.56
30 _
40 _
18.67
19.43
32.64
33.40
12.95
13.72
30.35
31.11
2.67
3.43
6.22
6.48
4.39
4.65
4.95
5.21
6.10
6.60
VOUT
GROUND
VCC
N/C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_TYPICAL DRAFT.
6. DIMENSION P TO CENTER OF LEAD WHEN
FORMED PARALLEL.
8
1
INCHES
MIN
MAX
1.035
1.065
0.813
0.833
0.593
0.623
0.026
0.034
0.090
0.110
0.027
0.059
0.008
0.012
0.130
0.150
30 _
40 _
0.735
0.765
1.285
1.315
0.510
0.540
1.195
1.225
0.105
0.135
0.245
0.255
0.173
0.183
0.195
0.205
0.240
0.260
CASE 473A–01
ISSUE A
S
A
S
DIM
A
B
C
F
G
J
L
M
P
R
S
U
INCHES
MIN
MAX
0.658
0.668
0.658
0.668
0.329
0.357
0.026
0.034
0.100 BSC
0.009
0.011
0.138
0.150
0_
15 _
0.738
0.748
0.503
0.523
0.002
0.020
0.135
0.145
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
MILLIMETERS
MIN
MAX
16.71
16.97
16.71
16.97
8.36
9.07
0.660
0.864
2.54 BSC
0.23
0.28
3.81
3.51
0_
15_
18.75
19.00
12.78
13.28
0.05
0.51
3.43
3.68
VOUT
GROUND
VSUPPLY
N/C
N/C
N/C
N/C
N/C
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Motorola Sensor MPXT5006D/D
Device Data
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